WO2006051700A1 - 液晶表示装置用基板の製造方法 - Google Patents
液晶表示装置用基板の製造方法 Download PDFInfo
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- WO2006051700A1 WO2006051700A1 PCT/JP2005/019894 JP2005019894W WO2006051700A1 WO 2006051700 A1 WO2006051700 A1 WO 2006051700A1 JP 2005019894 W JP2005019894 W JP 2005019894W WO 2006051700 A1 WO2006051700 A1 WO 2006051700A1
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- tft substrate
- substrate
- exposure
- reference position
- liquid crystal
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136222—Colour filters incorporated in the active matrix substrate
Definitions
- the present invention relates to a method for manufacturing a substrate for a liquid crystal display device in which a color filter or a black matrix is directly formed on a TFT substrate in which a thin film transistor is formed for each pixel region. Specifically, the TFT substrate is conveyed at a predetermined speed. A substrate for a liquid crystal display that attempts to accurately form a predetermined exposure pattern at a predetermined position on the TFT substrate by detecting the reference position set in advance in the imaged pixel area and controlling the exposure light irradiation timing. This relates to the manufacturing method.
- a liquid crystal display device has a configuration in which liquid crystal is sealed between a pair of transparent substrates arranged opposite to each other.
- one transparent substrate is a TFT substrate in which a pixel electrode and a thin film transistor are formed in an arrayed pixel region, and wiring for driving the thin film transistor is disposed around the pixel region.
- the other transparent substrate forms a black matrix corresponding to the thin film transistor and the wiring, covers a pixel of the black matrix, forms a color filter, and forms a common electrode on the black matrix and the color filter. It becomes a substrate.
- the line width of the black matrix is generally designed wide in consideration of the alignment error of the pair of transparent substrates. Therefore, in the conventional liquid crystal display device, the aperture ratio of the pixels of the black matrix is lowered, and it is difficult to make the pixel area fine.
- Patent Document 1 JP 2004-70196 A
- a method for manufacturing a substrate for a liquid crystal display device includes providing a thin film transistor for each pixel region and providing a wiring for driving the thin film transistor in the periphery of the pixel region.
- the exposure light irradiation timing is controlled with reference to a color filter or black matrix exposure pattern at a predetermined position on the TFT substrate. Step.
- the step of imaging the pixel region is performed by an imaging unit having an imaging position in front of the formation position of the exposure pattern in the transport direction of the TFT substrate.
- the imaging unit images the front side of the exposure pattern formation position in the direction of transport of the TFT substrate.
- the step of detecting the reference position binarizes the captured image of the pixel area, and the binarized image data of the pixel area and the preset reference position This is done by comparing the image data corresponding to and detecting the part where both data match.
- the captured image of the pixel area is binarized, the image data of the binarized pixel area is compared with image data corresponding to a preset reference position, and both data are The matched part is detected as a reference position.
- the pixel region is imaged while the TFT substrate provided with the thin film transistor and the wiring is conveyed at a predetermined speed, and a reference position preset in the imaged pixel region is detected.
- a color filter or black matrix exposure pattern can be accurately formed at a predetermined position on the TFT substrate. it can. Therefore, it is possible to realize a high-definition liquid crystal display device by reducing the pixel area while narrowing the line width of the black matrix and suppressing the decrease in aperture ratio.
- FIG. 1 is a conceptual diagram showing a configuration of an exposure apparatus used for carrying out a method for manufacturing a substrate for a liquid crystal display device according to the present invention.
- FIG. 2 is an explanatory view showing the relationship between the imaging means of the exposure apparatus, the opening of the mask, and the exposed area of the pixel area.
- FIG. 4 is a block diagram showing the second half of the processing system in the internal configuration of the image processing unit of the exposure apparatus.
- FIG. 5 is a plan view for explaining a manufacturing process of the method for manufacturing a substrate for a liquid crystal display device according to the present invention.
- FIG. 6 is a cross-sectional view illustrating the manufacturing process.
