WO2007018029A1

WO2007018029A1 - Exposure device and object to be exposed

Info

Publication number: WO2007018029A1
Application number: PCT/JP2006/314545
Authority: WO
Inventors: Koichi Kajiyama; Yoshio Watanabe
Original assignee: V Technology Co., Ltd.
Priority date: 2005-08-05
Filing date: 2006-07-24
Publication date: 2007-02-15
Also published as: JP2007041447A; KR101308691B1; TW200707139A; CN101238416A; KR20080032175A; JP4309874B2; CN101238416B; TWI391796B; HK1119784A1

Abstract

A color filter substrate (6) having an alignment mark is placed on a predetermined position of one end of a pattern region set on a surface. The color filter substrate (6) is conveyed by convey means (1) with the alignment mark ahead. Imaging means (3) images the alignment mark and a pixel. Control means (4) calculates a difference between a reference position on the color filter substrate (6) according to the alignment mark detection output obtained by the imaging means (3) and a reference position preset on a photo-mask (17) of an exposure optical system (2), moves the imaging means (3) and the exposure optical system (2) as a unitary block in a direction vertical to the convey direction of the color filter substrate (6) within a plane parallel to the surface of the convey means (1) on which the color filter substrate is placed, and applies exposure light emitted from an exposure light source (12) via the photo-mask (17) to the color filter substrate (6).

Description

Specification

Exposure apparatus and object to be exposed

Technical field

TECHNICAL FIELD [0001] The present invention relates to an exposure apparatus that mounts and conveys an object to be exposed and exposes it through a photomask, and more specifically, in a direction parallel to the mounting surface and in a direction orthogonal to the conveyance direction. The exposure apparatus and the exposure object are designed to correct the misalignment between the photomask and the exposure object, improve the overlay accuracy of the functional pattern on the exposure object and the exposure pattern, and reduce the exposure processing time. It is related.

Background art

In a conventional exposure apparatus, an alignment mark provided at a corner or the like of an object to be exposed (hereinafter referred to as “color filter substrate”) and an alignment mark provided on a photomask, Exposure is performed after the color filter substrate and photomask are aligned, and the entire surface of the color filter substrate is exposed using a large photomask or a small number of exposures. There are known a method (for example, see Patent Document 1) and a method for dividing and exposing a color filter substrate using a small photomask (for example, see Patent Document 2).

Patent Document 1: Japanese Patent Laid-Open No. 09-127702

Patent Document 2: Japanese Patent Laid-Open No. 2003-43939

Disclosure of the invention

Problems to be solved by the invention

[0003] However, in such a conventional exposure apparatus, in particular, the exposure apparatus described in Patent Document 1 has an advantage that it takes less time to align the color filter substrate and the photomask. However, there is a problem that it is difficult to manufacture the photomask with high accuracy, and that the photomask is obscured, it takes time and effort to adjust the gap between the photomask and the color filter substrate. Therefore, it has been difficult to improve the overlay accuracy between the pixel (functional pattern) portion of the color filter substrate and the exposure pattern.

[0004] In addition, the exposure apparatus described in Patent Document 2 takes alignment according to the number of divisions. In addition to the increase in the number of times, the overall exposure processing time is increased, and by adding alignment marks to the pixel (functional pattern) portion of the color filter substrate, there is a problem that part of the pixel is crushed. It was.

[0005] Therefore, the present invention addresses such problems, improves the overlay accuracy of the functional pattern on the object to be exposed and the exposure pattern, and shortens the exposure processing time. And an object to be exposed.

Means for solving the problem

[0006] In order to achieve the above object, an exposure apparatus according to the present invention has a large number of functional patterns formed in a pattern area set on the surface, and at least one key is formed at a predetermined position on one end side of the pattern area. A to-be-exposed body on which the alignment mark is formed, and a transport means for transporting the to-be-exposed body starting from the side on which the alignment mark is formed; and disposed above the transport means, Exposure light source power An exposure optical system for irradiating the object to be exposed through a photomask mounted on a mask stage with the exposure light to be emitted, and a plane parallel to the mounting surface of the object to be exposed of the transport means And a plurality of light receiving elements arranged side by side along the moving direction, which can be moved integrally with the exposure optical system in a direction orthogonal to the conveying direction of the exposed object. Body function patterns and alignment markers A deviation between a reference position on the object to be exposed and a reference position set in advance on the photomask based on the detection output of the alignment mark acquired by the imaging means. And a control means for moving the exposure optical system and the imaging means so as to correct the deviation.

