WO2005095670A3 - Procedes d'elimination de depots de surface par enceinte a distance - Google Patents
Procedes d'elimination de depots de surface par enceinte a distance Download PDFInfo
- Publication number
- WO2005095670A3 WO2005095670A3 PCT/US2005/010691 US2005010691W WO2005095670A3 WO 2005095670 A3 WO2005095670 A3 WO 2005095670A3 US 2005010691 W US2005010691 W US 2005010691W WO 2005095670 A3 WO2005095670 A3 WO 2005095670A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- surface deposits
- removing surface
- remote chamber
- chamber methods
- remote
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Public Health (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Computer Hardware Design (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007505281A JP2007530792A (ja) | 2004-03-24 | 2005-03-24 | 表面堆積物を除去するための遠隔チャンバ方法 |
BRPI0508204-8A BRPI0508204A (pt) | 2004-03-24 | 2005-03-24 | método de remoção de depósitos de uma superfìcie |
EP05734780A EP1733071A2 (fr) | 2004-03-24 | 2005-03-24 | Procedes d'elimination de depots de surface par enceinte a distance |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55622704P | 2004-03-24 | 2004-03-24 | |
US60/556,227 | 2004-03-24 | ||
US64044404P | 2004-12-30 | 2004-12-30 | |
US64083304P | 2004-12-30 | 2004-12-30 | |
US60/640,444 | 2004-12-30 | ||
US60/640,833 | 2004-12-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005095670A2 WO2005095670A2 (fr) | 2005-10-13 |
WO2005095670A3 true WO2005095670A3 (fr) | 2006-05-04 |
Family
ID=34965582
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/010692 WO2005098086A2 (fr) | 2004-03-24 | 2005-03-24 | Procedes telecommandes destines a eliminer des depots de surface dans des chambres |
PCT/US2005/010691 WO2005095670A2 (fr) | 2004-03-24 | 2005-03-24 | Procedes d'elimination de depots de surface par enceinte a distance |
PCT/US2005/010693 WO2005090638A2 (fr) | 2004-03-24 | 2005-03-24 | Procede a chambre separee pour l'elimination des depots de surface |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/010692 WO2005098086A2 (fr) | 2004-03-24 | 2005-03-24 | Procedes telecommandes destines a eliminer des depots de surface dans des chambres |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/010693 WO2005090638A2 (fr) | 2004-03-24 | 2005-03-24 | Procede a chambre separee pour l'elimination des depots de surface |
Country Status (6)
Country | Link |
---|---|
EP (3) | EP1733072A2 (fr) |
JP (3) | JP2007531289A (fr) |
KR (3) | KR20070037434A (fr) |
BR (3) | BRPI0508204A (fr) |
TW (3) | TWI281714B (fr) |
WO (3) | WO2005098086A2 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0697467A1 (fr) * | 1994-07-21 | 1996-02-21 | Applied Materials, Inc. | Procédé et dispositif de nettoyage d'une chambre de dépÔt |
US7581549B2 (en) * | 2004-07-23 | 2009-09-01 | Air Products And Chemicals, Inc. | Method for removing carbon-containing residues from a substrate |
RU2008108010A (ru) * | 2005-08-02 | 2009-09-10 | Массачусетс Инститьют Оф Текнолоджи (Us) | Способ применения фторида серы для удаления поверхностных отложений |
US9034199B2 (en) | 2012-02-21 | 2015-05-19 | Applied Materials, Inc. | Ceramic article with reduced surface defect density and process for producing a ceramic article |
US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
US10240230B2 (en) * | 2012-12-18 | 2019-03-26 | Seastar Chemicals Inc. | Process and method for in-situ dry cleaning of thin film deposition reactors and thin film layers |
JP6202423B2 (ja) * | 2013-03-05 | 2017-09-27 | パナソニックIpマネジメント株式会社 | プラズマクリーニング方法およびプラズマクリーニング装置 |
US9850568B2 (en) | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
SG11201605356PA (en) | 2013-12-30 | 2016-07-28 | Chemours Co Fc Llc | Chamber cleaning and semiconductor etching gases |
SG11202106864TA (en) * | 2018-12-25 | 2021-07-29 | Showa Denko Kk | Adhesion removal method and film-forming method |
US11854773B2 (en) | 2020-03-31 | 2023-12-26 | Applied Materials, Inc. | Remote plasma cleaning of chambers for electronics manufacturing systems |
