WO2006013211A1 - A semiconductor switch arrangement and an electronic device - Google Patents
A semiconductor switch arrangement and an electronic device Download PDFInfo
- Publication number
- WO2006013211A1 WO2006013211A1 PCT/EP2005/053819 EP2005053819W WO2006013211A1 WO 2006013211 A1 WO2006013211 A1 WO 2006013211A1 EP 2005053819 W EP2005053819 W EP 2005053819W WO 2006013211 A1 WO2006013211 A1 WO 2006013211A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor switch
- bipolar transistor
- node
- switch arrangement
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0822—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in field-effect transistor switches
Definitions
- N- buried layer 501 Such an arrangement enables the inventive concept to be used in an isolated LDMOS implementation if the EPI layer is N doped or none isolated LDMOS if the EPI layer is P doped.
- Located above the integrated circuit body is a plurality of gate regions 505 isolated from the integrated circuit body via insulation regions 506.
- the voltage across the MOSFET device 301 reaches the breakdown voltage Al of the bipolar transistor 302.
- current will flow from the load side of the MOSFET device 301 through the bipolar transistor 302 to the gate 305 of the MOSFET device 301 causing the voltage applied to the gate 305 of the MOSFET device 301 to increase, as shown in the fourth waveform 803.
- the bipolar transistor 412 described FIG. 4 clamps the voltage between the gate and source terminals between time T3 and T4
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Electronic Switches (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007524346A JP2008509548A (ja) | 2004-08-03 | 2005-08-03 | 半導体スイッチ装置と電子素子 |
| US11/573,078 US7916439B2 (en) | 2004-08-03 | 2005-08-03 | Semiconductor switch arrangement and an electronic device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04103726A EP1624570A1 (en) | 2004-08-03 | 2004-08-03 | A semiconductor switch arrangement |
| EP04103726.8 | 2004-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006013211A1 true WO2006013211A1 (en) | 2006-02-09 |
Family
ID=34929408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2005/053819 Ceased WO2006013211A1 (en) | 2004-08-03 | 2005-08-03 | A semiconductor switch arrangement and an electronic device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7916439B2 (enExample) |
| EP (1) | EP1624570A1 (enExample) |
| JP (1) | JP2008509548A (enExample) |
| KR (1) | KR20070056053A (enExample) |
| CN (1) | CN101019319A (enExample) |
| WO (1) | WO2006013211A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011126609A3 (en) * | 2010-03-30 | 2011-11-24 | Freescale Semiconductor, Inc. | Semiconductor device and method |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006047243A1 (de) * | 2006-05-15 | 2007-11-22 | Infineon Technologies Ag | Bordnetz mit mindestens einem Leistungstransistor und Verfahren zum Schutz eines Bordnetzes |
| US7994747B2 (en) * | 2007-07-13 | 2011-08-09 | Seagate Technology Llc | Suppressing phased motor voltage transients on disconnect |
| US7911750B2 (en) | 2008-02-27 | 2011-03-22 | Freescale Semiconductor, Inc. | Resistor triggered electrostatic discharge protection |
| WO2009128942A1 (en) * | 2008-04-16 | 2009-10-22 | Bourns, Inc. | Current limiting surge protection device |
| WO2009153627A1 (en) * | 2008-06-20 | 2009-12-23 | Freescale Semiconductor, Inc. | Semiconductor device and method of electrostatic discharge protection therefor |
| US8334575B2 (en) | 2008-10-03 | 2012-12-18 | Freescale Semiconductor, Inc. | Semiconductor device and electronic device |
| JP5595751B2 (ja) * | 2009-03-11 | 2014-09-24 | ルネサスエレクトロニクス株式会社 | Esd保護素子 |
| EP2614365B1 (en) * | 2010-09-09 | 2019-02-20 | Koninklijke Philips N.V. | A method and a device for attracting magnetic particles to a surface |
| US8354879B2 (en) | 2011-01-11 | 2013-01-15 | Freescale Semiconductor, Inc. | Power switch for decreased ramp rate |
| KR101710599B1 (ko) * | 2011-01-12 | 2017-02-27 | 삼성전자 주식회사 | 반도체 장치 및 그 제조 방법 |
| WO2014041388A1 (en) * | 2012-09-12 | 2014-03-20 | Freescale Semiconductor, Inc. | A semiconductor device and an integrated circuit comprising an esd protection device, esd protection devices and a method of manufacturing the semiconductor device |
| KR101926607B1 (ko) * | 2012-09-28 | 2018-12-07 | 삼성전자 주식회사 | 클램핑 회로, 이를 포함하는 반도체 장치 및 반도체 장치의 클램핑 방법 |
