WO2007020769A1 - Moule de métal servant à former un dispositif optique et son procédé de production - Google Patents

Moule de métal servant à former un dispositif optique et son procédé de production Download PDF

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Publication number
WO2007020769A1
WO2007020769A1 PCT/JP2006/314455 JP2006314455W WO2007020769A1 WO 2007020769 A1 WO2007020769 A1 WO 2007020769A1 JP 2006314455 W JP2006314455 W JP 2006314455W WO 2007020769 A1 WO2007020769 A1 WO 2007020769A1
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WO
WIPO (PCT)
Prior art keywords
layer
optical element
intermediate layer
heat insulating
base material
Prior art date
Application number
PCT/JP2006/314455
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Naito
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Priority to JP2007530927A priority Critical patent/JPWO2007020769A1/ja
Publication of WO2007020769A1 publication Critical patent/WO2007020769A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3828—Moulds made of at least two different materials having different thermal conductivities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms

Definitions

  • the present invention relates to an optical element molding die for producing an optical element, such as an optical lens and a diffraction grating, by injection molding of a resin. More particularly, the present invention relates to a mold for molding an optical element for molding an optical element for which accuracy on the order of microns or less is required, and a method of manufacturing the same.
  • Patent document 1 is mentioned as a conventional thing for shape
  • a mold for molding an optical element in which a heat insulating layer and a surface processed layer are formed on the surface of a stainless steel core mold.
  • the ceramic material is sprayed on the surface of the core mold to form a heat insulating layer integrally with the mold base material.
  • a non-ferrous metal material is electrolessly plated on the heat insulating layer to form a surface coating layer.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2002-96335
  • the present invention has been made to solve the problems of the conventional optical element molding die described above. That is, the object of the invention is to provide an optical element molding die which is excellent in the adhesion of the surface coating layer and can obtain high-precision transferability, together with its manufacturing method.
  • the optical element molding die of the present invention made for the purpose of solving the problem comprises a base material, a heat insulating layer provided by thermal spraying on the base material, and an intermediate provided on the heat insulating layer. It has a layer, and a surface layer that covers the intermediate layer and has a molding surface on which the optical element is molded.
  • a step of forming a heat insulating layer on a base material by thermal spraying a step of forming an intermediate layer on the heat insulating layer, and an intermediate layer And forming a molding surface for molding the optical element on the surface of the surface layer.
  • the optical element is molded by a molding surface which is a portion of the surface layer surface above the molding base surface of the base material.
  • the surface layer covers the intermediate layer, the intermediate layer is provided on the heat insulating layer, and the heat insulating layer is provided by injection on the forming base of the base material, the surface layer is the intermediate layer. Strongly adheres to the thermal insulation layer. That is, even if the temperature rises and falls repeatedly, the strain between the surface layer and the heat insulating layer is alleviated by the intermediate layer. Therefore, the adhesion of the surface layer is excellent.
  • the portion of the surface of the surface layer above the forming base surface of the base material is the forming surface, highly accurate transferability can be obtained.
  • the heat insulating layer is a ceramic layer
  • the surface layer is a metal layer, particularly a nonferrous metal layer having high adhesion and high corrosion resistance
  • the intermediate layer is a metal or a cermet or a graded material It is preferable to have a thickness not exceeding 200 m and to have a bond layer between the base material and the heat insulating layer to enhance the adhesion of those layers.
  • the surface layer can be manufactured by processes such as electroless plating, metal spraying and sputtering.
  • the intermediate layer be formed to cover the heat insulating layer, and that the edge be in contact with the base material.
  • the surface layer be formed so as to cover the intermediate layer and that the edge be in contact with the base material.
  • the thermal insulation layer after thermal spraying is processed and the shape of the target molded product It is desirable to carry out the finishing process prior to the formation of the intermediate layer.
  • the adhesion of the surface processed layer is excellent, and high-accuracy transferability can be obtained.
  • FIG. 1 is a cross-sectional view showing an optical element molding die according to the present embodiment.
  • FIG. 2 is an explanatory view showing the contents of each layer of an optical element molding die.
  • FIG. 3 An explanatory view showing surface roughness of each layer.
  • FIG. 4 is a cross-sectional view showing an example of a surface processed layer.
  • FIG. 5 is a cross-sectional view showing an example of an optical element molded by an optical element molding die.
  • FIG. 6 is a cross-sectional view showing another example of the surface processing layer.
  • FIG. 7 is a cross-sectional view showing another example of the optical element molding die.
  • the present invention is applied to a mold for molding an optical element for producing an optical lens, a diffractive optical element, and the like.
  • the base material 11, the bond layer 12, the heat insulating layer 13, the intermediate layer 14, and the surface tension finish layer 15 also have a downward force in the figure. It is laminated in this order.
  • the upper surface in the figure is the base surface of the formation, and the tip is offset to the negative side.
  • a groove 1 la for gripping at the time of maintenance inspection is formed.
  • the rough shape of the molded article is molded by this base material 11.
  • Bond layer 12 enhances adhesion between base material 11 and thermal insulation 13 For the purpose of These are similar to those conventionally used.
