WO2007031049A1 - Vorrichtung zur ermittlung der relativposition zwischen zwei im wesentlichen flächigen elementen - Google Patents
Vorrichtung zur ermittlung der relativposition zwischen zwei im wesentlichen flächigen elementen Download PDFInfo
- Publication number
- WO2007031049A1 WO2007031049A1 PCT/DE2006/001413 DE2006001413W WO2007031049A1 WO 2007031049 A1 WO2007031049 A1 WO 2007031049A1 DE 2006001413 W DE2006001413 W DE 2006001413W WO 2007031049 A1 WO2007031049 A1 WO 2007031049A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- elements
- line sensor
- relative position
- plane
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7069—Alignment mark illumination, e.g. darkfield, dual focus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Definitions
- a disadvantage of this known device is, however, that on the one hand the reference points for each new variant or size of printed circuit board or substrate must be redefined, so that the system when learning to a new circuit board model "learned" or complicated einjustiert
- the manufacturing tolerances in the case of the substrate or printed circuit board only a few, in particular only two, reference point pairs do not ensure sufficiently accurate masking of the template and printed circuit board or substrate an offset to be considered, which must be determined separately for each PCB type in tests. This requires in particular a high monitoring effort and also requires a relatively high level of waste.
- the invention further relates to a system for printing printed circuit boards or substrates to be provided with electrical tracks using a device according to one of the preceding claims, wherein the first of the two elements is formed by a template and the second of the two elements by the printed circuit board to be printed or by the substrate to be printed.
- a substantially extending in the Y direction carrier 4 is arranged, which is movable by means of a drive 5 shown schematically in the X direction.
- a drive 5 shown schematically in the X direction.
- an upper and a lower line sensor 7 and 8 are arranged on a support plate 6, which are movable by means of the drive 5 and the carrier 4 in the X direction.
- the support plate 6 can be moved on the carrier 4 in the Y direction, so that the entire row of facing surfaces of the printed circuit board 2 and the printing template 3 are optically scanned by the two line sensors 7 and 8 respectively.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/066,439 US20080283308A1 (en) | 2005-09-13 | 2006-08-11 | Device For Determining the Relative Position Between Two Essentially Flat Elements |
JP2008530314A JP2009508115A (ja) | 2005-09-13 | 2006-08-11 | 2つの実質的に平らな要素の相対位置を決定するための装置 |
BRPI0617170-2A BRPI0617170A2 (pt) | 2005-09-13 | 2006-08-11 | dispositivo para determinar a posição relativa entre os dois elementos essencialmente planos |
CA002622359A CA2622359A1 (en) | 2005-09-13 | 2006-08-11 | Device for determining the relative position between two essentially flat elements |
AU2006291872A AU2006291872B2 (en) | 2005-09-13 | 2006-08-11 | Device for determining the relative position of two substantially flat elements |
EP06775845A EP1924891A1 (de) | 2005-09-13 | 2006-08-11 | Vorrichtung zur ermittlung der relativposition zwischen zwei im wesentlichen flächigen elementen |
EA200800675A EA011464B1 (ru) | 2005-09-13 | 2006-08-11 | Устройство для определения взаимного положения двух, по существу, плоских элементов |
IL189803A IL189803A0 (en) | 2005-09-13 | 2008-02-26 | Device for determining the relative position between two essentially flat elements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005043833A DE102005043833A1 (de) | 2005-09-13 | 2005-09-13 | Vorrichtung zur Ermittlung der Relativposition zwischen zwei im Wesentlichen flächigen Elementen |
DE102005043833.4 | 2005-09-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007031049A1 true WO2007031049A1 (de) | 2007-03-22 |
Family
ID=37497898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2006/001413 WO2007031049A1 (de) | 2005-09-13 | 2006-08-11 | Vorrichtung zur ermittlung der relativposition zwischen zwei im wesentlichen flächigen elementen |
Country Status (14)
Country | Link |
---|---|
US (1) | US20080283308A1 (de) |
EP (1) | EP1924891A1 (de) |
JP (1) | JP2009508115A (de) |
KR (1) | KR101027880B1 (de) |
CN (1) | CN101263433A (de) |
AU (1) | AU2006291872B2 (de) |
BR (1) | BRPI0617170A2 (de) |
CA (1) | CA2622359A1 (de) |
DE (1) | DE102005043833A1 (de) |
EA (1) | EA011464B1 (de) |
IL (1) | IL189803A0 (de) |
UA (1) | UA89431C2 (de) |
WO (1) | WO2007031049A1 (de) |
