WO2005124467A1 - 電子ビーム描画装置 - Google Patents
電子ビーム描画装置 Download PDFInfo
- Publication number
- WO2005124467A1 WO2005124467A1 PCT/JP2005/011346 JP2005011346W WO2005124467A1 WO 2005124467 A1 WO2005124467 A1 WO 2005124467A1 JP 2005011346 W JP2005011346 W JP 2005011346W WO 2005124467 A1 WO2005124467 A1 WO 2005124467A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electron beam
- sample
- turntable
- sample stage
- adjustment
- Prior art date
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/261—Preparing a master, e.g. exposing photoresist, electroforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20214—Rotation
Definitions
- the present invention relates to an electron beam writing apparatus.
- the recording resolution is limited by the spot diameter of the recording laser light. Therefore, in order to increase the density of the above-mentioned disks, the disk diameter is smaller than that of laser light in the visible or ultraviolet region, and the disk is manufactured by a disk master manufacturing system using an electron beam that can improve the recording resolution. Production of masters, that is, cutting, is being considered.
- a strong master disk is manufactured by applying an electron beam resist to a substrate and then irradiating the substrate with an electron beam in a vacuum atmosphere.
- a latent image of a fine pattern is formed on an electron beam resist by electron beam irradiation (electron beam exposure).
- Such a substrate is subjected to a development process, a patterning process, and a resist removal process, so that a fine uneven pattern is formed on the substrate.
- Patent Documents 1 and 2 describe examples of a master disk manufacturing apparatus using an electron beam.
- the disk substrate coated with the electron beam resist is irradiated with an electron beam while being rotated on a rotating stage, so that concentric or radial microscopic portions are formed on the disk substrate.
- Non-Patent Document 1 describes a method of performing focus adjustment so that the resolution of an electron microscope image of an adjustment sample is optimized.
- Non-Patent Document 2 describes a method of adjusting the position of an electron beam by attaching a grating to the center of the turntable and rotating the turntable as a method of adjusting the center of rotation.
- Non-Patent Document 1 it is necessary to move the adjustment sample to the irradiation range of the electron beam at the time of adjustment. There is a problem that the moving distance needs to be long and the size of the whole drawing apparatus increases.
- the stage on which the adjustment sample is placed usually has such a function of applying the deceleration voltage. Not been. Therefore, the focal height of the electron beam differs between the potential of the substrate surface to which the deceleration voltage is applied and the adjustment sample which is at the ground potential because no deceleration voltage is applied.
- Patent Document 1 JP-A-2002-367241
- Patent Document 2 JP 2003-36572 A
- Non-Patent Document 1 JPN.J. Appl.Phys.Vol. 40, ppl653-1660, October 30, 2000, ⁇ High-Density Recording Using an Electron Beam Recorder, by Yasumitu Wada, Masahiro Katsumura, Yoshiaki Kojima, Hiroaki Kitahara and Tetsuya Iida
- Non-Patent Document 2 Applied Optics, VoL33, No.10, pp.2032, April 1, 1994, ⁇ Eletron-beam writing system and its application to large and high-density diffractive optic elements, Shiro Ogata, Masami Tada and Masahiro Yoneda
- An object of the present invention is to provide an electron beam writing apparatus capable of easily performing beam adjustment and rotation center adjustment without increasing the size of the apparatus.
- an electron beam writing apparatus includes: an electron beam emission unit that emits an electron beam; a rotation stage that rotatably supports a turntable that holds an object to be written; A sample table that is supported by the turntable within a range including the rotation center of the turntable and that holds an adjustment sample.
- the above-described electron beam writing apparatus irradiates an electron beam emitted from an electron beam emitting unit to an object to be written. Since the object to be drawn is held by the turntable supported by the rotary stage, the object to be drawn is irradiated with an electron beam while the turntable is rotating, so that the object to be drawn is rotated concentrically or radially.
- the ability to draw symmetrical patterns can be achieved.
- the object to be drawn includes, for example, a substrate for a master of an optical disk, but is not limited to this.
- Beam adjustment refers to, for example, focus adjustment of a spot of an electron beam formed on a drawing target.
- Rotation center adjustment refers to specifying the rotation center of the turntable and aligning the drawing origin with the electronic beam with the rotation center of the turntable in order to correctly form a concentric or radial fine pattern on the disk substrate. That means.
