BRPI0508205A - surface deposit removal methods - Google Patents

surface deposit removal methods

Info

Publication number
BRPI0508205A
BRPI0508205A BRPI0508205-6A BRPI0508205A BRPI0508205A BR PI0508205 A BRPI0508205 A BR PI0508205A BR PI0508205 A BRPI0508205 A BR PI0508205A BR PI0508205 A BRPI0508205 A BR PI0508205A
Authority
BR
Brazil
Prior art keywords
removal methods
deposit removal
surface deposit
enhancement
involves
Prior art date
Application number
BRPI0508205-6A
Other languages
Portuguese (pt)
Inventor
Herbert Harold Sawin
Bo Bai
Original Assignee
Massachusetts Inst Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Inst Technology filed Critical Massachusetts Inst Technology
Publication of BRPI0508205A publication Critical patent/BRPI0508205A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

MéTODOS DE REMOçãO DE DEPóSITOS DE SUPERFìCIE A presente invenção refere-se a um método de limpeza de plasma remoto aprimorado para a remoção de depósitos superfíciais de uma superfície, tal como o lado interno de câmara de deposição que é utilizada na fabricação de dispositivos eletrónicos. O aprimoramento envolve o uso de gás ativado com alta temperatura neutra de pelo menos cerca de 3000 K. O aprimoramento também envolve a otimização de razões entre oxigênio e fluorocarbono para melhores velocidades de corrosão e controle dos gases de emissão.SURFACE DEPOSIT REMOVAL METHODS The present invention relates to an improved remote plasma cleaning method for removing surface deposits from a surface, such as the inner side of the deposition chamber that is used in the manufacture of electronic devices. The enhancement involves the use of high neutral temperature activated gas of at least about 3000 K. The enhancement also involves optimizing oxygen to fluorocarbon ratios for better corrosion velocities and emission gas control.

BRPI0508205-6A 2004-03-24 2005-03-24 surface deposit removal methods BRPI0508205A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US55622704P 2004-03-24 2004-03-24
US64044404P 2004-12-30 2004-12-30
US64083304P 2004-12-30 2004-12-30
PCT/US2005/010692 WO2005098086A2 (en) 2004-03-24 2005-03-24 Remote chamber methods for removing surface deposits

Publications (1)

Publication Number Publication Date
BRPI0508205A true BRPI0508205A (en) 2007-07-17

Family

ID=34965582

Family Applications (3)

Application Number Title Priority Date Filing Date
BRPI0508205-6A BRPI0508205A (en) 2004-03-24 2005-03-24 surface deposit removal methods
BRPI0508214-5A BRPI0508214A (en) 2004-03-24 2005-03-24 surface deposit removal methods
BRPI0508204-8A BRPI0508204A (en) 2004-03-24 2005-03-24 method of removing deposits from a surface

Family Applications After (2)

Application Number Title Priority Date Filing Date
BRPI0508214-5A BRPI0508214A (en) 2004-03-24 2005-03-24 surface deposit removal methods
BRPI0508204-8A BRPI0508204A (en) 2004-03-24 2005-03-24 method of removing deposits from a surface

Country Status (6)

