WO2005109977A1 - Méthode de production de platine de circuit électronique - Google Patents

Méthode de production de platine de circuit électronique Download PDF

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Publication number
WO2005109977A1
WO2005109977A1 PCT/JP2005/008835 JP2005008835W WO2005109977A1 WO 2005109977 A1 WO2005109977 A1 WO 2005109977A1 JP 2005008835 W JP2005008835 W JP 2005008835W WO 2005109977 A1 WO2005109977 A1 WO 2005109977A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
soldering powder
solder
powder
liquid body
Prior art date
Application number
PCT/JP2005/008835
Other languages
English (en)
Inventor
Takekazu Sakai
Takashi Shoji
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to US11/579,879 priority Critical patent/US8038051B2/en
Priority to CN2005800187252A priority patent/CN1973589B/zh
Priority to EP05738537.9A priority patent/EP1745684B1/fr
Publication of WO2005109977A1 publication Critical patent/WO2005109977A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Definitions

  • This invention relates to a method for the production of an electronic circuit board. More particularly, the invention relates to a method for forming a solder layer on the surface of a fine conductive circuit electrode on an electronic circuit board, particularly a printed-wiring board.
  • the procedure which comprises a step of preparatorily forming a thin layer of solder on the surface of a conductive circuit electrode on the substrate, printing a solder paste or a flux thereon, positioning and loading the electronic components thereon and then reflowing the thin layer of solder alone or the thin layer of solder in conjunction with the solder paste, thereby bonding the layer by soldering is generally followed.
  • the electronic circuit boards have been in need of satisfying the trend of fine pitch with a view to miniaturizing electronic products.
  • Fine pitch parts such as, for example, the LSI of the QFP (quad flat package) type and the CSP (chip size package) each having a pitch of 0.3 mm, and the FC (flip chip) having a pitch of 0.15 mm, have come to be mounted on the electronic circuit boards in numerous quantities.
  • the electronic circuit boards therefore, are required to have a fine solder circuit pattern which conforms to the fine pitch.
  • the formation of a solder circuit with a solder film on the printed-wiring board is being accomplished by the plating method, the hot air leveler (HAL) method, or the method which comprises a step of printing the paste of solder powder and a step of reflowing the printed paste.
  • HAL hot air leveler
  • the method for producing a solder circuit by the plating technique incurs difficulty in adding to the thickness of the solder layer, and the HAL method and the method resorting to the printing of a solder paste encounter difficulty in coping with the fine pitch pattern.
  • a method which comprises causing a stickiness- imparting compound to react with the surface of a conductive circuit electrode of a printed-wiring board, thereby imparting stickiness to the surface, depositing solder powder on the sticking part consequently formed and then heating the printed-wiring board, thereby melting the solder and forming a solider circuit has been disclosed (refer, for example, to JP-AHEI 7-7244).
  • This invention is aimed at solving these problems and, in the method which comprises causing a stickiness-imparting compound to react with the surface of a conductive circuit electrode of a printed-wiring board, thereby imparting stickiness to the surface, depositing solder powder on the sticking part consequently formed and then heating the printed-wiring board, thereby melting the solder and forming a solder circuit as disclosed in JP-A HEI 7-7244, at providing a method for the production of an electronic circuit board capable of realizing a still finer circuit pattern, an electronic circuit board provided with a very fine circuit pattern and endowed with high reliability, and a circuit board having mounted therein electronic components and enabled to materialize high reliability and high mounting density.
  • the present inventor has pursued a diligent study with a view to solving the problems mentioned above and has consequently perfected this invention.
  • the first aspect of the present invention provides a method for the deposition of a soldering powder to an electronic circuit board, comprising the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to a resultant sticking part in a liquid body.
  • the second aspect of the invention provides a method for the production of an electronic circuit board, comprising the steps of imparting stickiness to an exposed metal surface of a substrate, depositing a soldering powder to a resultant sticking part in a liquid body, heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.
  • the third aspect of the invention provides the method according to the first or second aspect, wherein the step of depositing the soldering powder in the liquid body is performed by immersing a printed-wiring board in the liquid body having the soldering powder dispersed therein.
  • the fourth aspect of the invention provides the method according to any one of the first to third aspects, wherein the liquid body to be used for the deposition of the soldering powder is water.