- the beam adjustment and the rotation center adjustment are performed by irradiating the adjustment sample with an electron beam, but in the above-mentioned electron beam lithography system, the adjustment sample is held by the sample stage, and the sample stage is the rotation center of the turntable. Is supported by the turntable within the range including. Yotsu Beam adjustment and rotation center adjustment using the adjustment sample supported on the turntable, eliminating the need for a separate stage on which to mount the adjustment sample. It becomes.
- One embodiment of the above-described electron beam writing apparatus includes a sample stage support mechanism that supports the sample stage so as to be movable in a direction perpendicular to an object holding surface of the turntable.
- the sample stage holding the sample for adjustment can be moved in the direction perpendicular to the surface of the turntable. It can be evacuated to a position where it does not get in the way.
- the sample stage support mechanism enables the sample stage to move below the object holding surface of the turntable.
- the sample stage is retracted below the turntable, so that the arrangement of the drawing object on the turntable is not obstructed.
- the turntable has a recess formed in the object holding surface near the rotation center, and the sample stage support mechanism is provided in the recess. And a lifting mechanism for raising and lowering the sample stage.
- the concave portion is formed in the turntable, and the sample stage can be retracted into the concave portion when not needed by the sample stage supporting mechanism.
- the sample stage has conductivity, and the sample stage supporting mechanism operates when the object to be written is held on the turntable.
- the apparatus further includes voltage applying means for supporting the stage in contact with the object and applying a voltage to the sample stage.
- the sample stage holding the adjustment sample can also function as an electrode for applying a voltage to the object to be written. Therefore, for example, an electron beam deceleration voltage or the like can be applied to the object to be written through the sample stage. This eliminates the necessity of providing a voltage application electrode separately from the sample stage, and enables simplification of the device configuration and cost reduction.
- the sample stage support mechanism includes A table is urged against the object. Since the sample table also functions as an electrode for applying a voltage, the contact can be reliably maintained by appropriately biasing the sample table against the object to be drawn. Since the sample stage is fixed to the turntable and rotates, it is particularly effective for securing electrical connection during rotation.
- the adjustment sample is a conductive one which is smooth enough to reflect light and has a fine structure on the surface.
- the height of the sample can be detected using an optical substrate height measuring device, and accurate beam adjustment can be performed.
- FIG. 1 is a block diagram showing a basic configuration of a disc master manufacturing apparatus which is an embodiment of an electron beam writing apparatus according to the present invention.
- FIG. 2 is a cross-sectional view of a turntable according to a first embodiment and a second embodiment.
- FIG. 3 shows an example of a beam adjustment sample.
- FIG. 4 is a flowchart of an adjustment process according to the first embodiment.
- FIG. 5 is a sectional view of a turntable part according to a third embodiment.
- FIG. 6 is a flowchart of an adjustment process according to a third embodiment.
- FIG. 1 is a block diagram showing a configuration of a disc master manufacturing apparatus 10 which is an embodiment of an electron beam drawing apparatus according to the present invention.
- An electron beam is used in a vacuum atmosphere because it has the characteristic of being significantly attenuated in the atmosphere. Therefore, an electron gun, a turntable on which a substrate for producing an optical disk master is mounted, and the like are placed in a vacuum atmosphere.
- a silicon (Si) substrate is used for manufacturing an optical disc master.
- the silicon substrate is coated with an electron beam resist on its main surface.
- the substrate coated with the electron beam resist is rotated in the master disc manufacturing apparatus 10 and irradiated with an electron beam modulated by an information data signal, thereby forming a latent image of a fine uneven pattern such as pits and groups in a spiral. It is formed into a shape.
- the substrate is taken out of the disk master manufacturing apparatus 10 and subjected to a development process.
- a patterning process and a resist removal process are performed to form a fine concavo-convex pattern on the substrate.
- a conductive film is formed on the main surface of the substrate on which the pattern is formed, and is subjected to an electrodeposition process to manufacture an optical disk master (stamper).
- a disk master manufacturing apparatus 10 includes a vacuum chamber 11, a driving device for driving a disk substrate disposed in the vacuum chamber 11, and an electron beam attached to the vacuum chamber 11.
- An electron beam emission head 40 including an optical system is provided.
- An optical disk substrate 15 for an optical disk master (hereinafter, simply referred to as a “disk substrate”) is mounted on a turntable 16.
- the turntable 16 is driven to rotate about a vertical axis of the main surface of the disk substrate as a rotation axis by an air spindle motor 17 which is a rotary driving device for driving the disk substrate 15 to rotate.
