WO2006073120A1 - 光検出器、同光検出器を用いた空間情報検出装置、および光検出方法 - Google Patents
光検出器、同光検出器を用いた空間情報検出装置、および光検出方法 Download PDFInfo
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- WO2006073120A1 WO2006073120A1 PCT/JP2005/024109 JP2005024109W WO2006073120A1 WO 2006073120 A1 WO2006073120 A1 WO 2006073120A1 JP 2005024109 W JP2005024109 W JP 2005024109W WO 2006073120 A1 WO2006073120 A1 WO 2006073120A1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C3/00—Measuring distances in line of sight; Optical rangefinders
- G01C3/02—Details
- G01C3/06—Use of electric means to obtain final indication
- G01C3/08—Use of electric radiation detectors
- G01C3/085—Use of electric radiation detectors with electronic parallax measurement
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/4912—Receivers
- G01S7/4913—Circuits for detection, sampling, integration or read-out
- G01S7/4914—Circuits for detection, sampling, integration or read-out of detector arrays, e.g. charge-transfer gates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/491—Details of non-pulse systems
- G01S7/493—Extracting wanted echo signals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H01L27/14806—Structural or functional details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
- H01L27/14843—Interline transfer
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
- H01L27/1485—Frame transfer
Definitions
- the present invention relates to a photo detector, a spatial information detection apparatus using the photo detector, and a photo detection method.
- the present invention relates to a technique for stably obtaining a light receiving output of signal light as a detection target even under a condition where there is a lot of ambient light (natural light from the sun or indoor illumination light).
- photodetection elements such as photodiodes, phototransistors, and CCD image sensors are known. These photodetection elements are photoelectric sensors that detect the presence or absence of an object by changing the amount of received light, optical It is widely used in applications such as optical communication, transmission / reception time difference or phase difference, optical distance measurement using the principle of triangulation method, image sensor of video camera and digital camera, etc. ing.
- the excess carrier generated by light reception is recombined and the operating frequency for surface charge recombination is changed according to the exposure time, so the dynamic range of the received light quantity is suppressed. As a result, there is a problem that the control for obtaining the light receiving output within the proper range becomes complicated.
- the light detection element receives light during a light-off period in which signal light is not obtained and light emission source light is not emitted.
- the output is a component corresponding only to ambient light
- the light reception output of the light detection element during the lighting period in which light is emitted from the light source during the period in which signal light is obtained is the component in which ambient light and signal light are superimposed. It has been proposed to extract a component corresponding to only signal light by subtracting the light reception output of the light detection element during the light-off period from the light reception output of the light detection element during the lighting period.
- the dynamic range of the light detection element with respect to the signal light is reduced, so that there remains a problem that if the light detection element is saturated, a large received light output cannot be extracted with respect to the signal light. .
- the dynamic range of the light detection element with respect to the signal light is reduced. It is difficult to get a ratio.
- the main object of the present invention is to determine the carrier recombination probability in accordance with the amount of received light, to prevent saturation due to ambient light, to suppress the decrease of the dynamic range with respect to signal light, and consequently to the signal light.
- the photodetector of the present invention includes the following configuration:
- a photoelectric conversion unit that generates electrons and holes by light irradiation
- At least one electrode disposed on the photoelectric conversion unit via an insulating layer
- a first integration region formed of a potential well that is formed in the photoelectric conversion unit by applying a voltage to the electrode and integrates one of electrons and holes generated in the photoelectric conversion unit by light irradiation;
- a second integration region that is formed in the photoelectric conversion unit and integrates the other of the electrons and holes generated in the photoelectric conversion unit by light irradiation;
- a controller that controls at least one of the timing of applying a voltage to the electrode and the polarity of the voltage
- the electrons and holes transferred between the first integration region and the second integration region recombine the electrons and holes accumulated in the first integration region and the second integration region, and remain without being recombined.
- An output unit that outputs at least one of electrons and holes.
- At least one electrode is a pair of first and second electrodes provided via an insulating layer on the photoelectric conversion unit, and the control unit forms a first integrated region.
- the control unit integrates one of the electrons and holes generated in the photoelectric conversion unit by light irradiation in the first integration region, and generates electrons in the photoelectric conversion unit at different times by light irradiation. It is particularly preferred to control the timing and polarity of the voltage applied to the first and second electrodes so that the other of the holes is integrated in the second integration region.
- a first electrode corresponding to an “integrated electrode” in an embodiment described later
- a second electrode corresponding to a “holding electrode” in an embodiment described later
- two potential wells of a first integration region corresponding to an “integration region” in an embodiment described later
- a second integration region corresponding to a “holding region” in an embodiment described later
- the probability that recombination will occur in the first and second integration regions is considered to be higher than the probability that recombination will occur during the transport process.
- recombination is not performed using majority carriers pre-filled in the substrate, but electrons and holes generated by light reception are recombined to reduce environmental light components.
- saturation of the photodetector itself occurs, and a decrease in dynamic range of the photodetector with respect to the signal light can be suppressed.
- control unit is configured so that one of electrons and holes generated in the photoelectric conversion unit by light irradiation is accumulated in the first integration region and the other is accumulated in the second integration region. It is also preferable to apply different polarities to the first and second electrodes (corresponding to distribution electrodes in a sixth embodiment described later). In this case, by setting the voltages applied to the first electrode and the second electrode to opposite polarities, the electrons and holes generated in the photoelectric conversion unit are converted into a first integrated region and a second integrated region formed of a potential well. Then, the electrons and holes are transferred and recombined between the first integration region and the second integration region.
- the output level (light reception output level) of each pixel is caused by the probability (number of occurrences) of electrons and holes generated by light irradiation. It is known that fluctuations occur (shot noise), and in order to reduce the effects of shot noise, carriers (electrons or holes) are integrated to obtain the received light output. However, if the integration time is lengthened, the effect of shot noise can be reduced, but the response speed becomes slower. On the other hand, in the present invention, the recombination probability decreases as the number of generated electrons and holes decreases, so that the recombination probability fluctuates in the direction of suppressing fluctuation of the received light output. There is also an advantage that shot noise can be reduced.
- the photodetector has a light shielding film on the second electrode.
- the control unit causes one of the electrons and holes to be accumulated in the first integration region and then transferred and held in the second integration region so that the other of the electrons and holes is accumulated in the first integration region.
- the timing of applying voltage to the first and second electrodes and the polarity of the voltage are controlled. Since the second integration region corresponding to the second electrode is shielded from light, it is possible to prevent electrons and holes generated in the photoelectric conversion unit from being directly integrated in the second integration region.
- the first electrode is a pair of first electrodes
- the second electrode is a pair of second electrodes
- photoelectric conversion is performed between the first electrodes and between the second electrodes.
- a transfer electrode is provided on the part via an insulating layer, and the control part is applied to the first electrode, the second electrode, and the transfer electrode so that at least one of the remaining electrons and holes is transferred to the output part. It is preferable to control the voltage. According to this configuration, the separation between electrons and holes generated in the photoelectric conversion unit can be improved by increasing the distance between adjacent integrated electrodes.
- the transfer electrode when taking out the received light output, the transfer electrode is used to form a potential well in the photoelectric conversion unit, so that carriers (electrons or holes) constituting the received light output can be easily transferred. Note that the integration efficiency of the electron hole can be adjusted by controlling the voltage applied to the transfer electrode.
- the control unit controls the voltage applied to the first electrode, the second electrode, and the control electrode so that a potential gradient in a certain direction is formed between the first integrated region, the second integrated region, and the save region. It is preferable to do this. According to this configuration, electrons or holes cannot be retained in the potential well serving as the first integrated region (integrated region) or the second integrated region (retained region). By evacuating electrons or holes in the evacuation area, diffusion of electrons or holes can be prevented.
- the photoelectric conversion unit includes a substrate, an intermediate layer formed on the substrate, and a main functional layer formed on the intermediate layer, and the control unit is configured to apply a substrate voltage applied to the substrate.
- the control unit is configured to apply a substrate voltage applied to the substrate.
- both electrons and holes remaining in the photoelectric conversion unit can be discarded, it is possible to suppress errors in the received light output extracted from the photoelectric conversion unit by removing unnecessary carriers remaining in the photoelectric conversion unit. .
- a further object of the present invention is to provide a spatial information detection device using the above-mentioned photodetector, and the spatial information detection device includes the following configuration:
- Light projecting means for irradiating the target space with light whose intensity is modulated with a modulation signal of a predetermined frequency; in the photoelectric conversion unit of the photodetector, electrons and holes are generated by the light from the target space, and
- the controller is configured to apply a voltage to the first and second electrodes so that electrons are accumulated in the first integration region and holes are accumulated in the second integration region.
- An evaluation unit that evaluates the target space based on the output of the photodetector.
- the light reception output reflects the difference in the amount of received light corresponding to the two periods.
- a light receiving output corresponding to the change in the signal light in both periods is obtained.
- the structure of the evaluation unit can be simplified when the difference is required in the evaluation unit in order to obtain information on the target space.
- the spatial information the distance to the object existing in the target space, the reflectance of the object existing in the target space, the transmittance of the medium in the target space, and the like can be mentioned.
- the control unit applies a voltage to the first and second electrodes so that electrons are accumulated in the first integration region and holes are accumulated in the second integration region. And a state in which a voltage is applied to the first and second electrodes so that holes are integrated in the first integration region and electrons are integrated in the second integration region, every 180 degrees of the phase of the modulation signal.
- the electrons and holes in the first integration region and the second integration region are recombined, and the evaluation unit performs the first integration of the photodetector in each of the two sections having different phases of the modulation signal.
- the evaluation unit is preferably a distance calculation unit that converts a value obtained by dividing the difference obtained in one of the two sections by the difference obtained in the other into a distance.
