ZA200801602B - Device for determining the relative position of two substantially flat elements - Google Patents

Device for determining the relative position of two substantially flat elements

Info

Publication number
ZA200801602B
ZA200801602B ZA200801602A ZA200801602A ZA200801602B ZA 200801602 B ZA200801602 B ZA 200801602B ZA 200801602 A ZA200801602 A ZA 200801602A ZA 200801602 A ZA200801602 A ZA 200801602A ZA 200801602 B ZA200801602 B ZA 200801602B
Authority
ZA
South Africa
Prior art keywords
determining
relative position
substantially flat
flat elements
elements
Prior art date
Application number
ZA200801602A
Other languages
English (en)
Inventor
Kurtz Rainer
Huebsch Wolfram
Cannon Mark
Grumm Harald
Original Assignee
Ersa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa Gmbh filed Critical Ersa Gmbh
Publication of ZA200801602B publication Critical patent/ZA200801602B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7069—Alignment mark illumination, e.g. darkfield, dual focus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ZA200801602A 2005-09-13 2008-02-18 Device for determining the relative position of two substantially flat elements ZA200801602B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005043833A DE102005043833A1 (de) 2005-09-13 2005-09-13 Vorrichtung zur Ermittlung der Relativposition zwischen zwei im Wesentlichen flächigen Elementen

Publications (1)

Publication Number Publication Date
ZA200801602B true ZA200801602B (en) 2008-11-26

Family

ID=37497898

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200801602A ZA200801602B (en) 2005-09-13 2008-02-18 Device for determining the relative position of two substantially flat elements

Country Status (14)

Country Link
US (1) US20080283308A1 (ru)
EP (1) EP1924891A1 (ru)
JP (1) JP2009508115A (ru)
KR (1) KR101027880B1 (ru)
CN (1) CN101263433A (ru)
AU (1) AU2006291872B2 (ru)
BR (1) BRPI0617170A2 (ru)
CA (1) CA2622359A1 (ru)
DE (1) DE102005043833A1 (ru)
EA (1) EA011464B1 (ru)
IL (1) IL189803A0 (ru)
UA (1) UA89431C2 (ru)
WO (1) WO2007031049A1 (ru)
ZA (1) ZA200801602B (ru)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205427436U (zh) 2016-03-23 2016-08-03 北京京东方光电科技有限公司 显示器件的对位检测设备及曝光工艺系统
DE102017123686A1 (de) * 2017-10-11 2019-04-11 Miva Technologies Gmbh Verfahren und Belichtungseinrichtung zur Belichtung von zumindest einer gespeicherten Darstellung auf einem lichtempfindlichen Aufzeichnungsträger

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119204A (ja) * 1982-12-27 1984-07-10 Toshiba Corp マ−ク位置検出方法
JP2521910B2 (ja) * 1986-05-07 1996-08-07 オムロン株式会社 プリント基板の位置ずれ補正装置
EP0433263A3 (en) * 1989-12-13 1992-01-15 Erich Dipl.-Ing. Thallner Method and apparatus for the exposure of photosensitised substrates, especially semiconductor substrates
JPH05264221A (ja) * 1992-03-17 1993-10-12 Fujitsu Ltd 半導体露光装置用マーク位置検出装置及びこれを用いた半導体露光装置用位置合わせ装置
GB9323978D0 (en) * 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
JP3442163B2 (ja) * 1994-10-11 2003-09-02 富士通株式会社 位置合わせ方法および装置
JP3991165B2 (ja) * 1995-06-20 2007-10-17 株式会社ニコン 位置合わせ方法及び露光方法
JP3651718B2 (ja) * 1996-06-06 2005-05-25 ソニー株式会社 スクリーン印刷装置及び印刷方法
US5883663A (en) * 1996-12-02 1999-03-16 Siwko; Robert P. Multiple image camera for measuring the alignment of objects in different planes
GB2323664A (en) * 1997-03-25 1998-09-30 Dek Printing Machines Ltd Viewing and imaging systems
JPH11245369A (ja) * 1998-02-27 1999-09-14 Tenryu Seiki Kk 画像認識装置及びクリームはんだ印刷装置
DE60045379D1 (de) * 1999-07-26 2011-01-27 Panasonic Corp Verfahren und vorrichtung zum drucken von lötpaste
JP3580493B2 (ja) * 2000-08-11 2004-10-20 株式会社サキコーポレーション 走査ヘッドおよびそれを利用可能な外観検査方法および装置
JP4510272B2 (ja) * 2000-11-22 2010-07-21 パナソニック株式会社 クリーム半田印刷装置及びその制御方法
GB2377908A (en) * 2001-05-31 2003-01-29 Blakell Europlacer Ltd Screen printer for PCB with alignment apparatus
DE10311821B4 (de) * 2003-03-13 2008-11-20 Ekra Eduard Kraft Gmbh Maschinenfabrik Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck
GB2403003B (en) * 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces

Also Published As

Publication number Publication date
KR101027880B1 (ko) 2011-04-07
KR20080046709A (ko) 2008-05-27
US20080283308A1 (en) 2008-11-20
CA2622359A1 (en) 2007-03-22
EA011464B1 (ru) 2009-04-28
EP1924891A1 (de) 2008-05-28
EA200800675A1 (ru) 2008-08-29
IL189803A0 (en) 2008-11-03
WO2007031049A1 (de) 2007-03-22
AU2006291872B2 (en) 2010-06-10
JP2009508115A (ja) 2009-02-26
DE102005043833A1 (de) 2007-03-29
AU2006291872A1 (en) 2007-03-22
BRPI0617170A2 (pt) 2011-07-12
UA89431C2 (ru) 2010-01-25
CN101263433A (zh) 2008-09-10

Similar Documents

Publication Publication Date Title
EP1923721A4 (en) MEASURING DEVICE
EP1914565A4 (en) DEVICE FOR MEASURING DISTANCE
HK1163018A1 (zh) 劃線裝置
EP1967149A4 (en) COMPRESSOR-DISTRACTOR
EP1888875A4 (en) PACKER ANCHORAGE DEVICE
EP1962062A4 (en) POSITION DETECTOR
EP1898185A4 (en) POSITION SENSOR
EP1939603A4 (en) MOBILE TEST DEVICE
PL1760886T3 (pl) Urządzenie czujnikowe
EP1785697A4 (en) POSITION SENSOR
GB0428165D0 (en) Position measurement
GB0505013D0 (en) Device
EP1873491A4 (en) NAVIGATION DEVICE
EP1842033A4 (en) POSITION DETECTOR
IL187521A0 (en) Assay device
GB2430032B (en) Assay Device
PL1938116T3 (pl) Urządzenie do pomiaru współczynnika strat
EP1850149A4 (en) POSITION DETERMINING APPARATUS
GB0511943D0 (en) Device
ZA200801602B (en) Device for determining the relative position of two substantially flat elements
EP1686352B8 (en) Dimension measuring device
GB0521696D0 (en) Levelling device
TWI372241B (en) Device for measuring eccentricity
GB0513130D0 (en) Measuring device
GB0501155D0 (en) Sensor device