WO2007007800A1 - 黒色ペースト組成物、及びそれを用いたブラックマトリックスパターンの形成方法、並びにそのブラックマトリックスパターン - Google Patents
黒色ペースト組成物、及びそれを用いたブラックマトリックスパターンの形成方法、並びにそのブラックマトリックスパターン Download PDFInfo
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- WO2007007800A1 WO2007007800A1 PCT/JP2006/313890 JP2006313890W WO2007007800A1 WO 2007007800 A1 WO2007007800 A1 WO 2007007800A1 JP 2006313890 W JP2006313890 W JP 2006313890W WO 2007007800 A1 WO2007007800 A1 WO 2007007800A1
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 235000005811 Viola adunca Nutrition 0.000 description 1
- 240000009038 Viola odorata Species 0.000 description 1
- 235000013487 Viola odorata Nutrition 0.000 description 1
- 235000002254 Viola papilionacea Nutrition 0.000 description 1
- FKTASCFKSCLFBM-UHFFFAOYSA-L [O-]OO[O-].[Na+].[Na+].[Na+] Chemical compound [O-]OO[O-].[Na+].[Na+].[Na+] FKTASCFKSCLFBM-UHFFFAOYSA-L 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- UDMBCSSLTHHNCD-KQYNXXCUSA-N adenosine 5'-monophosphate Chemical compound C1=NC=2C(N)=NC=NC=2N1[C@@H]1O[C@H](COP(O)(O)=O)[C@@H](O)[C@H]1O UDMBCSSLTHHNCD-KQYNXXCUSA-N 0.000 description 1
- 229950006790 adenosine phosphate Drugs 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- FJTUUPVRIANHEX-UHFFFAOYSA-N butan-1-ol;phosphoric acid Chemical compound CCCCO.OP(O)(O)=O FJTUUPVRIANHEX-UHFFFAOYSA-N 0.000 description 1
- BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical compound CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 1
- OOSPDKSZPPFOBR-UHFFFAOYSA-N butyl dihydrogen phosphite Chemical compound CCCCOP(O)O OOSPDKSZPPFOBR-UHFFFAOYSA-N 0.000 description 1
- BNMJSBUIDQYHIN-UHFFFAOYSA-L butyl phosphate Chemical compound CCCCOP([O-])([O-])=O BNMJSBUIDQYHIN-UHFFFAOYSA-L 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- UBEWDCMIDFGDOO-UHFFFAOYSA-N cobalt(2+);cobalt(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Co+2].[Co+3].[Co+3] UBEWDCMIDFGDOO-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- BFYHFSGFMZUISQ-UHFFFAOYSA-N dibutyl dibutoxyphosphoryl phosphate Chemical compound CCCCOP(=O)(OCCCC)OP(=O)(OCCCC)OCCCC BFYHFSGFMZUISQ-UHFFFAOYSA-N 0.000 description 1
- BVXOPEOQUQWRHQ-UHFFFAOYSA-N dibutyl phosphite Chemical compound CCCCOP([O-])OCCCC BVXOPEOQUQWRHQ-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- WZPMZMCZAGFKOC-UHFFFAOYSA-N diisopropyl hydrogen phosphate Chemical compound CC(C)OP(O)(=O)OC(C)C WZPMZMCZAGFKOC-UHFFFAOYSA-N 0.000 description 1
- CZHYKKAKFWLGJO-UHFFFAOYSA-N dimethyl phosphite Chemical compound COP([O-])OC CZHYKKAKFWLGJO-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- KUMNEOGIHFCNQW-UHFFFAOYSA-N diphenyl phosphite Chemical compound C=1C=CC=CC=1OP([O-])OC1=CC=CC=C1 KUMNEOGIHFCNQW-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- ZUNGGJHBMLMRFJ-UHFFFAOYSA-O ethoxy-hydroxy-oxophosphanium Chemical compound CCO[P+](O)=O ZUNGGJHBMLMRFJ-UHFFFAOYSA-O 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 235000019000 fluorine Nutrition 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 125000002463 lignoceryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- WZESLRDFSNLECD-UHFFFAOYSA-N phenyl prop-2-eneperoxoate Chemical compound C=CC(=O)OOC1=CC=CC=C1 WZESLRDFSNLECD-UHFFFAOYSA-N 0.000 description 1
- XUYJLQHKOGNDPB-UHFFFAOYSA-N phosphonoacetic acid Chemical compound OC(=O)CP(O)(O)=O XUYJLQHKOGNDPB-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- QVLTXCYWHPZMCA-UHFFFAOYSA-N po4-po4 Chemical compound OP(O)(O)=O.OP(O)(O)=O QVLTXCYWHPZMCA-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- PRAHMDIEZMWIRW-UHFFFAOYSA-N propyl dihydrogen phosphite Chemical compound CCCOP(O)O PRAHMDIEZMWIRW-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