- FIG. 7 is a flowchart for explaining an exposure procedure by the exposure apparatus.
- FIG. 8 is an explanatory diagram showing a method for binarizing the output of the ring buffer memory of the image processing unit.
- FIG. 9 is an explanatory diagram showing an image of a first reference position preset in the pixel region of the TFT substrate and a lookup table thereof.
- FIG. 10 is an explanatory diagram showing an image of a second reference position preset in the pixel region of the TFT substrate and a look-up table thereof.
- FIG. 13 is a plan view showing an example of a black matrix mask formed on the TFT substrate.
- FIG. 14 is an explanatory view showing another configuration example of an exposure apparatus used when forming the black matrix.
- Imaging means
- FIG. 1 is a conceptual diagram showing a configuration of an exposure apparatus used for carrying out a method for manufacturing a substrate for a liquid crystal display device according to the present invention.
- This exposure apparatus irradiates exposure light from an exposure optical system and exposes a TFT of a color filter or black matrix mask interposed on the path of the exposure optical system on a TFT substrate.
- the image pickup means 2, the transport means 3, and the control means 4 are provided.
- the exposure optical system 1 exposes a predetermined color filter or black matrix pattern by irradiating the TFT substrate 6 coated with a color filter or a black matrix photosensitive coloring resist (photosensitive material) with exposure light.
- the light source 7 is a lamp that emits ultraviolet light, for example, and is controlled by the control means 4 described later. It is a flash lamp that emits light intermittently when controlled.
- the mask stage 8 is used to place and hold the mask 10 and is interposed on an optical path between the light source 7 and an imaging lens 9 described later.
- the imaging lens 9 forms an image of the opening 10a of the mask 10 on the TFT substrate 6 and is disposed so as to face the TFT substrate 6.
- the mask 10 is formed by forming a rectangular opening 10a that is parallel to the surface of the TFT substrate 6 and that is long in a direction perpendicular to the moving direction (arrow A direction). As shown in FIG.
- the light source 7 may be a normal ultraviolet lamp instead of a flash lamp.
- the intermittent irradiation of the exposure light may be performed, for example, by providing a shutter in front of the light source 7 in the irradiation direction and controlling the opening and closing of the shutter.
- an image pickup means 2 is provided with the front side of the exposure position by the exposure optical system 1 in the moving direction (arrow A direction) of the TFT substrate 6 as an image pickup position.
- the imaging means 2 images a pixel region formed in advance on the TFT substrate 6 and is, for example, a line CCD in which light receiving elements are arranged in a line.
- the imaging position of the imaging unit 2 and the exposure position by the exposure optical system 1 are separated by a predetermined distance D, and the imaging unit 2 captures the pixel area 11.
- the pixel area 11 reaches the exposure position after a predetermined time.
- the said distance D is so preferable that it is small.
- the movement error of the TFT substrate 6 can be reduced, and the exposure position can be more accurately positioned with respect to the pixel region 11.
- the center of the opening 10a of the mask 10 coincides with the center of the optical axis of the imaging lens 9, and in the transport direction (arrow A direction) of the TFT substrate 6, the imaging means 2 Is aligned with the imaging center.
- illumination means (not shown) is provided in the vicinity of the imaging means 2 so that the imaging area of the imaging means 2 can be illuminated.
- This transfer means 3 has a TFT substrate 6 placed on the stage so that it can move in the XY-axis direction.
- a transfer motor (not shown) is controlled by the control means 4 to move the stage 3a. It has become.
- the X-axis direction coincides with the transport direction (arrow A direction) of the TFT substrate 6, and the Y-axis direction is a direction orthogonal thereto.
- the transport means 3 is not shown in the figure.
- a position detection sensor such as an encoder or a linear sensor and a speed sensor are provided, and the output is fed back to the control means 4 to enable position control and speed control.
- alignment means 5 is provided in the transport means 3, and a deviation between the exposure position for the pixel row and the exposure position of the opening 10a of the mask 10 is calculated based on the reference position, and the stage 3a
- the rotation angle of ⁇ and the position in the Y-axis direction can be moved so that the above deviation can be corrected.
