WO2005117029A1 - ニッケル化合物含有溶液、その製造方法、およびそれを用いたニッケル金属薄膜形成法 - Google Patents
ニッケル化合物含有溶液、その製造方法、およびそれを用いたニッケル金属薄膜形成法 Download PDFInfo
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- WO2005117029A1 WO2005117029A1 PCT/JP2005/009759 JP2005009759W WO2005117029A1 WO 2005117029 A1 WO2005117029 A1 WO 2005117029A1 JP 2005009759 W JP2005009759 W JP 2005009759W WO 2005117029 A1 WO2005117029 A1 WO 2005117029A1
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- Prior art keywords
- nickel
- solution
- containing solution
- parts
- compound
- Prior art date
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 190
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 93
- 150000002816 nickel compounds Chemical class 0.000 title claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title description 2
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- 150000007524 organic acids Chemical class 0.000 claims abstract description 14
- 150000002815 nickel Chemical class 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims description 27
- 239000010409 thin film Substances 0.000 claims description 26
- 238000007650 screen-printing Methods 0.000 claims description 24
- -1 N-substituted hydrazines Chemical class 0.000 claims description 18
- 150000007857 hydrazones Chemical class 0.000 claims description 14
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims description 7
- 229940078494 nickel acetate Drugs 0.000 claims description 7
- 239000012461 cellulose resin Substances 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 claims description 2
- 235000005985 organic acids Nutrition 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 9
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 abstract description 7
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229940116411 terpineol Drugs 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 5
- 230000001603 reducing effect Effects 0.000 abstract description 5
- 238000010304 firing Methods 0.000 abstract description 3
- 229920002678 cellulose Polymers 0.000 abstract description 2
- 239000001913 cellulose Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 76
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 75
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 18
- 239000010408 film Substances 0.000 description 14
- 239000001856 Ethyl cellulose Substances 0.000 description 13
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 13
- 229920001249 ethyl cellulose Polymers 0.000 description 13
- 235000019325 ethyl cellulose Nutrition 0.000 description 13
- 235000019441 ethanol Nutrition 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 150000002429 hydrazines Chemical class 0.000 description 8
- 238000002441 X-ray diffraction Methods 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 7
- 239000007810 chemical reaction solvent Substances 0.000 description 7
- 238000004821 distillation Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229940078487 nickel acetate tetrahydrate Drugs 0.000 description 7
- OINIXPNQKAZCRL-UHFFFAOYSA-L nickel(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Ni+2].CC([O-])=O.CC([O-])=O OINIXPNQKAZCRL-UHFFFAOYSA-L 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000001737 promoting effect Effects 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- ROWKJAVDOGWPAT-UHFFFAOYSA-N Acetoin Chemical compound CC(O)C(C)=O ROWKJAVDOGWPAT-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 150000002169 ethanolamines Chemical class 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- GBHCABUWWQUMAJ-UHFFFAOYSA-N 2-hydrazinoethanol Chemical compound NNCCO GBHCABUWWQUMAJ-UHFFFAOYSA-N 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- XLSMFKSTNGKWQX-UHFFFAOYSA-N hydroxyacetone Chemical compound CC(=O)CO XLSMFKSTNGKWQX-UHFFFAOYSA-N 0.000 description 3
- 239000003446 ligand Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- SMAMDWMLHWVJQM-UHFFFAOYSA-L nickel(2+);diformate;dihydrate Chemical compound O.O.[Ni+2].[O-]C=O.[O-]C=O SMAMDWMLHWVJQM-UHFFFAOYSA-L 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VIDOPANCAUPXNH-UHFFFAOYSA-N 1,2,3-triethylbenzene Chemical compound CCC1=CC=CC(CC)=C1CC VIDOPANCAUPXNH-UHFFFAOYSA-N 0.000 description 2
- 239000000020 Nitrocellulose Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- RXKJFZQQPQGTFL-UHFFFAOYSA-N dihydroxyacetone Chemical compound OCC(=O)CO RXKJFZQQPQGTFL-UHFFFAOYSA-N 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- GFAZHVHNLUBROE-UHFFFAOYSA-N hydroxymethyl propionaldehyde Natural products CCC(=O)CO GFAZHVHNLUBROE-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- 229920001220 nitrocellulos Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical compound CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- IWSZDQRGNFLMJS-UHFFFAOYSA-N 2-(dibutylamino)ethanol Chemical compound CCCCN(CCO)CCCC IWSZDQRGNFLMJS-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940120503 dihydroxyacetone Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- HDZGCSFEDULWCS-UHFFFAOYSA-N monomethylhydrazine Chemical compound CNN HDZGCSFEDULWCS-UHFFFAOYSA-N 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/06—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
Definitions
- Nickel compound-containing solution method for producing the same, and method for forming nickel metal thin film using the same
- the present invention relates to a nickel-containing compound-containing solution (paste) for forming a nickel metal thin film layer on a substrate using a screen printing method.