  • the fifth aspect of the invention provides the method according to any one of the first to fourth aspects, wherein the liquid to be used for the deposition of the soldering powder has a rust-resisting agent incorporated therein.
  • the sixth aspect of the invention provides the method according to any one of the first to fifth aspects, wherein the soldering powder has a surface given a coating for prevention of oxidation.
  • the seventh aspect of the invention provides the method according to any one of the first to sixth aspects, wherein the substrate is given vibration during the deposition of the soldering powder thereon in the liquid body.
  • the eighth aspect of the invention provides the method according to the seventh aspect, wherein the vibration is low-frequency vibration.
  • the ninth aspect of the invention provides the method according to any one of the first to eighth aspects, wherein the soldering powder in the liquid body during the deposition of the soldering powder in the liquid body has a concentration in a range of 0.5 to 50 apparent volume %.
  • the tenth aspect of the invention provides the method according to any one of the sixth to ninth aspects, wherein the coating of the soldering powder is effected with a benzothiazole derivative, an amine having an alkyl group of 4 to 10 carbon atoms as a side chain thereof, thiourea, a silane coupling agent, lead, tin, gold, an inorganic acid salt or an organic acid salt.
  • the eleventh aspect of the invention provides the method according to the tenth aspect, wherein the organic acid salt is at least one member selected from the group consisting of lauric acid, myristic acid, palmitic acid and stearic acid.
  • the twelfth aspect of the invention provides an electronic circuit board manufactured through the method for the production of an electronic circuit board according to any one of the first to eleventh aspects.
  • the thirteenth aspect of the invention provides a method for mounting an electronic component, comprising a step of loading the electronic component on the electronic circuit board according to the twelfth aspect and a step of reflowing the soldering powder, thereby bonding the electronic component.
  • the fourteenth aspect of the invention provides an electronic circuit board having mounted thereon the electronic component manufactured by the method of mounting an electronic component according to the thirteenth aspect.
  • the method particularly has brought about an effect of decreasing the short circuits with a solder metal between the adjacent circuit patterns even in a very fine circuit pattern and has conspicuously exalted the reliability of an electronic circuit board. Further, by the method contemplated by this invention for the production of an electronic circuit board, it has been made possible to materialize miniaturization and exaltation of high reliability of a circuit board having electronic parts mounted thereon and provide an electronic device of outstanding characteristic properties.
  • the printed-wiring boards which constitute the subjects of this invention include plastic substrates, plastic film substrates, glass fabric substrates, paper-based epoxy resin substrates, substrates having a metal sheet superposed on ceramic substrates, one side printed-wiring boards having a circuit pattern formed with a conductive substance, such as metal, on an insulating substrate resulting from coating a metal matrix with plastic or ceramic, double side printed-wiring boards, multilayer printed-wiring boards and flexible printed-wiring boards, for example.
  • This invention utilizes a method which comprises causing a stickiness imparting compound to react with the surface of a conductive circuit electrode of a printed-wiring board, for example, thereby imparting stickiness to the surface, depositing solder powder on the sticking part consequently formed and then heating the printed-wiring board, thereby melting the solder, and forming a solder circuit.
  • a stickiness imparting compound to react with the surface of a conductive circuit electrode of a printed-wiring board, for example, thereby imparting stickiness to the surface, depositing solder powder on the sticking part consequently formed and then heating the printed-wiring board, thereby melting the solder, and forming a solder circuit.
  • the conductive substance for forming the circuit copper is used in most cases.
  • This invention does not need to limit the conductive substance to copper but may adopt any conductive substance which is enabled by the stickiness imparting substance which will be specifically described herein below to produce stickiness on the surface thereof.
  • the stickiness imparting compounds which can be preferably used in this invention naphthotriazole derivatives, benzotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercapto benzothiazole derivatives and benzothiazole thio fatty acids can be cited. While these stickiness imparting compounds manifest a strong effect particularly on copper, they are capable of imparting stickiness to the other conductive substances.
  • the benzotriazole derivatives are represented by this general formula (1).
  • Rl to R4 in the general formula (1) independently denote a hydrogen atom, an alkyl group having a carbon atom number in the range of 1 to 16, preferably 5 to 16, an alkoxy group, F, Br, CI, I, a cyano group, an amino group, or an OH group.
  • These compounds, as benzotriazole derivatives represented by the general formula (1), have their stickiness generally gain in strength in proportion as Rl to R4 have their carbon atom numbers increase.