[0007] With such a configuration, an exposure body on which at least one alignment mark is formed is placed at a predetermined position at one end of a pattern area where a large number of functional patterns are formed, and the above-described transporting means performs the above operation. A direction in which the object to be exposed is transported starting from the side on which the alignment mark is formed, and a direction perpendicular to the transport direction of the object to be exposed in a plane parallel to the mounting surface of the object to be exposed of the transport means The alignment mark and the functional pattern are imaged by an imaging means in which a large number of light receiving elements are arranged in a straight line along the line, and the control mark is used to detect and output the alignment mark acquired by the imaging means. Based on the reference position on the object to be exposed and the reference position preset on the photomask placed on the mask stage of the exposure optical system, The image pickup means and the exposure optical system are integrated in a direction parallel to the mounting surface of the transfer means and in a direction orthogonal to the transfer direction of the exposed object so as to correct the shift. The exposure object is irradiated with exposure light emitted from an exposure light source by the exposure optical system via the photomask.

[0008] The imaging means is one in which the light receiving elements are arranged in a straight line.

. As a result, the imaging means in which the light receiving elements are arranged in a straight line captures the alignment mark of the object to be exposed and the functional pattern of the pattern area.

[0009] Further, the imaging means is arranged to image the front side in the transport direction of the exposure position by the exposure optical system. As a result, the imaging unit images the front side of the exposure position in the transport direction by the exposure optical system.

[0010] Further, the exposure optical system includes a projection lens that is provided between the mask stage and the transport unit and projects a mask pattern formed on the photomask onto the object to be exposed. It is. As a result, the mask pattern formed on the photomask is projected onto the object to be exposed by the projection lens provided between the mask stage and the conveying means.

[0011] Further, the imaging means is disposed on an optical path deflected in a direction different from the optical path of the exposure optical system between the mask stage and the projection lens. Thus, the alignment mark and function of the object to be exposed by the imaging means disposed on the optical path deflected in a direction different from the optical path of the exposure optical system between the mask stage on which the photomask is placed and the projection lens Image the pattern.

Further, the control means has a predetermined positional relationship with a reference position of the photomask, and a light receiving element that detects a reference light receiving element preset in the imaging means and an alignment mark of the object to be exposed Is calculated, and the imaging means and the exposure optical system are moved so that the amount of deviation becomes zero. As a result, the control means calculates the amount of deviation between the reference light receiving element that has a predetermined positional relationship with the reference position of the photomask and is set in advance in the imaging means and the light receiving element that has detected the alignment mark of the object to be exposed. Then, the image pickup means and the exposure optical system are moved together so that the amount of deviation becomes the opening.

[0013] In addition, an object to be exposed according to the present invention is an object to be exposed in which exposure light is irradiated through a photomask while an exposure pattern having a predetermined shape is formed at a predetermined position while being conveyed in one direction. Thus, a large number of functional patterns formed in the pattern area set on the surface, a predetermined position on one end side of the pattern area, a reference position preset in the pattern area, and a preset in the photomask And at least one alignment mark formed to correct the positional deviation from the reference position and take the alignment.

[0014] With such a configuration, at least one alignment mark formed in a predetermined position on one end side of the non-turn area where a large number of functional patterns are formed while being conveyed in one direction is preset in the pattern area. The alignment is corrected by correcting the positional deviation between the reference position set in advance and the reference position set in advance on the photomask, and an exposure pattern is formed by irradiating the pattern area set on the surface with exposure light through the photomask. To do.

[0015] Further, alignment confirmation marks for confirming the alignment state are formed next to the alignment marks at the same intervals as the functional patterns arranged in the pattern area. As a result, the alignment state is confirmed by alignment confirmation marks formed at the same intervals as the functional patterns arranged in the pattern area side by side.