Definitions
- the present invention relates to a black paste composition suitable for forming various black matrices, a method for forming a black matrix pattern using the same, and a black matrix pattern thereof. More specifically, the maximum wavelength is 350 ⁇ ! Suitable for laser 'direct' imaging equipment using a laser oscillation light source of ⁇ 420nm, useful for efficiently forming fine black matrix patterns, and with excellent storage stability, and uses it
- the present invention relates to a method for forming a black matrix pattern, and the black matrix pattern.
- a black matrix pattern has been used for a front panel of a thin display.
- a black matrix pattern resist is applied and dried on a glass substrate to form a coating film, and the coating film is exposed to an image through a photomask on which a circuit or an electrode pattern is drawn.
- Black that adheres to the glass substrate by forming and baking a resist layer corresponding to the circuit and electrode pattern by developing with an alkaline aqueous solution using the difference in solubility in the developer between the exposed and unexposed areas.
- a matrix pattern was formed.
- Laser Direct Imaging which directly draws a circuit created by CAD (Computer Aided Design) using laser light.
- CAD Computer Aided Design
- LDI LDI draws patterns directly from CAD data, it can efficiently produce a small variety of products, and since it does not use a photomask, alignment is accurate and scaling correction is easy. There are many advantages such as eliminating the need for foreign matter adhesion, dirt, and scratch management.
- compositions to be sensitized by laser scanning a composition containing a specific dye sensitizer and a titanocene compound (see, for example, Patent Document 1 and Patent Document 2), A laser photosensitive composition containing a specific bisacylphosphine oxide (see, for example, Patent Document 3) has been proposed, but sufficient photosensitive speed has not been obtained.
- Patent Document 3 Japanese Unexamined Patent Application Publication No. 2004-45596 (Claims)
- the present invention has been developed in view of the above-mentioned problems, and its main purpose is to apply a fine black matrix pattern suitable for a laser one-direct imaging apparatus using a laser oscillation light source having a maximum wavelength power of S350 nm to 420 nm. It is an object to provide a black paste composition that is useful for efficient formation and excellent in storage stability, a method for forming a black matrix pattern using the same, and the black matrix pattern.
- R 1 represents a hydrogen atom, a methyl group, an ethyl group, a phenyl group or a halogen atom.
- IT represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- a black matrix pattern obtained by a method for forming a black matrix pattern, and a powerful method is provided.
- the black paste composition of the present invention exhibits excellent photocurability with respect to a laser oscillation light source having a maximum wavelength of 350 nm to 420 nm, it can be used as an exposure apparatus. It is possible to use an imaging device, which occurs with conventional exposure methods! /, And the photomask and glass substrate expand and contract, and there is no misalignment, and pattern loss due to foreign matter adhering to the photomask is eliminated. A highly reliable black matrix pattern can be formed.
- the use of a laser-direct imaging device eliminates the need for a photomask, facilitates the transfer of design power to manufacturing, and further reduces the product cost by reducing the defect rate. Become.
