CN101071785A - Substrate carrier capable of removing electrostatics - Google Patents
Substrate carrier capable of removing electrostatics Download PDFInfo
- Publication number
- CN101071785A CN101071785A CN 200610080368 CN200610080368A CN101071785A CN 101071785 A CN101071785 A CN 101071785A CN 200610080368 CN200610080368 CN 200610080368 CN 200610080368 A CN200610080368 A CN 200610080368A CN 101071785 A CN101071785 A CN 101071785A
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- Prior art keywords
- carrier
- substrate
- contact
- supporting module
- glass substrate
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention is a carrier for carrying a substrate, comprising: a support module having at least a contact region contacting with the substrate to support a support force to carry the substrate; and a conductive medium, connected to the contact region and a voltage reference to eliminate the static between the contact region and the substrate.
Description
Technical field
The present invention relates to a kind of carrier of bearing substrate, particularly relate to a kind of substrate carrier capable of removing electrostatics.
Background technology
Among semiconductor technology, each plate base (or wafer) all can pass through several different technology, to produce electronic product miscellaneous.For instance, with LCD (liquid crystal display, LCD) making, glass substrate also needs through the numerous and diverse flow process of overexposure, development, deposition or the like, and these numerous and diverse processing steps must be dependent on different machines and finish it, and therefore, glass substrate is in the process of making, must move to different machines and carry out different processing steps according to the technology of being carried out.
Yet, glass substrate is placed in the dust free room can produce charged bad situation, especially in the process that transmits, no matter glass substrate is on the conveyer that is positioned in the card casket (cassette), moves (such as vacuum machine people), or just in the machine of operation, glass substrate all can with arround environment produce friction, and produce static discharge (electrostatic discharge, ESD) effect.
In some particular machines; such as ULVAC PVD machine; be to utilize the vacuum machine human arm that glass substrate is sent to sputtering chamber (sputter chamber) earlier, carry out physical vapour deposition (PVD) afterwards again, and generate the film of semiconductor and protective layer in glass baseplate surface.
See also Fig. 1, Fig. 1 is the schematic diagram of existing machinery human arm (robot forklift) 100.As shown in Figure 1, robot arm 100 comprises supporting module 110,120, and a link block 130.Link block 130 is connected with the body of robot, and supporting module 110,120 and link block 130 interconnect, and with by the power that is connected between supporting module 110,120 and the link block 130, provides support module 110,120 1 support forces.Therefore, supporting module 110,120 just can be used for bearing glass substrate 150, so that glass substrate 150 is transported to different machines.
In addition, in general, also be provided with a plurality of contact mats 140 on the supporting module 110,120.When supporting module 110,120 transports glass substrate 150, these contact mats 140 can provide glass substrate more than 150 contact-making surface, to pass through these contact-making surfaces, required support force when glass substrate 150 carrying is provided, and a frictional force is provided simultaneously, slides between glass substrate 150 and the contact mat 140 preventing.
Yet, because these contact mats 140 meetings and glass substrate 1 50 mutual friction mutually, therefore can begin to accumulate electrostatic charge between glass substrate 150 and the contact mat 140, after electric charge is accumulated to a certain degree, between contact mat 140 and the glass substrate 150 just aforesaid electrostatic effect can take place, therefore, zone 160,170 shown in Figure 1 just can produce aforesaid electrostatic effect.Because electrostatic effect can change the electric field of zone arround 160,170, so just can make when glass substrate 150 carries out every technology, because of the instability of electric field produces unnecessary fabrication error.
Summary of the invention
In view of this, one of main purpose of the present invention is to provide a kind of substrate carrier capable of removing electrostatics, to solve the problems of the prior art.
The present invention discloses a kind of carrier that is used for carrying a substrate, and this carrier comprises: a supporting module and a conductive media.Wherein, this supporting module has at least one contact area and this substrate contacts, to provide this substrate one support force to carry this substrate, therefore above-mentioned static discharge effect may betide this contact area, one conductive media is electrically connected to this contact area and a voltage quasi position, to eliminate the static between this contact area and this substrate.
The present invention discloses the method that a kind of use one carrier carries a substrate in addition, and it comprises: use at least one contact area and this substrate contacts on the supporting module of this carrier, carry this substrate so that this substrate one support force to be provided; And this contact area is electrically connected to a voltage quasi position, to eliminate the static between this contact area and this substrate via this voltage quasi position.