[0016] Then, it is transported with the side on which the alignment mark is formed leading.

Thereby, the alignment mark is first detected by the image pickup means and the alignment is adjusted. The invention's effect

[0017] According to the invention of claim 1, the alignment mark provided at a predetermined position on the front side in the transport direction at one end of the pattern area of the object to be exposed is imaged by the imaging means, and the alignment mark is Since the deviation between the reference position of the photomask and the reference position of the object to be exposed is corrected based on the detected output of the function, the functional pattern of the same shape is orthogonal to the transport direction in the pattern area on the object to be exposed Even if they are formed in a line at a predetermined pitch in the direction, they can be aligned without causing a pitch shift. Therefore, the overlay accuracy of the exposure pattern with respect to the functional pattern on the object to be exposed can be improved. In addition, since the exposure is performed by aligning the exposure body while being conveyed, the time for the exposure process can be shortened.

[0018] According to the invention of claim 2, since the light receiving elements are arranged in a straight line, it is possible to identify one light receiving element that has detected the alignment mark of the object to be exposed. And alignment control becomes easy.

[0019] Further, according to the invention of claim 3, since the image pickup means images the front side of the exposure position in the transport direction, the image is taken by the image pickup means before exposure is performed by the exposure optical system. The alignment marks and function patterns can be imaged and aligned. Therefore, the present invention can also be applied to an apparatus that exposes a photomask close to an object to be exposed.

[0020] According to the invention of claim 4, since the exposure optical system is provided with the projection lens, the photomask and the object to be exposed can be arranged apart from each other. Therefore, there is no risk that the photoresist will adhere to the photomask and become dirty or damaged.

[0021] Further, according to the invention of claim 5, since the imaging means is disposed on the optical path deflected in a direction different from the optical path of the exposure optical system, the imaging means affects the optical path of the exposure optical system. The exposure position by the exposure optical system and the image pickup position by the image pickup means can be brought close to each other without affecting. Therefore, the imaging of the functional pattern by the imaging means and the exposure by the exposure optical system can be performed in substantially real time, and the overlay accuracy of the exposure pattern with respect to the functional pattern on the object to be exposed can be further improved.

[0022] According to the invention of claim 6, the control means calculates the amount of deviation between the reference light receiving element preset in the imaging means and the light receiving element that has detected the alignment mark of the object to be exposed. Therefore, the deviation between the reference position on the object to be exposed and the reference position of the photomask can be corrected based on the detection output of the alignment mark by the light receiving element of the imaging means. Therefore, it is possible to easily correct the positional deviation in the direction orthogonal to the transport direction of the object to be exposed in a plane parallel to the placement surface of the transport unit.

[0023] According to the invention of claim 7, since the alignment mark is provided at the leading end in the transport direction at one end of the pattern area, the alignment mark is imaged by the imaging means, and the alignment mark Based on this detection output, the deviation between the reference position of the pattern area and the reference position of the photomask can be easily corrected. Therefore, even if functional patterns having the same shape are formed in a line at a predetermined pitch in a direction orthogonal to the transport direction, alignment can be performed without causing a pitch shift. This improves the overlay accuracy of the exposure pattern to the functional pattern on the exposed object be able to.

[0024] According to the invention of claim 8, since the alignment confirmation mark is provided in alignment with the alignment mark, after alignment with the alignment mark, the alignment state can be confirmed with the alignment confirmation mark. it can. Further, by measuring the pitch of the alignment confirmation mark, the magnification of the projection lens or the expansion or contraction state of the object to be exposed can be confirmed.

Brief Description of Drawings

FIG. 1 is a conceptual diagram showing an embodiment of an exposure apparatus according to the present invention.

FIG. 2 is a plan view showing a color filter substrate used in the exposure apparatus.

FIG. 3 is an explanatory diagram showing a relationship between an exposure position by a photomask and an imaging position by an imaging unit in the embodiment.

FIG. 4 is an explanatory diagram showing exposure position deviation when a normal color filter substrate is used.

FIG. 5 is an explanatory diagram showing photomask alignment adjustment with respect to the color filter substrate.

