Classifications

• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
  • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
  • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
  • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B82—NANOTECHNOLOGY
  • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
  • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B82—NANOTECHNOLOGY
  • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
  • B82Y40/00—Manufacture or treatment of nanostructures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F10/00—Thin magnetic films, e.g. of one-domain structure
  • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
  • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
  • H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
  • H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
  • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
  • H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
  • H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
  • H01F41/303—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices with exchange coupling adjustment of magnetic film pairs, e.g. interface modifications by reduction, oxidation
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N50/00—Galvanomagnetic devices
  • H10N50/01—Manufacture or treatment
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N50/00—Galvanomagnetic devices
  • H10N50/10—Magnetoresistive devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F10/00—Thin magnetic films, e.g. of one-domain structure
  • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
  • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
  • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
  • H01F10/13—Amorphous metallic alloys, e.g. glassy metals
  • H01F10/132—Amorphous metallic alloys, e.g. glassy metals containing cobalt
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F10/00—Thin magnetic films, e.g. of one-domain structure
  • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
  • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
  • H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]

Definitions

• the present invention relates generally to magnetoelectronic devices, and more particularly relates to magnetic tunnel junction element structures and methods for fabricating magnetic tunnel junction element structures.
• Magnetoelectronics devices spin electronics devices, and spintronics devices are synonymous terms for devices that use the effects predominantly caused by electron spin. Magnetoelectronics effects are used in numerous information devices, and provide non- volatile, reliable, radiation resistant, and high-density data storage and retrieval.
• the numerous magnetoelectronics information devices include, but are not limited to, magnetic random access memory (MRAM), magnetic sensors, and read/write heads for disk drives.
• MRAM magnetic random access memory
• a magnetoelectronic device such as a magnetic memory element
• a magnetic memory element has a structure that includes multiple ferromagnetic layers separated by at least one non ⁇ magnetic layer.
• information is stored as directions of magnetization vectors in the magnetic layers.
• Magnetization vectors in one magnetic layer for instance, are magnetically fixed or pinned, while the magnetization direction of the other magnetic layer is free to switch between the same and opposite directions that are called "parallel” and “antiparallel” states, respectively.
• the magnetic memory element represents two different resistances. The resistance has minimum and maximum values when the magnetization vectors of the two magnetic layers point in substantially the same and opposite directions, respectively.
• a detection of change in resistance allows a device, such as an MRAM device, to provide information stored in the magnetic memory element.
• the difference between the minimum and maximum resistance values divided by the minimum resistance is known as the magnetoresistance ratio (MR).
• MR magnetoresistance ratio
• One type of magnetic memory element a magnetic tunnel junction (MTJ) element, comprises a fixed ferromagnetic layer that has a magnetization direction fixed with respect to an external magnetic field and a free ferromagnetic layer that has a magnetization direction that is free to rotate with the external magnetic field.
• the fixed layer and free layer are separated by an insulating tunnel barrier layer that relies upon the phenomenon of spin-polarized electron tunneling through the tunnel barrier layer between the free and fixed ferromagnetic layers.
• the tunneling phenomenon is electron spin dependent, making the magnetic response of the MTJ element a function of the relative orientations and spin polarization of the conduction electrons between the free and fixed ferromagnetic layer.
• the tunnel barrier layer is important to the performance of the MTJ element, as the MR is strongly dependent on the tunnel barrier quality.
• the surface smoothness of the tunnel barrier plays a critical role in making a high-quality MTJ device.
• surface roughness of the tunnel barrier leads to a reduction of MR due to non- tunnel current flow through the barrier or over oxidation of high spots in the bottom ferromagnetic layer, which consequently reduces reliability and thus process yield in MTJ device fabrication.
• FIG. 1 is a cross-sectional view of a magnetic tunnel junction element structure in accordance with one exemplary embodiment of the present invention
• FIG. 2 is a cross-sectional view of a magnetic tunnel junction element structure in accordance with another exemplary embodiment of the present invention
• FIG. 3 is a flow chart of a process in accordance with an exemplary embodiment of the present invention for making a magnetic tunnel junction element structure such as that of HGS. l or 2.
• an MTJ element 10 in accordance with one exemplary embodiment of the present invention comprises a substrate 16, a first electrode multilayer stack 14, a second electrode multilayer stack 12, and an insulating tunnel barrier layer 32 disposed between the first electrode multilayer stack 14 and the second electrode multilayer stack 12.
• Substrate 16 may comprise any suitable insulating material, such as, for example, a dielectric material.
