TW200623240A - Remote chamber methods for removing surface deposits - Google Patents
Remote chamber methods for removing surface depositsInfo
- Publication number
- TW200623240A TW200623240A TW094121537A TW94121537A TW200623240A TW 200623240 A TW200623240 A TW 200623240A TW 094121537 A TW094121537 A TW 094121537A TW 94121537 A TW94121537 A TW 94121537A TW 200623240 A TW200623240 A TW 200623240A
- Authority
- TW
- Taiwan
- Prior art keywords
- surface deposits
- removing surface
- remote chamber
- pretreatment
- pathway
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Abstract
The present invention relates to an improved remote plasma cleaning method for removing surface deposits from a surface, such as the interior of a deposition chamber that is used in fabricating electronic devices. The improvement involves addition of a nitrogen source to the feeding gas mixture comprising of oxygen and fluorocarbon. The improvement also involves pretreatment of interior surface of the pathway from the remote chamber to the surface deposits by activating a pretreatment gas mixture comprising of nitrogen source and passing the activated pretreatment gas through the pathway.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55622704P | 2004-03-24 | 2004-03-24 | |
US64044404P | 2004-12-30 | 2004-12-30 | |
US64083304P | 2004-12-30 | 2004-12-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200623240A true TW200623240A (en) | 2006-07-01 |
TWI284929B TWI284929B (en) | 2007-08-01 |
Family
ID=34965582
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094121536A TWI281715B (en) | 2004-03-24 | 2005-06-28 | Remote chamber methods for removing surface deposits |
TW094121538A TWI281714B (en) | 2004-03-24 | 2005-06-28 | Remote chamber methods for removing surface deposits |
TW094121537A TWI284929B (en) | 2004-03-24 | 2005-06-28 | Remote chamber methods for removing surface deposits |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094121536A TWI281715B (en) | 2004-03-24 | 2005-06-28 | Remote chamber methods for removing surface deposits |
TW094121538A TWI281714B (en) | 2004-03-24 | 2005-06-28 | Remote chamber methods for removing surface deposits |
Country Status (6)
Country | Link |
---|---|
EP (3) | EP1733071A2 (en) |
JP (3) | JP2007530792A (en) |
KR (3) | KR20070043697A (en) |
BR (3) | BRPI0508214A (en) |
TW (3) | TWI281715B (en) |
WO (3) | WO2005090638A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0697467A1 (en) * | 1994-07-21 | 1996-02-21 | Applied Materials, Inc. | Method and apparatus for cleaning a deposition chamber |
US7581549B2 (en) | 2004-07-23 | 2009-09-01 | Air Products And Chemicals, Inc. | Method for removing carbon-containing residues from a substrate |
RU2008108010A (en) * | 2005-08-02 | 2009-09-10 | Массачусетс Инститьют Оф Текнолоджи (Us) | METHOD OF APPLICATION OF SULFUR FLUORIDE FOR REMOVING SURFACE SEDIMENTS |
US9034199B2 (en) | 2012-02-21 | 2015-05-19 | Applied Materials, Inc. | Ceramic article with reduced surface defect density and process for producing a ceramic article |
US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
KR101792165B1 (en) * | 2012-12-18 | 2017-10-31 | 시스타 케미칼즈 인코포레이티드 | Process and method for in-situ dry cleaning of thin film deposition reactors and thin film layers |
JP6202423B2 (en) * | 2013-03-05 | 2017-09-27 | パナソニックIpマネジメント株式会社 | Plasma cleaning method and plasma cleaning apparatus |
US9850568B2 (en) | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
EP3090073B1 (en) * | 2013-12-30 | 2020-02-05 | The Chemours Company FC, LLC | Method of etching a film on a semiconductor in a semiconductor manufacturing process chamber |
US20220059327A1 (en) * | 2018-12-25 | 2022-02-24 | Showa Denko K.K. | Adhesion removal method and film-forming method |
US11854773B2 (en) | 2020-03-31 | 2023-12-26 | Applied Materials, Inc. | Remote plasma cleaning of chambers for electronics manufacturing systems |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5158644A (en) * | 1986-12-19 | 1992-10-27 | Applied Materials, Inc. | Reactor chamber self-cleaning process |
JP2002280376A (en) * | 2001-03-22 | 2002-09-27 | Research Institute Of Innovative Technology For The Earth | Method and apparatus of cleaning cvd apparatus |
-
2005
- 2005-03-24 EP EP05734780A patent/EP1733071A2/en not_active Withdrawn
- 2005-03-24 EP EP05760380A patent/EP1733072A2/en not_active Withdrawn
- 2005-03-24 WO PCT/US2005/010693 patent/WO2005090638A2/en active Application Filing
- 2005-03-24 JP JP2007505281A patent/JP2007530792A/en not_active Withdrawn
- 2005-03-24 WO PCT/US2005/010692 patent/WO2005098086A2/en active Application Filing
- 2005-03-24 EP EP05760434A patent/EP1737998A2/en not_active Withdrawn
- 2005-03-24 KR KR1020067021948A patent/KR20070043697A/en not_active Application Discontinuation
- 2005-03-24 JP JP2007505283A patent/JP2007531289A/en not_active Withdrawn
- 2005-03-24 JP JP2007505282A patent/JP2007531288A/en active Pending
- 2005-03-24 BR BRPI0508214-5A patent/BRPI0508214A/en not_active IP Right Cessation
- 2005-03-24 KR KR1020067021947A patent/KR20070037434A/en not_active Application Discontinuation
- 2005-03-24 BR BRPI0508205-6A patent/BRPI0508205A/en not_active Application Discontinuation
- 2005-03-24 KR KR1020067021949A patent/KR20070040748A/en not_active Application Discontinuation
- 2005-03-24 WO PCT/US2005/010691 patent/WO2005095670A2/en active Application Filing
- 2005-03-24 BR BRPI0508204-8A patent/BRPI0508204A/en not_active IP Right Cessation
- 2005-06-28 TW TW094121536A patent/TWI281715B/en not_active IP Right Cessation
- 2005-06-28 TW TW094121538A patent/TWI281714B/en not_active IP Right Cessation
- 2005-06-28 TW TW094121537A patent/TWI284929B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2005095670A3 (en) | 2006-05-04 |
KR20070037434A (en) | 2007-04-04 |
TW200623281A (en) | 2006-07-01 |
BRPI0508205A (en) | 2007-07-17 |
TWI284929B (en) | 2007-08-01 |
WO2005090638A9 (en) | 2006-01-26 |
KR20070043697A (en) | 2007-04-25 |
EP1733071A2 (en) | 2006-12-20 |
WO2005090638A2 (en) | 2005-09-29 |
WO2005090638A8 (en) | 2006-11-16 |
TW200623251A (en) | 2006-07-01 |
BRPI0508204A (en) | 2007-07-17 |
EP1737998A2 (en) | 2007-01-03 |
JP2007531288A (en) | 2007-11-01 |
BRPI0508214A (en) | 2007-07-17 |
JP2007530792A (en) | 2007-11-01 |
EP1733072A2 (en) | 2006-12-20 |
TWI281715B (en) | 2007-05-21 |
JP2007531289A (en) | 2007-11-01 |
WO2005098086A3 (en) | 2006-05-04 |
WO2005098086A2 (en) | 2005-10-20 |
WO2005095670A2 (en) | 2005-10-13 |
WO2005090638A3 (en) | 2006-04-13 |
TWI281714B (en) | 2007-05-21 |
KR20070040748A (en) | 2007-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |