WO2006019083A1 - ガスバリア性積層フィルムおよびその製造方法 - Google Patents
ガスバリア性積層フィルムおよびその製造方法 Download PDFInfo
- Publication number
- WO2006019083A1 WO2006019083A1 PCT/JP2005/014926 JP2005014926W WO2006019083A1 WO 2006019083 A1 WO2006019083 A1 WO 2006019083A1 JP 2005014926 W JP2005014926 W JP 2005014926W WO 2006019083 A1 WO2006019083 A1 WO 2006019083A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- gas
- vapor deposition
- gas barrier
- resin
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/048—Forming gas barrier coatings
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/42—Silicides
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45517—Confinement of gases to vicinity of substrate
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31928—Ester, halide or nitrile of addition polymer
Definitions
- the present invention relates to a laminated film having gas nore property and a method for producing the same, and more specifically, a gas barrier laminated film having excellent gas nore property, transparency and excellent impact resistance. And a manufacturing method thereof.
- a packaging material having gas barrier properties As a packaging material having gas barrier properties, a packaging material in which an aluminum foil layer is provided on a base material has been conventionally used. However, although such a packaging material has a stable gas noria property, it has an aluminum foil layer as a noria layer, so that it is not suitable for incineration and is not easy to dispose of after use. It was. Further, since the aluminum foil layer is provided, there is a problem that a packaging material having transparency cannot be obtained.
- packaging materials having a barrier layer made of polyvinylidene chloride (PVDC) or an ethylene butyl alcohol copolymer (EVOH) have been developed.
- PVDC polyvinylidene chloride
- EVOH ethylene butyl alcohol copolymer
- EVOH since PVDC contains chlorine, incineration after use generates chlorine gas, which is unfavorable for environmental hygiene.
- EVOH has the advantages of high oxygen gas barrier properties and low adsorption of flavor components, but it has the problem that oxygen gas noria properties deteriorate in high humidity atmospheres.
- EVOH has a problem that it does not have water vapor nooriety. For this reason, it is necessary to make the packaging material a complex laminated structure in order to block the steam power of EVOH, which is the NOR layer, and if the manufacturing cost increases!
- inorganic oxide thin films such as silicon oxide and acid aluminum as a packaging material that stably exhibits high gas barrier properties and fragrance retention and has transparency. Films with a barrier layer have been developed.
- This inorganic oxide thin film is formed by depositing an inorganic substance on a substrate by vacuum deposition, and there is no environmental problem at the time of disposal, and there is no humidity dependency of gas barrier properties. .
- Japanese Patent Laid-Open No. 7-80986 a method of providing a coating film having gas barrier properties on the surface of the deposited film.
- a material for the coating film a polymer having a high crystallinity and a high cohesive energy density of a polymer having a polar group such as a hydroxyl group is used.
- polybutyl alcohol and ethylene butyl alcohol copolymer are used.
- polar groups such as hydroxyl groups and amide groups bind to water molecules, and the gas barrier properties of the polar groups decrease as the environmental humidity increases.
- the gas barrier property is lowered due to the moisture vapor of the content, and the quality of the content is deteriorated during storage.
- the present invention has been made in view of such circumstances, and provides a gas barrier laminate film having excellent gas noria properties, transparency, and excellent impact resistance, and a method for producing the same.
- the purpose is to do.
- the gas-noreal laminated film of the present invention has a gas barrier property in which a vapor-deposited film of an inorganic oxide is provided on a substrate, and a gas-barrier coating film is provided on the vapor-deposited film.
- the surface side of the substrate on which the deposited film is formed is pretreated or primer coated,
- the gas nore coating film is formed by applying a gas nore coating liquid on the inorganic oxide film and then heating.
- a base material is prepared, and one side of the base material is pretreated or primer-coated,
- a gas nore coating liquid is formed on the vapor-deposited film by applying a gas nore coating liquid and heating at 150 to 250 ° C.
- FIG. 1 is a schematic cross-sectional view showing an example of a layer structure of a gas noreia laminated film of the present invention.
- FIG. 2 is a schematic cross-sectional view showing another example of the layer structure of the gas noreia laminated film of the present invention.
- FIG. 3 is a schematic view of a chemical vapor deposition apparatus used in the method of the present invention.
- FIG. 4 is a schematic view of a chemical vapor deposition apparatus used in the method of another embodiment of the present invention.
- FIG. 5 is a schematic view of a physical vapor deposition apparatus used in the method of the present invention.
- FIG. 1 is schematic cross-sectional views showing an example of the layer structure of the gas barrier laminated film of the present invention.
- a surface treatment of the base material is performed on one surface of the base film 1, and an inorganic oxide is deposited on the surface treatment la.
- a structure in which a film 2 is provided and a gas noble coating film 3 is provided on the inorganic oxide deposited film 2 is a basic structure.
- a primer coat layer lb is provided on one surface of the substrate film 1, and an inorganic acid layer is provided on the primer coat layer.
- the basic structure is a structure in which a vapor deposition film 2 is provided and a gas barrier coating film 3 is provided on the inorganic oxide deposition film 2.
- the inorganic oxide vapor deposition film may be formed by stacking two or more vapor-deposited inorganic oxide films having the same or different forces. .
- the base material constituting the gas-nominated laminated film of the present invention is excellent in chemical shearing physical strength, withstands the conditions for forming an inorganic oxide vapor-deposited film, and the like.
- a resin film or sheet that can be well retained without impairing the properties can be used.
- Such a resin film or sheet include, for example, polyolefin resin such as polyethylene resin or polypropylene resin, cyclic polyolefin resin, polystyrene resin, acrylonitrile. —Styrene copolymer (AS resin), Atari mouth-tolyl-butadiene—Styrene copolymer (ABS resin), poly (meth) acrylic resin, polycarbonate resin, polyethylene terephthalate, polyethylene naphthalate, etc. Polyester-based resins, various types of polyamide-based resins such as nylon, polyurethane-based resins, acetal-based resins, cellulose-based resins, and other various types of films or sheets can be used. [0022] In the present invention, the film or sheet of polyester resin, polyolefin resin, or polyamide resin, in particular, among the above-mentioned film or sheet of resin is used. It is preferable to use it.
- one or more of the various types of the above-mentioned various types of resin can be used as the above-described various types of resin films or sheets, and an extrusion method, a cast molding method, a T-die, etc.
- the film-forming method such as the method, cutting method, inflation method, etc.
- the above-mentioned various types of resin are formed into a single film, or two or more types of various types of resin are used.
- Multi-layer coextrusion film forming method Sarasako uses two or more types of resin and mixes them to form a film before forming a film.
- various types of resin films or sheets that are stretched in a uniaxial or biaxial direction using, for example, a tenter system or a tubular llama system can be used.
- the film thickness of various resin films or sheets is preferably about 6 to 200 ⁇ m, more preferably about 9 to about LOO / zm.
- a lubricant for example, a crosslinking agent, an antioxidant, an ultraviolet absorber, a light stabilizer, a filler, a reinforcing agent, an antistatic agent, a pigment, and the like are used. Furthermore, a modifying resin can also be used.
- the surface of various resin films! /, And the surface of the sheet are improved as necessary in order to improve the close adhesion to the vapor-deposited film of the inorganic oxide.
- a desired surface treatment layer can be provided in advance.
- the surface treatment layer for example, corona discharge treatment, ozone treatment, low temperature plasma treatment using oxygen gas or nitrogen gas, glow discharge treatment, treatment using chemicals, etc.
- pre-treatment such as oxidation treatment, etc., for example, corona treatment layer, ozone treatment layer, plasma treatment layer, oxidation treatment layer, etc. are formed and provided be able to.
- the above surface pretreatment is carried out as a method for improving the close adhesion between various types of resin films or sheets and the deposited film of inorganic oxides.
- Other methods for improving adhesion include, for example, a primer coat layer, an undercoat layer, an anchor coat layer, an adhesive layer, or a deposition anchor on the surface of various resin films or sheets in advance.
- a coating layer or the like is arbitrarily formed to form a surface treatment layer.
- Examples of the pretreatment coating agent layer include polyester-based resin, polyamide-based resin, polyurethane-based resin, epoxy-based resin, phenol-based resin, (meth) acrylic-based resin, It is possible to use a resin composition comprising as a main component of a vehicle an olefin acetate resin, a polyethylene resin, a polyolefin resin such as polypropylene, or a copolymer thereof or a modified resin, a cellulose resin, or the like. it can.
- the vapor deposition film which comprises the gas nootropic laminated film of this invention is demonstrated.