  • the naphtotriazole derivatives are represented by this general formula (2).
  • R5 to R10 in the general formula (2) independently denote a hydrogen atom, an alkyl group having a carbon atom number in the range of 1 to 16, preferably 5 to 16, an alkoxy group, F, Br, CI, I, a cyano group, an amino group, or an OH group.
  • the imidazole derivatives are represented by this general formula (3).
  • Rl l and R12 in the general formula (3) independently denote hydrogen, an alkyl group having a carbon atom number in the range of 1 to 16, preferably 5 to 16, an alkoxy group, F, Br, CI, I, a cyano group, an amino group, or an OH group.
  • the benzoimidazole derivatives are represented by this general formula (4).
  • R13 to R17 in the general formula (4) independently denote a hydrogen atom, an alkyl group having a carbon atom number in the range of 1 to 16, preferably 5 to 16, an alkoxy group, F, Br, CI, I, a cyano group, an amino group, or an OH group.
  • the imidazole derivatives and the benzoimidazole derivatives represented by the general formula (3) and the general formula (4) also have their stickiness generally gain in strength in proportion as Rll to R17 have their carbon atom numbers increase.
  • the mercapto benzothiazole derivatives are represented by this general formula (5).
  • R18 to R21 in the general formula (5) independently denote a hydrogen atom, an alkyl group having a carbon atom number in the range of 1 to 16, preferably 5 to 16, an alkoxy group, F, Br, CI, I, a cyano group, an amino group, or an OH group.
  • the benzothiazole thio fatty acid derivatives are represented by this general formula (6).
  • R22 to R26 in the general formula (6) independently denote a hydrogen atom, an alkyl group having a carbon atom number in the range of 1 to 6, preferably 1 or 2, an alkoxy group, F, Br, CI, I, a cyano group, an amino group, or an OH group.
  • R22 to R26 are preferred to have a carbon atom number 1 or 2.
  • At least one of the stickiness imparting compounds mentioned above is dissolved in water or acidic water and adjusted to a slightly acidic state preferably in the range of pH 3 to 4 prior to use.
  • inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid
  • the conductive substance is a metal.
  • organic acid formic acid, acetic acid, propionic acid, malic acid, oxalic acid, malonic acid, succinic acid and tartaric acid may be cited.
  • the concentration of the stickiness imparting compound is not rigidly restricted and is properly adjusted to suit the condition of use, the concentration in the range of 0.05 mass% to 20 mass% of the whole solution is preferably usable. If the concentration falls short of the lower limit of this range, the shortage will be at a disadvantage in preventing the sticky film from being formed fully satisfactorily.
  • the temperature of the treatment slightly increased from room temperature is rather advantageous in terms of the speed of formation and the amount of formation of the sticky film. While it is not restricted but is varied as with the concentration of the stickiness imparting compound and the kind of the pertinent metal, it is generally proper in the approximate range of 30°C to 60°C.
  • the time of immersion is not restricted but is preferably made as by adjusting other conditions to fall in the approximate range of 5 seconds to 5 minutes from the viewpoint of the efficiency of operation.
  • the presence of copper (monovalent or divalent) in an amount of 100 to 1000 ppm as ion in the solution is at an advantage in exalting the efficiency of formation of the sticky film in terms of the speed of formation and the amount of formation.
  • the printed-wiring board is advantageously treated with a stickiness-imparting compound solution when it is prepared in advance in such a state having the part of the conductive circuit not in need of soldering covered with a resist and only the electrode part of the conductive circuit of the circuit pattern (the exposed surface of metal on the substrate) left exposed.
  • This invention is characterized by effecting the deposition of a solder powder on the electronic wiring board endowed with stickiness in a liquid body. By carrying out the deposition of the solder powder in the liquid body, it is made possible to prevent the solder powder from being deposited electrostatically on the part lacking stickiness and prevent the solder powder from being electrostatically flocculated and allow formation of a fine pitch circuit board and use of a finely divided solder powder.
  • This invention prefers the deposition of the solder powder in the liquid body to be effected by immersing the printed-wiring board in a solution having the solder powder dispersed therein.
  • it is advantageous to exert vibration preferably in the range of 0.1 Hz to several kHz and particularly preferably a low frequency vibration on the solution having the solder powder dispersed therein.
  • the concentration of the solder powder in the solution during the deposition of the solder powder in the liquid body is preferably in the range of 0.5 to 10 apparent volume% and more preferably in the range of 3 to 8 apparent volume%.
  • This invention prefers to use water as the liquid body to be used for the deposition of the solder powder.