- the angle ⁇ of the stage 3a can be detected by an angle sensor.
- a control unit 4 is provided in connection with the light source 7, the imaging unit 2, and the transport unit 3.
- the control unit 4 controls the entire apparatus to be appropriately driven.
- the image processing unit 13 detects a reference position set in advance in the pixel area 11 captured by the imaging unit 2, and a pixel.
- storage unit 14 for storing CAD data of area 11 and data such as a lookup table corresponding to the reference position, distance D between the imaging position and exposure position, and moving speed V of TFT substrate 6
- the time t during which the pixel area 11 moves from the imaging position to the exposure position is calculated, and the exposure position (hereinafter referred to as “exposed area”) obtained based on the reference position and the mask 10 are calculated.
- a calculation unit 15 that calculates a positional deviation with respect to the opening 10a of the light source, a lamp controller 16 that controls the irradiation timing of the exposure light of the light source 7 with reference to the reference position, and a stage 3a of the conveying means 3 are Drive at a predetermined speed in the axial direction
- the transporting unit controller 1 7 for driving the Araimento means 5 provided in the feed unit 3, and a control unit 18 for controlling integrated the entire apparatus.
- FIG. 3 and FIG. 4 are block diagrams showing an example of the configuration of the image processing unit 13.
- the image processing unit 13 includes, for example, three ring buffer memories 19A, 19B, and 19C connected in parallel, and each of the ring buffer memories 19A, 19B, and 19C connected in parallel.
- Left end determination circuit that outputs the left end determination result when both data match. And the output data of the nine line buffer memories 20A, 20B, and 20C, and a look-up table of image data corresponding to the second reference position that defines the right end of the exposed area obtained from the storage unit 14 shown in FIG. (Hereinafter referred to as “LUT for right end”) and a right end determination circuit 23 for outputting a right end determination result when both data match.
- LUT left end determination circuit
- the image processing unit 13 inputs the left end determination result and counts the number of coincidence of image data corresponding to the first reference position, and the counting circuit 24A. Comparing the output of the circuit 24A with the leftmost pixel number obtained from the storage unit 14 shown in FIG. 1 and comparing both numerical values, the comparison circuit 25A outputs a left end designation signal to the storage unit 14, and the right end
- the counting circuit 24B that counts the number of coincidence of image data corresponding to the second reference position by inputting the judgment result, and comparing the output of the counting circuit 24B and the rightmost pixel number obtained from the storage unit 14 are both numerical values.
- the counting circuits 24A and 24B are reset by the reading start signal when the reading operation by the imaging means 2 is started. Further, the left end pixel counting circuit 26 is reset by an exposure end signal when the exposure for the predesignated region is completed.
- a known technique is applied to form TFTs 12 and pixel electrodes 28 in an array pixel region 11 on a TFT substrate. Then, the gate electrode line (horizontal wiring), the data electrode line (vertical wiring), and the wiring 29 which drive the TFT 12 are arranged around the pixel region, and the TFT substrate 6 is formed.
- a planarization layer 30 made of, for example, an organic film is formed so as to cover the TFT substrate 6.
- step S1 an image of the pixel area 11 is acquired by the imaging means 2.
- the acquired image data is captured and processed in the three ring buffer memories 19A, 19B, and 19C of the image processing unit 13 shown in FIG.
- the latest three data are output from each ring buffer memory 19A, 19B, 19C.
- the previous data is output from the ring buffer memory 19A
- the previous data is output from the ring buffer memory 19B
- the latest data is also output from the ring buffer memory 19C.
- an image of a 3 ⁇ 3 CCD pixel region is arranged on the same clock (time axis) by three line buffer memories 20A, 20B, and 20C. The result is obtained as an image as shown in FIG.
- step S2 the reference positions of the left and right ends of the exposure area are detected. Specifically, the detection of the reference position is performed in the left end determination circuit 22 by comparing the binarized data with the data of the left end LUT that also obtained the storage unit 14 force shown in FIG.