Explanation of symbols

[0026] 1 ... Conveying means

la ... mounting surface

2 Exposure optical system

3 ... Imaging means

4 ... Control means

5 ... Stage

6. Color filter substrate (exposed object)

7 ... Pattern area

8 Black matrix

9, 9a, 9b… Pixel (functional pattern)

10 Alignment mark

11 ··· Alignment confirmation mark 12 ... Exposure light source

13 ... Mask stage

1 "projection lens

16, 16a… Masterano turn

17 ... Photomask

18, 18n, 18s ... Light receiving element

29 ... exposure pattern

A ... Conveying direction

S1--'Reference position on the color filter substrate

S2 '· · Photomask reference position

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a conceptual view showing an embodiment of an exposure apparatus according to the present invention. This exposure apparatus irradiates exposure light through a photomask while transporting the exposure body in one direction to form a predetermined exposure pattern. The system 2, the image pickup means 3, and the control means 4 are used. Hereinafter, the case where the object to be exposed is, for example, a color filter substrate on which a black matrix is formed will be described.

[0028] The transport means 1 is configured to place the color filter substrate 6 coated with a color resist on the stage 5 and transport it at a predetermined speed in the direction of arrow A shown in FIG. For example, a conveyance roller (not shown) that moves 5, a conveyance driving unit such as a motor that rotationally drives the conveyance roller, a speed sensor that detects the conveyance speed of the stage 5, a position detection sensor that detects a position, and the like are provided. RU

[0029] As shown in FIG. 2, the color filter substrate 6 has a large number of pixels 9 of the black matrix 8 formed in the pattern region 7 set on the surface, and a predetermined position on one end side of the pattern region 7. One is formed to correct the misalignment between the reference position S1 preset in the pattern area 7 and the reference position S2 preset in the photomask 17 (to be described later) (see FIG. 3). The long and narrow alignment mark 10 is conveyed with the side on which the alignment mark 10 is formed leading. More In addition, alignment confirmation marks 11 are formed in alignment with the alignment marks 10 in the direction orthogonal to the arrow A direction. The alignment confirmation mark 11 is used for confirming the alignment state of the alignment mark 10. The same number of left and right alignment marks 10 are formed at the same interval as the pixel 9.

Note that the alignment mark 10 is also used as an exposure start marker. That is, when the alignment mark 10 is detected by the imaging means 3 described later, an exposure light source 12 of the exposure optical system 2 described later is turned on and exposure is started.

An exposure optical system 2 is provided above the stage 5 of the transport means 1. The exposure optical system 2 irradiates the color filter substrate 6 with exposure light to form a predetermined exposure pattern. The exposure light source 12, the mask stage 13, the projection lens 14, and the dichroic mirror 15 and.

[0032] The exposure light source 12 emits exposure light including ultraviolet rays, and is, for example, a high-pressure mercury lamp, a xenon lamp, an ultraviolet light emitting laser, or the like. The mask stage 13 is provided in front of the irradiation direction of the exposure light emitted from the exposure light source 12, and as shown in FIG. 3, for example, in the transport direction (arrow) on an opaque film formed on a transparent glass substrate. A photomask 17 in which a rectangular mask pattern 16 that transmits light is formed at a predetermined pitch in a direction orthogonal to the (A direction) so that it can be placed parallel to the placement surface la of the color filter substrate 6 of the transport means 1 It is summer. The projection lens 14 is provided between the stage 5 and the mask stage 13 of the transport means 1, and projects the mask pattern 16 formed on the photomask 17 onto the color filter substrate 6. is there. The dichroic mirror 15 is provided between the mask stage 13 and the projection lens 14, is configured to transmit ultraviolet light and reflect visible light, and reflects visible light from the color filter substrate 6. The imaging means 3 can receive light by deflecting in a direction different from the optical path of the exposure optical system 2.