  • a rust-resisting agent to the liquid body for the purpose of preventing the solid powder from being oxidized by the dissolved oxygen in the liquid body.
  • This invention prefers to coat the surface of the solder powder with the object of preventing the solder powder from being oxidized.
  • the coating agents for the solder powder include benzothiazole derivatives, amines having an alkyl group of a carbon atom number in the range of 4 to 10 as a side chain, thiourea, silane coupling agents, lead, tin, gold, inorganic acid salts and organic acid salts.
  • the coating is performed by using at least one member selected from the group of coating agents enumerated above.
  • the organic acid salt preferably at least one member selected from the group consisting of lauric acid, myristic acid, palmitic acid and stearic acid is used.
  • the method of treatment contemplated by this invention can be effectively used not only for the solder-precoated circuit board mentioned above but also for the formation of a bump for BGA bonding, for example. It is naturally embraced in the electronic circuit board of this invention.
  • the metal composition for the solder powder to be used in the method for the production of the electronic circuit board according to this invention the Sn-Pb-based, Sn-Pb-Ag-based, Sn-Pb-Bi-based, Sn-Pb-Ag-based and Sn- Pb-Cd-based alloys may be cited.
  • the Sn-In-based, Sn-Bi-based, In-Ag-based, In-Bi-based, Sn- Zn-based, Sn-Ag-based, Sn-Cu-based, Sn-Sb-based, Sn-Au-based, Sn-Bi-Ag-Cu-based, Sn-Ge-based, Sn-Bi-Cu-based, Sn-Cu-Ag-based, Sn-Ag-Zn-based, Sn-Cu-Ag-based, Sn-Bi-Sb-based, Sn-Bi-Sb-Zn-based, Sn-Bi-Cu-Zn-based, Sn-Ag-Sb-based, Sn-Ag-Sb- Zn-based, Sn-Ag-Cu-Zn-based and Sn-Zn-Bi-based alloys which do not contain Pb prove advantageous.
  • the eutectic crystal solder composed of 63 mass% of Sn and 37 mass% of Pb (hereinafter represented as "63Sn-37Pb") as the center, 62Sn-36Pb-2Ag, 62.6Sn-37Pb-0.4Ag, 60Sn- 40Pb, 50Sn-50Pb, 30Sn-70Pb, 25Sn-75Pb, 10Sn-88Pb-2Ag, 46Sn-8Bi-46Pb, 57Sn-3Bi- 40Pb, 42Sn-42Pb-14Bi-2Ag, 45Sn-40Pb-15Bi, 50Sn-32Pb-18Cd, 48Sn-52In, 43Sn- 57Bi, 97In-3Ag, 58Sn-42In, 95In-5Bi,60Sn-40Bi, 91Sn-9Zn, 96.5Sn-3.5Ag, 99.3Sn- 0.7Cu, 95Sn-5S
  • the solder powder to be used in this invention may be a mixture of two or more kinds of solder powders different in composition.
  • the electronic circuit board of this invention is manufactured by using an alloy composition selected from the Pb-free solders, particularly preferably from the solders containing Sn and Zn, or Sn, Zn and Bi, among other solder powders enumerated above, it allows elongation of the service life of a part mounted thereon and diversification of the part because it permits the reflow temperature to be lowered to the same level as the Sn-Pb-based solder.
  • JIS Japanese Industrial Standard
  • the method which resorts to the use of a standard sieve and a balance as specified by JIS can be generally adopted.
  • the determination can be otherwise effected by the image analysis with a microscope or the electrozone method with a coal-tar counter.
  • the principle of the operation of the coal-tar counter is described in the "Manual of Powder Technology" (complied by Particle Technology Society, 2 nd edition, pp. 19-20).
  • This counter determines the powder diameter distribution of a given powder by passing a solution having the powder dispersed therein through fine pores formed in a diaphragm and measuring the change in electric resistance on the opposite sides of the pores. It is capable of determining the ratios of individual particles with satisfactory reproducibility.
  • the electronic circuit board which is manufactured by this invention can be favorably in a method for mounting an electronic component by a procedure comprising a step of loading the electronic component in place and a step of reflowing a solder, thereby bonding the electronic component.
  • the electronic component can be bonded, for example, by applying a solder paste by the printing technique on a part of the substrate expected to have the electronic component bonded, loading the electronic component on the part, subsequently heating the electronic component, thereby melting the solder powder in the solder paste, and allowing the molten solder powder to set.
  • the method for bonding the electronic circuit board obtained by the method of this invention to the electronic component (mounting method)
  • the surface-mounting technology (SMT) for example.
  • This mounting method first applies a solder paste by the printing technique to the electronic circuit board, such as, for example, a necessary portion of the circuit pattern.
  • the reflow heat source a hot-air oven, an infrared oven, a steam condensing soldering device and a light beam soldering device are available.
  • the reflowing process contemplated by this invention is variable with the kind of solder alloy composition.
  • the reflow operation is preferably performed by the two-stage process of preheating and reflowing.
  • the preheating temperature is in the range of 130 to 180°C seconds and preferably in the range of 130 to 150°C
  • the preheating time is in the range of 60 to 120 seconds and preferably in the range of 60 to 90 seconds
  • the reflowing temperature is in the range of 210 to 230°C and preferably in the range of 210 to 220°C
  • the reflowing time is in the range of 30 to 60 seconds and preferably in the range of 30 to 40 seconds.