- the deposited film can be formed by chemical vapor deposition or physical vapor deposition.
- chemical vapor deposition examples include chemical vapor deposition (chemical vapor deposition, CVD) such as plasma chemical vapor deposition, thermochemical vapor deposition, and photochemical vapor deposition. Can be formed.
- an evaporation gas such as an organosilicon compound is used as a raw material, and an inert gas such as argon gas or helium gas is used as a carrier gas.
- an inert gas such as argon gas or helium gas
- a vapor deposition film of an inorganic oxide such as silicon oxide can be formed using a low temperature plasma chemical vapor deposition method using oxygen as a supply gas and using a low temperature plasma generator.
- a low-temperature plasma generator for example, a power capable of using a generator such as high-frequency plasma, pulse wave plasma, microwave plasma, etc. Generated by a high-frequency plasma method to obtain a stable plasma It is desirable to use a device.
- FIG. 3 is a schematic configuration diagram of a low-temperature plasma chemical vapor deposition apparatus showing an outline of a method for forming a deposited film of an inorganic oxide by the above-described plasma chemical vapor deposition method.
- a resin film or sheet is unwound from an unwinding roll 23 disposed in a vacuum chamber 22 of a plasma chemical vapor deposition apparatus 21, and further The resin film or sheet is conveyed on the circumferential surface of the cooling electrode drum 25 through the auxiliary roll 24 at a predetermined speed.
- oxygen gas, an inert gas, a monomer gas for vapor deposition such as an organosilicon compound, and the like are supplied from the gas supply devices 26, 27 and the raw material volatilization supply device 28, and the like, and the vapor deposition comprising them.
- the mixed gas composition for vapor deposition was introduced into the vacuum chamber 22 through the raw material supply nozzle 29 without adjusting the mixed gas composition for use in the vacuum, and the above-mentioned cooling drum 25 was conveyed on the circumferential surface of the electrode drum.
- a plasma is generated by a glow discharge plasma on an oil film or sheet, and this is irradiated to form a vapor-deposited film of an inorganic oxide such as silicon oxide to form a film.
- the cooling electrode drum 25 is applied with a predetermined power from the power source 31 disposed outside the chamber, and in the vicinity of the cooling electrode drum 25. Then, the generation of plasma is promoted by arranging the magnet 32, and then the resin film or sheet on which the deposited film of inorganic oxide such as silicon oxide is formed is guided through the guide roll 33. The film can be wound around a take-up roll 34 to produce a non-coated film having an inorganic oxide vapor-deposited film.
- the inorganic oxide vapor-deposited film may be in the form of a multilayer film in which two or more layers are laminated in addition to one layer of the inorganic oxide vapor-deposited film.
- the material to be used may be one kind or a mixture of two or more kinds, and a vapor deposited film of an inorganic oxide mixed with different kinds of materials may be formed.
- the vacuum chamber within a reduced pressure by a vacuum pump, vacuum 1 X 10- 1 ⁇ 1 X 10 _8 Torr , preferably about, the vacuum degree 1 X 10 one 3 to about 1 X 10 _7 Torr It is preferable to prepare.
- the organic silicon compound as the raw material is volatilized and mixed with oxygen gas, inert gas, or the like supplied from the gas supply apparatus. It is introduced into the vacuum chamber through the raw material supply nozzle.
- the content of the organosilicon compound in the mixed gas is approximately 1 to 40%
- the oxygen gas content is approximately 10 to 70%
- the inert gas content is approximately 10 to 60%.
- the mixing ratio of the organosilicon compound, oxygen gas, and inert gas can be about 1: 6: 5 to 1:17:14.
- a glow discharge brush is formed in the vicinity of the opening of the material supply nozzle in the vacuum chamber and the cooling electrode drum.
- the glow discharge plasma is derived from one or more gas components in the mixed gas, and in this state, the resin film or sheet is transported at a constant speed to cause the glow discharge.
- a vapor deposited film of an inorganic oxide such as silicon oxide can be formed on the cooling film on the peripheral surface of the electrode drum by a probe.
- the vacuum degree in the vacuum chamber one this time 1 X 10- 1 ⁇ 1 X 10 _4 Torr or so, preferably prepared at a vacuum of about 1 X 10- 1 ⁇ 1 X 10 _2 Torr It is also preferable that the speed of transporting the resin film is about 10 to 300 mZ, preferably about 50 to 150 m / min.
- the formation of a vapor deposition film of an inorganic oxide such as silicon oxide is carried out by supplying a plasma source gas to oxygen on a resin film or sheet. Since it is formed into a thin film in the form of SiOx while oxidizing with gas, the deposited oxide film of inorganic oxide such as silicon oxide is dense, continuous layer with little gaps and high flexibility It becomes. Therefore, the gas barrier property of a vapor-deposited film of inorganic oxide such as silicon oxide is much higher than that of a vapor-deposited film of inorganic oxide such as silicon oxide formed by a conventional vacuum vapor deposition method or the like. In other words, sufficient gas-noreness can be obtained with a thin film thickness.
- the surface of the sheet is not a resin film by SiOx plasma! Since iS is cleaned and polar groups and free radicals are generated on the surface of the resin film or sheet, it is formed by vapor deposition of inorganic oxide such as silicon oxide and resin film! / It has the advantage that it becomes a thing with high close adhesiveness.
- the degree of vacuum when forming a continuous film of inorganic oxide such as silicon oxide is 1
- X 10- 1 ⁇ 1 X 10 _4 Torr preferably about, 1 X 10- 1 ⁇ 1 X 10 from Rukoto be prepared about _2 Torr, the vacuum degree during vapor deposition film formed by the conventional vacuum vapor deposition (10 one 4 since ⁇ compared to 10 _5 T about orr) a low degree of vacuum, a film of ⁇ , and it is possible to shorten the vacuum state setting time in the raw exchange sheet, the degree of vacuum is stabilized, Ltd.
- the membrane process is stable.
- a vapor deposition film of silicon oxide formed using a vapor deposition monomer gas such as an organic silicon compound has a chemical reaction between a vapor deposition monomer gas such as an organic silicon compound and oxygen gas.
- the reaction product is closely adhered to one surface of a resin film or sheet to form a dense and flexible thin film.
- the general formula: SiOx (wherein X is 0 to 2 is a continuous thin film mainly composed of silicon oxide.
- the evaporated silicon oxide film is represented by the general formula: SiOx (wherein X represents a number from 1.3 to 1.9) in terms of transparency, barrier properties, and the like.
- a thin film mainly composed of a deposited silicon oxide film is preferable.
- the value of X is a force that varies depending on the molar ratio of vapor deposition monomer gas and oxygen gas, the energy of plasma, etc.
- the gas permeability decreases as the value of X decreases.
- the film itself is yellowish and the transparency is poor.
- the above-mentioned vapor-deposited film of silicon oxide is mainly composed of silicon oxide, and further, one kind of carbon, hydrogen, silicon or oxygen, or a compound having two or more kinds of elemental forces. It is preferable to contain at least one kind by chemical bonds or the like.
- a compound having a C—H bond, a compound having a Si—H bond, or a carbon unit is in the shape of graphite, diamond, fullerene, etc. These derivatives may be contained by chemical bonds or the like.
- Specific examples include hydrated carbon having a CH site, SiH silyl, SiH silylene, etc.
- Hydroxide derivatives such as 3 3 2 hydrated silica and SiH OH silanol.
- the type, amount, etc. of the compound contained in the deposited film of silicon oxide can be changed by changing the conditions of the vapor deposition process.
- the content of the above compound strength in the evaporated film of silicon oxide is about 0.1 to 50%, preferably about 5 to 20%.
- the present invention it is preferable to reduce the content of the above-mentioned compound in the evaporated silicon oxide film by reducing the surface force of the evaporated silicon oxide film in the depth direction.
- the impact resistance and the like can be enhanced by the above-described compound on the surface of the silicon oxide vapor-deposited film, and on the other hand, the content of the above-mentioned compound is small at the interface with the base material. The tight adhesion with the deposited silicon film becomes strong.
- the deposited silicon oxide film is, for example, an X-ray photoelectron spectrometer (XPS), a secondary ion mass spectrometer (SIMS), or the like.
- XPS X-ray photoelectron spectrometer
- SIMS secondary ion mass spectrometer
- the physical properties as described above can be confirmed by performing elemental analysis of the deposited film of silicon oxide by using a surface analysis device and performing analysis such as ion etching in the depth direction. .
- the deposited film thickness of the silicon oxide is about 50 A to 400 00 A. Is preferably about 100 to L000A. If it is thicker than 1000 A or 4000 A, cracks and the like are likely to occur in the film, so this is not preferable. If it is less than 50 A, the gas barrier effect cannot be expected.