  • the thermal insulation layer 13 is formed of a ceramic material having excellent thermal insulation. This prevents the heat of the resin material from escaping to the base material 11 and being rapidly cooled during the injection molding of an optical element or the like.
  • the heat insulating layer 13 is finished to a desired shape by machining. As a result, the thickness of the heat insulating layer 13 is prevented from variation due to the manufacture. As a result, there is no sagging to the periphery, and the periphery is an edge, so that the molding transferability of the periphery is improved.
  • the intermediate layer 14 of the next layer can be made thinner.
  • the intermediate layer 14 is for enhancing the adhesion between the heat insulating layer 13 and the surface layer 15.
  • the heat insulating layer 13 is a ceramic material
  • the surface processing layer 15 is a metal material. Therefore, the intermediate layer 14 is preferably made of a material that is compatible with any of these. Therefore, as the intermediate layer 14, for example, a metal-based material, or a metal and ceramic cermet or an inclined material is used. As a result, the adhesion between the heat insulating layer 13 and the intermediate layer 14 and between each of the intermediate layer 14 and the surface calorie layer 15 is good. Therefore, the heat insulating layer 13 and the surface processed layer 15 have strong adhesion by the intermediate layer 14.
  • the side force close to the thermal insulation layer 13 is also close to the surface processing layer 15 in the thickness direction of the laminate, and the mixing ratio is changed to the side. That is, in the intermediate layer 14 of the graded material, the base material of the heat insulating layer 13 is rich on the side close to the heat insulating layer 13, and the base material of the surface working layer 15 is rich on the side close to the surface heat layer 15.
  • the intermediate layer 14 covers the heat insulating layer 13 not only on the upper surface in FIG. 1 of the heat insulating layer 13 but also on the front, back, left, and right surfaces in the drawing. Therefore, the heat insulating layer 13 is not exposed to the outside after the intermediate layer 14 is formed. Also, the edge 14 a of the intermediate layer 14 is in direct contact with the base material 11. The offset portion of the base material 11 is filled with the middle layer 14. Since the target shape is formed by the heat insulating layer 13, the intermediate layer 14 may be formed as thin as the shape can be maintained. As a result, the external force of the intermediate layer 14 can be eliminated. For this reason, the intermediate layer 14 is formed with a thickness not exceeding 200 m.
  • This surface processed layer 15 is subjected to cutting on the upper surface in FIG. 1 to form a forming surface.
  • This surface strength coating layer 15 is preferably a metal-based material.
  • non-ferrous metal such as nickel is preferred, but it may be formed of metal nitride or metal carbide or metal carbonitride.
  • the surface layer 15 covers the entire middle layer 14. Furthermore, the edge 15 c of the surface processing layer 15 is in direct contact with the base material 11.
  • the base material 11 and the surface strength finishing layer 15 are metal-based materials. For this reason, they are in close contact and there is no risk of peeling even if heat history is applied.
  • base material 11 is formed of stainless steel or the like for general molds.
  • the base material 11 was selected to have a thermal conductivity of 23 WZmk and a linear expansion coefficient of ll ⁇ 10 6 6 Zk.
  • the bond layer 12 was formed to a thickness of about 0.1 mm by plasma spraying on the base material 11 using NiCr here. As this bond layer 12, one with a thermal conductivity of 20 W / mk and a linear expansion coefficient of 15 x 10 _ 6 Zk was selected.
  • the heat insulating layer 13 is preferably made of a material having a low thermal conductivity and a coefficient of linear expansion close to that of the base material 11. Further, it is preferable that the number of pinholes after thermal spraying be small.
  • a material of the heat insulating layer 13 zircom-based, acid aluminum-based, titanium oxide, acid chromium-based, etc. can be used.
  • ZrO ′ 24 MgO was selected. This material has a low porosity of the sprayed layer and is excellent in fineness.
  • the linear expansion coefficient is close to that of the base material 11. It also has the property of being resistant to thermal shock.
  • the heat insulating layer 13 one having a thermal conductivity of 1 to 1.5 W / mk and a linear expansion coefficient of 10 to: L 1 ⁇ 10 — 6 Zk was selected. Also, because this material has a high melting temperature, it is formed by plasma spraying, which creates a high temperature plasma state. The thickness was about 0.9 mm. In addition, the thermal insulation layer 13 after thermal spraying was machined to finish the shape of the desired molded product.
  • a NiAl alloy was selected here. This material has a thermal conductivity greater than 20 WZmk and a linear expansion coefficient of 13 X 10 _ 6 Zk.
  • high-speed flame spraying HVOF spraying
  • plasma thermal spraying is also possible, but HVOF thermal spraying is preferable. This is because the surface of the intermediate layer 14 after the thermal spraying is rough and pinholes etc. are easily generated It is easy to cause defects.
  • HVOF thermal spraying when the metal particles which are the material of the intermediate layer 14 collide with the heat insulating layer 13, a part of kinetic energy is converted to thermal energy. Then, due to the mechanical force of melting and collision, a dense laminated film is formed. As a result, pinholes are less likely to occur in the surface layer 15.
  • an electroless Ni-P plating layer was selected here. Since the intermediate layer 14 completely covers the heat insulating layer 13 as described above, this electroless nickel plating process is performed on the intermediate layer 14 and the base material 11. There is no place to be done for the thermal insulation layer 13. These are all conductors unlike the thermal insulation layer 13 which is a ceramic material. As a result, it is possible to perform labeling under the same pre-processing condition, and the quality of labeling improves. In addition, the adhesion of the resin becomes good. As this surface-strength-modified layer 15, one having a thermal conductivity of 4.0 to 7.2 W / mk and a linear expansion coefficient of 11 to 12 X 10-6 Zk was used.