- the present invention further provides a photodetector having the following configuration:
- a photoelectric conversion unit that generates electrons and holes by light irradiation
- One of the electrons and holes generated in the photoelectric conversion unit by light irradiation is held in the charge accumulation region and at the interface between the photoelectric conversion unit and the insulating layer, and then generated in the photoelectric conversion unit by light irradiation.
- a controller that controls the timing of applying a voltage to the electrode and the polarity of the voltage so that the other of the electrons and holes is accumulated in the charge accumulation region and the electrons and holes are recombined at the interface;
- An output unit that outputs at least one of electrons and holes remaining without being recombined.
- this photodetector by controlling the voltage applied to the electrode disposed via the insulating layer, electrons and holes generated in the photoelectric conversion unit are integrated in the charge integration region.
- One of electrons and holes is trapped by dangling bonds or interface potential at the interface.
- the other of electrons and holes is accumulated at different times in the charge accumulation region by reversing the polarity of the voltage, so it is generated at different times in the charge accumulation region consisting of the potential wells formed in the photoelectric converter. Accumulate in the electron and hole product area.
- the other of the electrons and holes is accumulated in the charge accumulation region while part of one of the electrons and holes is trapped in the charge accumulation region, the electrons and holes are recombined and killed. Therefore, by using at least one of electrons and holes remaining after this recombination as a light reception output, it is possible to provide a light reception output corresponding to the difference between the electrons and holes generated at different times in the photoelectric conversion unit. it can.
- Still another object of the present invention is to provide a photodetection method common to the technical idea of the photodetector described above, and includes the following steps.
- a light-receiving element having a photoelectric conversion unit that generates electrons and holes by light irradiation, and a pair of electrodes disposed on the photoelectric conversion unit via an insulating layer;
- the other of the electrons and holes generated in the photoelectric conversion unit by light irradiation is integrated in the second integration region consisting of a potential well formed in the photoelectric conversion unit by applying a voltage to the other electrode;
- electrons and holes are transferred between the first integrated region and the second integrated region, and are transferred to the first integrated region and the second integrated region. After the accumulated electrons and holes are recombined, at least one of the remaining electrons and holes without being recombined is output.
- FIG. 1 is a block diagram showing a configuration of a spatial information detection device using a photodetector according to a first embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view of the photodetector of the present embodiment.
- FIG. 3] (A) to (C) are operation explanatory diagrams showing voltage application timings.
- FIG. 5 (A) to (D) are operation explanatory views showing the principle of distance measurement in the spatial information detecting device.
- Fig. 6 is a schematic configuration diagram of a photodetector that works on the second embodiment of the present invention.
- FIG. 7 is a cross-sectional view of a principal part of a photodetector having a light shielding film.
- FIG. 8 is a cross-sectional view of a principal part of a photodetector having a converging lens.
- FIG. 9 (A) and (B) are a cross-sectional view of an essential part and an operation explanatory diagram of a photodetector according to a third embodiment of the present invention.
- FIG. 10 is a front view showing a photodetector that works on the fourth embodiment of the present invention.
- FIG. 11 is a cross-sectional view taken along line AA in FIG.
- FIG. 12 is a cross-sectional view of the main part showing a modification of the photodetector.
- FIG. 13 is a cross-sectional view of a waist portion showing a photodetector that can be applied to a fifth embodiment of the present invention.
- FIG. 14 (A) to (H) are operation explanatory diagrams showing voltage application timings.
- FIG. 15 is a schematic cross-sectional view of a photodetector that can be applied to a sixth embodiment of the present invention.
- FIG. 16 is a diagram for explaining the operation principle of the photodetector of the present invention.
- the photodetector according to the present invention has an insulating layer 14 (for example, a silicon oxide film) on the surface of a main functional layer 11 (for example, an n-type silicon layer) constituting the photoelectric conversion unit 1. )
- a main functional layer 11 for example, an n-type silicon layer constituting the photoelectric conversion unit 1.
- An integrated voltage is applied to the integrated electrode 12, and the potential of the main functional layer 11 is used as a reference potential (or the potential of an intermediate layer (see FIG. 2) on which the main functional layer 11 is laminated is used as a reference potential), An integrated voltage having a positive polarity and a negative polarity can be applied to the integrated electrode 12.
- an integrated region 1 lb which is a potential well capable of integrating electrons, is formed in the main functional layer 11, and a negative integrated voltage is applied to the integrated electrode 12.
- An integration region 1 lb which is a potential well capable of integrating holes, is formed in the main functional layer 11.
- a portion where light is incident in the vicinity of the integrated electrode 12 functions as a photosensitive portion 1la that generates electrons and holes by the incidence of light. Electrons and holes generated in the photosensitive portion 1 la are accumulated in the integrated region l ib according to the polarity of the integrated voltage applied to the integrated electrode 12. That is, if the integrated voltage is positive, electrons are integrated in the integrated region l ib, and if the integrated voltage is negative, holes are integrated in the integrated region l ib.
- signal light whose intensity is modulated by a certain light source (not shown) is projected, It is assumed that the photoelectric conversion unit 1 can receive signal light.
- the intensity of the signal light is modulated by a rectangular wave, and the light source repeats turning on and off alternately. That is, both the signal light and the ambient light are incident on the photoelectric conversion unit 1 when the light source is turned on, and only the ambient light is incident on the photoelectric conversion unit 1 when the light source is turned off. Therefore, it is possible to accumulate electrons in the integrated region 1 lb while the light source is on, and to collect holes in the integrated region 1 lb when the light source is turned off!
- the number of electrons corresponding to the amount of light received by combining signal light and ambient light, and the number of holes corresponding to the amount of light received only by ambient light is the number corresponding to the amount of received signal light.
- electrons do not always remain after recombination, and holes may remain, or forces that may cause both electrons and holes to remain. If holes are taken out as light reception output, it can be said that a light reception output with reduced environmental light components can be obtained compared to the case of taking out without recombination.
- (e) represents an electron
- (h) represents a hole.
- the integrated electrode 12 is integrated. It shows the moment when holes are accumulated by switching the integrated voltage applied to to negative polarity.
- the electrons accumulated in the integrated region l ib are dangling bonds near the surface of the force main functional layer 11 discharged from the integrated region l ib when the integrated voltage becomes negative.
- the electrons trapped by the interface potential remain in the integrated region l ib.
- the electrons generated in the main functional layer 11 by light irradiation are discharged from the main functional layer 11, and the generated holes are accumulated in the accumulation region 1 lb.
- FIG. 1 shows a case where a distance measuring device, which is a kind of spatial information detecting device, is configured by using the photodetector 6 of the present embodiment, and this distance measuring device displays an object 3 whose distance is to be measured.
- the light from the light source 2 is projected into the target space, and the light from the target space including the reflected light from the target 3 is received by the photodetector 6, and the amount of the reflected light from the target 3 is reflected. It is configured to obtain the received light output from the photodetector 6.
- a technique for measuring the distance to the object 3 with this type of configuration a technique using the principle of triangulation method and a technique for measuring the light emitted from the light source 2 until it is received by the photodetector 6 are used.
- the technology that measures time of flight is mainly used.
- a predetermined pattern of parallel rays is projected from the light source 2 to the target space, and the pattern formed on the target 3 passes through the light receiving optical system (not shown) to the photodetector 6. Convert the projected position to distance.
- the intensity of light projected from the light source 2 to the target space is modulated with an appropriate modulation waveform, and the light received by the light detector 6 and the light source 2 are projected.
- the force phase difference using the time difference as the flight time is converted to the flight time, and the distance is obtained from the flight time.
- a technique is employed in which light whose intensity is modulated is projected from the light source 2 and the distance to the object 3 is measured by the time of flight of the light.
- the technology of the present invention can be applied to reduce the influence of light, and the scope of the technical idea of the present invention is not limited to distance measurement purposes, but is based on fine particles (sensors such as smoke, dust, and dirt). It can be applied to various purposes that need to detect the amount of received light, such as a particle sensor that detects changes in the amount of received light due to light diffusion or attenuation.
- the light source 2 is driven by a modulation signal having a constant modulation frequency (for example, 10 MHz) output from the control circuit 4, and the intensity of light projected to the target space is modulated. It is modulated by.
- a rectangular wave is used as the waveform of the modulation signal, and the light source 2 is repeatedly turned on and off.
- other waveforms such as a sine wave, a sawtooth wave, and a triangular wave may be used as the waveform of the modulation signal.
- the period in which the light source 2 is lit is referred to as the lighting period
- the period in which the light source 2 is not lit is referred to as the extinguishing period.
- the light incident on the light detector 6 is only ambient light that does not include the light projected from the light source 2 into the target space. If the light source 2 is turned on, the light is detected.
- the light incident on the device 6 is the sum of the signal light including the light projected from the light source 2 into the target space and the ambient light. Therefore, the light received by the photodetector 6 is mainly ambient light during the extinguishing period, and is mainly a combination of ambient light and signal light during the lighting period. If the length of the light-on period and the light-off period is one-to-one, theoretically, the component of the ambient light is removed by subtracting the amount of light received during the light-off period from the amount of light received during the light-up period. Can be taken out.
- the light reception output output from the photodetector 6 is sent to a distance calculation circuit 5 as an evaluation unit, and the distance calculation circuit 5 uses the light reception outputs taken out from the photodetector 6 at a plurality of timings to generate a light source.
- the photodetector 6 includes a photoelectric conversion unit 1 that converts light into an electrical signal, and if only one photoelectric conversion unit 1 is used alone, an object that exists in a specific direction as viewed from the photoelectric conversion unit 1 3 is configured to detect the distance only, and as shown in Fig. 1, a plurality of photoelectric conversion units 1 are arranged to form a light detector 6, and a light receiving optical system is arranged in front of the light detector 6. If the direction in which the target space is viewed from the photodetector 6 through the received light optical system is associated with the position of each photoelectric conversion unit 1, a distance image having a distance in each direction as a pixel value can be generated.