- the black paste composition of the present invention comprises (A) a carboxyl group-containing resin and (B) a glass frit.
- the maximum wavelength is 350 ⁇ ! It has excellent characteristics when it exhibits excellent photo-curing properties for laser light sources of ⁇ 420nm.
- a black paste composition further comprising (E-2) a phosphine oxide polymerization initiator containing the structure represented by the general formula (III) in the above composition. Is done.
- the composition further comprises (F) boric acid and a phosphorus containing Z or (G) the structure represented by the formula (IV) or (V).
- F boric acid
- G the structure represented by the formula (IV) or (V).
- the carboxyl group-containing resin (A) contained in the black paste composition of the present invention a known and commonly used resin having a carboxyl group in the molecule can be used. Further, a carboxyl group-containing photosensitive resin (A ′) having a radically polymerizable unsaturated double bond in the molecule is more preferable in terms of photocurability and development resistance.
- a carboxyl group-containing resin obtained by copolymerization with an unsaturated carboxylic acid such as (meth) acrylic acid and one or more other compounds having an unsaturated double bond 2) Has an unsaturated carboxylic acid such as (meth) acrylic acid and other unsaturated double bonds
- a compound having an unsaturated double bond with an epoxy group such as glycidyl (meth) atalylate or 3,4-epoxycyclohexylmethyl (meth) acrylate
- a carboxyl group-containing photosensitive resin obtained by adding an ethylenically unsaturated group as a benton with (meth) acrylic acid chloride
- a compound having an unsaturated double bond with an epoxy group such as glycidyl (meth) acrylate or 3, 4-epoxycyclohexylmethyl (meth) acrylate, and another compound having an unsaturated double bond
- a carboxyl group-containing photosensitive resin obtained by reacting an unsaturated carboxylic acid such as (meth) acrylic acid with this copolymer and reacting the resulting secondary hydroxyl group with a polybasic acid anhydride,
- a carboxyl group-containing photosensitive resin obtained by reacting a polyfunctional epoxy compound with an unsaturated monocarboxylic acid and reacting the resulting hydroxyl group with a saturated or unsaturated polybasic acid anhydride
- a polyfunctional oxetane compound having at least two oxetane rings in one molecule is reacted with an unsaturated monocarboxylic acid, and saturated or unsaturated with respect to the primary hydroxyl group in the resulting modified oxetane resin.
- a carboxyl group-containing photosensitive resin obtained by reacting a saturated polybasic acid anhydride and (9) After reacting an unsaturated monocarboxylic acid with a polyfunctional epoxy resin, the carboxyl group-containing resin obtained by reacting with a polybasic acid anhydride further contains one oxirane ring in the molecule. Examples thereof include, but are not limited to, a carboxyl group-containing photosensitive resin obtained by reacting a compound having one or more ethylenically unsaturated groups.
- the carboxyl group-containing photosensitive resin of the above (2) and (3) is also preferable in terms of photocurability and baking ability.
- (meth) atalylate is a term that collectively refers to talate, metatalate, and a mixture thereof, and other similar expressions! The same is true.
- the carboxyl group-containing resin (A) as described above has a number of free carboxyl groups in the side chain of the knockbone polymer, development with a dilute aqueous alkali solution is possible.
- the acid value of the carboxyl group-containing resin (A) is preferably in the range of 40 to 200 mg KOHZg, more preferably in the range of 45 to 120 mg KOH / g. If the acid value of the carboxyl group-containing resin is less than 40 mg KOHZg, alkali development becomes difficult.On the other hand, if it exceeds 200 mg KOH / g, dissolution of the exposed area by the developer proceeds, so the line becomes thinner than necessary. In some cases, the exposed portion and the unexposed portion are not distinguished because they are dissolved and peeled off with a developer, making it difficult to draw a normal resist pattern.