• First electrode multilayer stack 14 and second electrode multilayer stack 12 include ferromagnetic layers, as described in more detail below.
• Tunnel barrier layer 32 preferably is formed of a dielectric material and more preferably is formed of an aluminum oxide (AlOx).
• Tunnel barrier layer 32 may have any suitable thickness, but preferably has a thickness in the range of from about 7 to about 15 angstroms.
• the layers of first multilayer stack 14, second multilayer stack 12, and tunnel barrier layer 32 may be formed by any suitable deposition process, such as, for example, ion beam deposition, physical vapor deposition (PVD), molecular beam epitaxy (MBE), and the like.
• First electrode multilayer stack 14 comprises a first, or base, electrode layer 18, which is formed on substrate 16.
• First electrode layer 18 may be composed of a single conductive material or layer or, alternatively, first electrode layer 18 may be a multi-layer stack of more than one conductive material or layer. In either case, first electrode layer 18 provides electrical contact to the layers of first electrode multilayer stack 14.
• first electrode multilayer stack 14 includes a seed layer 20 deposited overlying first electrode layer 18. Seed layer 20 may be formed of any suitable material suitable for seeding the subsequent formation of an antiferromagnetic AF pinning layer 24, described in more detail below.
• seed layer 20 examples include, for example, tantalum (Ta) or a tantalum nitride (TaNx) that is fabricated by reactive sputtering or by plasma or ion beam nitridation of a relatively thin, preferably less than about 100 angstroms and most preferably less than about 50 angstroms, layer of tantalum.
• Seed layer 20 may be a layer separate from first electrode layer 18 or may comprise the same layer as first electrode layer 18.
• First electrode multilayer stack 14 may also comprise an optional template layer 22 overlying seed layer 20.
• Template layer 22 may comprise a nickel iron (NiFe) alloy, a nickel iron cobalt (NiFeCo) alloy, ruthenium (Ru), tantalum (Ta), aluminum (Al), or any other material suitable for facilitating growth of an antiferromagnetic pinning layer 24.
• Antiferromagnetic pinning layer 24 is disposed overlying the seed layer 20 and/or the template layer 22.
• the antiferromagnetic pinning layer 24 may be formed from any suitable antiferromagnetic material, but preferably comprises a manganese alloy, with the general composition MnX, where X is preferably one or more materials selected from a group of platinum (Pt), palladium (Pd), nickel (Ni), indium (Ir), osmium (Os), ruthenium (Ru), or iron (Fe).
• X is preferably one or more materials selected from a group of platinum (Pt), palladium (Pd), nickel (Ni), indium (Ir), osmium (Os), ruthenium (Ru), or iron (Fe).
• a pinned ferromagnetic layer 26 is formed on and exchange coupled with the underlying antiferromagnetic pinning layer 24, which pins the magnetic moment of the pinned ferromagnetic layer 26 in one direction.
• the pinned ferromagnetic layer 26 is crystalline in structure and may be formed of, for example, a cobalt iron alloy, such as CoFe or CoFeX, where X may comprise boron (B), tantalum (Ta), hafnium (Hf), or carbon (C).
• An amorphous fixed ferromagnetic layer 30 is formed on a metallic coupling layer 28, which overlies pinned ferromagnetic layer 26.
• amorphous fixed ferromagnetic layer 30 may be formed of an alloy of cobalt (Co), iron (Fe), and boron (B).
• the amorphous fixed layer 30 may be formed of an alloy comprising 71.2 % at. cobalt, 8.8% at. iron, and 20% at. boron.
• This composition is a CoFe alloy with boron added to it and can be represented as (Co S gFe 1 0 80 B 2O .
• any other suitable alloy composition such as CoFeX (where X may be one or more of tantalum, hafnium, boron, carbon, and the like), or alloys comprising cobalt and/or iron, may be used to form amorphous fixed layer 30.
• Metallic coupling layer 28 may be formed of any suitable material that serves to antiferromagnetically couple crystalline pinned layer 26 and amorphous fixed layer 30, such as ruthenium, rhenium, osmium, rhodium, or alloys thereof, but is preferably formed of ruthenium.
• Metallic coupling layer 28, crystalline pinned layer 26, and amorphous fixed layer 30 create a synthetic antiferromagnet (SAF) structure 38.
• SAF synthetic antiferromagnet
• the antiferromagnetic coupling of the SAF structure provided through metallic coupling layer 28 makes MTJ element 10 more stable in applied magnetic fields. Additionally, by varying the thickness of ferromagnetic layers 26 and 30, magnetostatic coupling to the free layer can be offset and the hysteresis loop can be centered.
