WO2006022207A1 - 金属張り白色積層体 - Google Patents
金属張り白色積層体 Download PDFInfo
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- WO2006022207A1 WO2006022207A1 PCT/JP2005/015170 JP2005015170W WO2006022207A1 WO 2006022207 A1 WO2006022207 A1 WO 2006022207A1 JP 2005015170 W JP2005015170 W JP 2005015170W WO 2006022207 A1 WO2006022207 A1 WO 2006022207A1
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- white
- metal
- clad
- layer
- resin composition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2942—Plural coatings
- Y10T428/2949—Glass, ceramic or metal oxide in coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2962—Silane, silicone or siloxane in coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Definitions
- the present invention relates to a metal-clad white laminate using a white resin composition containing polyimide and a white pigment.
- This metal-clad white laminate is suitably used for a flexible printed wiring board on which an LED (light emitting diode) is mounted.
- printed wiring boards used for LED mounting are formed by heating and pressing a pre-predder in which a sheet-shaped glass base material is impregnated with a thermosetting resin containing a white pigment and a metal foil.
- the obtained rigid metal-clad laminate was mainly used.
- thermocompression adhesive layer A polyamic acid dispersion applied to an insulating substrate as an adhesive, followed by solvent removal and possibly imidization to form a thermocompression adhesive layer.
- a method is disclosed (see Patent Documents 4 and 5;).
- a method is disclosed in which a polyimide or polyamic acid dispersion is applied to a glass plate and the like, followed by removal of the solvent and, in some cases, imidization treatment to form a thermocompression-bonding adhesive film.
- An object to be bonded such as a metal layer is thermocompression bonded to the adhesive layer and adhesive film thus formed (see Patent Documents 4 to 6).
- These heat-resistant adhesives or adhesive films are aromatic polyimides obtained by polycondensation reaction of aromatic tetracarboxylic dianhydrides and aromatic diamines. Dispersions or films having aromatic polyamic acid strength are widely used.
- aromatic polyimide resin has excellent heat resistance and mechanical properties, it absorbs visible light and is colored from pale yellow to reddish brown. Objects have low reflectivity and low whiteness. Therefore, a flexible metal-clad laminate using a strong resin composition as an adhesive layer has a problem that it is not practical because it has a reduced brightness for LED mounting applications.
- Non-Patent Document 1 o Polyimides using aliphatic monomers are widely used in liquid crystal alignment films due to the feature of heat resistance in addition to transparency (Patent Documents). Refer to 7.) 0 However, for the purpose of LED mounting, a resin composition mixed with polyimide and white pigment using an aliphatic monomer is used for the adhesive layer.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-60321
- Patent Document 2 JP 2003-152295 A
- Patent Document 3 Japanese Patent Laid-Open No. 10-202789
- Patent Document 4 Japanese Patent No. 2943953
- Patent Document 5 Japanese Patent No. 3014526
- Patent Document 6 Japanese Patent No. 3213079
- Patent Document 7 Japanese Patent Laid-Open No. 2001-228481
- Non-Patent Document 1 Edited by Japan Polyimide Association, “Latest Polyimide: Basics and Applications”, N, Ti, S, 2002, p. 387-407
- An object of the present invention is to solve the problems of materials conventionally used for an insulating layer of a printed wiring board on which an LED is mounted, and to provide a white resin assembly having high reflectance and whiteness and excellent light resistance.
- An object of the present invention is to provide a flexible metal-clad laminate that uses a composition and is easy to reduce the thickness and weight. Means for solving the problem
- a rosin composition in which a polyimide having a repeating unit having an aliphatic tetracarboxylic acid structure and a white pigment are mixed has a reflectance and whiteness.
- the present inventors have found that a flexible metal-clad white laminate can be obtained that is thin and lightweight easily when the resin composition is used, in addition to being high and excellent in light resistance.
- the white resin layer made of a resin composition in which a white pigment is mixed with a polyimide having a repeating unit represented by the general formula I is an adhesive layer of at least one metal layer. It is a metal-clad white laminate.
- R is a tetravalent aliphatic group derived from a hydrocarbon having a cyclic structure, an acyclic structure, or a cyclic structure and an acyclic structure.
- ⁇ is a structure having 2 to 39 carbon atoms.
- At least one partial structure selected from the group consisting of 2 2 3 2 2 may intervene.