| JP6052068B2 (ja) * | 2013-06-07 | 2016-12-27 | 株式会社デンソー | 半導体装置の保護回路 |
| CN105097795B (zh) * | 2014-05-04 | 2018-03-16 | 无锡华润上华科技有限公司 | 具esd保护结构的半导体器件 |
| US9893724B2 (en) * | 2015-07-31 | 2018-02-13 | Texas Instruments Incorporated | Isolated output switching circuit |
| CN107393923B (zh) * | 2017-06-27 | 2020-06-23 | 苏州美天网络科技有限公司 | 开关性能稳定的功率器件 |
| CN107369683B (zh) * | 2017-06-27 | 2020-06-23 | 苏州美天网络科技有限公司 | 抗电磁干扰的功率器件 |
| CN107256865B (zh) * | 2017-06-27 | 2020-06-19 | 苏州美天网络科技有限公司 | 低损耗半导体功率器件 |
| DE102019210566B4 (de) * | 2019-07-17 | 2022-03-17 | Conti Temic Microelectronic Gmbh | Vorrichtung und Verfahren zum Messen eines durch eine PWM-angesteuerte induktive Last fließenden Stromes |
| CN113035937A (zh) * | 2021-03-12 | 2021-06-25 | 电子科技大学 | 一种高侧功率管的esd保护结构 |
| CN113658949B (zh) * | 2021-08-12 | 2022-06-14 | 深圳市芯电元科技有限公司 | 一种改善关断特性的mosfet芯片制造工艺 |
| CN114172498A (zh) * | 2021-11-11 | 2022-03-11 | 深圳先进技术研究院 | 开关电路、集成电路和电子设备 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5812006A (en) * | 1996-10-29 | 1998-09-22 | Texas Instruments Incorporated | Optimized power output clamping structure |
| DE19922924A1 (de) * | 1999-05-19 | 2000-11-30 | Siemens Ag | Überspannungsschutzvorrichtung für einen Halbleiterschalter |
| US6614633B1 (en) * | 1999-03-19 | 2003-09-02 | Denso Corporation | Semiconductor device including a surge protecting circuit |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3064457B2 (ja) * | 1991-03-08 | 2000-07-12 | 関西日本電気株式会社 | スイッチ回路およびゲート電圧クランプ型半導体装置 |
| JPH05235346A (ja) * | 1992-02-20 | 1993-09-10 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| DE19719919A1 (de) * | 1997-05-13 | 1998-11-26 | Daimler Benz Ag | Anordnung zum Schutz von elektrischen Einrichtungen |
| US6172383B1 (en) * | 1997-12-31 | 2001-01-09 | Siliconix Incorporated | Power MOSFET having voltage-clamped gate |
| US6049119A (en) * | 1998-05-01 | 2000-04-11 | Motorola, Inc. | Protection circuit for a semiconductor device |
| JP4501178B2 (ja) * | 1999-07-26 | 2010-07-14 | 株式会社デンソー | 半導体装置のための保護装置 |
| US6365932B1 (en) * | 1999-08-20 | 2002-04-02 | Denso Corporation | Power MOS transistor |
| JP2001196583A (ja) * | 1999-10-29 | 2001-07-19 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
| JP2004055999A (ja) * | 2002-07-23 | 2004-02-19 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| JP4590888B2 (ja) * | 2004-03-15 | 2010-12-01 | 株式会社デンソー | 半導体出力回路 |
| US7626243B2 (en) * | 2006-08-04 | 2009-12-01 | Advanced Analogic Technologies, Inc. | ESD protection for bipolar-CMOS-DMOS integrated circuit devices |
-
2004
- 2004-08-03 EP EP04103726A patent/EP1624570A1/en not_active Ceased
-
2005
- 2005-08-03 WO PCT/EP2005/053819 patent/WO2006013211A1/en not_active Ceased
- 2005-08-03 CN CNA200580026543XA patent/CN101019319A/zh active Pending
- 2005-08-03 US US11/573,078 patent/US7916439B2/en not_active Expired - Fee Related
- 2005-08-03 JP JP2007524346A patent/JP2008509548A/ja active Pending
- 2005-08-03 KR KR1020077002777A patent/KR20070056053A/ko not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5812006A (en) * | 1996-10-29 | 1998-09-22 | Texas Instruments Incorporated | Optimized power output clamping structure |
| US6614633B1 (en) * | 1999-03-19 | 2003-09-02 | Denso Corporation | Semiconductor device including a surge protecting circuit |
| DE19922924A1 (de) * | 1999-05-19 | 2000-11-30 | Siemens Ag | Überspannungsschutzvorrichtung für einen Halbleiterschalter |
Non-Patent Citations (1)
| Title |
|---|
| BERTRAND G ET AL: "ANALYSIS AND COMPACT MODELING OF A VERTICAL GROUNDED-BASE N-P-N BIPOLAR TRANSISTOR USED AS ESD PROTECTION IN A SMART POWER TECHNOLOGY", IEEE JOURNAL OF SOLID-STATE CIRCUITS, IEEE INC. NEW YORK, US, vol. 36, no. 9, September 2001 (2001-09-01), pages 1373 - 1381, XP001168170, ISSN: 0018-9200 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011126609A3 (en) * | 2010-03-30 | 2011-11-24 | Freescale Semiconductor, Inc. | Semiconductor device and method |
| US8344472B2 (en) | 2010-03-30 | 2013-01-01 | Freescale Semiconductor, Inc. | Semiconductor device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008509548A (ja) | 2008-03-27 |
| KR20070056053A (ko) | 2007-05-31 |
| US7916439B2 (en) | 2011-03-29 |
| CN101019319A (zh) | 2007-08-15 |
| EP1624570A1 (en) | 2006-02-08 |
| US20080246345A1 (en) | 2008-10-09 |
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