On the optical path L2 deflected in a direction crossing the optical path L1 in a direction different from the optical path L1 of the exposure optical system 2 between the mask stage 13 and the projection lens 14, the imaging means 3 is Is provided. The image pickup means 3 picks up the pixels 9 and the alignment marks 10 of the black matrix 8 of the color filter substrate 6 shown in FIG. 2 with the position close to the exposure position by the exposure optical system 2 as the image pickup position. A large number of light receiving elements 18 are arranged in a straight line in a direction perpendicular to the conveying direction indicated by arrow A in FIG. 3 within a plane parallel to the placement surface la of the conveying means 1. The alignment mechanism 19 can move in the direction of the arrow B or C perpendicular to the transport direction indicated by the arrow A in a plane parallel to the placement surface la of the transport means 1 integrally with the exposure optical system 2. Furthermore, it can be rotated about the center of the photomask 17 as a central axis. Then, as shown in FIG. 1, the color filter substrate 6 is illuminated from the back surface by the illumination light source 20 that irradiates visible light disposed below the stage 5 of the conveying means 1, and the color filter substrate. Pixels 9 of the black matrix 8 formed on 6 can be imaged clearly. If the visible light of the illumination light source 20 contains an ultraviolet component, an ultraviolet cut filter is provided in front of the illumination light source 20 to prevent the color resist applied to the color filter substrate 6 from being exposed. Good.

A control unit 4 is connected to the transport unit 1, the exposure light source 12, the imaging unit 3, the alignment mechanism 19, and the illumination light source 20. Based on the detection output of the alignment mark 10 acquired by the image pickup means 3, the control means 4 uses the reference position S1 (see FIG. 2) on the color filter substrate 6 and the reference position S2 ( (See FIG. 3), and the alignment mechanism 19 is driven so that the exposure optical system 2 and the imaging means 3 are parallel to the placement surface la of the transport means 1 so as to correct the misalignment. It moves in a direction perpendicular to the transport direction within the surface and rotates around the center of the photomask 17 as the central axis. Specifically, as shown in FIG. 5 (a), a reference light receiving element 18s set in advance in the light receiving element 18 of the imaging means 3 having a predetermined positional relationship with the reference position S2 of the photomask 17 Then, the amount of deviation from the light receiving element 18η that has detected the alignment mark 10 on the color filter substrate 6 is calculated, and the alignment mechanism 19 is driven so that the amount of deviation becomes zero, and the imaging means 3 and the exposure optical system 2 The photomask 17 is moved together. The exposure light source drive unit 21, the alignment mechanism controller 22, the image processing unit 23, the transport means controller 24, the illumination light source drive unit 25, the storage unit 26, the calculation unit 27, and the control unit 28 And with The

Here, the exposure light source drive unit 21 drives the exposure light source 12 to turn on. The alignment mechanism controller 22 controls driving of the alignment mechanism 19. Furthermore, the image processing unit 23 processes the image acquired by the imaging unit 3 to create image data, and also the image data and a lookup table (hereinafter referred to as “LUT”) stored in the storage unit 26. The reference position S1 of the pattern region 7 of the color filter substrate 6 is detected. Furthermore, the transport means controller 24 moves the stage 5 of the transport means 1 in a predetermined direction at a predetermined speed. The illumination light source drive unit 25 drives the illumination light source 20 to turn on. Further, the storage unit 26 stores, for example, the LUT for detecting the reference position S1 on the color filter substrate 6, the cell number of the reference light receiving element 18s of the imaging means 3, and the like. Furthermore, the calculation unit 27 detects the reference light receiving element 18s set in advance in the image pickup means 3 and the alignment mark 10 of the color filter substrate 6 having a predetermined positional relationship with the reference position S2 of the photomask 17. The amount of deviation from the light receiving element 18η is calculated. And the control part 28 controls drive of said each part appropriately.

Next, the operation of the exposure apparatus of the embodiment configured as described above will be described.

First, when a startup switch (not shown) is turned on, the control unit 4 is activated, the illumination light source 20 is turned on by the illumination light source driving unit 25, and the imaging unit 3 starts imaging. In addition, the transport means 1 is in a standby state with a color filter substrate 6 coated with a color resist placed on a predetermined position on the stage 5. Next, when an exposure start switch (not shown) is turned on, the stage 5 of the transport unit 1 is controlled by the transport unit controller 24 and starts moving in a direction indicated by an arrow 矢印 at a predetermined speed.