- the present invention relates to a nickel-containing compound-containing solution (paste) for forming an internal electrode of a multilayer ceramic capacitor (MLCC).
- the present invention relates to a solution-type paste containing a nickel metal sulfide, which is advantageous for dense and thin nickel metal films and can improve productivity.
- the MLCC has a structure in which a large number of dielectric layers of ceramics and internal electrode layers of metal are alternately stacked.
- a so-called nickel paste in which nickel metal fine particles are dispersed in an organic solvent containing an organic binder is used.
- the dielectric layer a green sheet obtained by solidifying ceramics such as barium titanate with an organic binder is used. Is used. A fine pattern of nickel paste is printed on a green sheet by a screen printing method, a large number of these are stacked, thermocompression bonded, and fired, whereby a dielectric layer and an internal electrode layer are simultaneously formed.
- a thin film is required for both the internal electrode layer and the dielectric layer.
- the nickel paste is prepared by mixing nickel metal powder in an organic vehicle prepared by dissolving an organic binder in an organic solvent, kneading and dispersing the mixture with a three-roll mill or the like, and adjusting the viscosity as necessary. It is manufactured by adding an organic solvent for dilution accordingly. Turbineol is mainly used as the organic solvent. Cellulose resins such as ethyl cellulose, nitrocellulose, etc., An acrylic resin such as tallylate is used. Also As the organic solvent for dilution, an aromatic hydrocarbon such as triethylbenzene is used. Nickel paste is used by adjusting its viscosity with a rotational viscometer to several to several tens Pa ⁇ s in order to impart printability by a screen printing method.
- a thin-film internal electrode layer is required for a small and large-capacity MLCC of an MLCC.
- the number of particles in the film thickness direction decreases as the thin film is formed, pinhole cracks are easily generated, and it becomes difficult to form a dense film.
- small particle diameters of nickel metal particles have been conventionally used.
- particles with particle sizes of 100 to 200 ⁇ m or several tens of nm have been used.
- the generation of pinholes and cracks still hinders the film thinning due to an increase in the specific surface area due to the small particle diameter and an increase in the paste viscosity due to poor dispersibility of the nickel metal particles.
- the film thickness has not been made thinner. This is essentially due to the use of metal particles as a nickel source.
- a method using a nickel metal film forming solution comprising an alcohol solution containing a reducing chelating ligand having a hydrazone unit and a nickel ion is disclosed (see Patent Document 1).
- an acetole and hydrazine force, an induced acetohydrazone and nickel acetate are reacted, and a solution of a nickel conjugate in which acetolehydrazone is coordinated to nickel is prepared in a solvent such as isopropyl alcohol. .
- This solution is applied and baked on the substrate by dip 'coating method or spin' coating method to obtain a nickel metal thin film.
- the alcohol used in this method is highly volatile and has relatively high surface tension, such as isopropyl alcohol, and the viscosity of the solution is low. It is difficult to use the printing method, resulting in poor productivity.
- turbineol which has a low volatility as a solvent and a surface tension suitable for screen printing, is required. It is also desired that the viscosity of the solution is in the above-mentioned range.