  • the surface roughness after formation of each layer is as shown in FIG.
  • the surface roughness of the heat insulating layer 13 is that after grinding.
  • the centerline average roughness (Ra) of the surface tension layer 15 is, and good results were obtained.
  • the surface strength finishing layer 15 formed in this way is subjected to surface corrosion according to the optical element to be manufactured.
  • the optical element molding die 10 is completed.
  • a surface processed layer 15A having a V-shaped groove can be formed by cutting with a diamond tool.
  • the surface strength completion layer 15A is shown hatched in the figure.
  • V-shaped grooves with a depth of 3 ⁇ m and a groove base angle of 65 ° are formed in parallel at 4 m intervals.
  • the desired shape may be formed by etching.
  • an optical element was manufactured using the optical element molding die 10 of the present embodiment formed as described above, and its transferability was verified.
  • a mold with a processed surface layer 15A with a V-shaped groove was used as the molding material, and molding conditions were: mold temperature 115 ° C., resin temperature 250 ° C., cooling time 60 se C , holding pressure 1 OOMPa, injection speed 200 mm Zsec.
  • the cross section of the molded article is shown in FIG.
  • the tip shape R was about 0.15 m when measured by SEM observation. From this, it can be said that a sufficiently good transferability was obtained.
  • Fig. 5 according to Fig. 4, the forming surface is shown. Shown in the lower middle.
  • good transferability was also confirmed for the binary shaped surface tension layer 15B as shown in FIG.
  • the thickness of the intermediate layer 14 is reduced, the transferability is improved. As described above, it is possible to make the intermediate layer 14 thinner by finishing the heat insulating layer 13 in a desired shape. Therefore, it is desirable that the thermal insulation layer 13 be formed thin in a range without any risk of the occurrence of exposed portions of the thermal insulation layer 13 due to thermal spraying unevenness. For example, about 10 m to 30 m is suitable. If the thickness of the intermediate layer 14 is 200 m or more, it is not preferable because peeling 'deformation due to film stress tends to occur during use.
  • the intermediate layer 14 can be replaced by a NiAl alloy to form a thermometer.
  • a cermet is formed by thermal spraying to form an intermediate layer 14.
  • the preferred material to be used is one based on the material of the heat insulating layer 13. For example, zircoa-ckel system ZrO-8MgO-35NiCr, ZrO ⁇ 8 ⁇ '25NiCr, and alumina-cket
  • aluminum-based AI O '30 (Ni20Al) can be used.
  • the intermediate layer 14 may be replaced by a NiAl alloy as a graded material.
  • the base material force of the thermal insulation layer 13 is also preferably changed to the base material of the surface strength finishing layer 15.
  • the forming method for example, several kinds of different blend ratios of the powder blend are prepared, and different blend ratios are sequentially supplied and stacked in each layer thickness stage.
  • two channels of powder feeders may be used to feed each material, and the feed ratio of each may be changed gradually.
  • the intermediate layer 14 in which the material ratio is gradually changed from Zr-Mg oxide to NiAl alloy is formed.
  • the formation of the surface processed layer 15 may be replaced by electroless nickel plating, and the metal material may be thermally sprayed directly on the heat insulating layer 13.
  • a NiAl alloy is formed by HVOF spraying.
  • the manufacturing process can be made only by the thermal spraying process, eliminating the sticking process.
  • the thermal insulation layer 13, the intermediate layer 14, and the surface tension finishing layer 15 can be formed continuously by one thermal spray machine.
  • the surface processed layer 15 is formed by thermal spraying, it is not necessary to cover the side surface of the heat insulating layer 13 with the intermediate layer 14. Also, the middle class 14 Even if it is not used, it can be used for a while.
  • the surface processed layer 15 may be formed by sputtering. If formed by sputtering, the problem of pinholes does not occur.
  • a suitable material TiN, CrN, A1N etc. can be used for nitrides, TiC, SiC etc. for carbides, DLC (diamond-like carbon), carbonitrides etc. can be used. Even in this case, it is not necessary to cover the side surface of the heat insulating layer 13 by the intermediate layer 14. In addition, even if there is no intermediate layer 14, it can be used for a while.
  • an optical element molding die 20 having a base material 21 of ship bottom shape may be used. In this way, the adhesion between the base material 21 and the heat insulating layer 13 is improved. In addition, when the contact area between the base material 21 and the intermediate layer 14 can be sufficiently secured in the peripheral portion, it is not necessary to cover the side surface of the base material 21 by the intermediate layer 14.
  • the base material 11 having a forming base surface and the heat insulating layer provided on the forming base surface of the base material 11 13 And an intermediate layer 14 provided on the heat insulating layer 13 and a surface processed layer 15 covering the intermediate layer 14.
  • the heat insulating layer 13 is a ceramic layer
  • the surface strength finishing layer 15 is a metal-based material layer
  • the intermediate layer 14 is formed of a metal or a cermet or a graded material.
  • the intermediate layer 14 has a thickness not exceeding 200 / z m. Thus, it has good transferability. Accordingly, the mold 10 for forming an optical element is excellent in the adhesion of the surface processed layer 15 and can obtain high-accuracy transferability.
  • the present embodiment is merely an example, and the present invention is not limited at all. Therefore, naturally, the present invention can be variously improved and modified without departing from the scope of the invention.
  • the materials of the above layers, the thickness of the layers, and the like are only an example, and the present invention is not limited thereto.
  • the present invention is applicable not only to optical elements but also to molds for precision members manufactured by injection molding of resin.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