- a photodetector 6 provided with a charge extraction unit 7 for arranging the photoelectric conversion unit 1 on the lattice points of a planar lattice having a rectangular unit cell force and extracting the output from the photoelectric conversion unit 1 to the outside.
- the photodetector 6 functions as an image sensor for generating a distance image.
- the charge extraction unit 7 that is the output unit of the unloader is a CCD, and the photoelectric conversion unit 1 also functions as a part of the charge extraction unit 7.
- control circuit 4 which is a control unit of the photodetector of the present embodiment controls the voltage applied to each electrode, which will be described later, and the charge extraction unit 7, and the light emission source 2 which is a light projecting means and the evaluation unit
- the modulation signal described above is output to the distance calculation circuit 5 that is.
- Each of the photoelectric conversion units 1 has the configuration shown in FIG. 2, and a main functional layer made of an n-type silicon layer via a substrate 10 that is an n-type silicon layer and an intermediate layer 16 that is a p-type silicon layer. 11 is provided.
- One surface of the main functional layer 11 (the main surface opposite to the substrate 10 in the thickness direction of the main functional layer 11) is covered with an insulating layer 14 made of a silicon oxide film.
- the substrate 10, the main functional layer 11, and the intermediate layer 16 are shared by a plurality of photoelectric conversion units 1.
- the main surface of the main functional layer 11 is opposed to the integrated electrode 12 and the holding electrode 13 through the insulating layer 14, and the entire holding electrode 13 and a part of the integrated electrode 12 are covered with a light shielding film 15.
- the integrated electrode 12 and the holding electrode 13 form an integrated region 1 lb and a holding region 1 lc as a potential well in the main functional layer 11 by applying the holding voltage and / or holding voltage, respectively.
- the integrated electrode 12 and the insulating layer 14 are translucent, and are covered with the light-shielding film 15, so that light incident on the part reaches the main functional layer 11 through the integrated electrode 12. . That is, a portion of the substrate 10, the main functional layer 11, and the intermediate layer 16 that is not covered by the light shielding film 15 is the photosensitive portion 1 la (FIG. 1) that generates electrons and holes in the photoelectric conversion portion 1. Function as reference). In the illustrated example, a part of the light shielding film 15 straddles the integrated electrode 12, but this is in the main functional layer 11 in the region of the main functional layer 11 corresponding to the electron or Hall force holding electrode 13 generated by photoexcitation. This is in order to prevent direct accumulation in the formed holding region 1 lc.
- the photoelectric conversion unit 1 In the photoelectric conversion unit 1 described above, electrons and holes are generated when light is incident on the photosensitive unit 11a, which is a portion not covered with the light shielding film 15. Further, when an integrated voltage is applied to the integrated electrode 12, an integrated region 1 lb is formed as a potential well in the main functional layer 11, and when a holding voltage is applied to the holding electrode 13, a holding region 1 lc is formed as a potential well in the main functional layer 11. It is formed. The distance between the integrated electrode 12 and the holding electrode 13 and the magnitude of the integrated voltage and the holding voltage are determined between the integrated region 1 lb formed as a potential well and the holding region 1 lc. The child and the hole are set to be movable.
- the intermediate layer 16 is maintained at the reference potential (ground potential), and the substrate 10 is Keep the potential higher than the reference potential. That is, a reverse bias is applied between the substrate 10 and the intermediate layer 16.
- the substrate voltage applied to the substrate 10 and the reset voltage applied to the intermediate layer 16 can be switched in three stages. That is, the substrate voltage can be switched between two levels of high potential and ground potential, and the reset voltage can be switched between low potential, ground potential, and high potential.
- the reset voltage is set to the low potential
- the reset voltage is set to the high potential
- the reset voltage is set to the ground potential
- the substrate voltage and the reset voltage are controlled by the control circuit 4.
- a case where the potential is higher than the reference potential is referred to as positive polarity
- a case where the potential is low is referred to as negative polarity.
- the substrate voltage and the reset voltage can be switched by a combination of DC power supplies E3, E4 and switching switches SW3, SW4.
- DC power supply E4 outputs three levels of high and low positive voltage and ground potential voltage
- DC power source E3 has three levels of positive and negative polarity voltage and ground potential voltage.
- the change-over switches SW3 and SW4 are both 3-contact switches that selectively select and supply the output voltage of each DC power supply E3 and E4.
- the timing for switching the substrate voltage and the reset voltage is controlled by the control circuit 4. In other words, the selection of the substrate voltage and the reset voltage by the control circuit 4 corresponds to switching of the switching switches SW3 and SW4.
- SW3 and SW4 are linked so that the potential difference of the substrate voltage with respect to the reset voltage is constant, and the substrate voltage is switched in three stages according to the reset voltage. Since the substrate 10 and the intermediate layer 16 are reversely biased at a high potential, a constant voltage that is higher than the reset voltage may be used as the substrate voltage regardless of the reset voltage.
- Both the integrated voltage applied to the integrated electrode 12 and the held voltage applied to the holding electrode 13 can be switched between a positive polarity and a negative polarity, and timing for switching the integrated voltage and the holding voltage. Is controlled by the control circuit 4 in the same manner as the substrate voltage and the reset voltage.
- the function of applying the integrated voltage and holding voltage in the control circuit 4 is directly This is schematically represented by the combination of current batteries El and E2 and switching switches SW1 and SW2.
- the DC power supplies El and E2 that apply the integrated voltage and holding voltage can output both positive and negative voltages, and the polarity can be switched by the switch SW1 and SW2. That is, the selection of the integrated voltage and the holding voltage by the control circuit 4 is equivalent to switching the switching switches SW1 and SW2.
- electrons When the integrated voltage is positive, electrons can be collected in the integrated region l ib, and when the integrated voltage is negative, holes can be collected in the integrated region l ib. Similarly, when the holding voltage is positive, electrons can be collected in the holding region 11c, and when the holding voltage is negative, holes can be collected in the holding region 11c.
- electrons and holes that are carriers generated in the photosensitive portion 11a electrons are used as the light reception output.
- the electrons and holes generated in the photosensitive portion 11a are accumulated at different timings according to the amount of light incident on the photosensitive portion 11a, and the accumulated electrons and holes are regenerated.
- the electrons remaining after the bonding are taken out. Therefore, if electrons or holes remain in the photosensitive part 1 la before the intended light enters the photosensitive part 11a, unnecessary electrons are contained in the electrons taken out from the photosensitive part 1 la, and the electrons from the photosensitive part 1 la are included.
- the number of electrons taken out does not correspond to the amount of light received at the photosensitive portion 1 la. Therefore, it is necessary to first discard the electrons and holes remaining in the photoelectric conversion unit 1 before being accumulated in the electron, hole, and ⁇ product regions l ib.
- the electrons and holes remaining in the photoelectric conversion unit 1 are individually discarded.
- the integrated voltage and the holding voltage are both made positive in order to push out from the hole accumulation area 1 lb and the holding area 1 lc.
- the reset voltage is made negative. In this state, since the holes move toward the intermediate layer 16, this state is continued for a time period in which the holes disappear from the photoelectric conversion unit 1 in consideration of the mobility of the holes.
- the integrated voltage and the holding voltage are set to the negative polarity, the reset voltage is set to the positive polarity, and the substrate voltage is set. Is higher than the reset voltage. Electrons remaining in the photoelectric conversion unit 1 move toward the intermediate layer 16, and some electrons are discarded from the intermediate layer 16, and the remaining electrons that have passed through the intermediate layer 16 are discarded from the substrate 10. Abandoned. After the holes and electrons are discarded from the photoelectric conversion unit 1 and the photodetector 6 is reset as described above, the amount of electrons and holes remaining in the photoelectric conversion unit 1 becomes an amount corresponding to the thermal equilibrium state. The photodetector 6 is reset each time the received light output is taken out from the photodetector 6.
- a positive integrated voltage is applied to the integrated electrode 12 to accumulate electrons in the integrated region l ib, and at this time, no electrons are accumulated in the holding region 11c.
- a negative holding voltage is applied to 1 lb of the holding electrode.
- the photosensitive part 1 la electrons and holes are generated by the incidence of light, but since the integrated voltage is positive and the holding voltage is a negative voltage, the main functional layer 11 holds from the integrated region 1 lb.
- a potential gradient occurs in the region 1 lc, and the reset voltage applied to the intermediate layer 16 is set to the ground potential, so that in the vicinity of the region irradiated with light in the main functional layer 11, the intermediate region l ib A striking potential gradient occurs in layer 16.
- the portion covered with the light shielding film 15 is a force in which a directional potential gradient is generated from the intermediate layer 16 to the holding region 1lc.
- Area 1 lc has almost no holes.
- the integrated voltage is set to a negative polarity and the holding voltage is set to a positive polarity while the reset voltage is kept at the ground potential.
- the main functional layer 11 has a potential gradient from the intermediate layer 16 to the integration region l ib and a potential gradient from the holding region 11c to the integration region l ib. Further, a directional potential gradient is also generated from the holding region 11c to the intermediate layer 16. Therefore, the electrons accumulated in the accumulation region l ib move to the holding region 11c.
- the electrons and holes generated by light irradiation in the photosensitive portion 11a move toward the intermediate layer 16, and the holes move toward the integration region l ib.
- electrons and holes generated in the photosensitive portion 1 la can be distributed to the holding region 1 lc and the accumulation region 1 lb.
- the hole when a hole exists in the holding region 11c, the hole also moves toward the accumulation region 1 lb by force.
- the electrons are directed from the accumulation region l ib to the holding region 11c, and the holes are directed from the photosensitive portion 11a or the holding region 11c to the accumulation region l ib, so that the electrons and holes meet and recombine.
- some of the electrons are captured by dangling bonds (or interface potentials) on the surface of the integrated region l ib, and the captured electrons are captured by the integrated region 1 Recombines with holes accumulated in lb and disappears.