Robot arm of the present invention has conductive media, and to eliminate the static that is produced between contact mat and the glass substrate, therefore, the situation of suffered electrostatic interference just can significantly be improved during script technology, also therefore can promote the rate of finished products of LCD.
Description of drawings
Fig. 1 is the schematic diagram of existing machinery human arm (robot forklift).
Fig. 2 is the schematic diagram of robot arm of the present invention (robot forklift).
Fig. 3 is the schematic diagram of an embodiment of conductive media shown in Figure 2.
The simple symbol explanation
110,120,210,220 supporting modules, 140,240 contact mats
150,250 glass substrates, 130,230 link blocks
160,170,260,270 zones, 100,200 robot arms
280 conductive medias
Embodiment
See also Fig. 2, Fig. 2 is the schematic diagram of robot arm of the present invention (robot forklift) 200.As shown in Figure 2, robot arm 200 also comprises supporting module 210,220, and a link block 230.Link block 230 is connected with the body of robot, and supporting module 210,220 and link block 230 interconnect, and with by the power that is connected between supporting module 210,220 and the link block 230, provides support module 210,220 1 support forces.Therefore, supporting module 210,220 just can be used for bearing glass substrate 250, so that glass substrate 250 is transported to different machines.
Identical with robot arm 100, also be provided with a plurality of contact mats 240 on the supporting module 210,220 of robot arm 200 of the present invention.When supporting module 210,220 transports glass substrate 250, these contact mats 240 can provide glass substrate more than 250 contact-making surface, to pass through these contact-making surfaces, required support force when glass substrate 250 carrying is provided, and a frictional force is provided simultaneously, slides between glass substrate 250 and the contact mat 240 preventing.
Among present embodiment, have a conductive media 280 above the supporting module 210,220 in addition, conductive media 280 1 ends are electrically connected to aforesaid contact mat 240, and the other end is electrically connected to earth terminal; Therefore, in zone 260,270, originally owing to contact mat 240 and glass substrate 250 mutually the electrostatic charge that produces of mutual friction just can be guided to earth terminal via conductive media 280, so just can eliminate aforesaid electrostatic effect effectively.
See also Fig. 3, Fig. 3 is the schematic diagram of an embodiment of conductive media 280 shown in Figure 2.As shown in Figure 3, conductive media 280 is a dendritic Copper Foil lead, and wherein each divides the contact mat 240 on the fork contact supporting module 210,220, and the other end of Copper Foil lead is electrically connected to earth terminal, therefore, electrostatic charge just can derive by the low-voltage of earth terminal.And dendritic Copper Foil lead 280 shown in Figure 3 only is a preferred embodiment of the present invention, in other words, conductive media 280 also can have different shapes, or utilizes other conductive materials to be made, so corresponding variation also belongs to category of the present invention.
Yet, in order positively the electrostatic charge between contact mat 240 and the glass substrate 250 to be directed at earth terminal, in the preferred embodiments of the present invention, the present invention has improved some elements, to reach the optimization of eliminating electrostatic charge, for instance, contact mat 240 adopts the micro conductive material to form, so, the electrostatic charge in zone 260,270 just can waltz through conductive contact mat 240 and conductive media 280 derivation; Contact mat 240 also can adopt other material, and aforesaid micro conductive material is as just the preferred embodiments of the present invention, but not restriction of the present invention.
In addition, as Fig. 2 and shown in Figure 3, conductive media 280 is smooth on supporting module 210,220 by a gum, therefore, for integrally-built optimization, and have influence on for fear of conductive media 280 and originally to desire the technology of carrying out, in the preferred embodiments of the present invention, gum adopts resistant to elevated temperatures gum, in order to avoid gum volatilizes unnecessary gas and influences technology; And the thickness of Copper Foil is also thin as much as possible, so that Copper Foil reaches minimum to the influence of technology, for instance, the thickness of Copper Foil can be 0.1mm; Yet, aforesaid high temperature resistant gum, 0.1mm copper thickness also only as the preferred embodiments of the present invention, the designer can select different materials and thickness along with the consideration of technology of desiring to carry out and cost, so corresponding variation is also without prejudice to spirit of the present invention.