- the air spindle motor 17 is housed in a translation stage 18.
- the translation stage 18 is coupled to a feed motor 19 which is a translation drive, and connects the air spindle motor 17 and the turntable 16 to the main surface of the disk substrate 15. Translate in a predetermined direction (X direction in the figure) in a parallel plane.
- the turntable 16 is made of a dielectric material, for example, a ceramic material, and the disk substrate 15 is held on the turntable 16 by an electrostatic chuck mechanism (not shown).
- the vacuum chamber 11 is provided with a light source 22 and a photodetector 23 for detecting the height of the main surface of the disk substrate 15, and the output of the photodetector 23 is supplied to the height detection unit 24.
- the light detector 23 includes, for example, a position sensor and a charge coupled device (CCD), receives a light beam emitted from the light source 22 and reflected on the surface of the disk substrate 15, and detects the height of the received signal. Supply to part 24.
- the height detector 24 detects the height of the main surface of the disk substrate 15 based on the received light signal.
- the vacuum chamber 11 is installed via a vibration isolator (not shown) such as an air damper, and transmission of external vibrations is suppressed. Further, a vacuum pump 28 is connected to the vacuum chamber 11, and the inside of the chamber is evacuated to maintain the inside of the chamber in a vacuum atmosphere at a predetermined pressure. Further, a drive control unit 30 for controlling the air spindle motor 17 and the feed motor 19 is provided. The drive control unit 30 operates under the control of the CPU 25 that controls the entire disc master manufacturing apparatus 10.
- a vibration isolator such as an air damper
- An electron beam emitting head 40 for emitting an electron beam includes an electron gun 41, a focusing lens 42, a blanking electrode 43, an aperture 44, a beam deflection electrode 45, a focus adjustment lens 46, and an objective lens 47. Are arranged in the electron beam ejection head 40 in this order.
- the electron beam emission head 40 is mounted on the ceiling surface of the vacuum chamber 11 with the electron beam emission port 49 provided at the tip of the electron gun barrel 48 facing the space inside the vacuum chamber 11. Further, the electron beam emission port 49 is disposed opposite to a position close to the main surface of the disk substrate 15 on the turntable 16.
- the electron gun 41 emits an electron beam accelerated to, for example, several OKeV by a cathode (not shown) to which a high voltage supplied from the electron gun power supply 51 is applied.
- the converging lens 42 converges the emitted electron beam and guides it to an aperture 44.
- the blanking drive unit 54 operates based on a signal from the recording control unit 52, controls the blanking electrode 43, and performs on / off control of the electron beam. That is, the blanking driving section 54 applies a voltage between the blanking electrodes 43 to largely deflect the passing electron beam. Large electron beam When the electron beam is deflected, the electron beam does not converge on the aperture of the aperture 44, does not pass through the aperture 44, and the electron beam ejection head 40 is turned off.
- the beam deflection drive unit 55 applies a voltage to the beam deflection electrode 45 to deflect the electron beam passing therethrough.
- the focus lens driving unit 56 adjusts the focus of the electron beam spot applied to the main surface of the disk substrate 15 based on the detection signal from the height detection unit 24.
- the blanking drive unit 54, the beam deflection drive unit 55, and the focus lens drive unit 56 function as a beam adjustment unit 57 and are controlled by the CPU 25.
- a deceleration voltage (1 V) which is a negative voltage large enough to decelerate the electron beam, is applied to the disk substrate 15.
- a voltage source 60 is provided for applying the deceleration voltage and the electrostatic chuck voltage for holding the disk substrate 15 on the turntable 16.
- the master disc manufacturing apparatus 10 having the above-described basic configuration, it is necessary to adjust the electron beam prior to actually manufacturing the master disc by irradiating the disc substrate 15 with an electron beam.
- the optical system such as the objective lens 47 in the electron beam ejection head 40 is adjusted to adjust the focus of the electron beam spot formed on the disk substrate 15 (hereinafter, this is referred to as “beam adjustment”). .)I do.
- the rotation center of the turntable 16 is specified, and the drawing origin by the electron beam is matched with the rotation center of the turntable 16, that is, the polar coordinate origin. (Hereinafter, this is referred to as “rotation center adjustment”).
- FIG. 2A is a cross-sectional view of the turntable 16 according to the first embodiment. Indicates a state where is not placed.
- a recess 50 is formed in the center of the turntable 16.