ZA (1) | ZA200801602B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019072727A1 (de) * | 2017-10-11 | 2019-04-18 | Miva Technologies Gmbh | Verfahren und belichtungseinrichtung zur belichtung von zumindest einer gespeicherten darstellung auf einem lichtempfindlichen aufzeichnungsträger |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205427436U (zh) | 2016-03-23 | 2016-08-03 | 北京京东方光电科技有限公司 | 显示器件的对位检测设备及曝光工艺系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0433263A2 (de) | 1989-12-13 | 1991-06-19 | Erich Dipl.-Ing. Thallner | Verfahren und Vorrichtung zur Belichtung lichtempfindlichgemachter Substrate, insbesondere Halbleitersubstrate |
US5400145A (en) * | 1992-03-17 | 1995-03-21 | Fujitsu Limited | Mark position detecting method and device for aligner and aligner having the device |
US6002487A (en) | 1995-06-20 | 1999-12-14 | Nikon Corporation | Alignment method for performing alignment between shot areas on a wafer |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119204A (ja) * | 1982-12-27 | 1984-07-10 | Toshiba Corp | マ−ク位置検出方法 |
JP2521910B2 (ja) * | 1986-05-07 | 1996-08-07 | オムロン株式会社 | プリント基板の位置ずれ補正装置 |
GB9323978D0 (en) * | 1993-11-22 | 1994-01-12 | Dek Printing Machines Ltd | Alignment systems |
JP3442163B2 (ja) * | 1994-10-11 | 2003-09-02 | 富士通株式会社 | 位置合わせ方法および装置 |
JP3651718B2 (ja) * | 1996-06-06 | 2005-05-25 | ソニー株式会社 | スクリーン印刷装置及び印刷方法 |
US5883663A (en) * | 1996-12-02 | 1999-03-16 | Siwko; Robert P. | Multiple image camera for measuring the alignment of objects in different planes |
GB2323664A (en) * | 1997-03-25 | 1998-09-30 | Dek Printing Machines Ltd | Viewing and imaging systems |
JPH11245369A (ja) * | 1998-02-27 | 1999-09-14 | Tenryu Seiki Kk | 画像認識装置及びクリームはんだ印刷装置 |
DE60045379D1 (de) * | 1999-07-26 | 2011-01-27 | Panasonic Corp | Verfahren und vorrichtung zum drucken von lötpaste |
JP3580493B2 (ja) * | 2000-08-11 | 2004-10-20 | 株式会社サキコーポレーション | 走査ヘッドおよびそれを利用可能な外観検査方法および装置 |
JP4510272B2 (ja) * | 2000-11-22 | 2010-07-21 | パナソニック株式会社 | クリーム半田印刷装置及びその制御方法 |
GB2377908A (en) * | 2001-05-31 | 2003-01-29 | Blakell Europlacer Ltd | Screen printer for PCB with alignment apparatus |
DE10311821B4 (de) * | 2003-03-13 | 2008-11-20 | Ekra Eduard Kraft Gmbh Maschinenfabrik | Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck |
GB2403003B (en) * | 2003-06-19 | 2006-06-07 | Dek Int Gmbh | Inspection system for and method of inspecting deposits printed on workpieces |
-
2005
- 2005-09-13 DE DE102005043833A patent/DE102005043833A1/de not_active Ceased
-
2006
- 2006-08-11 CN CNA2006800330397A patent/CN101263433A/zh active Pending
- 2006-08-11 EA EA200800675A patent/EA011464B1/ru not_active IP Right Cessation
- 2006-08-11 UA UAA200804311A patent/UA89431C2/ru unknown
- 2006-08-11 BR BRPI0617170-2A patent/BRPI0617170A2/pt not_active IP Right Cessation
- 2006-08-11 CA CA002622359A patent/CA2622359A1/en not_active Abandoned
- 2006-08-11 EP EP06775845A patent/EP1924891A1/de not_active Withdrawn
- 2006-08-11 AU AU2006291872A patent/AU2006291872B2/en not_active Ceased
- 2006-08-11 US US12/066,439 patent/US20080283308A1/en not_active Abandoned
- 2006-08-11 KR KR1020087008692A patent/KR101027880B1/ko active IP Right Grant
- 2006-08-11 JP JP2008530314A patent/JP2009508115A/ja not_active Withdrawn
- 2006-08-11 WO PCT/DE2006/001413 patent/WO2007031049A1/de active Application Filing
-
2008
- 2008-02-18 ZA ZA200801602A patent/ZA200801602B/xx unknown
- 2008-02-26 IL IL189803A patent/IL189803A0/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0433263A2 (de) | 1989-12-13 | 1991-06-19 | Erich Dipl.-Ing. Thallner | Verfahren und Vorrichtung zur Belichtung lichtempfindlichgemachter Substrate, insbesondere Halbleitersubstrate |
US5400145A (en) * | 1992-03-17 | 1995-03-21 | Fujitsu Limited | Mark position detecting method and device for aligner and aligner having the device |
US6002487A (en) | 1995-06-20 | 1999-12-14 | Nikon Corporation | Alignment method for performing alignment between shot areas on a wafer |
Non-Patent Citations (2)
Title |
---|
"Optics and Optical Instruments Catalog 2002", 2001, EDMUND OPTICS, INC., BARRINGTON, NJ, US, XP002412062 * |
"Optics and Optical Instruments Catalog 2002", 2001, EDMUND OPTICS, INC., pages: 223,231 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019072727A1 (de) * | 2017-10-11 | 2019-04-18 | Miva Technologies Gmbh | Verfahren und belichtungseinrichtung zur belichtung von zumindest einer gespeicherten darstellung auf einem lichtempfindlichen aufzeichnungsträger |
CN111512240A (zh) * | 2017-10-11 | 2020-08-07 | 密华科技有限公司 | 光敏记录介质上至少一幅存储图像的曝光方法和曝光设备 |
Also Published As
Publication number | Publication date |
---|---|
KR101027880B1 (ko) | 2011-04-07 |
KR20080046709A (ko) | 2008-05-27 |
ZA200801602B (en) | 2008-11-26 |
US20080283308A1 (en) | 2008-11-20 |
CA2622359A1 (en) | 2007-03-22 |
EA011464B1 (ru) | 2009-04-28 |
EP1924891A1 (de) | 2008-05-28 |
EA200800675A1 (ru) | 2008-08-29 |
IL189803A0 (en) | 2008-11-03 |
AU2006291872B2 (en) | 2010-06-10 |
JP2009508115A (ja) | 2009-02-26 |
DE102005043833A1 (de) | 2007-03-29 |
AU2006291872A1 (en) | 2007-03-22 |
BRPI0617170A2 (pt) | 2011-07-12 |
UA89431C2 (ru) | 2010-01-25 |
CN101263433A (zh) | 2008-09-10 |
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