- the first reference position for designating the left end of the exposure area is set at the intersection of the wiring 29 at the upper left corner of the pixel area 11 as shown in FIG. 9 (a)
- the left end LUT is as shown in FIG. 5B, and the data of the left end LUT at this time is “111100 100”. Therefore, the binarized data is compared with the data “111100100” of the left-end LUT, and when the two data match, the image data acquired by the imaging means 2 is the first base data.
- the left end determination circuit 22 outputs the left end determination result. As shown in FIG. 12, for example, when five pixel regions 11 are arranged, the upper left corner of each pixel region 11 corresponds to the first reference position.
- the number of coincidences is incremented in the counting circuit 24A shown in FIG. Then, the count number is compared with the left end pixel number obtained from the storage unit 14 shown in FIG. 1 by the comparison circuit 25A, and when both numerical values match, a left end designation signal is output to the storage unit 14.
- the first pixel area 11 is defined as the leftmost pixel number
- the upper left corner of the pixel area 11 is set as the first reference position.
- the element address in the line CCD of the imaging means 2 corresponding to the first reference position, for example EL, is stored in the storage unit 14.
- the binary key data is compared with right end LUT data obtained from the storage unit 14 shown in FIG.
- the second reference position for designating the right end of the exposed area is set at the intersection of the wiring 29 at the upper right corner of the pixel area 11 as shown in FIG.
- the right-end LUT is as shown in (b) of the figure, and the data of the right-end LUT at this time is “111001001”. Therefore, the binary key data is compared with the data “111001001” of the right end LUT, and when the two data match, the image data acquired by the imaging means 2 is the reference position at the right end of the exposed area.
- the right end determination circuit 23 outputs the right end determination result. Similar to the above, when five pixel regions 11 are arranged as shown in FIG. 12, for example, the upper right corner of each pixel region 11 corresponds to the second reference position.
- the number of coincidences is incremented in the counting circuit 24B shown in FIG. Then, the count number is compared with the right end pixel number obtained from the storage unit 14 shown in FIG. 1 by the comparison circuit 25B, and when both numerical values match, a right end designation signal is output to the storage unit 14.
- the fifth pixel region 11 is defined as the rightmost pixel number
- the upper right corner of the pixel region 11 is set as the second reference position.
- the element address, for example EL, in the line CCD of the imaging means 2 corresponding to the second reference position is stored in the storage unit 14.
- step S 3 the inclination ⁇ of the TFT substrate 6 with respect to the transport direction is calculated based on the detection times t 1 and t 2 of the first reference position and the second reference position.
- the distance from the position is based on the element address EL of the imaging means 2 corresponding to the first reference position and the element address EL of the imaging means 2 corresponding to the second reference position as shown in FIG.
- step S 4 an intermediate position between the first reference position and the second reference position is calculated by the calculation unit 15. Specifically, the element address EL of the image pickup means 2 corresponding to the first reference position read from the storage unit 14 and the area of the image pickup means 2 corresponding to the second reference position.
- the intermediate position is (EL + EL
- step S5 it is determined whether or not the intermediate position obtained in step S4 matches the imaging center (element address EL) of the imaging means 2. Where "NO"
- step S5 Move the TFT substrate 6 in the direction indicated by arrow ⁇ ⁇ .
- the center position of the exposure area matches the imaging center of the imaging means 2 (or the central position of the opening 1 Oa of the mask 10). Then, the process proceeds to step S7.
- step S5 On the other hand, if “YES determination” is determined in step S5, the process also proceeds to step S7.
- step S 7 it is determined whether or not the exposure area of the pixel area 11 is set to the exposure position of the exposure optical system 1. This determination is based on the detection time t of the first reference position stored in the storage unit 14, the width W and the transport speed V of the pixel region 11 in the transport direction shown in FIG.