La présente invention concerne un moule de métal servant à former un dispositif optique qui excelle en termes d'adhérence d'une couche traitée en surface, garantissant des prestations de transfert de haute précision. L'invention concerne un moule de métal servant à former un dispositif optique (10) ayant une surface de mise en forme servant à former un dispositif optique, lequel moule de métal comprend un matériau parent (11) ayant une surface de base de mise en forme, une couche d'isolation thermique (13) superposée sur la surface de base de mise en forme du matériau parent (11), une intercouche (14) superposée sur la couche d'isolation thermique (13) et une couche traitée en surface (15) recouvrant l'intercouche (14). Dans cette invention, hors de la surface de la couche traitée en surface (15), une partie au-dessus de la surface de base de mise en forme du matériau parent (11) constitue la surface de mise en forme. De préférence, la couche d'isolation thermique (13) est une couche de céramique, la couche traitée en surface (15) est une couche de matériau métallique, et l'intercouche (14) a une épaisseur n'excédant pas 200 µm.
PCT/JP2006/314455 2005-08-18 2006-07-21 Moule de métal servant à former un dispositif optique et son procédé de production WO2007020769A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007530927A JPWO2007020769A1 (ja) 2005-08-18 2006-07-21 光学素子成形用金型およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-237776 2005-08-18
JP2005237776 2005-08-18