- the weight average molecular weight of the carboxyl group-containing resin (A) varies depending on the resin skeleton, and generally ranges from 2,000 to 150,000, and further from 5,000 to 100,000,000. Is preferred. If the weight average molecular weight is less than 2,000, the tack-free performance may be inferior, the moisture resistance of the coating film after exposure is poor, the film is reduced during development, and the resolution is greatly inferior. On the other hand, if the weight average molecular weight exceeds 150,000, developability may be remarkably deteriorated and storage stability may be deteriorated.
- the amount of such carboxyl group-containing rosin (wax) is preferably 10 to 80% by mass, more preferably 15 to 50% by mass, based on the total composition.
- the amount is less than the above range, the coating film strength decreases, which is not preferable.
- the amount is larger than the above range, it is not preferable because the viscosity becomes high or the coating property is lowered.
- the glass frit ( ⁇ ) used in the black paste composition of the present invention has a soft saddle point of 30.
- a low-melting glass frit of 0 to 600 ° C. is used, and a material mainly composed of lead oxide, bismuth oxide, or zinc oxide can be suitably used. From the viewpoint of resolution, it is preferable to use one having an average particle size of 20 m or less, preferably 5 / zm or less.
- Preferred examples of the glass powder containing lead oxide as a main component include PbO force of 8 to 82% by mass% based on oxide, B
- Non-crystalline frit having a composition of%, BaO 1-25%, ZnO 1-20% and a soft saddle point of 420-590 ° C.
- preferred glass powder based on zinc oxide examples, mass 0/0 on the oxide basis, ZnO force 5 to 60%, KO is 2 to 15%, BO force 5-45 %, SiO
- MgO has a composition of 0 ⁇ 10%, softening point
- Non-crystalline frit having a force of 20 to 590 ° C can be mentioned.
- the black pigment (C) used in the black paste composition of the present invention includes a single metal oxide such as Cu, Fe, Cr, Mn, Co, Ru, and La, and Z or two or more metal elements.
- the composite oxide can be suitably used, and the average particle diameter is preferably 10 m or less, more preferably 2.5 m or less from the viewpoint of resolution.
- an average particle size of 1.0 ⁇ m or less, preferably 0.6 ⁇ m or less is suitable.
- cobalt tetraoxide (Co 2 O 3) fine particles having a specific surface area in the range of 1.0 to 20 m 2 Zg. This is because the specific surface area is 1.
- the amount of the black pigment (C) is 10 to 10 parts by mass per 100 parts by mass of the glass frit (B).
- a range of 100 parts by weight is appropriate. If less than the above range, sufficient blackness after firing It cannot be obtained and is not preferable. On the other hand, when the amount is larger than the above range, the light transmittance is lowered, and an undercut is likely to occur.
- the compound (D) having at least one radical polymerizable unsaturated group in one molecule used in the present invention includes 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, penta Hydroxyalkyl acrylates such as erythritol tritalylate and dipentaerythritol pentaphthalate; Mono- or diatalylates of glycols such as ethylene glycol, methoxytetraethylene glycolanol, polyethylene glycol, propylene glycol; N, N-dimethylacrylamide, N — Acrylamides such as methylol acrylamide, N, N-dimethylaminopropyl acrylamide; amino alkylamines such as N, N-dimethylaminoethyl acrylate, N, N-dimethylaminopropyl acrylate Relates; polyvalent alcohols such as hexanediol, trimethylolpropane, pentaerythr
- compounds having at least two radically polymerizable unsaturated groups in one molecule such as pentaerythritol tritalylate and dipentaerythritol hexatalylate, are excellent in photo-curing properties. ,preferable.
- this compound may be abbreviated as a polymerizable monomer.
- the blending amount of (D) having at least one radically polymerizable unsaturated group in one molecule is preferably 5 with respect to 100 parts by mass of the carboxyl group-containing resin (A). To 100 parts by mass, more preferably 10 to 70 parts by mass. The blending amount is 5 parts by mass If it is less than 1, the photocurability is lowered, and pattern formation becomes difficult by alkali development after irradiation with active energy rays, which is not preferable. On the other hand, when the amount exceeds 100 parts by mass, the solubility in an aqueous alkali solution is reduced and the coating film becomes brittle.