Here, FIG. 4 shows exposure deviation of the exposure pattern with respect to a normal color filter substrate 6 in which the alignment mark 10 is not formed. As shown in the figure, when the reference position S1 of the color filter substrate 6 is set at the upper left corner of the leftmost pixel 9a of the black matrix 8, the control means 4 is acquired by the imaging means 3. The image data of the image and the LUT read from the storage unit 26 are compared by the image processing unit 23. When the two match, the upper left corner of the pixel 9 is determined as the reference position S1. In this case, the exposure optical system 2 photomask When 17 is displaced in the direction of arrow B, the control means 4 misidentifies the upper left corner of the pixel 9b adjacent to the right end of the left end pixel 9a as the reference position S1, and determines the reference position S2 of the photomask 17 as the predetermined position. There is a possibility that the alignment mechanism 19 may be controlled so that the reference light receiving element 18s that has a positional relationship and is preset in the imaging means 3 is aligned with the upper left corner of the pixel 9b. For this reason, as shown in the figure, there is a possibility that the striped exposure pattern 29 is formed at a position deviated from the target position force.

On the other hand, as shown in FIG. 2, the color filter substrate 6 used in the exposure apparatus of the present invention extends in the direction of arrow A to a predetermined position at one end of the pattern region 7 where the black matrix 8 is formed. As shown in FIG. 5 (a), the elongated alignment mark 10 is formed and transported starting from the side on which the alignment mark 10 is formed. The alignment mark 10 is imaged by the imaging means 3. As a result, the exposure light source drive unit 21 is driven, the exposure light source 12 is turned on, and exposure is started.

At the same time, in the control unit 28, the cell number of the light receiving element 18 η that has detected, for example, the left edge of the alignment mark 10 is compared with the cell number of the reference light receiving element 18 s previously stored in the storage unit 26. . Then, the displacement amount is calculated by the calculation unit 27, and the alignment mechanism 19 is driven and controlled by the alignment mechanism controller 22 so that the displacement amount becomes zero, and the displacement mechanism 19 is placed in a plane parallel to the placement surface la of the transport device 1. Thus, the photomask 17 of the exposure optical system 2 and the imaging means 3 are moved together in the direction of arrow C shown in FIG. As a result, when the alignment mark 10 is positioned on the reference light receiving element 18s of the image pickup means 3, the reference position S1 of the color filter substrate 6 having a predetermined positional relationship with the alignment mark 10 and the reference receiving light are obtained. It is possible to form a striped exposure pattern 29 at the target position as shown by hatching in FIG. 2 when the element 18s and the reference position S2 of the photomask 17 having a predetermined positional relationship match. It becomes.

Next, as shown in FIG. 5 (b), an alignment confirmation marker is provided corresponding to each pixel 9 of the black matrix 8 of the color filter substrate 6 and is shorter than the alignment mark 10. The image 11 is picked up by the image pickup means 3. Then, the control means 4 detects the alignment mark 10 and the same number of alignment confirmation marks 11 arranged on the left and right of the alignment mark 10. The cell number of each received light receiving element 18 is read and the average value thereof is calculated by the calculating unit 27 and the result is compared with the cell number of the reference light receiving element 18s. At this time, if the two match, it is determined that the alignment has been performed correctly. In addition, the image data force acquired by the imaging means 3 for the pitch of the alignment confirmation mark 11 is also read and compared with the design value stored in the storage unit 26 in advance. The expansion or contraction of the substrate 6 can be confirmed. If an abnormality is detected in the confirmation with the alignment confirmation mark 11, stop the exposure operation and alarm the abnormality.

[0041] Thereafter, the movement of the alignment mechanism 19 is controlled based on the image data acquired by the imaging means 3, and the photomask 17 is placed at the upper left corner of the leftmost pixel 9a that is the reference position S1 of the color filter substrate 6. Exposure proceeds with the reference position S2 positioned. When the color filter substrate 6 is rotationally displaced during transportation, the alignment mechanism 19 is controlled so that the exposure optical system 2 and the imaging means 3 are integrated with the center of the photomask 17 as the central axis. Rotate to (Θ) to adjust the rotational deviation. As a result, even if the color filter substrate 6 is conveyed while swinging left and right, the photomask 17 moves following it, and the exposure pattern 29 is accurately formed at the target position as shown in FIG. become.