• the amorphous fixed layer 30 of the SAF structure 38 facilitates the growth of a tunnel barrier layer 32 having smoother surfaces than if the tunnel barrier layer 32 were grown over a crystalline or polycrystalline fixed layer.
• the smoother surfaces of the tunnel barrier layer improve the magnetoresistance of MTJ element 10.
• the crystalline pinned layer 26 of the SAF structure 38 results in sufficient antiferromagnetic coupling strength so that the SAF structure is stable in an external magnetic field. Accordingly, the amorphous fixed layer and the crystalline pinned layer serve to improve performance, reliability, and manufacturability of MTJ element 10.
• Second electrode multilayer stack 12 comprises a free ferromagnetic layer 34 and a protective second electrode layer 36.
• Second electrode layer 36 may be formed of any suitable conductive material, such as tantalum.
• second electrode layer 36 may comprise more than one layer of material, such as, for example, a layer of tantalum nitride overlying a layer of tantalum.
• the magnetic moment of free ferromagnetic layer 34 is not substantially fixed or pinned by exchange coupling and is substantially free to rotate in the presence of an applied magnetic field.
• the free layer 34 may have an amorphous or crystalline structure and may be formed of any suitable alloy composition, such as CoFeX (where X may be boron, tantalum, hafnium, carbon, and the like), or alloys comprising nickel and iron, or alloys comprising cobalt, nickel, and iron.
• the free layer 34 may comprise one layer of material or may comprise multiple layers.
• free layer 34 may comprise a single layer of NiFeCo.
• free layer 34 may be an SAF structure comprising, for example, two layers of ferromagnetic material, such as NiFe, separated by a coupling layer of conducting material such as ruthenium, rhenium, osmium, rhodium, alloys thereof, and the like.
• FIG. 1 and the above accompanying description discloses an MTJ element 10 with a crystalline pinned layer overlying an AF pinning layer, a metallic coupling layer overlying the crystalline pinned layer, an amorphous fixed layer overlying the coupling layer, a tunnel barrier layer overlying the fixed layer, and a free layer or free SAF structure overlying the tunnel barrier layer, the invention is not so limited.
• FIG. 2 illustrates an MTJ element 60 in accordance with another embodiment of the present invention.
• MTJ element 60 is similar to MTJ element 10 of FIG. 1, wherein like reference numerals designate like or similar layers.
• MTJ element 60 comprises substrate 16, first electrode multilayer stack 14, second electrode multilayer stack 12, and insulating tunnel barrier layer 32 disposed between the first electrode multilayer stack 14 and the second electrode multilayer stack 12.
• first electrode stack 14 may comprise a first electrode 18, a seed layer 20, a template layer 22, an antiferromagnetic pinning layer 24, a crystalline ferromagnetic pinned layer 26, a coupling layer 28, and an amorphous ferromagnetic fixed layer 30.
• second electrode multilayer stack 12 of MTJ element 60 may comprise a second electrode 36 and a free layer 34, which may comprise one ferromagnetic layer or may comprise multiple layers such as an SAF structure.
• MTJ element 60 further comprises an interface layer 62, which is formed between amorphous fixed layer 30 and tunnel barrier layer 32.
• MTJ element when the free layer 34 is one layer or multiple layers of amorphous material, MTJ element may comprise an interface layer 64, which is formed between tunnel barrier layer 32 and the amorphous free layer 34.
• MTJ element 60 may comprise both interface layer 62 and interface layer 64. Because the magnetoresistance of MTJ element 60 is proportional to the product of the spin polarizations of the ferromagnetic layers adjacent either surface of tunnel barrier layer 32, interface layer 62 and/or interface layer 64 may be used to enhance the magnetoresistance of MTJ element 60.
• interface layers 62 and 64 may be amorphous, crystalline or polycrystalline and may be formed of a "high spin polarization material.”
• high spin polarization material means a material having a spin polarization that is higher than the spin polarization of the amorphous ferromagnetic material to which it is adjacent.
• interface layer 62 may be formed of a material having a spin polarization that is higher than the spin polarization of amorphous fixed layer 30.
• interface layer 64 may be formed of a material having a spin polarization that is higher than the spin polarization of amorphous free layer 34.
• amorphous fixed layer 30 may comprise CoFeB and interface layer 62 may comprise CoFe.