- the photopolymerization initiator (E) used in the black paste composition of the present invention includes the following general formula (I):
- R 1 are represented by the following general formula (II), and the remaining R 1 is a hydrogen atom, a methyl group, an ethyl group, a phenyl group, or a halogen atom. Represents)
- R 2 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a fur group
- R J represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- the amount of such oxime-based photopolymerization initiator (E-1) is 0.01 to 20 parts by mass, preferably 0 with respect to 100 parts by mass of the carboxyl group-containing resin (A).
- the ratio is from 01 to 5 parts by mass.
- the black paste composition of the present invention has the following general formula (III):
- R 4 and R 5 each independently represents a linear or branched alkyl group having 1 to 6 carbon atoms, a cyclohexyl group, a cyclopentyl group, an aryl group, a halogen atom, or an alkyl group.
- a phosphine oxide photopolymerization initiator E-2 having a structure represented by:
- Examples of such phosphine oxide photopolymerization initiator (E-2) include 2,4,6 trimethylbenzoyldiphosphine oxide, bis (2,4,6 trimethylbenzoyl) phenol. -Rufosphine oxide, bis (2,6 dimethoxybenzoyl) -1,2,4,4 trimethyl Examples thereof include ru-pentylphosphine oxide.
- the amount of the phosphine oxide-based photopolymerization initiator (E-2) is preferably 60 parts by mass or less, more preferably 100 parts by mass with respect to 100 parts by mass of the above-mentioned carboxyl group-containing resin (A).
- the ratio is preferably 50 parts by mass or less.
- the compounding amount of the oxime photopolymerization initiator (E-1) represented by the general formula (I) is a phosphine oxide photopolymerization initiator (E-2) represented by the general formula (III). ) Less than the blending amount is preferable in order to obtain thick film curability with high sensitivity.
- the black paste composition of the present invention may further contain benzoin and benzoin alkyl ethers such as benzoin, benzoin methylenoate, benzoin ethylenoate, benzoin isopropenoreatenole, as needed, 2-acetophenones such as 2-dimethoxy-1-2-phenylacetophenone, 2,2-diethoxy-1-2-phenylacetophenone, 2,2-jetoxy-1-2-phenyl-acetophenone, 1,1-dichloroacetophenone; 2 —Methyl 1 [4 (Methylthio) phenol] 2 Morpholinopropane 1-on, 2-Benzyl-1-2-dimethylamino-1- 1- (4-morpholinophenol) 1-butanone 1 etc.
- benzoin and benzoin alkyl ethers such as benzoin, benzoin methylenoate, benzoin ethylenoate, benzoin isopropenoreatenole, as needed,
- thixanthone-based photopolymerization initiators such as 2,4 dimethylthioxanthone, 2,4 jetylthioxanthone, 2-clothioxanthone, and 2,4 diisopropylthioxanthone are used in combination with deep curability. Is preferable.
- the black paste composition of the present invention preferably has the ability to calcine boric acid (F) in order to increase the storage stability.
- an average particle size (D50) force pulverized by a jet mill, a ball mill, a roll mill or the like is preferably 20 ⁇ m or less, more preferably 5 ⁇ m or less.
- Such a finely powdered product tends to absorb moisture and re-agglomerate, so it is preferably used for speed and force after pulverization. It can also be pulverized together with a resin or the like contained in the paste.
- the mixing ratio of boric acid (F) is suitably 0.01 to LO parts by weight, preferably 0.1 to 2 parts, with respect to 100 parts by weight of the glass frit (B). Part by mass. Compounding power of boric acid With respect to 100 parts by mass of the glass frit (B), if it is less than 0.01, there is no effect of improving storage stability, which is not preferable.