- some of the holes are trapped by dangling bonds (or interface potential) on the surface of the holding region 11c, and the trapped holes recombine with electrons transferred to the holding region 1lc. And disappear.
- the electrons in the holding region 11c are directed to the integration region l ib, Since 1 lb holes are directed to the holding region 1 lc, they disappear when electrons and holes meet and recombine. Further, electrons generated in the photosensitive portion 11a are also collected in the accumulation region l ib, and some of the electrons accumulated in the accumulation portion l ib from the photosensitive portion 11a also contribute to recombination with holes.
- the photosensitive region 1 la since some of the holes existing in the integrated region l ib are captured by dangling bonds (or interface potentials) on the surface of the integrated region l ib, the photosensitive region 1 la enters the integrated region l ib. The recombination with the electrons transferred from the accumulation or holding region 1 lc disappears, and similarly, some of the electrons present in the holding region 11c are dangling bonds (or interface potentials) on the surface of the holding region 11c. ) And recombine with the holes transferred to the holding area 11c and disappear.
- the timing for switching the integrated voltage and the holding voltage is not necessarily the same as the lighting period and the extinguishing period of the light emission source 2, but the timing for switching the integrated voltage and the holding voltage is referred to as the lighting period. Since it is easy to understand the operation when it coincides with the extinguishing period, first, a case where the lighting period and extinguishing period of the light-emitting source 2 coincide with the switching timing of the integrated voltage and holding voltage will be described. That is, as shown in FIG. 3 (A), the light source 2 is turned on and off alternately, and a positive integrated voltage is applied to the integrated electrode 12 during the lighting period Pb (FIG. 3 (B)). Apply a negative holding voltage to the holding electrode 13. In the extinction period Pd, a negative integrated voltage is applied to the integrated electrode 12 (FIG. 3 (B)), and a positive holding voltage is applied to the holding electrode 13 (FIG. 3 (C)). C)).
- the amount of electrons accumulated in the integration region l ib in the lighting period Pb corresponds to the amount of light that is a combination of the signal light generated when the light source 2 is turned on and the ambient light other than the signal light.
- the electrons recombine with holes in the accumulation region l ib during the extinction period Pd and disappear. This means that at least part of the amount of electrons corresponding to the amount of ambient light has been extinguished, and the amount of electrons held in the holding region 11c is equal to the combined amount of signal light and ambient light. Less than the corresponding electron quantity. That is, the amount of electrons held in the holding region 11c corresponds to the amount of light obtained by reducing part of the amount of ambient light with respect to the combined amount of signal light and ambient light.
- the signal light can be obtained by repeating the lighting period Pb and the extinction period Pd multiple times.
- the ratio of the amount of electrons corresponding to ambient light to the amount of electrons corresponding to can be reduced. Therefore, by taking out the electrons remaining in the holding region ie after the recombination from the photodetector 6 and using them for the light reception output, it is possible to obtain the light reception output from which the ambient light component is removed to some extent.
- the voltage applied to the integrated electrode 12 and the holding electrode 13 is adjusted.
- the potential well formed in the main functional layer 11 is controlled, and the electrons held in the holding region 1 lc are transferred. That is, the main functional layer 11, the integrated electrode 12, and the holding electrode 13 are used to operate as a CCD, and electrons can be transferred in the left and right directions in FIG.
- the charge extraction portion 7 shown in FIG. 1 includes this function of the main functional layer 11.
- the control unit 4 determines that the integrated voltage applied to the integrated electrode 12 and the holding voltage applied to the holding electrode 13 have different polarities. Is controlled so that the voltage is applied in one direction. Also, the voltage value can be controlled along with the timing.
- the control of the voltage applied to the integrated electrode 12 and the holding electrode 13 in the extraction period is the same as the control of the voltage applied to the transfer gate in the CCD. That is, in the present embodiment, the main function layer 11 is also used as a vertical transfer register for transferring a carrier, like a frame transfer type CCD image sensor. In the photodetector 6, the main functional layer 11 is used as a vertical transfer register, and the electrons of the vertical transfer register force are transferred by the horizontal transfer register 21 (see FIG. 10), and the light reception output of each photosensitive portion 11a is transferred to the semiconductor substrate. Take it out.
- the same structure as the force interline CCD image sensor in which the main function layer 11 is also used as a transfer register is adopted, and a carrier held in the holding area 11c in the main function layer 11 is provided separately. Transfer to the vertical transfer register and take it out of the semiconductor substrate through the vertical transfer register and horizontal transfer register It may be.
- the technology that uses the amount of light received by the photoelectric conversion unit 1 obtained at timings corresponding to multiple phases synchronized with the lighting source 2 being turned on and off, and the light source 2 being turned on and off And a technique that uses the amount of light received by the photoelectric conversion unit 1 obtained at a plurality of timings that are not synchronized.
- a section of 180 degrees is set for every 90 degrees of the phase of the modulation signal, and the amount of received light is obtained in each section. That is, the received light intensity is obtained for four sections of the modulated signal, 0 to 180 degrees, 90 to 270 degrees, 180 to 360 degrees, and 270 to 90 degrees.
- the amount of light received in each section corresponds to the area of the figure shown in Fig. 4 (C) to Fig. 4 (F).
- the received light intensity in each section is represented by AO to A3
- the received light intensity of the ambient light and the signal light is Ab
- the received light intensity corresponding only to the environmental light is Ad
- the modulation signal period is 4T
- the time difference is td If so, the received light amounts AO to A3 can be expressed as follows.
- A2 Ab X td + AdX (2T—td)
- A3 Ab X (T td) + AdX (T + td)
- the time difference td can be obtained by using the period 4T of the modulation signal and the received light amounts AO to A3 of the four sections described above.
- the received light quantity AO to A3 corresponds to the received light output. Therefore, the distance calculation circuit 5 obtains the time difference td by using the received light output of each photoelectric conversion unit 1 given from the light detector 6 instead of the received light amount AO to A3, and converts it to the distance to the object 3. Can do.
- the sign of the calculation result of the above equation is appropriately selected so that the time difference td is positive.
- the section for obtaining the received light quantity AO is a section of 0 to 180 degrees in the modulation signal, and the received light quantity as shown in FIG. 4 (E).
- the interval for obtaining A2 is the interval of 180 to 360 degrees in the modulation period.
- the period during which the positive integrated voltage is applied to the integrated electrode 12 corresponds to the interval of 0 to 180 degrees in the modulation signal
- the period during which the negative integrated voltage is applied to the integrated electrode 12 is If the modulation signal corresponds to an interval of 180 to 360 degrees, the amount (number) of electrons generated in the photosensitive area 1 la and accumulated in the accumulation area l ib corresponds to the received light quantity AO, and is generated in the photosensitive area 11a.
- the amount (number) of holes accumulated in the integrated region 1 lb corresponds to the received light quantity A2.
- the amount of electrons remaining in the holding region 11c after the operation of alternately switching the polarity of the integrated voltage in the 0 to 180 degree interval and 180 to 360 degree interval in the modulation signal is (AO-A2) It can be said that it corresponds to.
- the polarity of the integrated voltage is positive in the 90 to 270 degree interval in the modulation signal and the polarity of the integrated voltage is negative in the 270 to 90 degree interval in the modulation signal.
- the amount corresponds to (A1 -A 3).
- the electrodes and holes are recombined and then the holding region 11c
- the calculation of (AO-A2) and (A1-A3) is performed, and the amount of calculation in the distance calculation circuit 5 can be reduced.
- the modulation signal for driving the light source 2 As the waveform, other waveforms such as sine wave, sawtooth wave and triangular wave can be used.
- a sine wave is used as the waveform of the modulation signal as shown in FIG. 5 (A) will be described.
- the received light amounts AO to A3 in the sections of 0 to 180 degrees, 90 to 270 degrees, 180 to 360 degrees, and 270 to 90 degrees in the modulation signal are shaded in FIGS. 5 (C) and 5 (D). Since it corresponds to the area shown, it can be expressed by a definite integral as shown below.
- phase ⁇ is a function of time t
- Ab is the maximum value of the light intensity received by the photoelectric converter 1
- Ad is the intensity of the light received by the photoelectric converter 1
- Ad corresponds to the light intensity corresponding to the ambient light received by the photoelectric conversion unit 1.
- the value in [] means the integration interval.
- Al — 2Aa-sin ⁇ + Ac- ⁇
- A2 2Aa-cos ⁇ + Ac- ⁇
- A3 2Aa sin ⁇ + Ac- ⁇
- ⁇ tan "( ⁇ 1- ⁇ 3) / ( ⁇ - ⁇ 2)... hi)
- the phase difference ⁇ can be obtained by the above equation. Can be sought.
- the waveform of the modulation signal is a sine wave
- the light reception output corresponding to (AO—A2) or (A1—A3) is obtained because of the assumption that the integration efficiency of electrons and holes into the 1 lb integration region is equal, This is based on the assumption that the recombination probability of 1 and the hole is 1 (that is, all the electrons and holes that are encountered recombine). In practice, the integration efficiencies are not equal and the recombination probability is much less than 1 (for example, 0.1). Therefore, the assumption that the recombination probability is 1 is left as it is, and equation (1) is corrected in consideration of the difference in the integration efficiency between electrons and holes.
- electrons are accumulated in the integrated region l ib in the period in which the phase of the modulation signal is 0 to 180 degrees and the period in which it is 90 to 270 degrees, respectively.
- Corresponding electrons are accumulated from the photosensitive portion 11a to the integrated region l ib, and holes corresponding to the received light amounts A2 and A3 are accumulated from the photosensitive portion 11a to the integrated region l ib.
- V (0 ⁇ ⁇ 1) be the integration efficiency of holes with respect to the integration efficiency of electrons in the integration region 1 lb. That is, it is assumed that the hole integration efficiency is smaller than that of electrons.