- the film thickness of the deposited film can be measured by a fundamental parameter method using, for example, a fluorescent X-ray analyzer (model name, RIX2000 model) manufactured by Rigaku Corporation.
- the volume velocity of the vapor-deposited film is increased, that is, a method of increasing the amount of monomer gas and oxygen gas or steaming. Yes Can be done by slowing the speed.
- 1, 1, 3, 3-tetramethyldisiloxane or hexamethyldisiloxane is used as a raw material.
- it is a particularly preferable raw material.
- anoregon gas, helium gas or the like can be used as the inert gas.
- the present invention it is preferable to form two or more silicon oxide layers when forming a deposited film by chemical vapor deposition.
- the gas noirality can be further improved.
- the plasma chemical vapor deposition apparatus 40 basically includes a base film supply chamber 41, a first film forming chamber 42, a second film forming chamber 43, and a third film forming chamber. It comprises a membrane chamber 44 and a scraping chamber 45 for winding a film obtained by forming a silicon oxide layer on the base film.
- the base film 1 wound on the unwinding roll 46 is fed to the first film forming chamber 42, and further this base film 1 is cooled at a predetermined speed via the auxiliary roll 47.
- the raw material volatilization supply device 49 and the gas supply device 50 are used to supply one or more types of organosilicon compound film forming monomer gas, oxygen gas, inert gas, etc.
- the mixed gas composition for film formation was introduced into the first film forming chamber 42 through the raw material supply nozzle 51, and the cooling electrode drum 48 on the circumferential surface
- plasma is generated by the glow discharge plasma 52, and this is irradiated to form a first silicon oxide layer which also has silicon oxide isotropic force. I'll do it.
- the base film obtained by forming the first silicon oxide layer in the first film forming chamber 42 is transferred to the second film through the auxiliary rolls 53 and 54. Then, the substrate film is fed into the chamber 43, and then the substrate film on which the first silicon oxide layer is formed is conveyed onto the cooling electrode drum 55 circumferential surface at a predetermined speed in the same manner as described above.
- the raw material volatilization supply device 56 and the gas supply device 57 supply one or more kinds of organic silicon compound monomer gas, oxygen gas, inert gas, etc. Then, while adjusting the mixed gas composition for film formation comprising them, the mixed gas composition for film formation is introduced into the second film forming chamber 43 through the raw material supply nozzle 58, and the above cooling is performed. Plasma is generated by glow discharge plasma 59 on the first silicon oxide layer of the base film obtained by forming the first silicon oxide layer transported on the electrode drum 55 peripheral surface, By irradiating this, a second silicon oxide layer having a silicon oxide isotropic force is formed.
- the base film obtained by forming the first and second silicon oxide layers in the second film-forming chamber is passed through the auxiliary rolls 60 and 61.
- the substrate film which is fed into the third film forming chamber 44 and then formed into a silicon oxide layer of the first layer and the second layer is cooled at a predetermined speed in the same manner as described above. Transport on the surface.
- the raw material volatilization supply device 63 and the gas supply device 64 supply one or more types of organic silicon compound monomer gas, oxygen gas, inert gas, etc.
- the above mixed gas composition for film formation is introduced into the third film formation chamber 44 through the raw material supply nozzle 65 while adjusting the mixed gas composition for film formation comprising them, and the cooling electrode Plasma is generated by glow discharge plasma 66 on the second silicon oxide layer of the base film formed from the first and second silicon oxide layers transported on the drum peripheral surface. This is irradiated to form a third silicon oxide layer having a silicon oxide isotropic force.
- the first layer, the second layer, and the third layer of the silicon oxide layer are formed as described above, and the base film on which these layers are stacked is passed through the auxiliary roll 67.
- a gas nore laminate film having a vapor deposition layer in which the first layer, the second layer, and the third layer of silicon oxide are overlaid can be produced by being wound around a scooping roll 68.
- each cooling electrode drum (18, 55, 62) disposed in each of the first, second, and third film forming chambers (42, 43, 44) Predetermined power is applied from a power source 69 arranged outside the first, second, and third film forming chambers, and each cooling / electrode drum (48, 55, 62) In the vicinity, magnets (70, 71, 72) are placed and the plasma generation force is increased by M.
- the above-described plasma chemical vapor deposition apparatus is provided with a vacuum pump or the like, and each film forming chamber or the like is prepared to be kept in a vacuum.
- a gas barrier laminated film in which the first layer, the second layer, and the third layer silicon oxide layer are overlaid is manufactured. It can be prepared to form a silicon oxide layer, such as two layers or four layers or more, and form a layered structure.
- the present invention is not limited only to the example of producing a gas noreia laminated film in which the first, second, and third silicon oxide layers are overlaid.
- each made Makushitsu is depressurized by a vacuum pump or the like, the degree of vacuum 1 X 10- 1 ⁇ 1 X 1 0 _8 Torr , preferably about, vacuum 1 X 10 one 3 ⁇ 1 X 10 _7 It is preferable to adjust to about Torr.
- each cooling electrode drum since a predetermined voltage is applied to each cooling electrode drum as a power source, a glow discharge plasma is generated in the vicinity of the opening of the raw material supply nozzle in each film forming chamber and the cooling electrode drum.
- the generated glow discharge plasma is also derived from one or more gas component forces of the mixed gas composition for film formation.
- the base film is transported at a constant speed, and the glossy plasma is transported.
- a silicon oxide layer having a silicon oxide isotropic force can be formed on the substrate film on the circumferential surface of the cooling electrode drum by a single discharge plasma.
- the vacuum degree of each film forming chamber in this case, 1 X 10- 1 ⁇ 1 X 10 _4 Torr or so, preferably prepared at a vacuum of about 1 X 10- 1 ⁇ 1 X 10 _2 Torr .
- the substrate film is conveyed at a speed of about 10 to 300 mZ, preferably about 50 to 150 mZ.
- the degree of vacuum in each film forming chamber may be the same or different in each chamber.
- a film forming monomer gas composed of one or more organic silicon compounds as raw materials is volatilized and mixed with oxygen gas, inert gas, or the like supplied from the gas supply apparatus. It is preferable to introduce the mixed gas composition for film formation into each film forming chamber through the raw material supply nozzle while adjusting the mixed gas composition for film formation composed of them.
- the gas mixing ratio of each gas component of the film-forming mixed gas composition is such that the content of the monomer gas for film-forming, which is one kind of organosilicon compound, is about 1 to 40%, oxygen gas It is preferable to prepare such that the content is about 0 to 70%, and the inert gas content is about 1 to 60%.
- the film-forming mixture prepared by changing the gas mixing ratio of each gas component of the film-forming mixed gas composition introduced into each film-forming chamber for each film-forming room. It is preferable to use a gas composition and form a film for each film forming chamber to overlay a silicon oxide layer that is equivalent to a silicon oxide.
- At least each gas of a film-forming monomer gas, an oxygen gas, and a film-forming mixed gas composition containing an inert gas that also has at least one kind of organosilicon compound is contained.
- a film-forming mixed gas composition is prepared, and the film-forming mixed gas composition is used by changing it for each film-forming chamber, and two or more layers of plasma using these film-forming mixed gas compositions are used.
- a silicon oxide layer can be formed by chemical vapor deposition.
- the film-forming monomer gas: oxygen gas: inert gas 1: 0-5: 1: film mixed gas composition consisting of a gas yarns ⁇ ratio (unit slm, which stands for standard rate coater Minute)
- the above mixed gas composition for film formation is arbitrarily combined, In the first, second, or third film-forming chamber, a film-forming mixed gas composition in which the mixing ratio of each gas component of the film-forming mixed gas composition is changed is used to form a film. Can do.
- the inorganic oxide deposition film may be, for example, a physical vapor deposition method such as a vacuum deposition method, a sputtering method, an ion plating method, or an ion cluster beam method (Physical Vapor Deposition method, PVD method). ) Can be used.
- a physical vapor deposition method such as a vacuum deposition method, a sputtering method, an ion plating method, or an ion cluster beam method (Physical Vapor Deposition method, PVD method). ) Can be used.
- a metal oxide or a metal oxide is used as a raw material, or a vacuum evaporation method in which a metal oxide is used as a raw material and heated to deposit on a resin film or sheet.
- Oxygen is introduced and oxidized to make a resin film, and then an oxidation reaction deposition method that deposits on a sheet, and a plasma-assisted oxidation reaction deposition method that further assists the oxidation reaction with plasma, etc.