- R in the general formula I is a tetravalent group derived from a cyclohexane force.
- the white pigment is acid titanium, acid zirconium, calcium oxide. , Zinc oxide, zinc oxide, aluminum oxide, zinc sulfide, calcium sulfate, barium sulfate, lead carbonate, lead hydroxide, basic zinc molybdate, basic calcium molybdate zinc, lead white, molybdenum white And at least one selected from the group consisting of litbon power More preferably, the white pigment is rutile-type titanium oxide having a coating layer formed on the surface, and more preferably, the coating layer force of the titanium oxide layer is SiO or A1.
- the titanium oxide coating layer is made of SiO or Al 2 O 3.
- the content of the white pigment in the resin composition is preferably 10 to 70% by weight, more preferably 20 to 50% by weight, and the whiteness of the resin composition layer is preferably 70 or more. Further, a unit area of the white resin layer is applied to the white resin layer exposed by removing the metal layer in the air with blue light having a wavelength width of 00 nm to 480 nm and a wavelength peak at 420 nm. It is preferable that the whiteness after irradiation for 1000 hours at an intensity of 90 WZm 2 is 60 or more.
- the white resin layer of the present invention is a flexible metal-clad white laminate formed by applying an organic solvent dispersion of the resin composition to a previously produced metal foil and then evaporating the solvent. It is particularly preferable that the white resin layer is a flexible metal-clad white laminate formed by superimposing a pre-manufactured metal foil on the pre-manufactured resin composition film and then thermocompression bonding. preferable.
- the present invention is a flexible metal-clad white laminate using a specific polyimide resin composition in which a white pigment, particularly a surface-treated rutile-type titanium oxide is blended, and has whiteness and light resistance.
- a white pigment particularly a surface-treated rutile-type titanium oxide is blended, and has whiteness and light resistance.
- it can be suitably used for printed wiring boards on which LEDs (light emitting diodes) are mounted.
- the polyimide used in the present invention has a repeating unit represented by the above general formula I.
- the content of the repeating unit represented by the general formula I preferably 10 to the total repeating units: L0 0 mole 0/0, more preferably 50 to: L00 is the mole%, it is substantially 100 mol% Is particularly preferred.
- the number of repeating units represented by the general formula I in one molecule of polyimide is preferably 10 to 2000, more preferably 20 to 200! / ⁇ .
- R in the general formula I is a tetravalent aliphatic group.
- R is cyclohexane
- cyclo Examples include tetravalent substituents derived from pentane, cyclobutane, bicyclo [2.2.2] otater 7-en, and stereoisomers thereof.
- a tetravalent aliphatic group represented by the following structural formula can be mentioned, and among them, a tetravalent substituent derived from cyclohexane force and its stereoisomer are more preferable.
- ⁇ in the general formula I is a structural unit having 239 carbon atoms, and is composed of an aliphatic structural unit, an alicyclic structural unit, an aromatic structural unit, an organosiloxane structural unit, or a combination or repetition thereof.
- ⁇ in the main chain of ⁇ , one O— SO CO—
- Preferable ⁇ includes polyalkylene, (poly) oxyalkylene having a terminal alkyl or aromatic, xylylene, and aliphatic structural units such as alkyl-substituted and halogen-substituted products thereof; cyclohexane, dicyclohexylmethane, dimethyl Cyclohexane, isophorone, norbornane, and their alkyl-substituted, halogen-substituted, etc.
- R is a divalent aliphatic group or an aromatic group
- n is a numerical range that meets the definition of ⁇ in the above general formula I.
- the polyimide used in the present invention is usually obtained by reacting a tetracarboxylic acid component and a diamine component (diamin and its derivatives) in a solution.
- a tetracarboxylic acid component used in the reaction include aliphatic tetracarboxylic acid, aliphatic tetracarboxylic acid alkyl ester, and aliphatic tetracarboxylic dianhydride.
- a polyimide having a cyclohexanetetracarboxylic acid skeleton has a high molecular weight, a flexible film is easily obtained, and the solubility in a solvent is sufficiently high. It is advantageous in terms of film forming power. From this point, in particular, cyclohexanetetracarboxylic dianhydride is preferred among these! /.
- the tetracarboxylic acid component includes other tetracarboxylic acids or derivatives thereof such as pyromellitic acid, as long as the solvent solubility of the polyimide, film flexibility, thermocompression bonding, and transparency are not impaired.