  • the reflowing temperatures may be in the range of 20 to 50°C and preferably in the range of 20 to 30°C respectively plus the melting points of the alloys to be used and the other preheating temperatures, preheating times, and reflowing times may be in the same ranges as mentioned above.
  • the reflowing process mentioned above may be carried out in an atmosphere of nitrogen or in the open air. In the case of effecting the operation of reflowing in nitrogen, it is made possible ty setting the oxygen concentration below 5 apparent volume% and preferably below 0.5 apparent volume% to enhance the solder's ability to wet the solder circuit, suppress the occurrence of solder holes and stabilize the treatment. Thereafter, the electronic circuit board is cooled to complete the surface mounting operation.
  • the work of bonding an electronic component may be performed on both sides of the printed-wiring board.
  • the electronic components which can be used for the method of mounting an electronic component according to this invention include LSI, resistors, condensers, transformers, inductances, filters, radiators, oscillators, etc., through not exclusively. Now, this invention will be explained below with reference to examples thereof.
  • Example 1 A printed-wiring board having the smallest electrode spacing of 50 ⁇ m was manufactured.
  • an aqueous 2 mass% solution of an imidazole-based compound conforming to the general formula (3) by having a hydrogen atom for Rll and an alkyl group of C ⁇ H 23 for R12 was used with the pH value thereof adjusted with acetic acid to about 4.
  • This aqueous solution was heated to 40°C and the aforementioned printed-wiring board pretreated with an aqueous hydrochloric acid solution was immersed in the heated aqueous solution, with the result that a sticky substance was formed on the surface of a copper circuit.
  • the printed-wiring board was immersed for 30 seconds in a solution that was obtained by causing a 96.5 Sn-3.5 Ag solder powder having an average particle diameter of about 20 ⁇ m to be dispersed in a concentration of 10 apparent volume% in water. Thereafter, the printed-wiring board was taken out of the solution, washed lightly with purified water and dried. The printed-wiring board was placed in an oven kept at 240°C to melt the solder powder and induce formation of a thin layer of 96.5 Sn-3.5 Ag solder in a thickness of about 20 ⁇ m on the exposed part of the copper circuit. The average particle diameter of the solder powder was determined by the use of a microtruck. The solder circuit produced absolutely no abnormal phenomena, such as bridging.
  • the sticky flux was prepared by using polymeric rosin and a disproportionating rosin and adding thereto a hydrogenated castor oil as a thixotropic agent and propylene glycol monophenyl ether as a solvent. This flux was applied by printing in a thickness of 100 ⁇ m and a bare chip (Au stand bump about 100 ⁇ m in height) was mounted on the layer of the flux and they were heated together with a reflow heat source to effect the soldering.
  • the preheating temperature was set at 150°C, the preheating time at 60 seconds, and the reflowing peak temperature at 230°C.
  • the electronic component-mounted circuit board resulting from the reflowing process was visually examines, it was found to be an ideal mounted board showing no sign of defective bonding.
  • Example 2 and Comparative Example 1 The experiments were performed by following the procedure of Example 1 while performing the formation of solder bumps under the conditions shown in Table 1. The results of these experiments were as shown in Table 1.
  • Example 3 Printed boards having an electrode formed in a circular shape with a solid resist were prepared as samples of the formation of a solder bump and were treated by following the procedure of Example 1 while using other conditions as shown in the following table. The results are shown in Table 2.
  • Examples 4 to 6 The experiments of forming a solder bump were made by following the procedure of Example 1 while using other conditions as shown in Table 3. The results are shown in Table 3.
  • this invention is enabled to realize miniaturization of and impartation of high reliability to a circuit board having mounted thereon an electronic component possessing a fine circuit pattern and enjoying high reliability and provide an electronic circuit board, a circuit board having mounted thereon an electronic component capable of realizing high reliability and high mounting density and an electronic device possessing excellent characteristic properties.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Une méthode pour déposer de la poudre à souder sur une platine de circuit électronique comprend les étapes de fournir une adhésivité à une surface métallique exposée d’un substrat et déposer une poudre à souder sur la partie adhésive résultante dans un corps liquide. La méthode peut comprendre en outre les étapes de chauffer le substrat, fondant ainsi la poudre à souder et formant un circuit de soudure.
PCT/JP2005/008835 2004-05-10 2005-05-10 Méthode de production de platine de circuit électronique WO2005109977A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/579,879 US8038051B2 (en) 2004-05-10 2005-05-10 Method for production of electronic circuit board
CN2005800187252A CN1973589B (zh) 2004-05-10 2005-05-10 电子电路板的制造方法
EP05738537.9A EP1745684B1 (fr) 2004-05-10 2005-05-10 Méthode de production de platine de circuit électronique