- the parameters that determine the number of electrons and holes integrated in the integrated region l ib are greatly affected by the thickness of the main functional layer 11 and the wavelength of the received light, as well as the amount of received light, the integrated voltage, and the applied integration voltage.
- N0-N2 h (A0) ah (A2)
- Nl-N3 h (Al) ah (A3)
- the function h may be regarded as a linear function with the received light amount AO, Al, A2, A3 as a parameter in the range where the amount of electrons and holes generated for the received light amount AO, Al, A2, A3 is not saturated. Therefore, the following equation is obtained by further modifying the above equation.
- the distance calculation circuit 5 uses the received light output obtained according to the amount of electrons remaining in the holding region 11c to determine the distance to the object 3 using an arithmetic expression, the received light output is (N1-N3 ) Or (NO-N2), and it must be taken into account that correction for the accumulation efficiency oc is necessary.
- the received light output is (N1-N3 ) Or (NO-N2), and it must be taken into account that correction for the accumulation efficiency oc is necessary.
- the distance calculation circuit 5 associates the received light output with the distance by a data table, and the integration efficiency a is folded into the data table.
- Equation (2) uses the number of electrons and holes NO, Nl, N2, and N3 as parameters, and the number of electrons and holes NO, Nl, N2, and N3 are integrated with the received light quantity AO, Al, A2, and A3. Since it is a function of voltage Va and application period Pa, if at least one element of each received light quantity AO, Al, A2, A3, integrated voltage Va, and application period Pa is adjusted, equation (2) can be used. The phase difference ⁇ can be obtained.
- the waveform of the modulation signal is adjusted using a function generator based on a technique such as broken line approximation.
- holes are accumulated when electrons are accumulated in the integration area lib.
- the integration efficiency ⁇ can be made close to 1.
- the integration efficiency a can be made closer to 1 even if the integration voltage Va application period Pa is longer than the integration period Va application period Pa when collecting electrons. become.
- the modulation signal is a rectangular wave
- the time difference td can be accurately obtained by correcting in consideration of the integration efficiency of electrons and holes.
- another waveform is used as the modulation signal.
- the force that assumes the recombination probability is 1
- the recombination probability when electrons and holes are recombined and annihilated depends on the density of electrons and holes. .
- the amount of received light is small, electrons may not be extinguished as much as possible, and when the amount of received light increases, the amount of electrons that disappear may be increased to prevent saturation of the photodetector 6. In such a case, it is necessary to adjust the recombination probability according to the amount of received light.
- the amount of holes generated in the photosensitive portion l ib are recombined, the amount of holes changes according to the amount of electrons. As a result, the recombination probability is automatically adjusted according to the amount of received light.
- phase difference ⁇ can be obtained by simply replacing ⁇ , Al, ⁇ 2, and A3 in Eq. (1) with AO', A ⁇ 2 ', and A3'.
- a light reception signal proportional to the amount of light received is extracted and a modulation signal is obtained. It is conceivable to output a local oscillation signal having a frequency different from that of the signal from the control circuit 4 and mix the received light signal and the local oscillation signal.
- the circuit configuration may be complicated. Therefore, the integrated voltage is applied to the integrated electrode 12, the timing of applying the held voltage to the holding electrode 13 is controlled by the local signal, and the function of the mixing circuit is realized by using the integrated region 1 lb and the holding region 1 lc. To do.
- each photoelectric conversion unit 1 is provided with two integrated electrodes (12a, 12b) and two holding electrodes (13a, 13b). That is, two integrated electrodes (12a, 12b) and holding electrodes (13a, 13b) form one group (or one pixel).
- the two holding electrodes (13a, 13b) are arranged apart from each other, and the two integrated electrodes (12a, 12b) are arranged between the holding electrodes (13a, 13b). Further, a gap “g” having a distance larger than the distance between the adjacent holding electrodes (13a, 13b) is formed between the integrated electrodes (12a, 12b).
- the light shielding film 15 is provided so as to straddle the holding electrodes (13a, 13b) of the adjacent photoelectric conversion unit 1.
- the set of the integrated electrode 12a and the holding electrode 13a and the set of the integrated electrode 12b and the holding electrode 13b function in the same manner as the relationship between the integrated electrode 12 and the holding electrode 13 in the first embodiment.
- the two integrated electrodes (12a, 12b) are applied with the opposite polarity of the integrated voltages, and the two holding electrodes (13a, 13b) are also supplied with the opposite polarities of the holding voltages. Applied.
- FIG. 6 voltages having opposite polarities are applied between the integrated electrodes (12a, 12b) or between the holding electrodes (13a, 13b), and the adjacent integrated electrode 12a, the holding electrode 13a, and the adjacent integrated electrode 12b
- the control circuit 4 applies an integrated voltage and a holding voltage to two DC power supplies El, E2, dual DC power supply El, E2 and integrated electrode 12a , 12b and holding electrodes 13a, 13b are schematically shown by two-contact switching switches SW1 and SW2.
- the integrated voltage and the holding voltage have the same voltage value.
- the principle of the present embodiment will be described on the assumption that the modulation signal for driving the light source 2 is a rectangular wave.
- the operation of the present embodiment will be described on the condition that the integrated voltage and the holding voltage are switched at a timing synchronized with the modulation signal. Operations other than this condition have already been described in the first embodiment, and are the same as those in the first embodiment except for the operations described in the present embodiment.
- the integrated voltage applied to the integrated electrode 12a is positive, and the integrated voltage applied to the integrated electrode 12b is negative. Further, during the lighting period, the holding voltage applied to the holding electrode 13a is negative, and the holding voltage applied to the holding electrode 13b is positive.
- the electrons and holes remaining in the main functional layer 11 are discarded before the electrons and holes are accumulated in the integration region 1 lb.
- the main functional layer 11 corresponds to the integrated electrode 12a. Electrons generated in the main functional layer 11 by light irradiation to the main functional layer 11 are accumulated in the integrated region 1 lb formed at the site where the main functional layer 11 corresponds to the integrated electrode 12b. In the integrated region 1 lb formed in the part, holes generated in the main functional layer 11 by light irradiation to the main functional layer 11 are integrated. In other words, the electrons and holes generated in the main functional layer 11 are distributed to the two integrated regions l ib formed in the main functional layer 11 at the portions corresponding to the respective integrated electrodes 12a and 12b, and integrated. Is done.
- the collector applied to the integrated electrodes 12a and 12b.
- the polarity of the product voltage and the holding voltage applied to the holding electrodes 13a and 13b is switched.
- the integrated voltage applied to the integrated electrode 12a has a negative polarity
- the holding voltage applied to the holding electrode 13a has a positive polarity
- the integrated voltage applied to the integrated electrode 12b has a positive polarity, and is applied to the holding electrode 13b.
- the holding voltage is negative.
- the electrons existing in the integrated region 1 lb corresponding to the integrated electrode 12a move to the holding region 11c corresponding to the holding electrode 13a while leaving a part of the electrons captured by the dangling bonds.
- the holes that existed in the integrated region 1 lb corresponding to the integrated electrode 12b move to the holding region 11c corresponding to the holding electrode 13b, leaving a part captured by the dangling bonds.
- the electrons left in the integrated region l ib corresponding to the integrated electrode 12a recombine with the integrated holes, and the holes left in the integrated region l ib corresponding to the integrated electrode 12b are recombined with the integrated electrons. To do.
- the integrated voltage applied to the integrated electrode 12a has a negative polarity, and the holding voltage applied to the holding electrode 13a and the integrated voltage applied to the integrated electrode 12b are both positive. Therefore, there is provided a force gap g for allowing electrons to move from the integrated region l ib corresponding to the integrated electrode 12a to the integrated region l ib corresponding to the integrated electrode 12b in addition to the holding region 11c corresponding to the holding electrode 13a alone. Therefore, the movement of electrons to the integrated region l ib corresponding to the integrated electrode 12b is suppressed.
- the integrated region l ib corresponding to the integrated electrode 12a is held in the holding region 1 lc corresponding to the electrons generated in the main functional layer 11 and the holding electrode 13a.
- the accumulated electrons are accumulated, and the accumulated holes accumulated in 1 lb of the integrated region corresponding to the integrated electrode 12a meet and recombine with these electrons and disappear.
- accumulation In the integrated region l ib corresponding to the electrode 12b the holes generated in the photosensitive portion 11a and the holes held in the holding region 11c corresponding to the holding electrode 13b are integrated and correspond to the integrated electrode 12b.
- the electrons will disappear from the holes when they meet and recombine with these holes.
- the electrons remaining in 11c are the same as those in the first embodiment, and the components corresponding to the ambient light are reduced.
- the recombination probability between electrons and holes with the same integration efficiency of electrons and holes is 1, no electrons should remain in the integrated region l ib corresponding to the integrated electrode 12b.
- the recombination probability is smaller than 1, electrons remain in the integrated region l ib corresponding to the integrated electrode 12b.
- the remaining electrons are generated during the extinguishing period, but have information about the lighting period because some of them disappear due to recombination with the holes generated during the lighting period. That is, the electrons remaining in the integrated region l ib corresponding to the integrated electrode 12b are components obtained by reducing the component for the ambient light from the component of the signal light and the ambient light.
- the operation for obtaining the distance of the light receiving output cover corresponding to each photoelectric conversion unit 1 in the photodetector 6 will be described below.
- electrons remaining in the integrated region l ib corresponding to the integrated electrode 12b are used for the received light output.
- the reason why electrons remain in the integrated region l ib corresponding to the integrated electrode 12b is that the hole integration efficiency ⁇ is smaller than 1 and the recombination probability ⁇ 8 is smaller than 1. Therefore, in order to obtain the distance from the received light output in the distance calculation circuit 5, the hole integration efficiency a (0 ⁇ a ⁇ 1) and the recombination probability i8 (0 ⁇ j8 ⁇ Modify equation (1) considering 1).