- step S9 the leftmost pixel number n is counted by the leftmost pixel counting circuit 26 shown in FIG. Then, the process proceeds to step S10, in which the leftmost pixel number n is set in advance and compared with the exposure end pixel column number N stored in the storage unit 14 by the comparator 27, and it is determined whether or not the two values match. Is done.
- step S10 If "NO determination" is determined in step S10, the process returns to step S1 and proceeds to the operation for detecting the next reference position. In this case, the counting circuits 24A and 24B shown in FIG.
- step S 10 all exposure to a predetermined area of the TFT substrate 6 is completed, and the left end pixel counting circuit 26 is reset by the exposure end signal shown in FIG. . Then, the transport means 3 returns the stage 3a to the start position at a high speed.
- the stage 3a is moved by a predetermined distance in the Y-axis direction, and the step S1 is performed.
- ⁇ S10 is executed again to expose the area adjacent to the exposed area.
- a plurality of the exposure optical system 1 and the imaging means 2 may be arranged in a row in the Y-axis direction so that the entire width of the TFT substrate 6 can be exposed once. Further, when the imaging area by the imaging means 2 is narrow relative to the exposed area, a plurality of imaging means 2 may be installed side by side in the radial direction.
- steps S1 to S10 have been described as a series of operations.
- the detection of the reference position is performed in parallel with the execution of the above steps, and the detection data is stored in the storage unit 14 as needed.
- the ⁇ adjustment of the TFT substrate 6 in step S3 and the Y-axis adjustment of the TFT substrate 6 in step S6 are performed by reading out the necessary data from the storage unit 14 force and the next exposure position of the TFT substrate 6 next. It is executed within the time to move to the exposure position.
- a positive photosensitive black resist is applied on the color filter.
- the photosensitive black resist photosensitive material
- the mask 10 of the black matrix 32 to be used has openings 10a arranged in a horizontal line corresponding to the pixel area 11 of the exposed area.
- the photosensitive black resist is applied so as to cover the TFT substrate 6, the pixel region 11 cannot be imaged from above the substrate.
- an exposure apparatus as shown in FIG.
- an image pickup means 2 is provided below the stage 3a so that the pixel region 11 can be imaged through the substrate from below the TFT substrate 6.
- the exposure procedure is performed in the same manner as in the third step. If exposure is completed in this way, development is performed and then main baking is performed, a liquid crystal display device in which a black matrix 32 is formed on a color filter as shown in FIGS. 5 (c) and 6 (d). A substrate is produced.
- the black matrix 32 is not limited to the one using a photosensitive black resist, and may be a metal film such as Cr, for example.
- a Cr film is formed on the color filters 31R, 31G, and 31B by, for example, sputtering, and a photoresist is applied on the Cr film.
- a Cr black matrix 32 can be formed by creating a resist pattern of the black matrix 32 using the exposure apparatus and etching the Cr film using the resist pattern as a mask.
- the pixel region 11 is imaged while the TFT substrate 6 is conveyed at a predetermined speed, and the imaged pixel region 11 is preset.
- the exposure pattern of the color filter and the black matrix can be accurately formed at a predetermined position of the TFT substrate 6. be able to.
- the exposure apparatus Even if the exposure apparatus is shifted, the pixel area 11 is imaged while the TFT substrate 6 is conveyed at a predetermined speed, a reference position preset in the imaged pixel area 11 is detected, and the reference area is detected.
- the exposure pattern of the color filter and the black matrix can be accurately formed at a predetermined position on the TFT substrate 6.
- the exposure apparatus is not limited to the one using a mask.
- the color filter 31R, 31G, 31B or black is scanned on the TFT substrate 6 by scanning a laser beam or driving a micromirror array.
- the pattern of the matrix 32 may be directly exposed.
- the imaging unit 2 images the pixel area 11 to detect a reference position preset in the pixel area 11 and performs exposure based on the reference position. Any exposure apparatus to be controlled may be used.