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WO2007020769A1 true WO2007020769A1 (fr) 2007-02-22

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US (1) US20070040291A1 (fr)
JP (1) JPWO2007020769A1 (fr)
KR (1) KR20080038080A (fr)
CN (1) CN1915637A (fr)
TW (1) TWI310725B (fr)
WO (1) WO2007020769A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008246699A (ja) * 2007-03-29 2008-10-16 Konica Minolta Opto Inc 光学素子成形用金型及び光学素子成形用金型作成方法
JP2009274351A (ja) * 2008-05-15 2009-11-26 Mitsubishi Engineering Plastics Corp 金型組立体、射出成形方法、及び、成形品
JP2009274352A (ja) * 2008-05-15 2009-11-26 Mitsubishi Engineering Plastics Corp 金型組立体、射出成形方法、及び、成形品
JP2010052279A (ja) * 2008-08-28 2010-03-11 Toyota Boshoku Corp 成形型
WO2012008372A1 (fr) * 2010-07-12 2012-01-19 神戸セラミックス株式会社 Matrice à isolation thermique et son procédé de production
JP2014046590A (ja) * 2012-08-31 2014-03-17 Mitsubishi Engineering Plastics Corp 断熱金型
KR101462177B1 (ko) * 2007-07-30 2014-11-26 삼성전자주식회사 사출성형용 코어
JP2014233953A (ja) * 2013-06-05 2014-12-15 神戸セラミックス株式会社 断熱金型及びその製造方法

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US20100074815A1 (en) * 2006-10-31 2010-03-25 Kanji Sekihara Master and Microreactor
JP4750681B2 (ja) * 2006-12-07 2011-08-17 住友重機械工業株式会社 断熱金型、金型部品、成形機及び断熱金型の製造方法
KR101447669B1 (ko) * 2010-06-14 2014-10-06 포리프라스틱 가부시키가이샤 금형의 제조방법
US20140263943A1 (en) * 2011-09-05 2014-09-18 Polyplastics Co., Ltd Mold
TW201438863A (zh) * 2013-04-10 2014-10-16 Hon Hai Prec Ind Co Ltd 模仁及其製作方法

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JP2004175112A (ja) * 2002-11-13 2004-06-24 Maxell Hi Tec Ltd 成型用金型及びその製造方法

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JP2000135718A (ja) * 1998-11-02 2000-05-16 Asahi Chem Ind Co Ltd 複合スタンパ
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JP2004175112A (ja) * 2002-11-13 2004-06-24 Maxell Hi Tec Ltd 成型用金型及びその製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008246699A (ja) * 2007-03-29 2008-10-16 Konica Minolta Opto Inc 光学素子成形用金型及び光学素子成形用金型作成方法
KR101462177B1 (ko) * 2007-07-30 2014-11-26 삼성전자주식회사 사출성형용 코어
JP2009274351A (ja) * 2008-05-15 2009-11-26 Mitsubishi Engineering Plastics Corp 金型組立体、射出成形方法、及び、成形品
JP2009274352A (ja) * 2008-05-15 2009-11-26 Mitsubishi Engineering Plastics Corp 金型組立体、射出成形方法、及び、成形品
JP2010052279A (ja) * 2008-08-28 2010-03-11 Toyota Boshoku Corp 成形型
WO2012008372A1 (fr) * 2010-07-12 2012-01-19 神戸セラミックス株式会社 Matrice à isolation thermique et son procédé de production
JP4966437B2 (ja) * 2010-07-12 2012-07-04 神戸セラミックス株式会社 断熱金型及びその製造方法
TWI477381B (zh) * 2010-07-12 2015-03-21 Kobe Ceramics Corp 隔熱模具及其製造方法
JP2014046590A (ja) * 2012-08-31 2014-03-17 Mitsubishi Engineering Plastics Corp 断熱金型
JP2014233953A (ja) * 2013-06-05 2014-12-15 神戸セラミックス株式会社 断熱金型及びその製造方法

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Publication number Publication date
US20070040291A1 (en) 2007-02-22
CN1915637A (zh) 2007-02-21
TWI310725B (en) 2009-06-11
TW200722256A (en) 2007-06-16
KR20080038080A (ko) 2008-05-02
JPWO2007020769A1 (ja) 2009-02-19

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