- a heating method of the vapor deposition material for example, a resistance heating method, a high-frequency induction heating method, an electron beam heating method (EB), or the like can be performed.
- EB electron beam heating method
- Examples of the inorganic oxide vapor deposition film include metal oxide vapor deposition films, and specifically, silicon (Si), aluminum (A1), magnesium (Mg), calcium ( Metal oxides such as Ca), potassium (K), tin (sn), sodium (Na), boron (B), titanium (Ti), lead (Pb), zirconium (Zr), yttrium (Y)
- the deposited film can be used.
- Preferable examples include metals such as silicon (Si) and aluminum (A1).
- the vapor deposition film of the above metal oxide can be referred to as a metal oxide such as a silicon oxide, an aluminum oxide, a magnesium oxide, and the like.
- a metal oxide such as a silicon oxide, an aluminum oxide, a magnesium oxide, and the like.
- Is represented by MOx such as SiOx, A10x, MgOx (wherein M represents a metal element, and the value of X varies depending on the metal element).
- the range of the value of X is 0-2 for silicon (Si), 0-1.5 for aluminum (A1), 0-1 for magnesium (Mg), calcium ( Ca) is 0 to 1, potassium (K) is 0 to 0.5, tin (Sn) is 0 to 2, sodium (Na) is 0 to 0.5, boron (B) is 0 to 1, 5, Titanium (Ti) is 0-2, Lead (Pb) is 0-1, Zirconium (Zr) is 0-2, Yttrium (Y) is 0-1.5. be able to.
- the thickness of the deposited film of the inorganic oxide as described above varies depending on the metal used or the type of the metal oxide, but for example, about 50 to 4000A, Preferably, it is desirable to form it arbitrarily within the range of ⁇ to ⁇ A.
- the deposited metal film of the inorganic oxide is used as a metal to be used, or the metal oxide is used in one kind or a mixture of two or more kinds, and different materials are used. It is also possible to form a vapor-deposited film of mixed inorganic oxide.
- FIG. 5 is a schematic configuration diagram showing an example of a take-up vacuum deposition apparatus.
- the resin film or sheet 1 fed out from the unwinding roll 82 passes through the guide rolls 83 and 84. Guided to cooled coating drum 85.
- the vapor deposition source 86 heated by the crucible 92 for example, metallic aluminum or acid aluminum is evaporated on the resin film or sheet guided on the cooled coating drum. Further, if necessary, oxygen gas or the like is blown out from the oxygen gas outlet 87, and an inorganic oxide vapor deposition film such as aluminum oxide is deposited on the resin film through the mask 88 while supplying the oxygen gas. It is formed on the sheet. Next, for example, a resin film or a sheet formed with a vapor deposited film of an inorganic oxide such as an acid film is applied to the winding roll 91 via the guide rolls 89 and 90. A film or sheet of a resin having a vapor-deposited film of inorganic oxide can be wound up.
- a vapor deposition film of an inorganic oxide of the first layer is formed by using the winding type vacuum vapor deposition apparatus as described above, and then the inorganic oxide is similarly formed.
- An inorganic oxide vapor deposition film is further formed on the vapor deposition film, or a winding as described above.
- a take-up type vacuum vapor deposition device this is connected in series, and an inorganic oxide vapor deposition film is continuously formed, thereby forming an inorganic oxide vapor deposition film consisting of two or more multilayer films. Can be formed.
- gas nore coating film made of a gas nore composition obtained by polycondensation of a composition containing alkoxide, polyvinyl alcohol and Z or ethylene'vinyl alcohol by a sol-gel method.
- the alkoxide that can be suitably used in the present invention has a general formula: R 1 M (OR 2 ) (wherein M is gold)
- R 2 is an organic group having 1 to 8 carbon atoms, n is 0 or more, m is an integer of 1 or more, and n + m represents the valence of M), and the partial hydrolyzate of this alkoxide
- at least one of alkoxide hydrolysis condensates can be used.
- the partial hydrolyzate of the alkoxide described above may be one in which one or more of the alkoxy groups are hydrolyzed, and a mixture thereof.
- the hydrolysis condensate represents a dimer or more of partially hydrolyzed alkoxide, and a dimer to hexamer is usually used.
- ruthenium, titanium, aluminum, etc. can be used, and preferable is silicon.
- These alkoxides can be used singly or as a mixture of two or more different metal atom alkoxides in the same solution.
- organic group R 1 examples include, for example, a methyl group, an ethyl group, an n-propyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, a sec-butyl group, and a t-butyl group. And alkyl groups such as n-hexyl group and n-octyl group.
- organic group R 2 include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, and a sec butyl group.
- alkoxysilane in which M is Si is preferably an alkoxysilane represented by Si (OR a ), and R is a lower alkyl group.
- R a is a methyl group
- Examples thereof include poxysilane Si (OC H) and tetrabutoxysilane Si (OC H).
- alkylalkoxysilane R b Si (OR can be used (m is 1, 2, 3
- R b the R e, a methyl group, etc. Echiru group is used, specific examples of the alkyl alkoxy silane, methyltrimethoxysilane CH Si (OCH), methyltriethoxysilane
- Toxisilane (CH) Si (OC H) and the like can be mentioned. These alkoxysilanes, al
- Kill alkoxysilanes can be used alone or in admixture of two or more.
- polycondensation products of alkoxysilanes can also be used, and specific examples include polytetramethoxysilane and polytetraemethoxysilane.
- zirconium alkoxides in which M is Zr include
- Zr (0-C H) or the like can be preferably used.
- titanium alkoxides in which M is Ti include tetramethoxytitanium Ti (0—CH 3), tetraethoxytitanium Ti (0—C H),
- specific examples of aluminum alkoxides in which M is A1 include tetramethoxyaluminum A1 (0—CH 3) and tetraethoxyaluminum A1 (0—C H).
- AKO-C H AKO-C H
- the like can be preferably used.
- a mixture of two or more of these alkoxides may be used.
- the toughness and heat resistance of the resulting laminated film can be improved, and a decrease in the retort resistance of the film during stretching can be avoided.
- the amount of zirconium alkoxide used is in the range of 10 parts by weight or less, preferably about 5 parts by weight, based on 100 parts by weight of alkoxysilane. When the amount exceeds 10 parts by weight, the formed composite polymer becomes gely, the brittleness of the composite polymer increases, and the composite polymer layer easily peels off when the base film is coated.
- the thermal conductivity of the resulting film is lowered, and the heat resistance of the substrate is remarkably improved.
- the amount of titanium alkoxide used is in the range of 5 parts by weight or less, preferably about 3 parts by weight, based on 100 parts by weight of alkoxysilane. When the amount exceeds 5 parts by weight, the brittleness of the formed composite polymer increases, and the composite polymer is easily peeled off when the base film is coated.
- a silane coupling agent is used in combination with the alkoxide.
- a known organic reactive group-containing organoalkoxysilane can be used.
- an organoalkoxysilane having an epoxy group is preferred. Examples include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyljetoxysilane, and j8 (3,4 epoxy cyclohexyl) ethyltrimethoxysilane.
- Such silane coupling agents may be used in combination of two or more.
- the amount of the silane coupling agent used is in the range of 0.1 to 20 parts by weight with respect to 100 parts by weight of the alkoxysilane.
- the composite polymer formed is increased in rigidity and brittleness, and the insulation and caloric properties of the composite polymer layer are lowered.
- the composition for forming a gas barrier coating film includes polyvinyl alcohol and Z or ethylene'bulol alcohol copolymer.
- polybulal alcohol and ethylene'bulcoalcohol copolymer By combining polybulal alcohol and ethylene'bulcoalcohol copolymer, the gas coating properties, water resistance, weather resistance, etc. of the resulting coating film are remarkably improved.
- the laminated film that combines Sarakuko, polyvinyl alcohol, and ethylene-but-alcohol copolymer has excellent hot water resistance and gas noriability after hydrothermal treatment.
- the content weight ratio of each of the combination of polybulle alcohol and ethylene 'bulualcohol copolymer is 10: 0. 05 ⁇ : L0: 6 More preferred is about 10: 1.
- the total content of the polybutal alcohol and Z or ethylene 'bulualcohol copolymer is in the range of 5 to 600 parts by weight, preferably about 50 to 400 parts by weight, with respect to 100 parts by weight of the total alkoxide. Part. If it exceeds 600 parts by weight, the brittleness of the composite polymer will increase, and the water resistance and weather resistance of the resulting laminated film will also decrease. If it is less than 5 parts by weight, the gas barrier properties will be reduced.