• amorphous free layer 34 may comprise CoFeB and interface layer 64 may comprise CoFe.
• interface layers 62 and 64 also may comprise CoFeX, where X may comprise boron, tantalum, hafnium, carbon, and the like, and X is less than 5 % at.
• interface layers 62 and 64 may comprise other cobalt-containing alloys or other iron-containing alloys.
• interface layer 62 or interface layer 64 or both may depend on various factors such as, for example, the desired magnetic properties of the MTJ element, the desired electrical properties of the MTJ element, the intended application of the MTJ element, and the like.
• Interface layers 62 and 64 are sufficiently thin that they do not counteract the improvement in MTJ device performance due to the amorphous nature of fixed layer 30 and/or free layer 34.
• interface layers 62 and 64 have a thickness that is no greater than 15 angstroms.
• interface layers 62 and 64 have a thickness no greater than 10 angstroms and, more preferably, have a thickness no greater than 5 angstroms.
• FIG. 3 is a flowchart of a process 100, in accordance with an exemplary embodiment of the present invention for fabricating a semiconductor structure such as the structures illustrated in FIGS. 1 and 2.
• the process 100 may begin by providing a substrate, such as substrate 16 of FIGS.
• first electrode layer 18 may comprise one or more layers of metal or other conductive material that provides electrical contact to layers formed subsequently.
• Seed layer 20 may be deposited overlying first electrode layer 18 (step 106). Seed layer 20 may be a layer separate from first electrode layer 18 or, alternatively, seed layer 20 may comprise the same layer or layers as first electrode layer 18.
• An optional template layer 22 then may be fabricated overlying seed layer 20 and/or first electrode layer 18 (step 108).
• Process 100 further comprises disposing an antiferromagnetic pinning layer 24 overlying optional template layer 22 and/or seed layer 20 and/or first electrode layer 18 (step 110) and forming a crystalline pinned ferromagnetic layer 26 on antiferromagnetic pinning layer 24 so that pinned ferromagnetic layer 26 is exchange coupled with antiferromagnetic pinning layer 24 (step 112).
• a metallic coupling layer 28 then is deposited overlying pinned ferromagnetic layer 26 (step 114).
• metallic coupling layer 28 may be formed of any suitable thickness and of any suitable material that serves to antiferromagnetically couple crystalline pinned layer 26 with an overlying amorphous fixed layer 30.
• metallic coupling layer 28 may include ruthenium, osmium, rhodium, rhenium, and the like, and alloys thereof.
• metallic coupling layer 28 is formed of ruthenium.
• metallic coupling layer 28 then is exposed to a surface modifier that modifies the exposed surface of metallic coupling layer 28 (step 116).
• surface modifier means any suitable material that modifies the surface of metallic coupling layer 28 so that a subsequently formed fixed layer 30 overlying metallic coupling layer 28 exhibits a smoother surface upon which a tunnel barrier layer may be formed than would be exhibited if the metallic coupling layer were not so modified.
• the surface modifier results in an increase in MR of the MTJ element.
• the surface modifier also may result in improved breakdown voltage and fewer tunneling hot spots in MTJ elements, thus increasing yield and narrowing bit resistance distribution of MTJ element arrays.
• the surface modifier comprises oxygen.
• metallic coupling layer 28 may be exposed to an oxygen environment having a dose (pressure multiplied by exposure time) of from about 10 "5 Torr-s to about 10 "1 Torr-s at room temperature.
• Metallic coupling layer 28 is exposed to the oxygen environment for a time that is sufficiently long to permit the oxygen to modify the exposed surface of metallic coupling layer 28 but for a time that is sufficiently short that the antiferromagnetic coupling provided by the metallic coupling layer 28 is not substantially reduced.
• metallic coupling layer is exposed to an oxygen environment for a time that is sufficiently short that oxygen is not permitted to deposit to a thickness that is discernable by standard measurement techniques.
• metallic coupling layer 28 is exposed to an oxygen environment for a time period that permits no more than two monolayers of oxygen to be deposited on the exposed surface of metallic coupling layer 28.
• the surface modifier may comprise materials other than or in addition to oxygen, such as, for example, air, an argon (Ar)/oxygen (O 2 ) mixture, or a nitrogen (N 2 )/oxygen (O 2 ) mixture.
• a fixed ferromagnetic layer may be deposited overlying metallic coupling layer 28 (step 118).
• the fixed ferromagnetic layer may be formed of a crystalline ferromagnetic material, such as, for example, CoFe or any other suitable cobalt alloy and/or iron alloy.