- boric acid (F) When boric acid (F) is blended in this way, it is desirable to use a hydrophobic solvent having a solubility in water of 1OOg at 25 ° C of 20g or less.
- a hydrophobic solvent having a solubility in water of 1OOg at 25 ° C of 20g or less.
- water dissolved in the organic solvent ionizes the metal contained in the glass frit and causes gelation, which is not preferable.
- Examples of such phosphorus compounds (G) include methyl phosphate, ethyl phosphate, propyl phosphate, butyl phosphate, phosphate phosphate, dimethyl phosphate, jetyl phosphate, dibutyl phosphate, phosphate Dipropyl, diphenyl phosphate, isopropyl phosphate, diisopropyl phosphate, n-butyl phosphate, methyl phosphite, ethyl phosphite, propyl phosphite, butyl phosphite, phosphorous acid To phenyl, dimethyl phosphite, jetyl phosphite, dibutyl phosphite, dipropyl phosphite, diphenyl phosphite, isopropyl phosphite, diisopropyl phosphite, n-butyl phosphi
- the amount of the phosphorus compound (G) is preferably 10 parts by mass or less, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the glass frit (B). .
- the blending amount of the phosphorus compound (G) exceeds 10 parts by mass with respect to 100 parts by mass of the glass frit (B), the calcination property is lowered, which is not preferable.
- the black paste composition of the present invention contains an organic solvent for synthesizing the carboxyl group-containing resin (A), adjusting the composition, or adjusting the viscosity for application to a substrate or carrier film.
- an organic solvent for synthesizing the carboxyl group-containing resin (A), adjusting the composition, or adjusting the viscosity for application to a substrate or carrier film.
- boric acid (F) when blended, it is desirable to use a hydrophobic solvent having a solubility in water of 1Og at 25 ° C of 2 Og or less.
- the black paste composition of the present invention may further comprise, as necessary, known and commonly used thermal polymerization inhibitors such as hydroquinone, hydrated quinone monomethyl ether, t-butylcatechol, pyrogallol, and phenothiazine, fine silica, organic Known conventional thickeners such as bentonite and montmorillonite, antifoaming agents such as silicones, fluorines and polymers, and silane coupling agents such as Z or leveling agents, imidazoles, thiazoles and triazoles Such known and commonly used additives can be blended.
- thermal polymerization inhibitors such as hydroquinone, hydrated quinone monomethyl ether, t-butylcatechol, pyrogallol, and phenothiazine
- fine silica organic Known conventional thickeners such as bentonite and montmorillonite, antifoaming agents such as silicones, fluorines and polymers, and silane coupling agents such as Z or leveling agents
- the black paste composition of the present invention as described above is adjusted to a viscosity suitable for the coating method using, for example, the organic solvent, and is applied on the substrate by a dip coating method, a flow coating method, a roll coating method, a bar coating method, or the like.
- a tack-free coating film can be formed by applying it by a method such as the one-ter method, screen printing method, curtain coating method, etc., and drying it at about 60-120 ° C. for about 5-40 minutes.
- a tack-free coating film can be formed by applying the above composition on a carrier film, drying it, and laminating it on a substrate.
- the absorbance per 1 ⁇ m thickness of the coating film thus dried is preferably from 0.1 to 0.8, in terms of pattern forming ability. If the absorbance is less than 0.1, it is not preferable because the light absorption of the coating film becomes insufficient and image formation becomes difficult. On the other hand, if the absorbance exceeds 0.8, the deep curability is lowered and the pattern shape tends to be in an undercut state, which is not preferable.
- the black pigment (C), the oxime photopolymerization initiator (E-1), and the phosphine oxide photopolymerization initiator (E-2) This can be done by adjusting the amount added.
- contact type or non-contact type
- active energy rays through a photomask having a pattern formed thereon
- the unexposed portion is diluted with a dilute alkaline aqueous solution (eg, 0.3 to 3% sodium carbonate aqueous solution).
- a dilute alkaline aqueous solution eg, 0.3 to 3% sodium carbonate aqueous solution.