- the above composition (coating liquid) is applied onto a vapor deposition film, and the composition is polycondensed by a gel-gel method to obtain a coating film.
- a sol-gel catalyst mainly a polycondensation catalyst, tertiary amine which is substantially insoluble in water and soluble in an organic solvent is used.
- tertiary amine which is substantially insoluble in water and soluble in an organic solvent is used.
- the amount used is from 0.01 to 1 part by weight, preferably about 0.03 part by weight, per 100 parts by weight of the total amount of alkoxide and silane coupling agent.
- the above composition may further contain an acid.
- the acid is used as a catalyst for the sol-gel process, mainly as a catalyst for hydrolysis of alkoxysilane and silane coupling agents.
- mineral acids such as sulfuric acid, hydrochloric acid and nitric acid, and organic acids such as acetic acid and tartaric acid are used.
- the amount of the acid used is 0.001 to 0.05 moles, preferably about 0.01 mole, based on the total mole amount of the alkoxide and the alkoxide content of the silane coupling agent (eg, silicate moiety).
- the amount of water exceeds 2 mol, the polymer obtained from the alkoxysilane and the metal alkoxide becomes spherical particles, and the spherical particles are three-dimensionally crosslinked to form a porous polymer having a low density. It becomes. Porous polymers cannot improve the gas barrier properties of the substrate film.
- the amount of water is less than 0.8 mol, the caro-hydrolysis reaction does not proceed easily.
- the gas barrier coating film-forming composition preferably contains an organic solvent.
- Organic solvents include methyl alcohol, ethyl alcohol, n -propyl alcohol, Isopropyl alcohol, n-butanol, etc. are used.
- the polybulal alcohol and the Z or ethylene ′ bulalcohol copolymer are in a state of being dissolved in a composition (coating solution) containing the above alkoxide or silane coupling agent.
- a composition (coating solution) containing the above alkoxide or silane coupling agent is appropriately selected.
- n-butanol is preferably used.
- Ethylene butyl alcohol copolymer soluble in a solvent is commercially available as, for example, Soanol (trade name).
- the amount of the organic solvent used is usually 30 to 500 parts by weight per 100 parts by weight of the total amount of the alkoxide, silane coupling agent, polyvinyl alcohol and Z or ethylene butyl alcohol copolymer, acid, and Zogel method catalyst. is there.
- a coating solution is prepared by mixing the alkoxysilane, silane coupling agent, butyl alcohol polymer, zeolite gel method catalyst, acid, water, organic solvent, and metal alkoxide as necessary.
- this coating solution is applied to the substrate film by a conventional method and dried.
- the polycondensation of the above alkoxysilane, metal alkoxide, silane coupling agent and butyl alcohol polymer further proceeds to form a composite polymer layer.
- the above operation is repeated to load a plurality of composite polymer layers.
- the film coated with the coating solution is heated at a temperature of 150 ° C to 250 ° C for 30 seconds to 10 minutes.
- a coating liquid mainly composed of alkoxysilane, a silane coupling agent, and a butyl alcohol polymer is applied to the surface of the substrate on which the vapor-deposited film is provided, and 150 ° C to 250 ° C.
- gas barrier coating films mainly composed of butyl alcohol polymer have significantly reduced oxygen barrier properties in a high temperature and humidity atmosphere (40 ° C, 90 Rh%).
- the gas noble laminated film of the present invention has an excellent oxygen barrier property even in an atmosphere with high temperature and humidity.
- the gas-based coating film itself composed mainly of vinyl alcohol polymer does not have a water vapor barrier property, as in the present invention.
- a coating liquid having the above composition to the surface of the vapor-deposited film of the base material and subjecting it to a heat treatment at a predetermined temperature, the water vapor noreality is remarkably improved.
- the reason for this is not limited to this. That is, in the coating film, a bridging reaction occurs in which the hydrogen alcohol polymer and the hydrolyzate of alkoxysilane are hydrogen-bonded or chemically bonded, and the butyl alcohol polymer is crystallized.
- Oxygen barrier property and water vapor noreality are excellent due to the tight adhesion of the vapor-deposited film and the gas-noble coating film by hydrogen bonding or chemical bonding over the interface between the film and the gas-noria coating film. Can be obtained.
- the gas-nolia coating film has a crosslinked structure by hydrogen bonds, chemical bonds, or the like, the molecular motion of the polymer is restricted even when placed in an atmosphere with high temperature and humidity. For this reason, it is considered that high gas noria properties are exhibited.
- the heating temperature is less than 150 ° C, the oxygen noreness and water vapor noreia are not improved. In addition, at temperatures exceeding 250 ° C, the substrate is damaged, and curls are generated, resulting in a decrease in gas noliativity.
- the heating temperature is preferably 180 to 200 ° C.
- an ethylene 'butyl alcohol copolymer or a composition using both an ethylene vinyl alcohol copolymer and polyvinyl alcohol may be used instead of the butyl alcohol polymer.
- Laminated films using both ethylene 'bulualcohol copolymer and polybulualcohol further improve the gas barrier properties after hot water treatment such as boil treatment and retort treatment.
- the following laminated film is preferably formed in order to improve the gas barrier property after the hot water treatment.
- a composition containing polybulual alcohol is applied in advance to at least one surface of the base film to form a first composite polymer layer, and then the ethylene 'bulualcohol is coated on the coated surface.
- a composition containing the copolymer is applied to further form a second composite polymer layer.
- a plurality of gas-nolia coating films may be formed on a base film.
- Gas barrier properties are further improved by providing multiple layers of gas-nolia coating films. Can be achieved.
- the function of the gas noble coating film will be described as an example using alkoxysilane.
- Alkoxysilane and metal alkoxide are hydrolyzed by the added water.
- the acid serves as a catalyst for hydrolysis.
- the generated hydroxyl power proton is taken away by the action of the sol-gel method catalyst, and hydrolyzed products are dehydrated and polycondensed.
- the silane coupling agent is simultaneously hydrolyzed by the acid catalyst, and the alkoxy group becomes a hydroxyl group.
- the opening of the epoxy group also occurs due to the action of the base catalyst, generating a hydroxyl group.
- a polycondensation reaction between the hydrolyzed silane coupling agent and the hydrolyzed alkoxide also proceeds. Furthermore, since there is polyvinyl alcohol or ethylene'bulualcohol copolymer, or polyvinyl alcohol and ethylene'vinyl alcohol in the reaction system, the reaction with the hydroxyl group of polyvinyl alcohol and ethylene'vinyl alcohol copolymer also occurs.
- the resulting polycondensate is a composite polymer containing an inorganic part that also has a bonding force, such as Si—O—Si, Sj—OZr, Si—O—Ti, and an organic part derived from the silane coupling agent. .
- a linear polymer having a partial structural formula represented by the formula (wherein R represents an alkyl group) and further having a portion derived from a silane coupling agent is first formed.
- This polymer has OR groups (alkoxy groups such as ethoxy groups) branched from linear polymers.
- This OR group is hydrolyzed to become an OH group using the acid present as a catalyst, and the OH group is first deprotonated by the action of the sol-gel catalyst (base catalyst), and then polycondensation proceeds. That is, this OH group has the following formula:
- R represents hydrogen or an alkyl group
- ml, m2 and m3 represent an integer of 1 or more, and R represents an alkyl group).
- the above reaction proceeds at room temperature, and the viscosity of the coating solution increases during preparation.
- this coating solution is applied to the base film and heated to remove the solvent and the alcohol produced by the polycondensation reaction, the polycondensation reaction is completed, and a transparent composite polymer layer is formed on the base film. It is formed.
- the composite polymers between the layers are also condensed, and the layers are firmly bonded to each other.
- the organic reactive group of the silane coupling agent and the hydroxyl group generated by hydrolysis are bonded to the hydroxyl group on the substrate film surface, the adhesion between the substrate film surface and the composite polymer layer is also good.
- a linear polymer has crystallinity and has a structure in which a large number of minute crystals are embedded in an amorphous part.
- a crystal structure is the same as that of a crystalline organic polymer (for example, a salty vinylidene polypolyalcohol), and a polar group (OH group) is partially present in the molecule, and the cohesive energy of the molecule is Excellent gas barrier properties due to high molecular chain rigidity.
- the vapor-deposited film of inorganic oxide and the gas barrier coating film form, for example, a chemical bond, a hydrogen bond, or a coordinate bond by hydrolysis' cocondensation reaction, and thus an inorganic acid.
- the adhesion between the deposited film and the gas barrier coating film is improved, and the synergistic effect of the two layers can provide a better gas barrier effect.
