WO2005112117A3 - Leistungs-halbleiterbauteil - Google Patents

Leistungs-halbleiterbauteil Download PDF

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Publication number
WO2005112117A3
WO2005112117A3 PCT/DE2005/000848 DE2005000848W WO2005112117A3 WO 2005112117 A3 WO2005112117 A3 WO 2005112117A3 DE 2005000848 W DE2005000848 W DE 2005000848W WO 2005112117 A3 WO2005112117 A3 WO 2005112117A3
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WO
WIPO (PCT)
Prior art keywords
semiconductor component
power semiconductor
semiconductor assembly
semiconductor
electrical connections
Prior art date
Application number
PCT/DE2005/000848
Other languages
English (en)
French (fr)
Other versions
WO2005112117A2 (de
Inventor
Ralf Otremba
Original Assignee
Infineon Technologies Ag
Ralf Otremba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Ralf Otremba filed Critical Infineon Technologies Ag
Priority to JP2007511853A priority Critical patent/JP4444335B2/ja
Priority to US11/568,885 priority patent/US8299585B2/en
Publication of WO2005112117A2 publication Critical patent/WO2005112117A2/de
Publication of WO2005112117A3 publication Critical patent/WO2005112117A3/de

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Ein Leistungs-Halbleiterbauteil (1, 30, 40) weist ein erstes und ein zweites aktives Halbleiterbauelement (2, 3) auf, deren elektrische Anschlüsse (8, 14) in Form von Anschlussbeinchen (9, 15) aus den Halbleiterbauelementen herausgeführt werden. Das erste Halbleiterbauelement (2) ist mit dem zweiten Halbleiterbauelement (3) wenigstens teilweise durch eine Steckverbindung elektrisch verbunden. Die Steckverbindung ist durch Ineinandergreifen der Anschlussbeinchen (15) des zweiten Halbleiterbauelements (3) in die elektrischen Anschlüsse (8) des ersten Halbleiterbauelements realisiert.
PCT/DE2005/000848 2004-05-11 2005-05-04 Leistungs-halbleiterbauteil WO2005112117A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007511853A JP4444335B2 (ja) 2004-05-11 2005-05-04 電力半導体装置
US11/568,885 US8299585B2 (en) 2004-05-11 2005-05-04 Power semiconductor device

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DE102004023307A DE102004023307B3 (de) 2004-05-11 2004-05-11 Leistungs-Halbleiterbauteil
DE102004023307.1 2004-05-11

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WO2005112117A2 WO2005112117A2 (de) 2005-11-24
WO2005112117A3 true WO2005112117A3 (de) 2006-02-02

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JP (1) JP4444335B2 (de)
CN (1) CN100557799C (de)
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WO (1) WO2005112117A2 (de)

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US7550834B2 (en) 2006-06-29 2009-06-23 Sandisk Corporation Stacked, interconnected semiconductor packages
US7615409B2 (en) 2006-06-29 2009-11-10 Sandisk Corporation Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
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US8853849B2 (en) 2013-03-06 2014-10-07 Infineon Technologies Austria Ag Package arrangement and a method of manufacturing a package arrangement

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Also Published As

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JP4444335B2 (ja) 2010-03-31
CN1954427A (zh) 2007-04-25
US8299585B2 (en) 2012-10-30
WO2005112117A2 (de) 2005-11-24
JP2007536749A (ja) 2007-12-13
US20090045446A1 (en) 2009-02-19
CN100557799C (zh) 2009-11-04
DE102004023307B3 (de) 2005-10-20

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