The above-mentioned technology of LCD screen of all utilizing is illustrated, yet the present invention also can be used in the technology of various different electronic products; In other words, robot arm of the present invention is not limited to be used for the bearing glass substrate, and robot arm of the present invention can be used to carrying in fact and transport various substrates, or wafer.
In addition, the present invention also is not limited to be implemented on aforesaid robot arm; In practical application, the carrier that all are used for bearing substrate all can utilize method of the present invention will be attached to the static elimination of substrate, and so corresponding variation also belongs to category of the present invention.
Compared to prior art, robot arm of the present invention has conductive media, to eliminate the static that is produced between contact mat and the glass substrate, therefore, the situation of suffered electrostatic interference just can significantly be improved during script technology, also therefore can promote the rate of finished products of LCD screen.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (10)
1. one kind is used for the carrier of bearing substrate, and it comprises:
Supporting module, it has at least one contact area and this substrate contacts, is used to provide this base plate supports power to carry this substrate; And
Conductive media is electrically connected to this contact area and voltage quasi position, to eliminate the static between this contact area and this substrate via this voltage quasi position.
2. carrier as claimed in claim 1, wherein this supporting module comprises a plurality of contact mats, each contact mat provides a contact area to come and this substrate contacts.
3. carrier as claimed in claim 2, wherein these a plurality of contact mats form with the micro conductive material.
4. carrier as claimed in claim 1, wherein this conductive media comprises metallic film, is connected in this contact area.
5. carrier as claimed in claim 4, wherein this metallic film is a Copper Foil.
6. carrier as claimed in claim 5, wherein this Copper Foil is smooth on this supporting module.
7. carrier as claimed in claim 6, wherein this Copper Foil and this supporting module utilize the mutual gluing of gum.
8. carrier as claimed in claim 7, wherein this gum is high temperature resistant gum.
9. carrier as claimed in claim 1, wherein this substrate is a glass substrate.
10. carrier as claimed in claim 1, wherein this voltage quasi position is an earthing potential.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610080368 CN101071785A (en) | 2006-05-11 | 2006-05-11 | Substrate carrier capable of removing electrostatics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610080368 CN101071785A (en) | 2006-05-11 | 2006-05-11 | Substrate carrier capable of removing electrostatics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101071785A true CN101071785A (en) | 2007-11-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610080368 Pending CN101071785A (en) | 2006-05-11 | 2006-05-11 | Substrate carrier capable of removing electrostatics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101071785A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104603926A (en) * | 2012-08-29 | 2015-05-06 | 夏普株式会社 | Substrate processing device and device for producing liquid crystal display panel |
| CN103227136B (en) * | 2008-03-13 | 2016-01-20 | 株式会社尼康 | Substrate holder, substrate holding unit, base board delivery device and Base Plate Lamination Device |
| CN106783724A (en) * | 2017-01-11 | 2017-05-31 | 惠科股份有限公司 | Substrate bearing device |
| CN110238816A (en) * | 2019-05-09 | 2019-09-17 | 京东方科技集团股份有限公司 | Mechanical arm, manipulator and transmission equipment |
-
2006
- 2006-05-11 CN CN 200610080368 patent/CN101071785A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103227136B (en) * | 2008-03-13 | 2016-01-20 | 株式会社尼康 | Substrate holder, substrate holding unit, base board delivery device and Base Plate Lamination Device |
| CN104603926A (en) * | 2012-08-29 | 2015-05-06 | 夏普株式会社 | Substrate processing device and device for producing liquid crystal display panel |
| CN106783724A (en) * | 2017-01-11 | 2017-05-31 | 惠科股份有限公司 | Substrate bearing device |
| WO2018129881A1 (en) * | 2017-01-11 | 2018-07-19 | 惠科股份有限公司 | Substrate bearing device and liquid crystal display fabricating device |
| US10766713B2 (en) | 2017-01-11 | 2020-09-08 | HKC Corporation Limited | Substrate carrier apparatus and liquid crystal display manufacturing device |
| CN110238816A (en) * | 2019-05-09 | 2019-09-17 | 京东方科技集团股份有限公司 | Mechanical arm, manipulator and transmission equipment |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Open date: 20071114 |