- the nickel ligated product described in this method has a low compatibility with such a solvent or is unstable in these solvents, so that the nickel ligated product is precipitated. Occurs. In addition, this causes another problem that it is difficult to control the viscosity of the solution.
- Patent Document 1 JP 2001-192843 A
- Non-Patent Document 1 Niigata Prefectural Institute of Technology, Industrial Technology Research Report 2003, 42-46 Disclosure of Invention
- An object of the present invention is to develop a solution-type nickel paste containing a nickel conjugate having a reducing ligand and using a solvent suitable for a screen printing method.
- a stable nickel-containing compound is used in these solvents having high solubility in a solvent such as turbineol, and the viscosity of the solution-type nickel paste is suitable for screen printing. The goal was to be able to control within the range.
- the present invention has been made in order to solve the above-mentioned problems in the prior art.
- ⁇ -hydroxyketones and N-1-substituted or N, ⁇ -2-substituted hydrazines The present invention relates to a nickel compound-containing solution containing a nickel-containing compound obtained by reacting a hydrazone obtained by reacting with a nickel salt of an organic acid, and using terbineol as a solvent.
- the present invention relates to a nickel compound-containing solution containing a nickel conjugate obtained by reacting a 2-substituted 2-aminoethanol with a nickel salt of an organic acid, and using terbineol as a solvent.
- the present invention relates to a nickel-containing solution containing nickel.
- the present invention relates to a nickel-containing conjugate-containing solution further containing a cellulose resin or an acrylic resin.
- the present invention relates to a method for forming a nickel metal thin film, which comprises applying the nickel-containing compound-containing solution on a substrate by a screen printing method and then performing a heat treatment.
- the hydrazone ⁇ ⁇ ⁇ 2-aminoethanol which also has unsubstituted hydrazine power with a-hydroxyketones has reducing properties, has a strong dissolution promoting effect of organic acid nickel salts in solvents such as isopropyl alcohol, but has a polarizing effect. Low, it does not dissolve the organic acid nickel salt in the solvent turbineol. Instead, the present inventors use hydrazones obtained by reacting N-1-substituted or N, N-substituted hydrazines with ⁇ -hydroxyketones, and ⁇ -substituted 2-aminoethanols. As a result, it was found that the organic acid nickel salt was stably dissolved in terpineol. The present invention has also made an effort to make this finding decisive for solving the above problems.
- Examples of the a-hydroxyketones in the present invention include acetol, acetoin, dihydroxyacetone and the like.
- N-1-substituted or N, N-2-substituted hydrazines to be reacted with these are hydrazines in which one or two hydrogen atoms of one amino group have been substituted.
- an alkyl group is preferable.
- the alkyl group may have a hydroxyl group. Examples of such an alkyl group include a methyl group, an ethyl group, a hydroxyethyl group, and a propyl group.
- the two substituents may be the same or different.
- N-substituted hydrazines such as monomethylhydrazine, hydroxyethylhydrazine and the like
- N, N-substituted hydrazines such as dimethylhydrazine and the like
- the use ratio of the a-hydroxyketones to the N-1-substituted or N, N-disubstituted hydrazines is not particularly limited, and the yield of hydrazones may be increased. Since they react, the molar ratio can be, for example, 1: 1.
- a-hydroxyketones and the N-1-substituted or N, N-2-substituted hydrazines react at room temperature to form hydrazones. These are formed by the lone pair of a hydroxyl group and an amino group. It is thought that it co-ordinates with the Kell ion to exhibit the effect of promoting dissolution in turbineol and the like.
- the "substituted 2-aminoethanols" in the present invention are those obtained by substituting one or two hydrogen atoms of an amino group of 2-aminoethanol.
- an alkyl group is preferable.
- the alkyl group may have a hydroxyl group. Examples of such an alkyl group include a methyl group, an ethyl group, a hydroxyethyl group, a propyl group and a butyl group. These may be monosubstituted or 2-substituted, and the substituents in the latter may be the same or different.