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020077013091A KR101143058B1 (ko) | 2004-11-12 | 2005-10-28 | 액정 표시 장치용 기판의 제조 방법 |
US11/798,287 US7812920B2 (en) | 2004-11-12 | 2007-05-11 | Production method of substrate for liquid crystal display using image-capturing and reference position detection at corner of pixel present in TFT substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004328322A JP4731886B2 (ja) | 2004-11-12 | 2004-11-12 | 液晶表示装置用基板の製造方法 |
JP2004-328322 | 2004-11-12 |
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US11/798,287 Continuation US7812920B2 (en) | 2004-11-12 | 2007-05-11 | Production method of substrate for liquid crystal display using image-capturing and reference position detection at corner of pixel present in TFT substrate |
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WO2006051700A1 true WO2006051700A1 (ja) | 2006-05-18 |
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PCT/JP2005/019894 WO2006051700A1 (ja) | 2004-11-12 | 2005-10-28 | 液晶表示装置用基板の製造方法 |
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US (1) | US7812920B2 (ja) |
JP (1) | JP4731886B2 (ja) |
KR (1) | KR101143058B1 (ja) |
CN (1) | CN100517009C (ja) |
TW (1) | TWI399576B (ja) |
WO (1) | WO2006051700A1 (ja) |
Cited By (1)
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US8451426B2 (en) | 2006-06-07 | 2013-05-28 | V Technology Co., Ltd. | Exposure method and exposure apparatus |
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US8456586B2 (en) * | 2009-06-11 | 2013-06-04 | Apple Inc. | Portable computer display structures |
US8408780B2 (en) | 2009-11-03 | 2013-04-02 | Apple Inc. | Portable computer housing with integral display |
US8743309B2 (en) | 2009-11-10 | 2014-06-03 | Apple Inc. | Methods for fabricating display structures |
US9143668B2 (en) | 2010-10-29 | 2015-09-22 | Apple Inc. | Camera lens structures and display structures for electronic devices |
US8467177B2 (en) | 2010-10-29 | 2013-06-18 | Apple Inc. | Displays with polarizer windows and opaque masking layers for electronic devices |
CN105223789A (zh) * | 2014-06-24 | 2016-01-06 | 深圳莱宝高科技股份有限公司 | 彩色滤光片和显示装置制作方法 |
CN108564560B (zh) * | 2017-12-29 | 2021-05-11 | 深圳市华星光电半导体显示技术有限公司 | 基于色阻颜色的对位方法及对位系统 |
GB2581466A (en) * | 2018-07-04 | 2020-08-26 | Flexenable Ltd | Control component for optoelectronic device |
US11838432B2 (en) | 2019-12-03 | 2023-12-05 | Apple Inc. | Handheld electronic device |
US11637919B2 (en) | 2019-12-03 | 2023-04-25 | Apple Inc. | Handheld electronic device |
US12003657B2 (en) | 2021-03-02 | 2024-06-04 | Apple Inc. | Handheld electronic device |
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- 2004-11-12 JP JP2004328322A patent/JP4731886B2/ja not_active Expired - Fee Related
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2005
- 2005-10-28 CN CNB2005800460165A patent/CN100517009C/zh not_active Expired - Fee Related
- 2005-10-28 KR KR1020077013091A patent/KR101143058B1/ko active IP Right Grant
- 2005-10-28 WO PCT/JP2005/019894 patent/WO2006051700A1/ja active Application Filing
- 2005-11-04 TW TW094138694A patent/TWI399576B/zh not_active IP Right Cessation
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2007
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Also Published As
Publication number | Publication date |
---|---|
US20070211206A1 (en) | 2007-09-13 |
US7812920B2 (en) | 2010-10-12 |
JP2006139040A (ja) | 2006-06-01 |
KR101143058B1 (ko) | 2012-05-08 |
TWI399576B (zh) | 2013-06-21 |
JP4731886B2 (ja) | 2011-07-27 |
KR20070086002A (ko) | 2007-08-27 |
CN100517009C (zh) | 2009-07-22 |
TW200615638A (en) | 2006-05-16 |
CN101099106A (zh) | 2008-01-02 |
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