- the gas barrier coating film forming composition for example, a roll coat such as a gravure coater, a spray coat, a spin coat, a datebing, a brush, a bar code, an applicator or the like
- a roll coat such as a gravure coater, a spray coat, a spin coat, a datebing, a brush, a bar code, an applicator or the like
- the gas barrier coating film of the present invention having a dry-baked film thickness of 0.01-30 ⁇ m, preferably 0.1-10 ⁇ m, can be formed by one or more coatings.
- a primer agent or the like can be applied in advance onto the vapor-deposited film of the inorganic oxide.
- a vapor deposition layer is further provided, and the gas noble coating film is formed on the vapor deposition layer in the same manner as described above. It may be formed.
- the gas-noble laminated film of the present invention is useful as a packaging material because it has the excellent characteristics as described above, and particularly has a gas barrier property (because it has excellent 0)
- the gas nore laminate film of the present invention has excellent gas nore property after hydrothermal treatment, particularly after high pressure hydrothermal treatment (retort treatment).
- the printed layer is composed of one or more ordinary ink vehicles as the main component, and if necessary, a plasticizer, a stabilizer, an antioxidant, a light stabilizer, an ultraviolet absorber, a curing agent, a bridge.
- Add one or more additives such as bridging agents, lubricants, antistatic agents, fillers, etc., add colorants such as dyes and pigments, and use solvents, diluents, etc. Kneaded to prepare an ink composition, and then the ink composition is used. For example, gravure printing, offset printing, letterpress printing, screen printing, transfer printing, flexographic printing, etc. are used.
- a desired printed pattern having characters, figures, symbols, patterns, and the like can be printed to form a printed pattern layer.
- the ink vehicle known ones such as sesame oil, drill oil, soybean oil, hydrocarbon oil, rosin, rosin ester, rosin-modified resin, shellac, alkyd resin, phenolic resin Fatty acid, maleic acid resin, natural resin, hydrocarbon resin, polyvinyl chloride resin, polyvinyl acetate resin, polystyrene resin, polybutyl petroleum resin, acrylic or methacrylic resin , Polyamide resin, polyester resin, polyurethane resin, epoxy resin, urea resin, melamine resin, aminoalkyd resin, nitrocellulose, ethyl cellulose, salty rubber, cyclized rubber, One or more of the others can be used.
- sesame oil drill oil, soybean oil, hydrocarbon oil, rosin, rosin ester, rosin-modified resin, shellac, alkyd resin, phenolic resin Fatty acid, maleic acid resin, natural resin, hydrocarbon resin, polyvinyl chloride resin, polyvinyl acetate resin,
- the laminating adhesive layer constituting the laminated material will be described.
- the adhesive constituting the adhesive layer for laminating include, for example, polyvinyl acetate adhesives, homopolymers such as ethyl acrylate, butyl acrylate, 2-ethylhexyl ester, and methacrylic methacrylates with these. Copolymers such as methyl acrylate, acrylonitrile, styrene, etc.
- Adhesives phenolic resin adhesives, epoxy adhesives, polyurethane adhesives, reactive (meth) acrylic adhesives
- Adhesives such as rubber adhesives made of chloroprene rubber, nitrile rubber, styrene-butadiene rubber, etc., silicone adhesives, alkali metal silicates, low melting point glass, etc. can be used. .
- the above adhesive is water-based, solution-type, emulsion type, , Slip composition It can be used in any form, such as film, sheet, powder, solid, etc.Furthermore, regarding the adhesion mechanism, chemical reaction type, solvent volatilization type, hot melt type, hot pressure type, etc. It's also a form of misalignment.
- the above-mentioned adhesive is applied to the entire surface including the printing layer by, for example, a roll coating method, a gravure roll coating method, a kiss coating method, a coating method such as others, or a printing method.
- the adhesive layer for laminating can be formed by drying the solvent or the like, and the coating or coating amount is preferably about 0.1 to LOgZm 2 (dry state).
- the heat-sealable resin layer constituting the heat-sealable resin layer is not particularly limited as long as it can be melted by heat and mutually melted.
- low density polyethylene medium density polyethylene, high density polyethylene, linear (Linear) Low density polyethylene, polypropylene, ethylene-butyl acetate copolymer, ionomer resin, ethylene acrylate copolymer, ethylene acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene propylene copolymer
- Acid-modified polyolefin resins such as polymers, methylpentene polymers, polyethylene, polypropylene, etc. modified with unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic anhydride, fumaric acid, etc.
- the heat-sealable resin layer can be formed by dry-laminating the above-mentioned resin film or sheet on the surface of the laminating adhesive layer.
- the film or sheet of the above-mentioned resin can be used in a single layer or a multilayer, and the thickness of the film or sheet of the above-mentioned resin is preferably about 5 ⁇ m to 300 ⁇ m. Is about 10 m to 110 m.
- the thickness of the film or sheet of the resin is such that the film of the inorganic oxide constituting the film or sheet of the resin having the film of inorganic oxide is formed when the bag-like container body is made.
- linear low density polyethylene among the above-described film or sheet of resin. Since linear low density polyethylene has adhesiveness, it has little advantage in improving impact resistance with less propagation of breakage, and since the inner layer is always in contact with the contents, It is also effective for preventing degradation of environmental stress cracking resistance.
- other low-fat can be blended with linear low-density polyethylene.
- the heat resistance is slightly inferior in a high-temperature environment.
- seal stability to deteriorate
- tearability is improved and it contributes to easy opening.
- the linear low density polyethylene specifically, a film or sheet of an ethylene ⁇ -olefin copolymer polymerized using a metalocene catalyst can be used in the same manner.
- the ethylene ⁇ -olefin copolymer film or sheet polymerized using the above-mentioned meta-octacene catalyst include, for example, a combination of a meta-orcene complex such as a catalyst using a combination of zirconocene dichloride and methylalumoxane, and an alumoxane.
- a meta-orcene complex such as a catalyst using a combination of zirconocene dichloride and methylalumoxane
- an alumoxane alumoxane.
- the catalyst that is, a film or sheet of ethylene mono-olefin copolymer obtained by polymerization using a meta-octacene catalyst can be used.
- the meta-catacene catalyst is also called a single-site catalyst because the current catalyst is called a multi-site catalyst with heterogeneous active sites, while the active sites are uniform. is there.
- the product name “Kernel” manufactured by Mitsubishi Chemical Co., Ltd. the product name “Epoliyu” manufactured by Mitsui Petrochemical Co., Ltd.
- the film or sheet constituting the heat-sealable resin layer can be used as a single layer or multiple layers, and the thickness thereof is about 5 m to 300 m, preferably about 10 to 100 m. It is.
- a film or sheet of an ethylene ⁇ -olefin copolymer polymerized using a meta-dioxide catalyst is used as the resin film having heat sealability as described above. Has the advantage that low temperature heat sealability is possible when the bag is manufactured.
- a resin film may be sandwiched between the adhesive layer for laminating and the heat-sealable resin layer.
- the strength and puncture resistance and the like are improved.
- a resin film it has excellent mechanical, physical, chemical, etc. strength, excellent puncture resistance, etc., heat resistance, moisture resistance, pinhole resistance, transparency, etc. It is possible to use a film or sheet of a resin having excellent properties.
- polyester-based resins polyamide-based resins, polyaramid-based resins, polypropylene-based resins, polycarbonate-based resins, polyacetal-based resins, fluorine-based resins, and other tough resins.
- No oil film or sheet can be used.
- the above-described film or sheet of resin is used, and this is used, for example, by using the above-mentioned laminating adhesive or the like by a dry laminating method or the like. And the heat-sealable resin layer.
- any of an unstretched film or a stretched film stretched in a uniaxial direction or a biaxial direction can be used. Further, in the present invention, the thickness of the resin film or sheet is too thick if it can be kept to the minimum necessary for strength, puncture resistance, etc. On the other hand, if it is too thin, the strength, puncture resistance, etc. will be reduced, which is preferable.
- packaging bags are subjected to harsh physical and chemical conditions, so the laminated material constituting the packaging bags is required to have strict packaging suitability, deformation prevention strength, drop Various conditions such as impact strength, pinhole resistance, heat resistance, sealability, quality maintenance, workability, hygiene, etc. are required. Therefore, in the present invention, in addition to the above materials, other materials satisfying the above various conditions can be arbitrarily used.