- ⁇ -monoalkyl-2-aminoethanols such as ⁇ -methyl-2-aminoethanol and diethanolamine; ⁇ , ⁇ -dimethyl-2-aminoethanol, ⁇ , ⁇ dibutyl-1-aminoethanol And ⁇ , ⁇ dialkyl-1-aminoethanols.
- ⁇ -monoalkyl-2-aminoethanols such as ⁇ -methyl-2-aminoethanol and diethanolamine
- ⁇ , ⁇ dialkyl-1-aminoethanols are considered to be chelate-type coordinated to the nickel ion by the lone pair of the hydroxyl group and the amino group, and to exert the effect of promoting dissolution in turbineol and the like.
- Ni (II) As the nickel salt of an organic acid, a carboxylate of Ni (II) can be used.
- nickel formate, nickel acetate and the like can be mentioned. These may or may not have water of crystallization. Specific examples include nickel acetate tetrahydrate, nickel formate dihydrate, and the like.
- the nickel-containing compound-containing solution of the present invention comprises a hydrazone obtained by reacting an ex-hydroxyketone with an N-1-substituted or N, N-substituted hydrazine in an appropriate solvent. It can be obtained by reacting an N-substituted 2-aminoethanol with a nickel salt of an organic acid and replacing the solvent with terbineol.
- Solvents used in the reaction include hydrazones and ⁇ -substituted 2-aminoethanols obtained by reacting ⁇ -hydroxyketones with N-1-substituted or N, ⁇ -substituted hydrazines, and the reaction product It is particularly limited as long as a certain nickel ligature can be dissolved. There is no.
- low molecular weight solvents such as methanol, ethanol, propyl alcohol and isopropyl alcohol can be used.
- the reaction is carried out at the boiling point of the reaction solvent, and the end point is determined when the unreacted nickel salt of the organic acid disappears or does not decrease.
- the reaction can be carried out without a solvent, and the solvent substitution can also be omitted by initially using Karabaneol as a reaction solvent.
- the water of crystallization separates into the system as the reaction proceeds, so that dehydration is necessary.
- unreacted organic acid nickel salt remains, it may be removed by filtration or centrifugation.
- the reaction system When the salt of the organic acid and the amine released by the reaction has low solubility in the reaction solvent, the reaction system may be gelled and the reaction may not proceed. In such cases, the ability to change the salt with amine to a nickel salt of an organic acid that dissolves in the reaction solvent, or the ability to change the reaction solvent to one that dissolves the salt well, no solvent or in turbineol The reaction may be performed.
- the solvent may be changed to ethyl alcohol.
- hydrazones obtained by reacting ⁇ -hydroxyketones with N-1-substituted or N, N—2-substituted hydrazines, and ⁇ substituted 2-aminoethanols are formed by-
- the molar amount is preferably 1 to 2 times, more preferably 2 times.
- the yield of the above reaction is low, and the effect of promoting the dissolution of the resulting KK-gel conjugate in turbineol tends to be low.
- the molar ratio exceeds 2 times, the dissolution promoting effect tends to reach a plateau.
- the nickel-containing compound-containing solution of the present invention may use methyl ethine ketone, butyl carbitol acetate, or the like in combination with potassium vineol, which uses terbineol as a solvent.
- the content of the nickel-containing compound is preferably 1% by mass or more, more preferably 2% by mass or more, in terms of the amount of metallic nickel obtained by reduction. is there.
- the content of the nickel-containing compound increases, the viscosity of the solution increases, but there is an advantage that a thick nickel film can be formed with a small amount of the solution. Therefore, the content of the nickel compound in the solution is preferably set in consideration of the viscosity suitable for the coating and printing means, the necessary thickness of the nickel film, and the like.
- the nickel-containing conjugate-containing solution of the present invention may contain a cellulose resin or an acryl resin if necessary. This utilizes the adjustment of the viscosity of the nickel compound-containing solution or the function as a binder, and any one used in conventional nickel pastes can be used without any particular limitation. Specifically, ethylcellulose, nitrocellulose and the like can be used as the cellulose resin, and methyl methacrylate and the like can be used as the acrylic resin. The content of these resins in the solution containing the nickel iris may be up to about 5% by weight. A terpineol solution of these resins may be prepared in advance, and the above-mentioned terbineol solution of the nickel compound may be mixed therewith. Alternatively, a turbineol solution of these resins may be used instead of turbineol when replacing the reaction solvent.