- a direct drawing apparatus for example, It is possible to use a laser-director (imaging device) that directly draws an image with a laser using CAD data from a computer.
- the active energy ray source include a laser diode that emits laser light having a maximum wavelength in the range of 350 nm to 420 nm, a gas laser, a solid laser, and the like, and a laser diode is particularly preferable.
- the direct drawing apparatus for example, those manufactured by Nippon Orbotech, Pentax, Hitachi Viameca-Tass, Ball's Semiconductor, etc. can be used. Use it.
- a conventional exposure machine can be used.
- a halogen lamp a high-pressure mercury lamp, a laser beam, a metal halide lamp, a black lamp, an electrodeless lamp, etc. are used.
- a spray method, an immersion method, or the like is used.
- Developers include aqueous alkali metal solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium silicate, monoethanolamine, diethanolamine, triethanolamine, tetramethylammonium- Amin aqueous solution such as ⁇ beam hydro O dimethylsulfoxide, in particular about 1.5 wt 0/0 but dilute aqueous alkaline solution of the following concentrations are preferably used, the carboxyl group of the carboxyl group-containing ⁇ (a) in the composition is Ken It is not limited to the developer as described above, as long as the uncured portion (unexposed portion) is removed. Further, it is preferable to perform washing with water and acid neutralization in order to remove an unnecessary developer after development.
- the substrate on which the black matrix pattern is formed by the above development can be baked at about 400 to 600 ° C in air or in a nitrogen atmosphere to form a desired black matrix pattern.
- the weight average molecular weight of the resulting copolymerized resin was measured by Shimadzu Corporation pump LC 6AD and Showa Denshi Co., Ltd.
- Shodex (registered trademark) KF-804, KF-803, KF. — 802 was measured by high-performance liquid chromatography using three tubes.
- this carboxyl group-containing resin solution is referred to as A-1 varnish.
- the carboxyl group-containing resin solution was cooled, methylo-idroquinone was used as a polymerization inhibitor, tetrabutylphosphonium bromide was used as a catalyst, and glycidyl metatalylate was added at 95 to 105 ° C for 16 hours.
- the addition reaction was carried out at an addition molar ratio of 0.12 mole to 1 mole of the carboxyl group, and the reaction mixture was taken out after cooling.
- the weight average molecular weight of the carboxyl group-containing photosensitive resin produced by the above reaction was about 10,000, the acid value was 59 mgKOHZg, and the double bond equivalent was 950.
- this carboxyl group-containing photosensitive resin solution is referred to as A-2 varnish.
- the firing was performed by raising the temperature from room temperature to 590 ° C at a rate of 5 ° CZ, holding at 590 ° C for 10 minutes, and then allowing to cool to room temperature.
- Table 2 shows the results of the evaluation of the various characteristics of the substrates thus obtained.
- L / S lOO / 150 / zm line is exposed at 50mi / cm 2 accumulated light intensity, developed for 20 seconds with 0.4% NaCO aqueous solution with a liquid temperature of 30 ° C, and then with an optical microscope Line
- the comparative example was not practical because the exposure time with the laser was long, so the following tests were hard to carry out.
- the pattern after development in the alkali development type black paste composition when exposed at the above minimum exposure amount was observed with a microscope, and evaluated by checking whether there was any irregular variation in the line.
- the evaluation criteria are as follows.
- the shape of the line after firing was evaluated by observing the pattern after the firing with a microscope and checking for irregularities in the line.
- the evaluation criteria are as follows.
- the adhesion was evaluated by peeling with a cellophane adhesive tape and checking for pattern peeling.
- the evaluation criteria are as follows.
- the black paste yarn and the composition of the present invention have sufficient sensitivity to laser light and can form a high-definition pattern.
- the line shape after firing has excellent adhesion to the substrate with irregular variations o
- the firing was performed at a temperature rising rate of 5 ° CZ from room temperature to 590 ° C, and the temperature was 1 at 590 ° C. The process was held for 0 minutes and then regulated to room temperature.