- low density polyethylene low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, ethylene propylene copolymer, ethylene acetate butyl copolymer, ionomer resin, ethylene acrylate acrylate copolymer , Ethylene acrylic acid or methacrylic acid copolymer, methyl pentene polymer, polybutene resin, poly salt vinyl resin, polyvinyl acetate resin, poly salt vinyl-redene resin, Salt-Buyl—Salt-vinylidene copolymer, poly (meth) acrylic resin, polyacryl-tolyl resin, polystyrene resin, acrylonitrile-styrene copolymer (AS resin), acrylonitrile —Butadiene monostyrene copolymer (ABS resin), polyester resin, polyamide resin, polycarbonate Known resins such as saponified resin, polyvinyl alcohol-based resin, saponified ethylene a
- the film or sheet may be any of unstretched, uniaxially or biaxially stretched, and the like.
- the thickness is arbitrary, but a range force of several ⁇ m to 300 ⁇ m can be selected and used.
- the film or sheet may be any form of film such as extrusion film formation, inflation film formation, and coating film.
- an inorganic oxide vapor-deposited film is provided on one surface of the base film, and then a gas barrier coating film is provided on the inorganic oxide vapor-deposited film.
- the primer layer, the printed pattern layer, and the adhesive layer for laminating are sequentially formed using various coating methods or printing methods, or dry laminating methods, etc.
- a heat-sealable resin layer is provided on the laminating adhesive layer, and further, there is strength between the laminating adhesive layer and the heat-sealable resin layer,
- a laminated material for a packaging bag can be produced by laminating a film of a resin having excellent puncture resistance.
- a packaging bag using the above laminated material will be described.
- the bag-shaped container body consisting of wearing bags Then, using the above-mentioned laminated material having gas noorious laminated film strength, this laminated material is folded in two, and the heat-sealable resin layer faces are overlapped, and the end portions are heat-sealed.
- a package can be manufactured by forming a cylindrical package, then sealing the bottom to fill the contents, and sealing the top.
- the laminated material as described above is folded or overlapped so that the inner layer faces each other, and the peripheral edge thereof is, for example, a side seal type or a two-side seal type.
- a side seal type or a two-side seal type for example, Three-sided seal type, four-sided seal type, envelope sticker seal type, jointed seal type (pillow seal type), pleated seal type, flat bottom seal type, square bottom seal type, gusset type, etc.
- Various types of wearing bags can be manufactured by sealing.
- a self-supporting packaging bag (standing bouch) is also possible.
- the heat sealing can be performed by a known method such as a bar seal, a rotary roll seal, a belt seal, an impulse seal, a high frequency seal, an ultrasonic seal, and the like.
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 / zm is used, and this film is mounted on a feeding roll of a plasma chemical vapor deposition apparatus.
- a 200 A thick silicon oxide vapor deposition film was formed on the corona-treated surface of the terephthalate film.
- Hexamethyldisiloxane Oxygen gas: Helium 1.0: 3.0: 3.0 (unit: slm)
- composition (b) prepared in advance in an EVOH solution of composition (a) dissolved in a mixed solvent of EVOH, isopropyl alcohol, and ion-exchanged water.
- a hydrolyzed liquid consisting of ethyl silicate 40, isopropyl alcohol, acetyl acetylacetone aluminum, and ion exchange hydraulic power, and then prepare the poly (alcohol) aqueous solution, acetic acid, isopropyl alcohol and ion exchange of composition (c) prepared in advance.
- a mixed solution consisting of water was added and stirred to obtain a colorless and transparent composition for forming a barrier coating film.
- the plasma-treated surface formed in the above (1) is coated with the gas noble coating film composition prepared above by a gravure roll coating method, and after coating, a drying oven at 200 ° C is applied. By passing through the inside at a speed of 300 mZ, heat treatment is performed to form a gas-noble coating film with a thickness of 0.4 g / m 2 (dry operation state), and a gas barrier laminated film is produced. .
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 / zm is used, and this film is mounted on a feeding roll of a plasma chemical vapor deposition apparatus.
- a 200 A thick silicon oxide vapor deposition film was formed on the corona-treated surface of the terephthalate film.
- the plasma-treated surface formed in the above (1) was coated by the gravure roll coat method with the gas-nore coating film composition prepared above. After coating, it passes through a drying oven at 200 ° C at a speed of 200 mZ, and then heat treatment is performed to form a gas noble coating film with a thickness of 0.3 g / m 2 (in dry operation). 7 made of conductive laminated film.
- a biaxially stretched polyethylene terephthalate film with a thickness of 12 / zm is used and mounted on the feed roll of a plasma chemical vapor deposition apparatus. Under the conditions shown below, the corona of the biaxially stretched nylon film is used. A 200 A thick silicon oxide vapor deposition film was formed on the treated surface.
- composition (b) prepared in advance in an EVOH solution in which EVOH of composition (a) was dissolved in a mixed solvent of isopropyl alcohol and ion-exchanged water
- Ethyl silicate 40, isopropyl alcohol, acetylacetone aluminum, and a hydrolyzed liquid such as ion exchange hydraulic power are added and stirred, and the composition prepared in advance (polybulal alcohol aqueous solution, silane coupling agent, acetic acid, isopropyl alcohol)
- a liquid mixture consisting of ion exchange hydraulic power and the like was added and stirred to obtain a colorless and transparent composition for a noble coating film.
- the plasma-treated surface formed in (1) above was coated by the gravure roll coating method with the gas-novel coating film composition prepared above, and then in a 180 ° C drying furnace.
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 / zm was used, and this was mounted on a feeding roll of a plasma chemical vapor deposition apparatus, and then the above-mentioned biaxially stretched polyethylene under the conditions shown below.
- a 200 A thick silicon oxide vapor deposition film was formed on the corona-treated surface of the terephthalate film.
- composition prepared in accordance with the composition shown in Table 4 below (b) polybutyl alcohol, ethanol, and an ethyl silicate having a composition (a) prepared in advance in a mixed solution having ion exchange hydraulic power , Ethanol, hydrochloric acid, ion-exchanged water, and a hydrolytic solution composed of a silane coupling agent were added and stirred to obtain a colorless transparent coating composition for a barrier coating film.
- the gas-noreous composition prepared above is applied to the plasma-treated surface formed in (1) above by the gravure roll coating method. Coated with 200 ° C drying oven after coating By passing through the inside at a speed of 200 mZ, heat treatment was performed to form a gas barrier coating film having a thickness of 0.3 gZm 2 (in a dry operation state) to produce a gas barrier laminated film.
- a biaxially stretched polyethylene terephthalate film with a thickness of m was prepared as a base film, and this was installed in a plasma chemical vapor deposition apparatus with a three-chamber force.
- HMDS O hexamethyldisiloxane
- the mixing ratio of the source gases is set to HMDSO: 0: He
- the third film forming chamber was not used.
- the source gas was introduced into the first film-forming chamber and the second film-forming chamber, respectively. While transporting the refractory film at a line speed of 200 mZmin, electric power was applied, and on the one corona-treated surface of the biaxially stretched polyethylene terephthalate film with a thickness of 12 ⁇ m, the thickness of the first layer was 60A, the second layer A two-layered silicon oxide layer having a thickness of 70A and a total thickness of 130A was formed to form a deposited film.
- Table 5 (wt) a Ethyl Silicate 40 (Corcotone Earth) 11. 460 Isopropyl Alcohol 17. 662
- the plasma-treated surface formed in (1) above was coated by the gravure roll coating method with the gas noble coating film composition prepared above, and then in a 180 ° C drying furnace.
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 m was prepared as a substrate film, and this was mounted on a plasma chemical vapor deposition apparatus having a three-chamber force.
- HMDSO which is an organic silicon compound as a raw material
- oxygen gas and helium which was an inert gas, supplied from a gas supply device.
- the mixing ratio of the source gases is HMDSO: 0: He
- the source gas is introduced into the first film-forming chamber, the second film-forming chamber, and the third film-forming chamber, respectively. While feeding a 12 m long biaxially stretched polyethylene terephthalate film at a line speed of 300 mZmin, power was applied to the first layer on one corona-treated surface of the 12 ⁇ rn thick biaxially stretched polyethylene terephthalate film. A three-layered silicon oxide layer consisting of 40A of thickness, 45A of second layer, 45A of third layer, 45A of third layer and 130A total thickness is formed to form a plurality of deposited films Formed.
- composition prepared according to the composition shown in Table 6 below (B) A composition prepared in advance in a mixed solution consisting of polyvinyl alcohol, ethanol and ion exchange hydraulic power. A hydrolyzed solution composed of silicate, ethanol, hydrochloric acid, ion-exchanged water, and a silane coupling agent was added and stirred to obtain a colorless transparent noble coating film composition.