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004139394 2004-05-10
JP2004-139394 2004-05-10
US57294604P 2004-05-21 2004-05-21
US60/572,946 2004-05-21

Publications (1)

Publication Number Publication Date
WO2005109977A1 true WO2005109977A1 (fr) 2005-11-17

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PCT/JP2005/008835 WO2005109977A1 (fr) 2004-05-10 2005-05-10 Méthode de production de platine de circuit électronique

Country Status (7)

Country Link
US (1) US8038051B2 (fr)
EP (1) EP1745684B1 (fr)
JP (1) JP4576286B2 (fr)
KR (1) KR100891320B1 (fr)
CN (1) CN1973589B (fr)
TW (1) TWI280087B (fr)
WO (1) WO2005109977A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2047725A1 (fr) * 2006-08-03 2009-04-15 Showa Denko K.K. Procédé de production d'une carte de circuit imprimé à brasure
EP2100486A1 (fr) * 2006-12-27 2009-09-16 Showa Denko K.K. Procédé de fabrication d'une carte de circuits conducteurs
US8109432B2 (en) 2005-07-11 2012-02-07 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US8123111B2 (en) 2005-03-29 2012-02-28 Showa Denko K.K. Production method of solder circuit board
EP2528422A1 (fr) * 2010-01-20 2012-11-28 Showa Denko K.K. Appareil pour faire adhérer de la poudre de soudure et procédé pour faire adhérer de la poudre de soudure à un circuit imprimé électronique

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JP4819611B2 (ja) * 2006-08-03 2011-11-24 昭和電工株式会社 ハンダ回路基板の製造方法
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Publication number Priority date Publication date Assignee Title
US8123111B2 (en) 2005-03-29 2012-02-28 Showa Denko K.K. Production method of solder circuit board
US8109432B2 (en) 2005-07-11 2012-02-07 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
EP2047725A1 (fr) * 2006-08-03 2009-04-15 Showa Denko K.K. Procédé de production d'une carte de circuit imprimé à brasure
EP2047725A4 (fr) * 2006-08-03 2010-05-26 Showa Denko Kk Procédé de production d'une carte de circuit imprimé à brasure
EP2100486A1 (fr) * 2006-12-27 2009-09-16 Showa Denko K.K. Procédé de fabrication d'une carte de circuits conducteurs
EP2100486A4 (fr) * 2006-12-27 2012-12-05 Showa Denko Kk Procédé de fabrication d'une carte de circuits conducteurs
EP2528422A1 (fr) * 2010-01-20 2012-11-28 Showa Denko K.K. Appareil pour faire adhérer de la poudre de soudure et procédé pour faire adhérer de la poudre de soudure à un circuit imprimé électronique
EP2528422A4 (fr) * 2010-01-20 2013-08-28 Showa Denko Kk Appareil pour faire adhérer de la poudre de soudure et procédé pour faire adhérer de la poudre de soudure à un circuit imprimé électronique
US8752754B2 (en) 2010-01-20 2014-06-17 Showa Denko K.K. Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

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JP4576286B2 (ja) 2010-11-04
CN1973589B (zh) 2011-03-30
US20070284136A1 (en) 2007-12-13
KR20070011578A (ko) 2007-01-24
US8038051B2 (en) 2011-10-18
KR100891320B1 (ko) 2009-03-31
JP2005354043A (ja) 2005-12-22
CN1973589A (zh) 2007-05-30
EP1745684B1 (fr) 2014-04-16
EP1745684A1 (fr) 2007-01-24
TWI280087B (en) 2007-04-21
EP1745684A4 (fr) 2010-05-12
TW200608845A (en) 2006-03-01

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