Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
  • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
  • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70691—Handling of masks or workpieces
  • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment

Definitions

• the image pickup means and the exposure optical system are integrated in a direction parallel to the mounting surface of the transfer means and in a direction orthogonal to the transfer direction of the exposed object so as to correct the shift.
• the exposure object is irradiated with exposure light emitted from an exposure light source by the exposure optical system via the photomask.
• the imaging means is one in which the light receiving elements are arranged in a straight line.
• the alignment mark provided at a predetermined position on the front side in the transport direction at one end of the pattern area of the object to be exposed is imaged by the imaging means, and the alignment mark is Since the deviation between the reference position of the photomask and the reference position of the object to be exposed is corrected based on the detected output of the function, the functional pattern of the same shape is orthogonal to the transport direction in the pattern area on the object to be exposed Even if they are formed in a line at a predetermined pitch in the direction, they can be aligned without causing a pitch shift. Therefore, the overlay accuracy of the exposure pattern with respect to the functional pattern on the object to be exposed can be improved. In addition, since the exposure is performed by aligning the exposure body while being conveyed, the time for the exposure process can be shortened.
• FIG. 1 is a conceptual diagram showing an embodiment of an exposure apparatus according to the present invention.
• the transport means 1 is configured to place the color filter substrate 6 coated with a color resist on the stage 5 and transport it at a predetermined speed in the direction of arrow A shown in FIG.
• a conveyance roller (not shown) that moves 5
• a conveyance driving unit such as a motor that rotationally drives the conveyance roller
• a speed sensor that detects the conveyance speed of the stage 5
• a position detection sensor that detects a position, and the like
• An exposure optical system 2 is provided above the stage 5 of the transport means 1.
• the exposure optical system 2 irradiates the color filter substrate 6 with exposure light to form a predetermined exposure pattern.
• the exposure light source 12, the mask stage 13, the projection lens 14, and the dichroic mirror 15 and.
• the imaging means 3 On the optical path L2 deflected in a direction crossing the optical path L1 in a direction different from the optical path L1 of the exposure optical system 2 between the mask stage 13 and the projection lens 14, the imaging means 3 is Is provided.
• the image pickup means 3 picks up the pixels 9 and the alignment marks 10 of the black matrix 8 of the color filter substrate 6 shown in FIG. 2 with the position close to the exposure position by the exposure optical system 2 as the image pickup position.
• a large number of light receiving elements 18 are arranged in a straight line in a direction perpendicular to the conveying direction indicated by arrow A in FIG. 3 within a plane parallel to the placement surface la of the conveying means 1.
• the storage unit 26 stores, for example, the LUT for detecting the reference position S1 on the color filter substrate 6, the cell number of the reference light receiving element 18s of the imaging means 3, and the like. Furthermore, the calculation unit 27 detects the reference light receiving element 18s set in advance in the image pickup means 3 and the alignment mark 10 of the color filter substrate 6 having a predetermined positional relationship with the reference position S2 of the photomask 17. The amount of deviation from the light receiving element 18 ⁇ is calculated. And the control part 28 controls drive of said each part appropriately.
• the control unit 4 is activated, the illumination light source 20 is turned on by the illumination light source driving unit 25, and the imaging unit 3 starts imaging.
• the transport means 1 is in a standby state with a color filter substrate 6 coated with a color resist placed on a predetermined position on the stage 5.
• an exposure start switch (not shown) is turned on, the stage 5 of the transport unit 1 is controlled by the transport unit controller 24 and starts moving in a direction indicated by an arrow ⁇ ⁇ at a predetermined speed.
• FIG. 4 shows exposure deviation of the exposure pattern with respect to a normal color filter substrate 6 in which the alignment mark 10 is not formed.
• the control means 4 is acquired by the imaging means 3.
• the image data of the image and the LUT read from the storage unit 26 are compared by the image processing unit 23. When the two match, the upper left corner of the pixel 9 is determined as the reference position S1.
• the alignment mechanism 19 may be controlled so that the reference light receiving element 18s that has a positional relationship and is preset in the imaging means 3 is aligned with the upper left corner of the pixel 9b. For this reason, as shown in the figure, there is a possibility that the striped exposure pattern 29 is formed at a position deviated from the target position force.
• the color filter substrate 6 used in the exposure apparatus of the present invention extends in the direction of arrow A to a predetermined position at one end of the pattern region 7 where the black matrix 8 is formed.
• FIG. 5 (a) the elongated alignment mark 10 is formed and transported starting from the side on which the alignment mark 10 is formed.
• the alignment mark 10 is imaged by the imaging means 3.
• the exposure light source drive unit 21 is driven, the exposure light source 12 is turned on, and exposure is started.
• an alignment confirmation marker is provided corresponding to each pixel 9 of the black matrix 8 of the color filter substrate 6 and is shorter than the alignment mark 10.
• the image 11 is picked up by the image pickup means 3.
• the control means 4 detects the alignment mark 10 and the same number of alignment confirmation marks 11 arranged on the left and right of the alignment mark 10.
• the cell number of each received light receiving element 18 is read and the average value thereof is calculated by the calculating unit 27 and the result is compared with the cell number of the reference light receiving element 18s. At this time, if the two match, it is determined that the alignment has been performed correctly.
• the alignment mark 10 and the alignment confirmation mark 11 are formed in an elongated shape in the direction of arrow A as shown in FIG. Alternatively, it may be rectangular or linear as long as it can be detected by the light receiving element 18 of the imaging means 3 or may be formed to have a width substantially equal to the width of the pixel 9 of the black matrix 8. In the above description, the case where there are one alignment mark 10 is described. However, the present invention is not limited to this, and a plurality of alignment marks 10 may be formed at predetermined intervals.
• the imaging unit 3 is disposed so as to capture a position close to the exposure position by the exposure optical system 2 .
• the present invention is not limited to this, and the imaging unit 3 May be arranged so as to image the front side in the transport direction of the exposure position by the exposure optical system 2.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Multimedia (AREA)
• Health & Medical Sciences (AREA)
• Environmental & Geological Engineering (AREA)
• Epidemiology (AREA)
• Public Health (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

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Citations (3)

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• 2005
  • 2005-08-05 JP JP2005227675A patent/JP4309874B2/ja active Active
• 2006
  • 2006-07-24 KR KR1020087003346A patent/KR101308691B1/ko active IP Right Grant
  • 2006-07-24 WO PCT/JP2006/314545 patent/WO2007018029A1/ja active Application Filing
  • 2006-07-24 CN CN2006800288313A patent/CN101238416B/zh active Active
  • 2006-07-28 TW TW95127838A patent/TWI391796B/zh not_active IP Right Cessation
• 2008
  • 2008-10-22 HK HK08111633.2A patent/HK1119784A1/xx unknown

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