- the integrated voltage Va and application period Pa are the same regardless of electrons and holes.
- the number of electrons NO and N1 integrated in the integrated region lib when the received light amount is AO and Al, respectively.
- NO h (AO)
- Nl h (Al)
- the received light intensity is A2 and A3
- NO and N1 represent the number of holes
- N2 and N3 represent the number of electrons
- NO ah (AO)
- Nl ah (Al)
- N2 h (A2)
- N3 h (A3).
- the number of electrons remaining due to recombination of electrons and holes is (NO—j8N2) or (NO) regarding the integrated region lib corresponding to the integrated electrode 12a and the holding region 11c corresponding to the holding electrode 13a.
- the number of electrons remaining after being recombined with holes using the set of the integrated electrode 12b and the holding electrode 13b is expressed by the following equation.
- the distance calculation circuit 5 calculates the difference between the two. If the two difference values thus obtained are divided, the division result corresponds to (AO ⁇ A2) / (A1 ⁇ A3) in equation (1), so that the phase difference ⁇ can be obtained.
- the integration efficiency a and The phase difference ⁇ can be obtained by removing the influence of the recombination probability ⁇ .
- the light-shielding film 15 holds the holding electrodes (13a, 13b so that light does not enter the holding regions 11c corresponding to the two holding electrodes (13a, 13b) provided in each photoelectric conversion unit 1.
- a lens array 19 including lenses 19a corresponding to the photoelectric conversion units 1 may be arranged.
- the lens array 19 it is possible to use a lens in which a force-independent lens 19a is held by a lens frame, assuming that the lens 19a is continuously formed integrally with a synthetic resin molded product.
- Each lens 19 a is a plano-convex lens having a convex light incident surface, and is arranged so that the boundary between the lenses 19 a coincides with the boundary of the photoelectric conversion unit 1.
- the lens 19a is a converging lens, and has a function of converging incident light at the central portion of the photoelectric conversion unit 1 as indicated by an arrow in FIG. 8. With this function, light is applied to the holding electrodes (13a, 13b). Is prevented from entering. That is, similarly to the case where the light shielding film 15 is provided, it is possible to prevent light from entering the holding region 11c corresponding to the holding electrodes (13a, 13b). In addition, since the light incident on the region corresponding to the entire surface of the photoelectric conversion unit 1 is converged and enters the light sensitive unit 11a in the photoelectric conversion unit 1, the aperture ratio is larger than that in the case where the light shielding film 15 is provided. The light utilization efficiency is increased.
- the photodetector 6 is configured by arranging a plurality of photoelectric conversion units 1, and When the main functional layer 11 is also used as a vertical transfer register, the potential electrode formed in the main functional layer 11 is controlled by using the integrated electrodes (12a, 12b) and the holding electrodes (13a, 13b). In order to transfer carriers (electrons or holes), if the gap “g” is too wide, a potential well for transferring carriers at the gap “g” may not be formed.
- the transfer electrode 22 is added between the integrated electrodes (12a, 12b), thereby reducing the distance between the integrated electrodes (12a, 12b).
- the feature is that the electrons and holes remaining in the holding region 11c can be easily transferred while easily spreading and separating the electrons and holes.
- the transfer electrode 22 is kept at OV without applying the transfer voltage, so that the transfer electrode 22 exceeds the width of the transfer electrode 22.
- a gap g having a width can be formed between the integrated electrodes (12a, 12b).
- a gap is formed between the photoelectric conversion units 1 adjacent in the vertical direction in order to suppress carrier leakage from the holding region 11c.
- the transfer electrode 23 By adding the transfer electrode 23 to the corresponding part as well, while separating the electrons and holes between the adjacent photoelectric conversion parts 1 in the vertical direction, the carriers move easily during carrier transfer! It becomes possible to form a potential well.
- six electrodes, integrated electrodes (12a, 12b), holding electrodes (13a, 13b), and transfer electrodes (22, 23) are used per group (one pixel).
- a plurality of groups of integrated electrodes (12a, 12b) and holding electrodes (13a, 13b) sharing the main functional layer 11 are provided,
- the transfer electrodes (22, 23) are arranged between the integrated electrodes (12a, 12b) adjacent in the group and between the holding electrodes (13a, 13b) adjacent in the group, respectively.
- the efficiency of hole integration in the integration region 1 lb is smaller than that of electrons.
- one photoelectric conversion unit 1 has integrated electrodes (12a, 12b ) And two holding electrodes (13a, 13b), and using the light receiving output corresponding to this photoelectric converter 1, the integration efficiency (excluding the effects of X and recombination probability ⁇ is obtained.
- the hole integration efficiency is extremely small compared to electrons, the effect of using the recombination of electrons and holes cannot be obtained sufficiently, so that electrons and holes are integrated in the integration region l ib. During this period, the hole integration efficiency may be increased by applying an appropriate voltage to the transfer electrode 22.
- the integration is performed.
- a negative voltage having an absolute value smaller than the integrated voltage applied to the electrode 12a (or the integrated electrode 12b) is applied to the transfer electrode 22.
- the transfer electrode 22 does not contribute to the hole accumulation, but a voltage having an appropriate negative polarity should be applied to the transfer electrode 22.
- the holes generated in the photosensitive portion 11a are formed corresponding to the transfer electrode 22 that is not only the integrated region 1 lb corresponding to the integrated electrode 12a (or the integrated electrode 12b).
- Potential is also accumulated in wells. Since the potential well formed corresponding to the transfer electrode 22 is shallower than the potential well that is the integrated region l ib with respect to the hole, the potential well is integrated into the potential well formed corresponding to the transfer electrode 22. The hole flows in the accumulation region l ib. As a result, it is possible to accumulate more holes in the integrated region l ib than when the integrated electrode 12a (or the integrated electrode 12b) is used alone. In the above example, it is assumed that the hole integration efficiency is lower than that of electrons. Conversely, when the electron integration efficiency is lower than holes, the transfer electrode 22 is used for electron integration. In addition, an appropriate positive voltage may be applied to the transfer electrode 22. Other configurations and operations are the same as those in the second embodiment.
- a waste electrode 17 is provided adjacent to the photoelectric conversion unit 1, and the waste voltage applied to the waste electrode 17 is controlled, so that the photoelectric conversion unit 1 has It is characterized in that the remaining electrons and holes are discarded.
- waste electrodes 17 along one vertical and horizontal direction are arranged between each pair of photoelectric conversion units 1 adjacent in the other direction.
- the integrated electrodes (12a, 12b), the holding electrodes (13a, 13b), and the transfer electrodes ( 22 and 2 3) are arranged in the vertical direction (vertical direction in FIG. 10), and a waste electrode 17 extending in the vertical direction is provided between the columns in which the photoelectric conversion units 1 are arranged in the vertical direction.
- the rectangular integrated electrodes (12a, 12b) and the holding electrodes (13a, 13b) extend in a direction perpendicular to the longitudinal direction of each of the holding electrodes (13a, 13b) at an approximately equal distance from each of the integrated electrodes and the holding electrodes.
- a waste electrode 17 is provided on the surface of the photoelectric conversion unit 1 so as to exit.
- one end force carrier of the vertical transfer register which is the main functional layer 11 is delivered to the horizontal transfer register 21 which constitutes the charge transfer unit 7 together with the vertical transfer register.
- the integrated electrodes (12a, 12b), the holding electrodes (13a, 13b), and the transfer electrodes (22, 23) are divided for each column in the vertical direction, but the columns are not divided. Alternatively, four rows may be composed of one electrode extending in the horizontal direction.
- the waste electrode 17 is formed on the main functional layer 11 which is an n-type semiconductor layer in a region having a main surface force of a predetermined depth (2 to 3 m).
- the main functional layer 11 and the waste electrode 17 are joined together in an ohmic manner.
- a positive or negative waste voltage to the waste electrode 17
- the electrons and holes remaining in the main functional layer 11 are discarded. It becomes possible to dispose of the main functional layer 11 through the electrode 17.
- the waste electrode 17 by keeping the waste electrode 17 at OV without applying a voltage, there is a 1 lb integration region formed in the main functional layer 11 adjacent in the horizontal direction, and electrons or holes are mixed between the holding regions 1 lc. Therefore, the waste electrode 17 contributes to the improvement of the separability of the photoelectric conversion unit 1.
- the waste electrode 17 functions as a separation electrode that separates the photoelectric conversion units 1 from each other in the horizontal direction. Therefore, the depth of the waste electrode 17 is set so that the carrier (especially holes) remaining in the main functional layer 11 can be surely discarded, and the leakage of carriers between the photoelectric conversion units 1 is prevented. It is determined in consideration of prevention.
- the separation electrode made of a conductive material is not provided with the waste electrode 17 and the optical
- the electrons and holes remaining in the main functional layer 11 may be disposed through the substrate 10 and the intermediate layer 16 for the purpose of separating the electric conversion unit 1.
- a discard voltage is applied to the discard electrode 17 with a polarity depending on whether the electrons or the holes are discarded.
- a positive disposal voltage is applied to the disposal electrode 17.
- a negative disposal voltage is applied to the waste electrode 17
- the holes remaining in the integration region ib corresponding to the integrated electrode 12a are discarded, and then a positive disposal voltage is applied to the waste electrode 17.
- the electrons remaining in the holding region 11c corresponding to the holding electrode 13a are discarded.
- This configuration can be used when the conductive type of the substrate 10 is used, and of course, even when the conductive type of the substrate 10 and the carrier cannot be discarded through the substrate 10, Disposal The residual carrier in the main functional layer 11 can be discarded through the electrode 17.