- diamine component used in the reaction diamine, diisocyanate, diaminodisilanes and the like can be increased.
- Diamine is preferred.
- the diamine content in the diamine-based component is preferably 50 mol% or more (including 100 mol%).
- the diamine may be an aliphatic diamine or an aromatic diamine or a mixture thereof.
- aromatic diamine refers to a diamine in which an amino group is directly bonded to an aromatic ring, and an aliphatic group, an alicyclic group, and other substituents are included in a part of the structure. May be.
- Aliphatic diamine represents a diamine in which an amino group is directly bonded to an aliphatic group or an alicyclic group, and an aromatic group or other substituent may be included in a part of the structure.
- Examples of the aliphatic diamine include 4,4'-diaminodicyclohexyl methane, ethylene diamine, hexamethylene diamine, polyethylene glycol bis (3-aminopropyl) ether, polypropylene glycol bis (3 aminopropyl). ) Ether, 1,3 bis (aminomethyl) cyclohexane, 1,4 bis (aminomethyl) cyclohexane, m xylylenediamine, p xylylenediamine, isophorone diamine, norbornane diamine, siloxane diamine And the like.
- aromatic diamine examples include 4,4, -diaminodiphenyl ether, 4,4, -diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, m-phenylenediamine, p-phenylenediamine, Examples include diaminobenzophenone, 2,6 diaminonaphthalene, and 1,5-diaminonaphthalene.
- the glass transition temperature of the polyimide constituting the resin composition A is determined mainly by the selected diamine, but is generally 350 ° C or lower. Adhesion occurs at temperatures above the glass transition temperature. If the glass transition temperature is too high, the thermocompression bonding temperature becomes too high, which is inappropriate. If the glass transition temperature is too low, the heat resistance of the polyimide layer is insufficient, which is not preferable.
- the range of the glass transition temperature is preferably 200 to 350 ° C, particularly preferably 250 to 320 ° C.
- the polyimide of the present invention is usually produced as an organic solvent solution.
- the organic solvent is not particularly limited.
- ⁇ -methyl 2-pyrrolidone ⁇
- DMAC dimethylacetamide
- GBL y-butarate rataton
- a poor solvent such as hexane, heptane, benzene, toluene, xylene, chlorobenzene, or dichlorobenzene can be used together with these solvents to such an extent that the polymer does not precipitate.
- Polyimide can be produced by any production method using the above-described tetracarboxylic dianhydride component and diamine component. These include (1) a solution polymerization method, (2) a method of obtaining a polyamic acid solution to form a film and then imidizing, (3) a method of obtaining a salt or oligomer and performing solid phase polymerization, 4) A method using tetracarboxylic dianhydride and diisocyanate as raw materials and other methods known in the art can be used, and each method can be used in combination. In the reaction, conventionally known catalysts such as acids, tertiary amines, and anhydrides can be used.
- An organic solvent solution of polyimide is produced by the following methods (1) to (3).
- a tetracarboxylic acid component is added to an organic solvent solution of a diamine component, or a diamine component is added to an organic solvent solution of a tetracarboxylic acid component, preferably at 80 ° C. or less, particularly around room temperature or above. Hold at the following temperature for 0.5-3 hours.
- An azeotropic dehydration solvent such as toluene or xylene is added to the resulting polyamic acid solution of the reaction intermediate, and a dehydration reaction is performed while removing the produced water out of the system by azeotropy to obtain an organic solvent solution of polyimide.
- a polyamic acid solution was prepared using a high-boiling solvent such as Talesol, and maintained at 150 to 220 ° C. for 3 to 12 hours to form a polyimide, and then dissolved in polyimide such as methanol. A poor solvent is added to precipitate the polyimide. Filtration / washing 'After separation as a solid by drying, it is dissolved in an organic solvent such as N, N-dimethylacetamide to obtain an organic solvent solution of polyimide.
- a high-boiling solvent such as Talesol
- a tertiary amine compound is preferably used as a catalyst.
- These include trimethylamine, triethylamine (TEA), tripropylamine, tributylamine, triethanolamine, N, N-dimethylethanolamine, N, N-jetylethanolamine, triethylenediamine, N-methylpyrrolidine, N-ethylpyrrolidine, N-methylpiperidine, N-ethylpiperidine, imidazole, pyridine, quinoline, isoquinoline and the like can be mentioned.