• the fixed ferromagnetic layer may be amorphous, such as amorphous fixed layer 30 described above with reference to FIGS. 1 and 2.
• the amorphous fixed layer may be formed of an amorphous ferromagnetic alloy such, as CoFeX, where X may be boron, carbon, tantalum, hafnium, and the like, or may be formed of other alloys of cobalt and/or iron .
• process 100 further may comprise depositing a first interface layer, such as interface layer 62 of FIG. 2, overlying the fixed layer (step 120).
• Interface layer 62 may be formed of a material having a spin polarization that is higher than the spin polarization of the amorphous fixed layer 30.
• the fixed layer may comprise an amorphous layer of CoFeB and the first interface layer may comprise CoFe.
• the first interface layer may comprise CoFeX, where X may comprise boron, tantalum, carbon, hafnium and the like, and X is less than 5 % at.
• the first interface layer may comprise other cobalt-containing alloys or other iron-containing alloys.
• An insulating tunnel barrier layer such as tunnel barrier layer 32 of FIGS. 1 and 2, then may be formed overlying the first interface layer and/or the fixed layer (step 122).
• the tunnel barrier layer may be formed using any suitable insulating material known in the semiconductor industry for forming tunnel barrier layers.
• the tunnel barrier layer may be formed by depositing a layer of aluminum overlying the first interface layer and/or the fixed layer and oxidizing the aluminum layer, as is well known in the art.
• a free ferromagnetic layer such as free ferromagnetic layer 34, then may be formed overlying the tunnel barrier layer (steps 126).
• the free layer may have an amorphous or crystalline structure and may be formed of any suitable alloy composition, such as CoFeX (where X may be boron, carbon, tantalum, hafnium, and the like), NiFe alloys or other alloys comprising cobalt, iron, and nickel.
• the free layer may be an SAF structure comprising, for example, two layers of ferromagnetic material, such as NiFe, separated by a metallic coupling layer of insulating material such as ruthenium, rhenium, osmium, rhodium, and the like, and alloys thereof.
• a second interface layer such as interface layer 64, may be deposited overlying the tunnel barrier layer before forming the amorphous free ferromagnetic layer (step 124).
• the second interface layer may comprise a material having a spin polarization that is higher than the spin polarization of the free layer.
• the free layer may comprise amorphous CoFeB and the second interface layer may comprise CoFe.
• the second interface layer may comprise CoFeX, where X may comprise boron, tantalum, hafnium, carbon, and the like, and X is less than 5 % at.
• the second interface layer may comprise other cobalt-containing alloys and/or other iron-containing alloys.
• a second electrode layer such as second electrode layer 36, may be disposed overlying the free layer (step 128).
• the second electrode layer may be formed of any suitable conductive material, such as tantalum.
• the second electrode layer may comprise more than one layer of material, such as, for example, a layer of tantalum nitride (TaNx) overlying a layer of tantalum.
• the formation of the layers of process 100 described above with reference to FIG. 3 may be performed using any suitable conventional deposition method(s) known in the semiconductor industry, such as, for example, ion beam deposition, physical vapor deposition (PVD), molecular beam epitaxy (MBE), and the like. Further, it will be appreciated that processes of the present invention are not limited to the order of the steps as described above with reference to FIG. 3. Rather, the steps may be performed in reverse order to fabricate a magnetic tunnel junction element having a tunnel barrier layer overlying a free layer or free layer SAF structure, a fixed layer overlying the tunnel barrier layer, and a pinned layer overlying the fixed layer.
• PVD physical vapor deposition
• MBE molecular beam epitaxy
• a first ferromagnetic layer of the free SAF structure may deposited, followed by the deposition of a metallic coupling layer.
• the metallic coupling layer then may be exposed to a surface modifier that modifies the exposed surface of the metallic coupling layer.
• the surface modifier modifies the surface of the metallic coupling layer so that a subsequently formed second ferromagnetic layer overlying the metallic coupling layer exhibits a smoother surface upon which a tunnel barrier layer may be formed than would be exhibited if the metallic coupling layer were not so modified.
• a second ferromagnetic layer of the free SAF layer may be deposited overlying the metallic coupling layer.
• both the metallic coupling layer of the fixed SAF structure and the metallic coupling layer of the free SAF structure could be exposed to a surface modifier before subsequent deposition of an overlying layer to improve the physical quality of the overlying layer.

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• 2004
  • 2004-07-26 US US10/899,610 patent/US7098495B2/en not_active Expired - Lifetime
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