EA200800675A1 - Устройство для определения взаимного положения двух, по существу, плоских элементов - Google Patents

Устройство для определения взаимного положения двух, по существу, плоских элементов

Info

Publication number
EA200800675A1
EA200800675A1 EA200800675A EA200800675A EA200800675A1 EA 200800675 A1 EA200800675 A1 EA 200800675A1 EA 200800675 A EA200800675 A EA 200800675A EA 200800675 A EA200800675 A EA 200800675A EA 200800675 A1 EA200800675 A1 EA 200800675A1
Authority
EA
Eurasian Patent Office
Prior art keywords
elements
essence
determination
flat elements
mutual position
Prior art date
Application number
EA200800675A
Other languages
English (en)
Other versions
EA011464B1 (ru
Inventor
Райнер Куртц
Марк Каннон
Вольфрам Хюбш
Харальд Грумм
Original Assignee
Эрза Гмбх
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Эрза Гмбх filed Critical Эрза Гмбх
Publication of EA200800675A1 publication Critical patent/EA200800675A1/ru
Publication of EA011464B1 publication Critical patent/EA011464B1/ru

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7069—Alignment mark illumination, e.g. darkfield, dual focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)

Abstract

В заявке описано устройство для определения взаимного положения в плоскости Х-У двух, по существу, плоских элементов (2, 3), расположенных по существу один над другим на расстоянии друг от друга в направлении Z, содержащее по меньшей мере один расположенный между указанными элементами оптический регистрирующий прибор (6-8), позволяющий регистрировать по меньшей мере по две точки на обращенных друг к другу поверхностях элементов, и блок обработки, выполненный с возможностью анализа изображений точек в отношении их взаимного положения в плоскости Х-У. При этом оптический регистрирующий прибор имеет по меньшей мере одну линейку (7, 8) светочувствительных элементов, установленную с возможностью перемещения относительно обоих элементов таким образом, чтобы по меньшей мере на отдельных участках оптически сканировать обращенные друг к другу поверхности элементов.
EA200800675A 2005-09-13 2006-08-11 Устройство для определения взаимного положения двух, по существу, плоских элементов EA011464B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005043833A DE102005043833A1 (de) 2005-09-13 2005-09-13 Vorrichtung zur Ermittlung der Relativposition zwischen zwei im Wesentlichen flächigen Elementen
PCT/DE2006/001413 WO2007031049A1 (de) 2005-09-13 2006-08-11 Vorrichtung zur ermittlung der relativposition zwischen zwei im wesentlichen flächigen elementen

Publications (2)

Publication Number Publication Date
EA200800675A1 true EA200800675A1 (ru) 2008-08-29
EA011464B1 EA011464B1 (ru) 2009-04-28

Family

ID=37497898

Family Applications (1)

Application Number Title Priority Date Filing Date
EA200800675A EA011464B1 (ru) 2005-09-13 2006-08-11 Устройство для определения взаимного положения двух, по существу, плоских элементов

Country Status (14)

Country Link
US (1) US20080283308A1 (ru)
EP (1) EP1924891A1 (ru)
JP (1) JP2009508115A (ru)
KR (1) KR101027880B1 (ru)
CN (1) CN101263433A (ru)
AU (1) AU2006291872B2 (ru)
BR (1) BRPI0617170A2 (ru)
CA (1) CA2622359A1 (ru)
DE (1) DE102005043833A1 (ru)
EA (1) EA011464B1 (ru)
IL (1) IL189803A0 (ru)
UA (1) UA89431C2 (ru)
WO (1) WO2007031049A1 (ru)
ZA (1) ZA200801602B (ru)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205427436U (zh) 2016-03-23 2016-08-03 北京京东方光电科技有限公司 显示器件的对位检测设备及曝光工艺系统
DE102017123686A1 (de) * 2017-10-11 2019-04-11 Miva Technologies Gmbh Verfahren und Belichtungseinrichtung zur Belichtung von zumindest einer gespeicherten Darstellung auf einem lichtempfindlichen Aufzeichnungsträger

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119204A (ja) * 1982-12-27 1984-07-10 Toshiba Corp マ−ク位置検出方法
JP2521910B2 (ja) * 1986-05-07 1996-08-07 オムロン株式会社 プリント基板の位置ずれ補正装置
EP0433263A3 (en) * 1989-12-13 1992-01-15 Erich Dipl.-Ing. Thallner Method and apparatus for the exposure of photosensitised substrates, especially semiconductor substrates
JPH05264221A (ja) * 1992-03-17 1993-10-12 Fujitsu Ltd 半導体露光装置用マーク位置検出装置及びこれを用いた半導体露光装置用位置合わせ装置
GB9323978D0 (en) * 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
JP3442163B2 (ja) * 1994-10-11 2003-09-02 富士通株式会社 位置合わせ方法および装置
JP3991165B2 (ja) * 1995-06-20 2007-10-17 株式会社ニコン 位置合わせ方法及び露光方法
US6923117B1 (en) * 1999-07-26 2005-08-02 Matsushita Electric Industrial Co., Ltd. Solder paste printing apparatus and printing method
JP3651718B2 (ja) * 1996-06-06 2005-05-25 ソニー株式会社 スクリーン印刷装置及び印刷方法
US5883663A (en) * 1996-12-02 1999-03-16 Siwko; Robert P. Multiple image camera for measuring the alignment of objects in different planes
GB2323664A (en) * 1997-03-25 1998-09-30 Dek Printing Machines Ltd Viewing and imaging systems
JPH11245369A (ja) * 1998-02-27 1999-09-14 Tenryu Seiki Kk 画像認識装置及びクリームはんだ印刷装置
JP3580493B2 (ja) * 2000-08-11 2004-10-20 株式会社サキコーポレーション 走査ヘッドおよびそれを利用可能な外観検査方法および装置
JP4510272B2 (ja) * 2000-11-22 2010-07-21 パナソニック株式会社 クリーム半田印刷装置及びその制御方法
GB2377908A (en) * 2001-05-31 2003-01-29 Blakell Europlacer Ltd Screen printer for PCB with alignment apparatus
DE10311821B4 (de) * 2003-03-13 2008-11-20 Ekra Eduard Kraft Gmbh Maschinenfabrik Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck
GB2403003B (en) * 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces

Also Published As

Publication number Publication date
WO2007031049A1 (de) 2007-03-22
ZA200801602B (en) 2008-11-26
CA2622359A1 (en) 2007-03-22
DE102005043833A1 (de) 2007-03-29
US20080283308A1 (en) 2008-11-20
KR101027880B1 (ko) 2011-04-07
BRPI0617170A2 (pt) 2011-07-12
EA011464B1 (ru) 2009-04-28
EP1924891A1 (de) 2008-05-28
CN101263433A (zh) 2008-09-10
IL189803A0 (en) 2008-11-03
AU2006291872A1 (en) 2007-03-22
AU2006291872B2 (en) 2010-06-10
KR20080046709A (ko) 2008-05-27
UA89431C2 (ru) 2010-01-25
JP2009508115A (ja) 2009-02-26

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Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM AZ KZ KG MD TJ TM

MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): BY RU