- the concentration of the solution of the polyimide is preferably 5 to 70 weight 0/0, more preferably 10 to 50 wt%, and more preferably, especially 10 to 40 wt%. If it is less than 5% by weight, the thickness of the resin composition layer tends to be non-uniform, which is preferable. If it exceeds 70% by weight, the viscosity becomes remarkably large and handling becomes difficult.
- a surface active agent such as a fluorine-based or polysiloxane-based compound may be added to the organic solvent solution of polyimide as described below. This makes it easy to obtain a polyimide layer and a polyimide film with good surface smoothness.
- lead, basic zinc molybdate, basic calcium zinc molybdate, lead white, molybdenum white, and lithobon power are preferred.
- rutile-type titanium oxide with a coating layer on the surface is the preferred coating
- the layer is SiO or Al 2 O treatment
- the coating layer is SiO or Al 2 O treatment
- Rutile-type titanium oxide that is obtained by 2 2 3 2 2 3, followed by polyol treatment and siloxane treatment is particularly preferable.
- the white pigment is usually used as a white pigment dispersion mixed in a polyimide solution.
- the combination may be performed either before the synthesis of the polyimide, before the dissolution operation, during the synthesis, or after the completion of the synthesis, and after the completion of the synthesis, it may be performed either after the synthesis is completed or after dilution with a diluent solvent. To do.
- Stirring and dispersion of white pigment may be carried out in a stirring tank equipped with a stirrer having an appropriate stirring ability, or may be carried out using a device for mixing such as a ball mill or a revolving / spinning type mixing device. be able to.
- the particle size of the white pigment used in the present invention is preferably 0.05 to 5 ⁇ m, more preferably 0.1 to 1 ⁇ m.
- the particle size is less than 0.05 m, the light reflectance decreases, while when it exceeds 5 ⁇ m, the unevenness of the surface of the resin composition layer is conspicuous, resulting in poor appearance or mechanical properties. In particular, this is not preferable because the decrease in elongation at break becomes large.
- the content of the white pigment with respect to the polyimide is preferably 10 to 70% by weight, more preferably 20 to 50% by weight, based on the solid content.
- the content exceeds 70% by weight the mechanical properties, particularly the breaking strength, are lowered, and sufficient adhesive strength cannot be obtained, which is not preferable.
- the content is less than 10% by weight it is not preferable because sufficient reflectance and whiteness cannot be obtained.
- the reflectance of the white resin layer of the present invention is preferably 50% or more at 410 nm to 780 nm. If it is less than 50%, light penetration occurs, which is not preferable.
- the whiteness of the white resin layer is preferably 70 or more. If the degree of whiteness is less than 70, light is absorbed and yellowish.
- a wavelength width force of 00 ⁇ ! Is applied to the white resin layer exposed by removing the metal layer.
- the whiteness after continuous irradiation for 1000 hours at an intensity of 90 WZm2 with respect to the unit area of the white resin layer in the air with blue light having a wavelength peak at 420 nm at 480 nm is 60 Above, preferably 70 or more, is practically preferable. If the whiteness is less than 60, it absorbs light and is colored yellow. It ’s not.
- Examples of the metal foil used for the metal layer include copper, aluminum, stainless steel, gold, silver, and nickel, and copper, aluminum, and stainless steel are preferable.
- the thickness of the metal foil is not particularly limited, but good caloric properties can be obtained if it is in the range of 5 to: LOOm that is usually used.
- the metal layer can also be produced by sputtering, vapor deposition, electroless plating, and the like, and examples of the metal include copper, nickel, chromium, tin, cobalt, and gold. Preferred are copper, nickel, and gold. As appropriate, it is multilayered.
- the thickness of the metal layer is not particularly limited, but is preferably 10 m or less, which is difficult to obtain by other methods in order to make use of the characteristics of the thin film formation method. 2-: LO m is more preferable.
- an insulating base material can be used as appropriate.
- Flexible type is preferred as these.
- Flexible insulating base materials include polyimide, polybenzimidazole, polybenzoxazole, polyamide (including aramid), polyetherimide, polyamideimide, polyester (including liquid crystalline polyester), polysulfone, and polyethersulfone. , Polyether ketone, and polyether ether ketone.
- Preferred are polyimide, polybenzimidazole, polyamide (including polyamide), polyetherimide, polyamideimide, and polyethersulfone.
- the insulating substrate made of the resin composition of the present invention can also be used.