- Insulation isolation part 18 is an insulating material consisting of a silicon oxide layer (SiO 2)
- the insulating separation part 18 is intended to prevent carrier leakage between the photoelectric conversion parts 1 adjacent in the horizontal direction, the depth from the main surface is determined by the depth of the holding region 11c, for example, 2 to 3 / Set to zm.
- an electrode for discarding carriers remaining in the main functional layer 11 is separately provided.
- the circumference of the semiconductor substrate on which the photodetector 6 is formed An overflow drain similar to the CCD image sensor is provided in the part, and the carrier can be discarded through the overflow drain.
- the photodetector 6 has a configuration in which the main functional layer 11 also functions as a vertical transfer register. However, a vertical transfer register is provided separately from the main functional layer 11, and a transfer gate is connected from the main functional layer 11. The carrier may be handed over to the vertical transfer register. If this configuration is adopted, the main functional layer 11 may be surrounded by the waste electrode 17 or the insulating separation part 18 except for the portion where the transfer gate is provided.
- control electrodes (24a, 24b) are provided instead of the transfer electrode 22 described in the third embodiment, and two transfer electrodes 23 are used instead of the transfer electrode 23.
- Control electrodes (25a, 25b) are provided, respectively.
- the integrated electrode (12a, 12b), the holding electrode (13a, 13b), the control electrode (24a, 24b), and the control electrode (25a, 25b) are provided in one photoelectric conversion unit 1. Two each are provided, and a configuration with eight electrodes per pixel is adopted. In the figure, these electrodes are arranged at equal intervals.
- the control electrodes (24a, 24b) are arranged between adjacent integrated electrodes (12a, 12b) in one photoelectric conversion unit 1, and thus light is transmitted through the control electrodes (24a, 24b).
- control electrodes (25a, 25b) are arranged between the holding electrodes (13a, 13b) provided in the two adjacent photoelectric conversion units 1, and therefore the control electrodes (25a, 25b) are covered with the light shielding film 15. Is called.
- FIGS. 14A to 14H voltages are applied to the control electrode 25a, the holding electrode 13a, the integrated electrode 12a, the control electrode 24a, the control electrode 24b, the integrated electrode 12b, the holding electrode 13b, and the control electrode 25b, respectively.
- This shows the change in the depth of the potential well formed.
- the horizontal line in the center of each figure shows the state where the potential well is not formed, and the potential well for electrons is located below the central horizontal line.
- the formation state and the state above the central horizontal line represent the state where the potential well for the hole is formed.
- the center line is a reference potential
- a positive voltage is applied during the period in which the potential well for electrons is formed
- a negative voltage is applied during the period in which the potential well for holes is formed. Apply It will be a period.
- the integrated voltage applied to the integrated electrodes (12a, 12b) and the holding voltage applied to the holding electrodes (13a, 13b) are each a positive / negative step and a reference potential of 3
- the voltage applied to the control electrodes (24a, 24b, 25a, 25b) is switched to four stages: positive one stage, negative two stages, and reference potential.
- the electron is represented by the symbol e
- the hole is represented by the symbol h
- the movement of the electron e or the hole h is represented by an arrow.
- the symbols e and h with circles indicate that they are electrons or holes accumulated from the photosensitive portion 1 la.
- the basic operation is a case where the light source 2 repeats lighting and extinguishing and obtains a light receiving output corresponding to the difference in the amount of received light between the lighting period Pb and the extinguishing period Pd.
- the accumulation period Tel and the transfer period Tml correspond to the lighting period Pb
- the accumulation period Tc2 and the transfer period Tm2 correspond to the extinguishing period Pd.
- the switching time of the lighting period Pb and the light-off period Pd coincides with the switching time of the integrated voltage and holding voltage, so the integration period shown in FIG. This means that only T cl and Tc2 are operating.
- transfer periods Tml and Tm2 are provided between the accumulation periods Tel and Tc2, and the transfer periods Tml and Tm2 include an accumulation region 1 lb and a holding region 1 lc. Electrons or holes are prevented from diffusing by regulating the direction of movement of electrons or holes by forming a potential gradient between them.
- the control electrodes (24a, 24b, 25a, 25b) in the main functional layer 11 are applied.
- the electron or hole is temporarily retreated in the retreat area, and then transferred to the accumulation area l ib or the retention area 11c. Prevents diffusion of electrons or holes.
- State 1 is the integration period Tcl
- state 6 is the integration period Tc2.
- the electrons or holes generated in the photosensitive portion 11a are integrated into the integration region l ib and integrated.
- the electrons or holes transferred to the holding area 11c before the periods Tcl and Tc2 are held in the holding area 11c.
- the operation during the integration period Tel, Tc2 is basically the same as in the first to fourth embodiments.
- States 2 to 5 are the transfer period Tml
- states 6 to 9 are the transfer period Tm2.
- the polarity of the integrated voltage and the holding voltage is switched in each of the transfer periods Tml and Tm2.
- states 3 and 8 that once becomes the reference potential between the polarities.
- a potential well serving as a retreat area is formed in the main functional layer 11 at a portion corresponding to the control electrode (24a, 24b, 25a, 25b).
- Electrons or holes are transferred from the integrated region l ib corresponding to the integrated electrode (12a, 12b) to the retreat region corresponding to the control electrode (25b, 25a), respectively, and the holding region corresponding to the holding electrode (13a, 13b)
- a potential gradient is applied to the main functional layer 11 so that electrons or holes can be transferred from 11c to the retreat areas corresponding to the control electrodes (24a, 24b).
- the accumulation region 1 lb and the retention region 1 lc have different types of carriers (if one is an electron, the other Therefore, when electrons or holes are transferred to the retreat area, the electrons and holes are recombined.
- recombination of electrons and holes is performed mainly after switching the polarity between the integrated voltage and the holding voltage in other embodiments, but in this embodiment, not only after switching the polarity between the integrated voltage and the holding voltage. This is also performed when the polarity of the integrated voltage and the holding voltage is switched. That is, by providing the save area, when the integrated voltage and the holding voltage pass the reference potential, the electrons and holes are transferred to the save area, and the electrons and holes are recombined during the transfer. In Fig. 14, the force of the part where the arrows cross represents this state.
- the electrons or holes trapped on the surface of the main functional layer 11 in the integration region l ib and the holding region 11c have moved to the integration region 1 lb and the holding region 1 lc. Recombine with electrons or holes.
- Electrons move toward the save area formed on the opposite side of the hold area while holding the hole, and the electrons that have reached the save area without recombining with the hole are accumulated areas l
- the ib and the holding region 11c move to a region different from the region that initially held electrons, and recombine with the holes remaining in the region.
- the hole is held in the accumulation region 1 lb and the holding region 1 lc, and the region force also holds the electron, and the hole moves toward the retreat region formed on the opposite side of the region.
- the holes that have reached the evacuation region without recombining with electrons move to a region different from the region that originally held the hole in the accumulation region 1 lb and the retention region 1 lc, and remain in that region. It recombines with the electron that had been used.
- the integrated region 1 lb or the holding region 1 lc is formed without diffusion of electrons and holes.
- a potential gradient is applied so as to move toward the evacuation region through the evacuation region, and then, the electrons and holes are pulled back to the accumulation region ib or the holding region 11c.
- Transfer period Tml, Tm2 states 2 and 7 are preparation periods before switching the polarity of the integrated voltage and holding voltage.
- states 2 and 7 the main functional layer 11 A potential gradient can be applied to the surface to prevent diffusion of electrons and holes.
- states 1 to: LO in order to collect many electrons and holes in the integration region l ib, states 1 to: LO Of these, the states 1 and 6 corresponding to the integration periods Tcl and Tc2 are made longer than the other states.
- states 1 to 5 and states 6 to 10 have substantially the same operation, except that states involving electrons and holes are interchanged.
- a main functional layer 1 made of an n-type silicon layer is disposed on a substrate 10 that is an n-type silicon layer via an intermediate layer 16 that is a p-type silicon layer. 1 is provided, and an insulating layer 14 made of a silicon oxide film is formed on the main functional layer 11.
- a plurality of distribution electrodes 32a and 32b are arranged on the main surface of the main functional layer 11 with the insulating layer 14 therebetween. Two distribution electrodes (32a, 32b) are arranged close to each other. Therefore, one photoelectric conversion unit 1 has a pair of distribution electrodes (32a, 32b), and the substrate 10, the main functional layer 11, the insulating layer 14, and the intermediate layer 16 are shared with other photoelectric conversion units 1. .
- distribution electrodes (32a, 32b) When a distribution voltage is applied to the distribution electrodes (32a, 32b), potential wells (31a, 31b) are formed in the main functional layer 11, respectively.
- the distribution electrodes (32a, 32b) and the insulating layer 14 are translucent, and are configured such that light reaches the main functional layer 11 through the distribution electrodes (32a, 32b).
- the distribution voltage applied to each of the distribution electrodes (32a, 32b) can be switched between two steps of positive polarity and negative polarity. If the distribution voltage applied to each distribution electrode (32a, 32b) is positive, electrons can be collected in each potential well (31a, 31b), and if the distribution voltage is negative, holes are generated in the potential well (31a, 31b). Can be collected. In this embodiment, at least one of electrons and holes, which are carriers generated in the photoelectric conversion unit 1, is used as a light reception output.
- the necessary carriers of electrons and holes are taken out as a light-receiving output after several transports of electrons and holes, the number of carriers is reduced compared to the case where the accumulated carriers are output as they are. In particular, saturation in the photoelectric conversion unit 1 is less likely to occur.
- the recombination probability between electrons and holes depends on the density of electrons and holes. The higher the density, the greater the recombination probability. Therefore, recombination occurs when the received light quantity is low and the density is low. The ratio of the remaining electrons and holes to the electrons and holes generated in the main functional layer 11 is increased, and conversely, recombination occurs when the amount of received light is high and the density is high.
- the ratio of the remaining electrons and holes to the electrons and holes generated in is reduced.