In the above-described embodiment, the alignment mark 10 and the alignment confirmation mark 11 are formed in an elongated shape in the direction of arrow A as shown in FIG. Alternatively, it may be rectangular or linear as long as it can be detected by the light receiving element 18 of the imaging means 3 or may be formed to have a width substantially equal to the width of the pixel 9 of the black matrix 8. In the above description, the case where there are one alignment mark 10 is described. However, the present invention is not limited to this, and a plurality of alignment marks 10 may be formed at predetermined intervals.

In the above embodiment, the case where the imaging unit 3 is disposed so as to capture a position close to the exposure position by the exposure optical system 2 has been described. However, the present invention is not limited to this, and the imaging unit 3 May be arranged so as to image the front side in the transport direction of the exposure position by the exposure optical system 2.

Furthermore, in the above embodiment, the force described in the case where the projection optical system 2 is provided with the projection lens 14 is not limited to this, and the proximity exposure apparatus without the projection lens 14 is used. It can be applied.

In the above description, the case where the object to be exposed is the color filter substrate 6 has been described. However, the present invention is not limited to this, and the object to be exposed may be a TFT substrate of a liquid crystal display panel or a semiconductor. It may be a substrate. In this case, when the object to be exposed is an opaque substrate, the illumination light source 20 is preferably disposed above the transport means 1 for epi-illumination.

Claims

The scope of the claims

[1] An object to be exposed on which a large number of functional patterns are formed in a pattern area set on the surface and at least one alignment mark is formed at a predetermined position on one end side of the pattern area is placed. Transport means for transporting the object to be exposed starting from the side on which the alignment mark is formed;

An exposure optical system that is disposed above the transport means and irradiates the object to be exposed with exposure light emitted from an exposure light source through a photomask mounted on a mask stage; and It can be moved integrally with the exposure optical system in a direction perpendicular to the conveying direction of the object to be exposed within a plane parallel to the mounting surface of the object to be exposed, and arranged side by side along the moving direction. An imaging means for imaging the functional pattern and alignment mark of the object to be exposed;

A deviation between a reference position on the object to be exposed and a reference position set in advance on the photomask is calculated based on a detection output of the alignment mark acquired by the imaging means, and the deviation is corrected. A control means for moving the exposure optical system and the image pickup means,

An exposure apparatus comprising:

[2] The exposure apparatus according to [1], wherein the image pickup means includes the light receiving elements arranged in a straight line.

[3] The exposure apparatus according to [1], wherein the image pickup unit is arranged to pick up an image of a front side in a transport direction of an exposure position by the exposure optical system.

[4] The exposure optical system includes a projection lens that is provided between the mask stage and the transport unit and projects a mask pattern formed on the photomask onto the object to be exposed. The exposure apparatus according to claim 1.

5. The imaging device according to claim 4, wherein the imaging means is disposed on an optical path deflected in a direction different from the optical path of the exposure optical system between the mask stage and the projection lens. Exposure equipment.

[6] The control means detects a reference light receiving element preset in the imaging means and an alignment mark of the object to be exposed having a predetermined positional relationship with a reference position of the photomask. 2. The exposure apparatus according to claim 1, wherein a deviation amount with respect to the received light receiving element is calculated, and the imaging means and the exposure optical system are moved so that the deviation amount becomes zero.

[7] An object to be exposed in which exposure light is irradiated through a photomask while an exposure pattern having a predetermined shape is formed at a predetermined position while being conveyed in one direction,

A large number of functional patterns formed in the pattern area set on the surface;

At least one of the predetermined positions on the one end side of the pattern area is used to correct the misalignment between the reference position preset in the pattern area and the reference position preset in the photomask. The alignment mark formed,

An object to be exposed.

[8] The alignment confirmation mark for confirming the alignment state arranged side by side with the alignment mark is formed at the same interval as a plurality of functional patterns arranged in the pattern area. Exposed object.