- the thickness of the flexible type insulating substrate is not particularly limited, but is preferably 3-150 ⁇ m.
- single-sided metal foil-clad sheets obtained by using these, and printed wiring sheets and films produced using the same film are used in the same manner as the above-mentioned insulating base material to form metal-foil-clad sheets, so that multilayer printed wiring sheets and films can be obtained.
- the flexible metal-clad white laminate of the present invention is generally produced by the following (1) to (4) using the components described above.
- polyimide of the general formula I of the present invention can be used as a solution and can be thermocompression bonded, (1) to (3) using them are particularly preferred, and (1) and (2) are particularly preferred.
- the method for producing a white resin film in advance is generally to apply a white resin solution on a substrate having been given release properties, remove the solvent, peel off, and appropriately post-dry. by.
- the solvent is usually removed by evaporation at a temperature of 100 to 350 ° C. It is produced by evaporating the solvent in an inert atmosphere or under reduced pressure.
- the thickness of the film or white resin layer is 3 to: LOO / zm, and 15 to: LOO m is usually selected as the white resin layer to be formed on the white resin film or metal foil. Usually 3 to 50 ⁇ m is selected as the white resin layer to be formed on the material.
- a CVD method when using the vapor deposition method, a CVD method, an ion plating method, or the like can be applied in addition to the normal vapor deposition.
- the white resin layer surface may be subjected to a known pretreatment such as treatment with an alkaline chemical solution, plasma treatment or sandblast treatment before forming the metal layer. Such pretreatment further improves the adhesive strength between the resin composition film and the metal layer.
- the white resin layer can be laminated and integrated with a surface of a metal foil, an insulating base material, a printed wiring network or the like by using thermocompression bonding.
- thermocompression bonding may be performed by hot pressing, or may be performed continuously using a pressure roll or the like.
- thermocompression bonding temperature is preferably 200 to 400 ° C, more preferably 250 to 350 ° C.
- the applied pressure is preferably 0.1 to 200 kgfZcm 2 , more preferably 1 to: LOOkgfZcm 2 .
- thermocompression bonding may be performed in a reduced pressure atmosphere to remove the solvent and bubbles.
- the adhesive strength between the metal layer and the resin composition layer in the flexible metal-clad white laminate produced under the above conditions is extremely good. For example, in the case of an electrolytic copper foil and a resin composition layer, lkgf / cm 2 or more Adhesive strength of is achieved.
- the polyimide constituting the resin composition A used in the present invention is soluble in the organic solvent exemplified above. For this reason, the resin-coated composition layer of the printed wiring board after the metal-clad white laminate or circuit pattern obtained by each of the above methods is wet-etched using an aprotic polar organic solvent as an etchant. For example, it can be applied to the formation of via holes and flying leads and the removal of the cover coat of the terminal portion.
- DSC-50 differential scanning calorimeter manufactured by Shimadzu Corporation
- DSC measurement was performed under the condition of a heating rate of 10 ° C. Zmin to determine the glass transition temperature.
- the 90 ° peel strength was measured using a rotary jig in accordance with JIS C 6471.
- a spectral whiteness photometer ERP-80WX manufactured by Tokyo Denshoku was used to irradiate the resin composition layer at 457 nm and 550 nm, and the spectral reflectance was measured.
- Blue light having a wavelength width of 400 nm to 480 nm and having a wavelength peak at 420 nm was continuously irradiated in air at an intensity of 90 WZm 2 per unit area of the resin composition layer for 1000 hours. It was expressed by the whiteness afterwards.
- Hastelloy (HC22) autoclave is charged with 552 g of pyromellitic acid, 200 g of a catalyst with rhodium supported on activated charcoal (manufactured by NE Chemcat Corporation), and 1656 g of water.
- the reactor was purged with nitrogen gas.
- the inside of the reactor was replaced with hydrogen gas, and the hydrogen pressure in the reactor was raised to 60 ° C with 5.
- OMPa The reaction was carried out for 2 hours while maintaining the hydrogen pressure at 5.
- OMPa The hydrogen gas in the reactor was replaced with nitrogen gas, the reaction solution was extracted from the autoclave, and the reaction solution was filtered while hot to separate the catalyst.
- the filtrate was concentrated by evaporating water under reduced pressure on a rotary evaporator to precipitate crystals.