- the dynamic range of the received light output is suppressed with respect to the dynamic range of the received light amount, and an effect of making the saturation in the photoelectric conversion unit 1 less likely to occur can be expected.
- the shot noise due to the difference in the amount of received light is suppressed, and compared with the case where the received light output is taken out without recombination, the integration time (light reception time) is shortened by the amount that the effect of shot noise is reduced, Response speed can be improved.
- the basic operation of the photoelectric conversion unit 1 will be described. According to the amount of light incident on the photoelectric conversion unit 1, the electrons and holes generated simultaneously in the photoelectric conversion unit 1 are sorted and accumulated in two potential wells (31a, 31b), and the accumulated electrons and holes are recombined. Power remaining after Since at least one of the element and the hole is extracted as a light reception output, if electrons or holes remain in the photoelectric conversion unit 1 before the target light is incident on the photoelectric conversion unit 1, it is extracted from the photoelectric conversion unit 1. An unnecessary component is included in the received light output, and the received light output extracted from the photoelectric conversion unit 1 does not correspond to the received light amount in the photoelectric conversion unit 1. Therefore, before the electrons and holes are accumulated in the potential wells 3 la and 31b, the electrons and holes remaining in the photoelectric conversion unit 1 are first discarded. This charge discarding process has already been described in detail in the first embodiment, and is therefore omitted.
- the electrons generated in the photoelectric conversion unit 1 are accumulated in the potential well 3 la, and the holes generated in the photoelectric conversion unit 1 are accumulated in the potential well 3 lb.
- a potential gradient occurs from the potential well 31a to the potential well 31b, so that there is a hole in the potential well 31a! If electrons are present in the hole, they are transported toward the potential well 31a.
- the distribution voltage applied to the distribution electrode 32a is made negative while the reset voltage is kept at the ground potential, and the distribution voltage applied to the distribution electrode 32b is made positive.
- sexually At this time, in the main functional layer 11, a directional potential gradient is generated from the intermediate layer 16 to the potential well 31a, and at the same time, a potential gradient is generated from 3 lb of the potential well to the intermediate layer 16. That is, the electrons generated in the photoelectric conversion unit 1 are accumulated in the potential well 3 lb, and the holes generated in the photoelectric conversion unit 1 are accumulated in the potential well 31a.
- a potential gradient is generated from the potential well 3 lb to the potential well 31 a, so that the electrons accumulated in the potential well 3 la It is transferred to 3 lb of the potential well and accumulated in 3 lb of the potential well! And the holes are transferred to the potential well 31a.
- some electrons are trapped and not transferred by the surface dangling bonds or interface potential, and in the potential well 3 lb, they are not surface dangling bonds! The hole is not captured and transferred.
- the electrons and holes recombine with the electrons and holes accumulated or transported in the potential well 3 la, 3 lb.
- electrons generated in the photoelectric conversion unit 1 are accumulated in the potential well 31a, holes are accumulated in the potential well 3 lb, and holes in the potential well 3 la are transferred to the potential well 3 lb.
- Potential well 3 lb of electrons are transferred to potential well 3 la. Therefore, the electrons and holes trapped in the potential wells 3 la and 3 lb recombine with the accumulated or transferred electrons and holes, and the electrons and holes that are encountered during the transfer recombine to generate photoelectric. Some of the electrons and holes generated in the converter 1 disappear due to recombination.
- the force potential well (31a, 32b) can be used to extinguish some of the electrons and holes generated in the photoelectric conversion unit 1 by changing the polarity of the distribution voltage applied to the distribution electrodes (32a, 32b) only once. If the number of electrons and holes that are integrated at once in 31b) is reduced (that is, if the integration time is shortened), the photoelectric conversion unit 1 is less likely to be saturated. It is desirable to perform the operation of exchanging multiple times. Also, if the polarity of the distribution voltage is switched once, the density of electrons and holes is low, and electrons and holes are low. Although the probability of encountering the recombination is low, changing the polarity many times increases the density of electrons and holes involved in recombination and increases the recombination probability.
- the light source 2 is repeatedly turned on and off to recombine electrons and holes, so that an amount of electrons and holes corresponding to the signal light remain in the potential well (31a, 31b).
- a light reception period and an extraction period in which at least one of electrons and holes remaining in the potential well (31a, 31b) is taken out from the photoelectric conversion unit 1 are necessary. Voltage control in these periods is described in the first embodiment. Since it has already been explained, the duplicate explanation here is omitted.
- two vertical transfer registers are used to transfer electrons and holes individually, and each potential well (31a, 31b) is used.
- the held carriers may be transferred to the vertical transfer registers in each column. In this configuration, it is desirable to provide separate horizontal transfer registers for electronics and for halls.
- transfer electrodes are arranged between the distribution electrodes (32a, 32b).
- the distance between the distribution electrodes can be increased and the electrons and holes can be easily separated, but the electrons and holes remaining in the potential wells (31a, 31b) can be easily transferred, or the configuration similar to that shown in FIG. It is also possible to dispose of electrons and holes remaining in the photoelectric conversion unit by providing a waste electrode.
- the present embodiment adopts a configuration in which the insulating separation part is formed in a proper position and the control electrodes are arranged on both sides so that the distribution electrodes (32a, 32b) are sandwiched therebetween. Is also possible.
- the main functional layer 11 is n-type
- the intermediate layer 16 is p-type
- the substrate 10 is n-type.
- the conductivity type can be selected as appropriate as long as the above-described operation is possible. It is also possible to use force holes that employ electrons as the light-receiving output. Alternatively, both electrons and holes can be used as the light receiving output. For example
- the recombination probability is not actually 1. Therefore, after recombination of electrons and holes by controlling the integrated voltage and holding voltage, the electrons and holes are recombined. If only one of these remains, both electrons and holes remain.
- the number of light beams corresponding to the amount of light received during the lighting period Pb is obtained.
- the number of electrons and the number of holes corresponding to the amount of light received during the extinction period Pd are considered to disappear by the same number due to recombination.
- Ne is the number of electrons accumulated in the lighting period Pb
- Nh is the number of holes accumulated in the light-off period Pd
- Nd is the number of electrons and holes annihilated by one recombination.
- the number of electrons and holes remaining after recombination becomes Ne-Nd and Nh-Nd. Therefore, either electron or hole is used for the light-receiving output, which is less than when extracted without recombination, and as a result, saturation of the photodetector 6 is suppressed.
- the period for collecting electrons is the period corresponding to the received light quantity AO or A1 shown in Fig. 4 or 5
- the period for collecting holes is the period for received light quantity A2 or A3
- the number of electrons is the number corresponding to the received light quantity AO or A1.
- the number of electrons is the number obtained by subtracting a constant ND proportional to the NE force Nd.
- the number of holes after recombination is the number corresponding to the received light quantity A2 or A3. A fixed number proportional to Nd.
- the external circuit that performs the power of AO-A2 or A1-A3 to reverse the polarity of the light-receiving output corresponding to electrons and holes at the output of the photodetector 6 (For example, in the distance calculation circuit 5), the two received light outputs obtained from the photodetector 6 are added.
- the present invention it is possible to prevent saturation of the light reception output due to ambient light, and to suppress a decrease in dynamic range with respect to signal light. Therefore, it is possible to detect signal light even under conditions of stronger ambient light than before, and in particular, it is possible to provide a spatial information detection device that can accurately and stably detect outdoor target space information. Further expansion of usage is expected in the field of systems and the like.
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Abstract
Description
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US11/722,110 US7476841B2 (en) | 2005-01-05 | 2005-12-28 | Photodetector, spatial information detecting device using the photodetector, and photo detection method |
EP05844831A EP1835549A4 (en) | 2005-01-05 | 2005-12-28 | PHOTODETECTOR, ROOM INFORMATION DETECTION DEVICE WITH PHOTO DETECTOR AND PHOTO DETECTION METHOD |
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JP2005001003A JP5122728B2 (ja) | 2005-01-05 | 2005-01-05 | 光検出素子、光検出素子の制御方法、空間情報検出装置 |
JP2005001950A JP4857561B2 (ja) | 2005-01-06 | 2005-01-06 | 光検出素子、光検出素子の制御方法 |
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JP2008270675A (ja) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | 受光素子、受光素子の感度制御方法、空間情報の検出装置 |
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CA2682662A1 (en) * | 2007-03-30 | 2008-10-16 | Panasonic Electric Works Co., Ltd. | Image pickup device, spatial information detecting apparatus using the same device and method for taking out received-light output from the same device |
JP5134427B2 (ja) * | 2008-04-30 | 2013-01-30 | 浜松ホトニクス株式会社 | 固体撮像装置 |
JP5629134B2 (ja) * | 2010-06-14 | 2014-11-19 | パナソニック株式会社 | 電荷結合素子の駆動装置、空間情報検出装置 |
JP5815940B2 (ja) * | 2010-12-15 | 2015-11-17 | キヤノン株式会社 | 距離計測装置、距離計測方法、およびプログラム |
US10132626B2 (en) * | 2013-09-18 | 2018-11-20 | Infineon Technologies Ag | Adaptive distance estimation |
DE102017205631A1 (de) * | 2017-04-03 | 2018-10-04 | Robert Bosch Gmbh | LiDAR-System und Verfahren zum Ermitteln eines Systemzustands eines LiDAR-Systems |
JP7054343B2 (ja) * | 2017-12-26 | 2022-04-13 | 川崎重工業株式会社 | 分注装置及び分注方法 |
CN111950190A (zh) * | 2019-05-16 | 2020-11-17 | 开利公司 | 用于无线感测装置的部署方法和系统 |
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Also Published As
Publication number | Publication date |
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US7476841B2 (en) | 2009-01-13 |
EP1835549A4 (en) | 2009-11-11 |
EP1835549A1 (en) | 2007-09-19 |
US20080029690A1 (en) | 2008-02-07 |
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