- Table 3 shows the results of the evaluation of the various characteristics of the substrates thus obtained.
- L / S lOO / 150 / zm line is exposed with an integrated light intensity of 50mi / cm 2 and the liquid temperature is 30 ° C.
- the pattern after development in the alkali development type black paste composition when exposed at the above minimum exposure amount was observed with a microscope, and evaluated by checking whether there was any irregular variation in the line.
- the evaluation criteria are as follows.
- ⁇ Slightly irregular variation, warping, etc.
- the shape of the line after firing was evaluated by observing the pattern after the firing with a microscope and checking for irregularities in the line.
- the evaluation criteria are as follows.
- the alkali development type black paste composition of the present invention has sufficient sensitivity even when a high-pressure mercury lamp is used as the light source, and can form a high-definition pattern. I was strong. In addition, because of the dramatic improvement in sensitivity, a significant reduction in exposure time can be achieved when applied to conventional lamp-type exposure. Furthermore, there was no irregular variation in the line shape after firing, good adhesion to the substrate, and excellent storage stability. It should be noted that the blackness after baking was satisfactory regardless of the exposure method.
Abstract
Description
Claims
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CN2006800253738A CN101223478B (zh) | 2005-07-13 | 2006-07-12 | 黑色糊剂组合物及使用其的黑色矩阵图案的形成方法、以及该黑色矩阵图案 |
US12/013,009 US7648814B2 (en) | 2005-07-13 | 2008-01-11 | Black paste composition, method of forming black matrix pattern by using the same, and the black matrix pattern formed |
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JP2013148602A (ja) * | 2012-01-17 | 2013-08-01 | Nippon Shokubai Co Ltd | 感光性樹脂組成物 |
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- 2006-07-12 CN CN2006800253738A patent/CN101223478B/zh not_active Expired - Fee Related
- 2006-07-12 TW TW095125502A patent/TW200720845A/zh unknown
- 2006-07-12 KR KR1020087000869A patent/KR100939416B1/ko not_active IP Right Cessation
- 2006-07-12 JP JP2007524683A patent/JP4834664B2/ja not_active Expired - Fee Related
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2008146855A1 (ja) * | 2007-05-29 | 2008-12-04 | Asahi Glass Company, Limited | 感光性組成物、隔壁、ブラックマトリックス |
US8153340B2 (en) | 2007-05-29 | 2012-04-10 | Asahi Glass Company, Limited | Photosensitive composition, partition walls and black matrix |
JP2009042732A (ja) * | 2007-07-18 | 2009-02-26 | Taiyo Ink Mfg Ltd | 感光性組成物、及びその焼成物からなるパターン |
KR101451986B1 (ko) * | 2007-07-18 | 2014-10-21 | 다이요 홀딩스 가부시키가이샤 | 감광성 조성물 및 그의 소성물을 포함하는 패턴 |
WO2010113513A1 (ja) * | 2009-03-31 | 2010-10-07 | 太陽インキ製造株式会社 | レーザーを用いたパターン形成方法 |
JP2010237573A (ja) * | 2009-03-31 | 2010-10-21 | Taiyo Ink Mfg Ltd | レーザーを用いたパターン形成方法 |
JP2013148602A (ja) * | 2012-01-17 | 2013-08-01 | Nippon Shokubai Co Ltd | 感光性樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
TW200720845A (en) | 2007-06-01 |
CN101223478B (zh) | 2011-10-12 |
JPWO2007007800A1 (ja) | 2009-01-29 |
US7648814B2 (en) | 2010-01-19 |
KR100939416B1 (ko) | 2010-01-28 |
JP4834664B2 (ja) | 2011-12-14 |
CN101223478A (zh) | 2008-07-16 |
KR20080019289A (ko) | 2008-03-03 |
US20080118864A1 (en) | 2008-05-22 |
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