- the precipitated crystals were separated into solid and liquid at room temperature and dried to obtain 48 lg of 1,2,4,5-cyclohexanetetracarboxylic acid (yield 85.0%).
- the glass transition temperature of the obtained film was 315 ° C.
- this film is When the total light transmittance was measured with a haze meter (Nippon Denshoku Co., Ltd. ⁇ - ⁇ 80) in accordance with K7105, it showed a high value of 90%.
- This polyimide film was heat-treated in air at 220 ° C. for 4 hours, and the total light transmittance before and after the heat treatment was measured. However, there was no change at 90%.
- This polyimide film was heat-treated in air at 220 ° C for 4 hours, and the total light transmittance before and after the heat treatment was measured. There was no change at 89%.
- a mayonnaise bottle was fixed to PAINT CONDITIONER RED DEVIL TOOL manufactured by UNION, NJ, and mixed and dispersed for 30 minutes.
- the alumina beads were separated by filtration to obtain a resin composition.
- the obtained resin composition was applied, After heating on a 100 ° C hot plate for 1 hour to evaporate the solvent, fix it on a stainless steel fixture and heat in a hot air dryer at 220 ° C for 2 hours to further evaporate the solvent.
- a single-sided flexible copper-clad white laminate was obtained (resin composition layer 25 ⁇ m).
- a flexible copper-clad white laminate having 4 ⁇ m of the resin composition layer was obtained in the same manner as in Example 2 except that the resin composition obtained in Example 3 was used.
- the adhesive strength of the flexible copper-clad white laminate was 1. INZmm.
- the reflectance and whiteness were evaluated by coating / spreading the resin composition layer obtained by etching and removing the copper foil of the flexible copper-clad white laminate. The results are shown in Table 1.
- Example 1 instead of 5 g of rutile titanium oxide with a median diameter of 0.43 ⁇ m (PF-691 made by Ishihara Sangyo Co., Ltd., treated with siloxane), the type of titanium oxide in Example 1 is a rutile with a median diameter of 0.55 ⁇ m. Same as Example 1 except that 5g of type titanium oxide (PC-3 manufactured by Ishihara Sangyo) (surface treated in the order of Si 02 treatment, polyol treatment, and siloxane treatment from the side closest to titanium oxide) was used. And a single-sided flexible copper-clad white laminate having a resin composition layer of 25 m was obtained. The reflectance, whiteness and light resistance of the white surface after the copper foil of the single-sided flexible copper-clad white laminate was removed by etching were evaluated. The results are shown in Table 1.
- Example 1 instead of 5 g of rutile titanium oxide with a median diameter of 0.43 ⁇ m (PF-691 made by Ishihara Sangyo Co., Ltd., treated with siloxane), the type of titanium oxide in Example 1 is a rutile with a median diameter of 0.64 ⁇ m.
- Type Titanium Oxide 5g (PF-711 made by Ishihara Sangyo) Surface treatment in the order of Si02 treatment and polyol treatment. ) was used in the same manner as in Example 1 to obtain a single-sided flexible copper-clad white laminate having a resin composition layer of 25 ⁇ m. The reflectance, whiteness and light resistance of the white surface after the copper foil of the single-sided flexible copper-clad white laminate was removed by etching were evaluated. The results are shown in Table 1.
- Example 1 instead of 5 g of rutile type titanium oxide with a median diameter of 0.43 ⁇ m (PF-691 made by Ishihara Sangyo Co., Ltd., treated with siloxane), the type of titanium oxide in Example 1 is a rutile type with a median diameter of 0.67 m. Except for using 5g of titanium oxide (CR-90-2 manufactured by Ishihara Sangyo Co., Ltd.) (surface treatment in the order of Si02 treatment and polyol treatment from the side closest to titanium oxide.) A single-sided flexible copper-clad white laminate having a fat composition layer of 25 ⁇ m was obtained. The reflectance, whiteness, and light resistance of the white surface after the copper foil of the single-sided flexible copper-clad white laminate was removed by etching were evaluated. The results are shown in Table 1.
- Example 1 instead of 5 g of rutile type titanium oxide having a median diameter of 0.43 ⁇ m (PF-691 made by Ishihara Sangyo Co., Ltd., treated with siloxane), the type of titanium oxide in Example 1 was 0.75 ⁇ m. Except for using 5g type titanium oxide (Ishihara Sangyo CR-80, Si02 treated), the same procedure as in Example 1 was carried out, Obtained. The reflectance, whiteness and light resistance of the white surface after the copper foil of the single-sided flexible copper-clad white laminate was removed by etching were evaluated. The results are shown in Table 1.