- a diluting solvent can be added to the nickel-containing compound-containing solution of the present invention, if necessary.
- the diluting solvent those used in the conventional nickel paste can be used without any particular limitation, and specific examples thereof include aromatic hydrocarbons such as triethylbenzene.
- the viscosity of the nickel compound-containing solution is suitable for screen printing by using a binder, a resin, or a diluting solvent as necessary, or simply adjusting the content of terbineol.
- the viscosity can be controlled within the range of several to several tens Pa's. The viscosity can be measured as described later.
- the method for forming a nickel metal thin film of the present invention comprises applying the above nickel-containing compound-containing solution onto a substrate by a screen printing method and then performing a heat treatment.
- a nickel compound-containing solution obtained by dissolving a nickel conjugate in turbineol suitable for screen printing.
- This nickel compound containing solution is Alternatively, a solution whose viscosity has been adjusted by adding a binder resin or the like has suitability for screen printing, and a nickel metal thin film can be formed by applying it on a substrate and firing it.
- the viscosity was measured at a temperature of 25 ° C using a TV-20 rotational viscometer manufactured by Toki Sangyo Co., Ltd.
- the L type was used for the low viscosity range
- the H type was used for the high viscosity range.
- Acetol (74 parts) was dissolved in isopropyl alcohol (300 parts), and dimethylhydrazine (60 parts) was added dropwise while stirring. After the dropwise addition, the mixture was stirred at room temperature for 3 hours or more to obtain a hydrazone. This was added to 124 parts of nickel acetate tetrahydrate, and refluxed for 1 hour to obtain an isopropyl alcohol solution of the nickel conjugate. To the resulting solution was added 322 parts of turbineol, and isopropyl alcohol was removed by distillation under reduced pressure to obtain a turbineol solution containing 5% of nickel. At this time, the solution was yellow-brown and had a viscosity of 137 mPa's (L type, Z20 rpm).
- the film was dried at 110 ° C for 30 minutes, and heat-treated at 500 ° C to obtain a thin film. X-ray diffraction confirmed that this thin film was formed of nickel metal.
- a turbineol solution (150 parts) of the obtained nickel ligated product and 66 parts of a 10% terbineol solution of ethyl cellulose were mixed by a three-roll mill, containing 5.6% of nickel and 3.1% of ethyl cellulose.
- the resulting nickel paste was obtained.
- the viscosity of the nickel paste at this time was 4.2 Pa-s (H type ZlOOrpm).
- screen printing (200 mesh) was performed on a heat-resistant glass plate (coating # 1737) of 2 cm ⁇ 7 cm. It was dried at 110 ° C for 30 minutes, and further heat-treated at 500 ° C to obtain a thin film. X-ray diffraction confirmed that this thin film was formed of nickel metal! / ⁇ .
- a nickel compound-containing solution obtained by dissolving a nickel conjugate in turbineol suitable for screen printing can be obtained.