- a sample stage 72 holding a beam adjustment sample 71 (hereinafter, also simply referred to as “sample 71”) is accommodated in the concave portion 50 while being supported by a sample stage support mechanism 73.
- the sample stage support mechanism 73 is configured as an elevating mechanism that moves the sample stage 72 in the vertical direction in the figure.
- the sample table support mechanism 73 is fixed to the turntable 16, the sample table 72 rotates as the turn table 16 rotates. Further, the sample table 72 has a concave portion on the side where the disk substrate 15 is mounted, and the sample 71 is fixed in the concave portion. Here, the sample 71 is fixed within a range including the rotation center of the turntable 16.
- the sample 71 be one that can be applied to both the above-described beam adjustment and rotation center adjustment.
- metal particles such as Au or latex spheres are randomly dispersed on the surface of a material having a flat surface to reflect light, and conductive treatment is performed, or a flat surface to reflect light is used.
- a material having a surface a material obtained by conducting a conductive treatment by patterning a fine dot array pattern or a mesh line pattern as shown in FIG. In this way, if the sample 71 is made of a pattern that is smooth and conductive enough to reflect light, it can be used for both beam adjustment and rotation center adjustment, so separate samples are prepared for each adjustment application. You don't have to.
- the beam adjustment and the rotation center adjustment are performed before placing the disk substrate 15 on the turntable 16. That is, as shown in FIG. 2A, at the time of adjustment, the sample stage 72 is raised by the sample stage support mechanism 73 so that the sample 71 is located slightly above the upper surface of the turntable 16.
- the position of the sample stage 72 is such that the sample surface of the sample 71 substantially coincides with the upper surface position of the disk substrate 15 when the disk substrate 15 is placed on the turntable 16. That is, the height of the sample surface of the sample 71 from the turntable 16 is the same as the height of the disk substrate, and the error between the height of the sample surface from the turntable and the thickness of the disk substrate is within the focal depth of the electron beam. It is preferable to set.
- FIG. 2B is a cross-sectional view of the turntable 16 when the disk substrate 15 is mounted.
- the sample table 72 is recessed to a position where the mounting of the disk substrate 15 is not impeded by the sample table support mechanism 73, that is, a position below the upper surface of the turntable 16. Descend within.
- FIG. 4 shows a flowchart of the adjustment processing in the first embodiment.
- the sample 71 has a dot pattern illustrated in FIG. 3A.
- step S1 First, as shown in FIG. 2 (a), by adjusting the sample stage support mechanism 73, the sample surface force of the sample 71 is raised from the upper surface of the turntable 16 by almost the thickness of the disk substrate 15. Raise the sample table 72 until it is no more (step S1).
- SEM image a scanning electron microscope image obtained from the information of secondary electrons or reflected electrons. Display and observe the sample surface.
- the SEM image of the sample surface is a dot pattern image as shown in Fig. 3 (a), but if the focus of the electron beam is not located on the sample surface, the shape of one dot of the dot pattern Are blurred or have a large elliptical shape due to astigmatism.
- the shape of one dot in the dot pattern is circular and its area is minimized. Therefore, the SEM image of the sample surface is observed, and the optical system in the electron beam ejection head 40, such as the objective lens 47, the focus adjustment lens 46, and the astigmatism corrector, is adjusted to obtain the best resolution (step). S2).
- rotation center adjustment is performed. That is, the drawing origin of the electron beam is made to coincide with the rotation center of the turntable 16. Specifically, while rotating the turntable 16, an electron beam is irradiated on the sample surface to perform a run, and an SEM image is displayed and observed. In this example, since a dot pattern as shown in FIG. 3A is used as the sample 71, a concentric SEM image as shown in FIG. 3B is observed when the turntable 16 rotates. The center of this concentric circle The position of the stage 18, the deflection amount of the electron beam, and the like are adjusted so that is positioned at the center of the image field of the electron microscope. At this time, since the stage 18 can be moved only in the X direction in FIG.
- the alignment in the X direction is mainly performed by moving the stage 18, and the position in the Y direction (that is, a method perpendicular to the moving direction of the stage 18).
- the alignment is performed by controlling the amount of deflection of the electron beam by the electron beam emission head 40, or by moving the electron beam emission head 40.
- a low-magnification SEM image is displayed at first, and the position of the stage 18 is controlled so that the electron beam comes to the center position of the concentric image.