- Example 1 instead of 5 g of rutile titanium oxide with a median diameter of 0.43 ⁇ m (PF-691 made by Ishihara Sangyo Co., Ltd., treated with siloxane), the type of titanium oxide in Example 1 is a rutile with a median diameter of 0.77 ⁇ m.
- SR-1 manufactured by Sakai Chemical Industry Co., Ltd., treated with A1203
- the obtained resin composition was applied, 100 ° C hot play After heating for 1 hour to evaporate the solvent, fix it on a stainless steel fixture and heat in a hot air dryer at 220 ° C for 2 hours to further evaporate the solvent. Heated for a period of time and heat imidized to obtain a single-sided flexible copper-clad white laminate (resin composition layer 25 ⁇ m) o White side after removing the copper foil of the single-sided flexible copper-clad white laminate by etching The reflectance, whiteness and light resistance were evaluated. The results are shown in Table 1.
- the organic solvent dispersion of the resin composition obtained in Example 1 was applied to a glass plate, heated on a hot plate at 90 ° C for 1 hour to evaporate the solvent, and then peeled off from the glass plate. A membrane was obtained.
- This self-supporting film was fixed on a stainless steel fixing jig and heated in a hot air dryer at 220 ° C. for 2 hours to further evaporate the solvent, thereby obtaining a flexible film having a thickness of 4 m.
- the reflectance and whiteness were evaluated for the resin composition layer obtained by etching and removing the copper foil of the flexible copper-clad white laminate. The results are shown in Table 1.
- Kapton having a thickness of 52.8 m which was obtained by washing the rosin composition obtained in Example 10 with ethanol in advance.
- 200H manufactured by Toray DuPont Co., Ltd.
- Further thick electrolytic copper foil Mitsubishi Metal Mining Co., Ltd. (Mit 3EC—VLP) made by sui Mining & Smelting Co. Ltd.
- the metal-clad white laminate of the present invention can be suitably used for printed wiring boards, particularly printed wiring boards on which LEDs (light emitting diodes) are mounted.
- LEDs light emitting diodes
- via holes and flying leads are formed, and terminal portion cover coats are used. It can be suitably applied to the removal.
Abstract
Description
Claims
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CN200580027970XA CN101005948B (zh) | 2004-08-23 | 2005-08-19 | 覆金属箔白色层压体 |
US11/574,165 US8642181B2 (en) | 2004-08-23 | 2005-08-19 | Metal-clad white laminate |
KR1020077004086A KR101196188B1 (ko) | 2004-08-23 | 2005-08-19 | 금속 부착 백색 적층체 |
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PCT/JP2005/015170 WO2006022207A1 (ja) | 2004-08-23 | 2005-08-19 | 金属張り白色積層体 |
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US (1) | US8642181B2 (ja) |
KR (1) | KR101196188B1 (ja) |
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TW (1) | TW200613136A (ja) |
WO (1) | WO2006022207A1 (ja) |
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JP2010160471A (ja) * | 2008-12-12 | 2010-07-22 | Sekisui Chem Co Ltd | 感光性組成物及びソルダーレジスト組成物 |
WO2011018907A1 (ja) * | 2009-08-10 | 2011-02-17 | 積水化学工業株式会社 | 感光性組成物及びソルダーレジスト組成物 |
US8512856B2 (en) | 2007-08-08 | 2013-08-20 | Ain Co., Ltd. | Method for producing wiring board and wiring board |
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TWI456021B (zh) * | 2011-09-30 | 2014-10-11 | 達邁科技股份有限公司 | 聚合物膜及發光裝置之應用 |
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- 2005-08-19 CN CN200580027970XA patent/CN101005948B/zh active Active
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Also Published As
Publication number | Publication date |
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US20070292709A1 (en) | 2007-12-20 |
KR101196188B1 (ko) | 2012-11-01 |
TWI367825B (ja) | 2012-07-11 |
KR20070044462A (ko) | 2007-04-27 |
US8642181B2 (en) | 2014-02-04 |
TW200613136A (en) | 2006-05-01 |
CN101005948A (zh) | 2007-07-25 |
CN101005948B (zh) | 2012-03-21 |
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