CN116145106A (zh) * | 2023-02-21 | 2023-05-23 | 苏州鼎芯光电科技有限公司 | 一种用于半导体镀膜工艺腔室的清洁方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5158644A (en) * | 1986-12-19 | 1992-10-27 | Applied Materials, Inc. | Reactor chamber self-cleaning process |
EP1304731A1 (fr) * | 2001-03-22 | 2003-04-23 | Research Institute of Innovative Technology for the Earth | Procede de nettoyage d'un dispositif cvd et dispositif nettoyant afferent |
-
2005
- 2005-03-24 BR BRPI0508204-8A patent/BRPI0508204A/pt not_active IP Right Cessation
- 2005-03-24 WO PCT/US2005/010692 patent/WO2005098086A2/fr active Application Filing
- 2005-03-24 BR BRPI0508205-6A patent/BRPI0508205A/pt not_active Application Discontinuation
- 2005-03-24 KR KR1020067021947A patent/KR20070037434A/ko not_active Application Discontinuation
- 2005-03-24 BR BRPI0508214-5A patent/BRPI0508214A/pt not_active IP Right Cessation
- 2005-03-24 EP EP05760380A patent/EP1733072A2/fr not_active Withdrawn
- 2005-03-24 KR KR1020067021948A patent/KR20070043697A/ko not_active Application Discontinuation
- 2005-03-24 JP JP2007505283A patent/JP2007531289A/ja not_active Withdrawn
- 2005-03-24 JP JP2007505281A patent/JP2007530792A/ja not_active Withdrawn
- 2005-03-24 EP EP05760434A patent/EP1737998A2/fr not_active Withdrawn
- 2005-03-24 WO PCT/US2005/010691 patent/WO2005095670A2/fr active Application Filing
- 2005-03-24 KR KR1020067021949A patent/KR20070040748A/ko not_active Application Discontinuation
- 2005-03-24 EP EP05734780A patent/EP1733071A2/fr not_active Withdrawn
- 2005-03-24 JP JP2007505282A patent/JP2007531288A/ja active Pending
- 2005-03-24 WO PCT/US2005/010693 patent/WO2005090638A2/fr active Application Filing
- 2005-06-28 TW TW094121538A patent/TWI281714B/zh not_active IP Right Cessation
- 2005-06-28 TW TW094121536A patent/TWI281715B/zh not_active IP Right Cessation
- 2005-06-28 TW TW094121537A patent/TWI284929B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5158644A (en) * | 1986-12-19 | 1992-10-27 | Applied Materials, Inc. | Reactor chamber self-cleaning process |
EP1304731A1 (fr) * | 2001-03-22 | 2003-04-23 | Research Institute of Innovative Technology for the Earth | Procede de nettoyage d'un dispositif cvd et dispositif nettoyant afferent |
Non-Patent Citations (2)
Title |
---|
ALLGOOD C ET AL: "Evaluation of octafluorocyclobutane as a chamber clean gas in a plasma-enhanced silicon dioxide chemical vapor deposition reactor", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ELECTROCHEMICAL SOCIETY. MANCHESTER, NEW HAMPSHIRE, US, vol. 150, no. 2, 2003, pages G122 - G126, XP002280013, ISSN: 0013-4651 * |
OH C H ET AL: "Effect of N-containing additive gases on global warming gas emission during remote plasma cleaning process of silicon nitride PECVD chamber using C4F8/O2/Ar chemistry", SURFACE & COATINGS TECHNOLOGY ELSEVIER SWITZERLAND, vol. 171, no. 1-3, 1 July 2003 (2003-07-01), pages 267 - 272, XP002362634, ISSN: 0257-8972 * |
Also Published As
Publication number | Publication date |
---|---|
EP1733071A2 (fr) | 2006-12-20 |
TW200623251A (en) | 2006-07-01 |
WO2005098086A2 (fr) | 2005-10-20 |
JP2007531289A (ja) | 2007-11-01 |
TWI284929B (en) | 2007-08-01 |
TWI281715B (en) | 2007-05-21 |
KR20070037434A (ko) | 2007-04-04 |
BRPI0508204A (pt) | 2007-07-17 |
WO2005090638A9 (fr) | 2006-01-26 |
WO2005090638A8 (fr) | 2006-11-16 |
EP1737998A2 (fr) | 2007-01-03 |
WO2005090638A3 (fr) | 2006-04-13 |
TW200623240A (en) | 2006-07-01 |
JP2007531288A (ja) | 2007-11-01 |
JP2007530792A (ja) | 2007-11-01 |
WO2005098086A3 (fr) | 2006-05-04 |
EP1733072A2 (fr) | 2006-12-20 |
KR20070040748A (ko) | 2007-04-17 |
WO2005090638A2 (fr) | 2005-09-29 |
BRPI0508214A (pt) | 2007-07-17 |
BRPI0508205A (pt) | 2007-07-17 |
TWI281714B (en) | 2007-05-21 |
WO2005095670A2 (fr) | 2005-10-13 |
KR20070043697A (ko) | 2007-04-25 |
TW200623281A (en) | 2006-07-01 |
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