- This nickel compound-containing solution, or a solution whose viscosity has been adjusted by adding a binder resin or the like thereto, has suitability for screen printing, and is applied to a substrate and baked to form a nickel metal thin film. Can be formed.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05743247A EP1770720A4 (en) | 2004-05-28 | 2005-05-27 | SOLUTION CONTAINING A NICKEL COMPOUND, PROCESS FOR PRODUCING THE SAME, AND METHOD FOR FORMING A THIN FILM OF NICKEL METAL USING THE SAME |
US11/569,645 US20070289479A1 (en) | 2004-05-28 | 2005-05-27 | Nickel Compound-Containing Solution, Method of Producing the Same, and Method of Forming Nickel Metal Thin Film Using the Same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-160082 | 2004-05-28 | ||
JP2004160082A JP4597582B2 (ja) | 2004-05-28 | 2004-05-28 | ニッケル化合物含有溶液、その製造方法、およびそれを用いたニッケル金属薄膜形成法 |
JP2004160083A JP2005336584A (ja) | 2004-05-28 | 2004-05-28 | ニッケル化合物含有溶液、その製造方法、およびそれを用いたニッケル金属薄膜形成法 |
JP2004-160083 | 2004-05-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005117029A1 true WO2005117029A1 (ja) | 2005-12-08 |
Family
ID=35451108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/009759 WO2005117029A1 (ja) | 2004-05-28 | 2005-05-27 | ニッケル化合物含有溶液、その製造方法、およびそれを用いたニッケル金属薄膜形成法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070289479A1 (ja) |
EP (1) | EP1770720A4 (ja) |
KR (1) | KR20070040761A (ja) |
WO (1) | WO2005117029A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010174313A (ja) * | 2009-01-28 | 2010-08-12 | Tosoh Corp | 銅微粒子分散体及びその製造方法 |
WO2022118698A1 (ja) * | 2020-12-03 | 2022-06-09 | Jsr株式会社 | 金属含有膜形成用組成物、金属含有膜、金属含有膜形成方法及び金属含有膜形成用組成物の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4775664B2 (ja) * | 2005-06-17 | 2011-09-21 | 住友金属鉱山株式会社 | ニッケル膜形成用塗布液、及びニッケル膜とその製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0565656A (ja) * | 1991-09-04 | 1993-03-19 | Tanaka Kikinzoku Kogyo Kk | ニツケル薄膜形成材料 |
JP2001192843A (ja) * | 2000-01-17 | 2001-07-17 | Gifu Univ | ニッケル金属膜形成用溶液、およびこれを用いたニッケル金属薄膜の形成方法 |
JP2002060807A (ja) * | 2000-08-21 | 2002-02-28 | Murata Mfg Co Ltd | Ni金属粉末の製造方法、並びに導電性ペーストおよびセラミック電子部品 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3798516A (en) * | 1973-01-17 | 1974-03-19 | Du Pont | Ceramic capacitors with noble electrodes alloy |
JP3115095B2 (ja) * | 1992-04-20 | 2000-12-04 | ディップソール株式会社 | 無電解メッキ液及びそれを使用するメッキ方法 |
JP2005537386A (ja) * | 2001-10-05 | 2005-12-08 | スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー | 導電性電子フィーチャを堆積するための低粘度前駆体組成物および方法 |
-
2005
- 2005-05-27 EP EP05743247A patent/EP1770720A4/en not_active Withdrawn
- 2005-05-27 US US11/569,645 patent/US20070289479A1/en not_active Abandoned
- 2005-05-27 KR KR1020067027239A patent/KR20070040761A/ko not_active Application Discontinuation
- 2005-05-27 WO PCT/JP2005/009759 patent/WO2005117029A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0565656A (ja) * | 1991-09-04 | 1993-03-19 | Tanaka Kikinzoku Kogyo Kk | ニツケル薄膜形成材料 |
JP2001192843A (ja) * | 2000-01-17 | 2001-07-17 | Gifu Univ | ニッケル金属膜形成用溶液、およびこれを用いたニッケル金属薄膜の形成方法 |
JP2002060807A (ja) * | 2000-08-21 | 2002-02-28 | Murata Mfg Co Ltd | Ni金属粉末の製造方法、並びに導電性ペーストおよびセラミック電子部品 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1770720A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010174313A (ja) * | 2009-01-28 | 2010-08-12 | Tosoh Corp | 銅微粒子分散体及びその製造方法 |
WO2022118698A1 (ja) * | 2020-12-03 | 2022-06-09 | Jsr株式会社 | 金属含有膜形成用組成物、金属含有膜、金属含有膜形成方法及び金属含有膜形成用組成物の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1770720A4 (en) | 2009-04-29 |
EP1770720A1 (en) | 2007-04-04 |
KR20070040761A (ko) | 2007-04-17 |
US20070289479A1 (en) | 2007-12-20 |
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