- the residual error component at the rotation center position of the turntable 16 is corrected.
- the above operation is repeated while enlarging the SEM image to match the drawing origin of the electron beam with the rotation center of the turntable 16 (step S3).
- the sample stage 72 is lowered to a position where it does not hinder the mounting of the disk substrate 15 on the turntable 16 ( Step S4).
- the disk substrate 15 coated with the photoresist is placed on the turntable 16 so that the center of rotation preferably coincides with the center of the disk substrate 15 (step S5). After that, exposure by electron beam drawing is performed, and a master disc is manufactured.
- the sample stage can be lowered into the turntable 16 to a position where the mounting of the disk substrate 15 is not hindered when the substrate is mounted.
- the dedicated stage held is not required, and the device can be downsized.
- the center of rotation can be adjusted at any time as a function of the device, and it is possible to perform high-precision drawing without deviation from the origin. Become.
- the first embodiment is directed to a disk substrate 15 having no center hole.
- the second embodiment is applied when the disk substrate on which the electron beam is to be drawn has a center hole, and is different from the first embodiment in the structure of the turntable. Note that, except for the structure of the turntable, in the second embodiment, Since the entire configuration of the disk master manufacturing apparatus 10 is the same as that of the first embodiment, a duplicate description will not be given.
- FIG. 2C shows a cross-sectional view of the turntable 16a according to the second embodiment.
- the disc substrate 15a has a center hole, and a center boss 78 that engages with the center hole of the disc substrate 15a is provided on the upper surface of the turntable 16a. Therefore, the center boss 78 is also used as a sample table, and the sample 71 is arranged on the center boss 78. That is, the center boss 78 with which the disk substrate 15a having the center hole is engaged is used together with the sample stage on which the sample 71 is placed.
- the center boss 78 has a concave portion, and the sample 71 is placed in the concave portion. At this time, the sample 71 is placed in the recess of the center boss 78 such that the height of the sample surface of the sample 71 from the upper surface of the turntable 16a is the same as the thickness of the disk substrate 16a.
- the beam adjustment and the rotation center adjustment are performed in the same manner as in the first embodiment by observing the sample 71 by SEM.
- the disk substrate 15a can be held on the turntable 16a with the center hole of the disk substrate 15a engaged with the center boss 78, it is not necessary to lower the center boss 78, which also functions as a sample stage. ,. In other words, beam adjustment and rotation center adjustment are possible even after the disk substrate 15a is mounted on the turntable 16a.
- FIG. 5A is a cross-sectional view of the turntable 16 according to the third embodiment, and uses the sample stage 72 as an electrode for applied voltage.
- the sample stage 72 is made of a conductive material, for example, a metal material, and a voltage source 60 applies an electron beam deceleration voltage.
- the upper end 72a of the sample table 72 contacts the lower surface of the disk substrate 15, as shown in FIG. Electronic web provided by Apply a deceleration voltage to the disk substrate 15.
- the sample stage support mechanism 73 supports the sample stage 72 at a position where the upper end 72a of the sample stage 72 contacts the lower surface of the disk substrate 15 with an appropriate pressure while the disk substrate 15 is placed on the turntable 16. I do.
- FIG. 6 is a flowchart of the adjustment process in the third embodiment.
- the adjustment processing includes beam adjustment and rotation center adjustment as in the first embodiment.
- steps S11 to S15 are the same as steps S1 to S5 of the first embodiment, and a description thereof will not be repeated.
- step S11 to step S15 the sample stage support mechanism 73 is driven to raise the sample stage 72 again, and as shown in FIG.
- the sample stage support mechanism 73 is stopped at a position where it comes into contact with the lower surface of the substrate 15 (step S16).
- step S17 drawing by an electron beam is performed (step S17).
- a deceleration voltage is applied from the voltage source 60 to the sample stage 72 and the disk substrate 15 which are electrically connected by contact so that they become a negative electrode.
- the disk substrate 15 is negatively charged, and the electrons in the electron beam applied to the main surface of the disk substrate 15 are decelerated.
- the sample stage 72 on which the sample 71 for performing the beam adjustment and the rotation center adjustment is mounted is reduced by the electron beam deceleration. Since it is also used as an electrode for applying the application voltage, it is not necessary to provide an electrode for the deceleration voltage separately from the sample stage 72, and the configuration of the apparatus can be simplified.
- FIG. 5B shows a modification of the third embodiment, in which a sample stage support mechanism is constituted by a panel 73a.
- the upper end of panel 73a functioning as a sample stage support mechanism is fixed to the bottom surface of sample stage 72, and the lower end is fixed to the bottom surface of concave portion 50 formed in turntable 16.
- the panel 73a urges the sample table 72 against the lower surface of the disk substrate 15 with an appropriate pressure.
- the upper end 72a of the sample stage 72 can always keep in contact with the lower surface of the disk substrate 55 by the elastic force of the spring 73a. It becomes possible.
- FIG. 5C shows another modification according to the second embodiment, in which a sample stage is used as an electrode for an electrostatic chuck.
- the disk substrate 15 It must be securely fixed to the level 16.
- an electrostatic chuck system in which the disk substrate 15 and the turntable 16 are electrostatically attracted by Coulomb force is used.
- the sample stage 72 was used as an electrode for applying a decelerating voltage of the electron beam, but as shown in FIG. By applying a positive voltage to the internal electrode 61 to make it positive, the disk substrate 15 and the turntable 16 can be electrostatically attracted.
- the present invention can be applied to a rotary stage type electron beam drawing apparatus that draws a fine rotationally symmetric pattern (for example, a spiral pattern, a concentric pattern, a radial pattern, etc.) such as a master disk of an optical disk or a magnetic disk.
- a fine rotationally symmetric pattern for example, a spiral pattern, a concentric pattern, a radial pattern, etc.
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2006514835A JPWO2005124467A1 (ja) | 2004-06-21 | 2005-06-21 | 電子ビーム描画装置 |
US11/630,362 US7679071B2 (en) | 2004-06-21 | 2005-06-21 | Electron beam drawing apparatus |
EP05753235A EP1775634A1 (en) | 2004-06-21 | 2005-06-21 | Electron beam drawing device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004182290 | 2004-06-21 | ||
JP2004-182290 | 2004-06-21 |
Publications (1)
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WO2005124467A1 true WO2005124467A1 (ja) | 2005-12-29 |
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PCT/JP2005/011346 WO2005124467A1 (ja) | 2004-06-21 | 2005-06-21 | 電子ビーム描画装置 |
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US (1) | US7679071B2 (ja) |
EP (1) | EP1775634A1 (ja) |
JP (1) | JPWO2005124467A1 (ja) |
CN (1) | CN1981243A (ja) |
WO (1) | WO2005124467A1 (ja) |
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JP2010170712A (ja) * | 2009-01-20 | 2010-08-05 | Hitachi Ltd | 荷電粒子線装置 |
JP2010277721A (ja) * | 2009-05-26 | 2010-12-09 | Hitachi High-Technologies Corp | 荷電粒子線装置用試料ホルダの回転中心探索方法及び回転中心探索システム |
WO2014112428A1 (ja) * | 2013-01-17 | 2014-07-24 | 株式会社 日立ハイテクノロジーズ | 荷電粒子線装置 |
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CN108799723A (zh) * | 2018-06-29 | 2018-11-13 | 苏州舍勒智能科技有限公司 | 一种具有分离式转盘的旋转平台 |
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- 2005-06-21 US US11/630,362 patent/US7679071B2/en not_active Expired - Fee Related
- 2005-06-21 EP EP05753235A patent/EP1775634A1/en not_active Withdrawn
- 2005-06-21 WO PCT/JP2005/011346 patent/WO2005124467A1/ja active Application Filing
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010170712A (ja) * | 2009-01-20 | 2010-08-05 | Hitachi Ltd | 荷電粒子線装置 |
JP2010277721A (ja) * | 2009-05-26 | 2010-12-09 | Hitachi High-Technologies Corp | 荷電粒子線装置用試料ホルダの回転中心探索方法及び回転中心探索システム |
WO2014112428A1 (ja) * | 2013-01-17 | 2014-07-24 | 株式会社 日立ハイテクノロジーズ | 荷電粒子線装置 |
US9543113B2 (en) | 2013-01-17 | 2017-01-10 | Hitachi High-Technologies Corporation | Charged-particle beam device for irradiating a charged particle beam on a sample |
Also Published As
Publication number | Publication date |
---|---|
US20080006781A1 (en) | 2008-01-10 |
EP1775634A1 (en) | 2007-04-18 |
US7679071B2 (en) | 2010-03-16 |
CN1981243A (zh) | 2007-06-13 |
JPWO2005124467A1 (ja) | 2008-07-31 |
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