- the plasma-treated surface formed in the above (1) was coated by the gravure roll coating method with the above-prepared composition for a gas-nore coating film. After coating, it passes through a drying oven at 200 ° C at a speed of 200 mZ, and heat treatment is performed to form a gas noble coating film with a thickness of 0.3 g / m 2 (dry operation state). Made 7 gas barrier laminated films. [0201] Example 7
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 m was used as the base film, and plasma treatment was performed on the surface to be deposited as a pre-deposition treatment.
- the above-described biaxially stretched polyethylene terephthalate film is mounted on a feed roll of a take-up vacuum vapor deposition apparatus, which is fed out, and aluminum is applied to the plasma-treated surface of the biaxially stretched polyethylene terephthalate film.
- a vacuum deposition method using an electron beam (EB) heating system while supplying oxygen gas a 200A thick evaporated aluminum oxide film was formed under the following deposition conditions.
- Electron beam power 25kW
- Deposition surface Corona-treated surface
- a plasma-treated surface was formed in which the surface tension of the deposited film surface of aluminum was improved to 54dyneZcm or more.
- the plasma-treated surface formed in the above (1) was coated by the gravure roll coating method with the above-prepared composition for gas-nore coating film.
- heat treatment is performed by passing through a drying oven at 200 ° C at a speed of 300 mZ to form a gas noble coating film with a thickness of 0.4 g / m 2 (dry operation state). Made 7 gas barrier laminated films.
- Example 8 A biaxially stretched polyethylene terephthalate film having a thickness of 12 ⁇ m was used as a base film, and a plasma treatment was performed on the surface to be deposited as a pre-deposition treatment. Next, the above-mentioned biaxially stretched polyethylene terephthalate film is mounted on a feed roll of a take-up type vacuum vapor deposition apparatus, which is fed out, and aluminum is used as a deposition agent on the plasma treated surface of the biaxially stretched polyethylene terephthalate film. Then, an oxygen-aluminum oxide film having a thickness of 200 A was formed under the same deposition conditions as in Example 7 by vacuum deposition using an electron beam (EB) heating method while supplying oxygen gas.
- EB electron beam
- Example 2 a plasma treated surface was formed in which the surface tension of the evaporated aluminum oxide film surface was increased to 54 dyne Zcm or more.
- the plasma-treated surface formed in the above (1) was coated by the gravure roll coating method with the above-prepared composition for gas-nore coating film.
- heat treatment is performed by passing through a drying oven at 200 ° C at a speed of 300 mZ to form a gas noble coating film with a thickness of 0.4 g / m 2 (dry operation state). Made 7 gas barrier laminated films.
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 m was used as the base film, and the surface subjected to vapor deposition was subjected to corona treatment as a pretreatment.
- the above-mentioned biaxially stretched polyethylene terephthalate film is mounted on a take-up roll of a take-up vacuum deposition apparatus, and this is fed out, and aluminum is used as a deposition source on the corona treatment surface of the biaxially stretched polyethylene terephthalate film.
- an oxygen-aluminum oxide film having a thickness of 2 OOA was formed under the same deposition conditions as in Example 8 by vacuum deposition using an electron beam (EB) heating method while supplying oxygen gas.
- EB electron beam
- Example 7 a plasma-treated surface was formed in which the surface tension of the evaporated film surface of aluminum oxide was improved to 54 dyne Zcm or more.
- a colorless and transparent barrier coating composition was obtained in the same manner as in Example 3.
- the plasma-treated surface formed in the above (1) was coated by the gravure roll coating method with the above-prepared composition for gas-nore coating film. After coating, it passes through a drying oven at 200 ° C at a speed of 200 mZ, and heat treatment is performed to form a gas noble coating film with a thickness of 0.3 g / m 2 (dry operation state). Made of gas barrier laminate film.
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 ⁇ m was used as a substrate film, and a primer coat layer was provided on the surface to be deposited.
- the above-mentioned biaxially stretched polyethylene terephthalate film is mounted on a feed roll of a take-up type vacuum vapor deposition apparatus, which is fed out, and aluminum is deposited on the primer layer surface of the biaxially stretched polyethylene terephthalate film.
- an oxygen-aluminum oxide film having a thickness of 200 A was formed under the same deposition conditions as in Example 7 by vacuum deposition using an electron beam (EB) heating method while supplying oxygen gas. .
- EB electron beam
- Example 7 a plasma-treated surface was formed in which the surface tension of the evaporated film surface of aluminum oxide was improved to 54 dyne Zcm or more.
- a biaxially stretched polyethylene terephthalate film having a thickness of 12 m was used as a base film, and a primer coat layer was provided on the surface to be deposited.
- the above-mentioned biaxially stretched polyethylene terephthalate film is mounted on a feed roll of a take-up type vacuum vapor deposition apparatus, which is fed out, and aluminum is deposited on the primer layer surface of the biaxially stretched polyethylene terephthalate film.
- an oxygen-aluminum oxide film having a thickness of 200 A was formed under the same deposition conditions as in Example 7 by vacuum deposition using an electron beam (EB) heating method while supplying oxygen gas. .
- EB electron beam
- Example 7 a plasma-treated surface was formed in which the surface tension of the evaporated film surface of aluminum oxide was improved to 54 dyne Zcm or more.
- a biaxially stretched nylon 6 film with a thickness of 15 m was used as the film, and a plasma treatment was performed as a pretreatment.
- the above biaxially stretched nylon 6 film is mounted on a take-up roll of a take-up vacuum deposition apparatus, which is fed out, and aluminum is used as a deposition source on the plasma-treated surface of the biaxially stretched nylon 6 film.
- a 200A thick evaporated aluminum oxide film was formed under the same deposition conditions as in Example 7 by vacuum deposition using an electron beam (E8) heating method.
- the gas barrier laminate films produced in Examples 1 to 12 were measured for oxygen permeability and water vapor permeability.
- the oxygen permeability was measured with a measuring instrument (model name, OXTRAN) manufactured by MOCON, USA under the conditions of a temperature of 23 ° C. and a humidity of 90% RH.
- the water vapor transmission rate was measured with a measuring instrument (model name, PERMATRAN) manufactured by MOC ON, USA under conditions of a temperature of 40 ° C. and a humidity of 90% RH.
Abstract
Description
Claims
Priority Applications (3)
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CN2005800353905A CN101039801B (zh) | 2004-08-17 | 2005-08-15 | 气体阻隔性叠层薄膜及其制造方法 |
EP20050780234 EP1787796B1 (en) | 2004-08-17 | 2005-08-15 | Gas barrier multilayer film and method for producing same |
KR1020077006009A KR101392300B1 (ko) | 2004-08-17 | 2007-03-15 | 가스 배리어성 적층 필름 및 그 제조 방법 |
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JP2004236996A JP2006056007A (ja) | 2004-08-17 | 2004-08-17 | ガスバリア性積層フィルムおよびそれを使用した積層材 |
JP2004-237598 | 2004-08-17 | ||
JP2004237598A JP2006056036A (ja) | 2004-08-17 | 2004-08-17 | ガスバリア性積層フィルムおよびそれを使用した積層材 |
JP2004-236996 | 2004-08-17 | ||
JP2004333220 | 2004-11-17 | ||
JP2004-333220 | 2004-11-17 | ||
JP2005039758A JP4549880B2 (ja) | 2004-11-17 | 2005-02-16 | 透明ガスバリア性積層体 |
JP2005-039758 | 2005-02-16 |
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US (1) | US7811669B2 (ja) |
EP (1) | EP1787796B1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007216504A (ja) * | 2006-02-16 | 2007-08-30 | Dainippon Printing Co Ltd | ガスバリア性積層フィルムおよびその製造方法 |
JP2008179104A (ja) * | 2007-01-26 | 2008-08-07 | Dainippon Printing Co Ltd | バリア性フィルム |
JP2008264998A (ja) * | 2007-04-16 | 2008-11-06 | Dainippon Printing Co Ltd | ガスバリア性積層フィルム、その製造方法、それを使用した包装用積層材、および包装袋 |
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EP3939782A4 (en) * | 2019-03-13 | 2022-12-07 | Sumitomo Chemical Company Limited | GAS BARRIER LAMINATE |
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KR101392300B1 (ko) | 2014-05-07 |
US20070269664A1 (en) | 2007-11-22 |
US7811669B2 (en) | 2010-10-12 |
KR20070051332A (ko) | 2007-05-17 |
EP1787796B1 (en) | 2013-02-13 |
EP1787796A1 (en) | 2007-05-23 |
EP1787796A4 (en) | 2010-06-02 |
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