Country Link
EP (3) EP1733072A2 (en)
JP (3) JP2007530792A (en)
KR (3) KR20070037434A (en)
BR (3) BRPI0508205A (en)
TW (3) TWI284929B (en)
WO (3) WO2005098086A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0697467A1 (en) * 1994-07-21 1996-02-21 Applied Materials, Inc. Method and apparatus for cleaning a deposition chamber
US7581549B2 (en) 2004-07-23 2009-09-01 Air Products And Chemicals, Inc. Method for removing carbon-containing residues from a substrate
JP2009503271A (en) * 2005-08-02 2009-01-29 マサチューセッツ インスティテュート オブ テクノロジー CVD / PECVD-remote chamber method using sulfur fluoride to remove surface deposits from inside a plasma chamber
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
US9212099B2 (en) * 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
US10240230B2 (en) * 2012-12-18 2019-03-26 Seastar Chemicals Inc. Process and method for in-situ dry cleaning of thin film deposition reactors and thin film layers
JP6202423B2 (en) * 2013-03-05 2017-09-27 パナソニックＩｐマネジメント株式会社 Plasma cleaning method and plasma cleaning apparatus
US9850568B2 (en) 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
CN112981369B (en) * 2013-12-30 2023-11-10 科慕埃弗西有限公司 Chamber Cleaning and Semiconductor Etching Gases
SG11202106864TA (en) * 2018-12-25 2021-07-29 Showa Denko Kk Adhesion removal method and film-forming method
US11854773B2 (en) 2020-03-31 2023-12-26 Applied Materials, Inc. Remote plasma cleaning of chambers for electronics manufacturing systems
CN116145106A (en) * 2023-02-21 2023-05-23 苏州鼎芯光电科技有限公司 Cleaning method for semiconductor coating process chamber

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158644A (en) * 1986-12-19 1992-10-27 Applied Materials, Inc. Reactor chamber self-cleaning process
JP2002280376A (en) * 2001-03-22 2002-09-27 Research Institute Of Innovative Technology For The Earth Method and apparatus of cleaning cvd apparatus

Also Published As

Publication number Publication date
WO2005095670A3 (en) 2006-05-04
WO2005090638A3 (en) 2006-04-13
WO2005095670A2 (en) 2005-10-13
BRPI0508204A (en) 2007-07-17
WO2005098086A3 (en) 2006-05-04
KR20070043697A (en) 2007-04-25
JP2007531289A (en) 2007-11-01
WO2005090638A8 (en) 2006-11-16
WO2005098086A2 (en) 2005-10-20
JP2007531288A (en) 2007-11-01
TW200623281A (en) 2006-07-01
TW200623251A (en) 2006-07-01
TWI281715B (en) 2007-05-21
EP1733071A2 (en) 2006-12-20
TWI281714B (en) 2007-05-21
WO2005090638A2 (en) 2005-09-29
BRPI0508214A (en) 2007-07-17
TWI284929B (en) 2007-08-01
TW200623240A (en) 2006-07-01
JP2007530792A (en) 2007-11-01
EP1737998A2 (en) 2007-01-03
EP1733072A2 (en) 2006-12-20
KR20070040748A (en) 2007-04-17
KR20070037434A (en) 2007-04-04
WO2005090638A9 (en) 2006-01-26

Similar Documents

Publication Publication Date Title
BRPI0508205A (en) surface deposit removal methods
DE602006005844D1 (en) METHOD FOR PRODUCING A MODIFIED GRINDING BOD PRESSURE
TWI264775B (en) Plasma etching method
BRPI0516136A (en) method and equipment for developing a group (iii) metal nitride film and group (iii) metal nitride film
TW200608489A (en) Plasma treatment method and plasma etching method
MY139113A (en) Methods of etching photoresist on substrates
TW200741857A (en) Plasma treating apparatus and plasma treating method
DE602006012037D1 (en) SCRATCH-RESISTANT COATED GLASS
PT1362213E (en) PROCESS AND DEVICE FOR CLEANING BURNING INSTALLATIONS
WO2007133413A3 (en) Photoresist stripping chamber and methods of etching photoresist on substrates
TW200729273A (en) Plasma abatement deivce
EA201071150A1 (en) COMPLETE OF ORGANIC CORROSION INHIBITOR FOR ORGANIC ACIDS
TW200718479A (en) Method of using sulfur fluoride for removing surface deposits
EP1986965A4 (en) Use of pvpp to remove contaminants from produced water of an oil or gas well
BR0317372A (en) Vacuum arc source with magnetic field generator device
BR0107178A (en) Process for re-melting without salt, free from oxidation, aluminum, its alloys, as well as aluminum scrap
AU2003276094A1 (en) Semiconductor surface treatment and mixture used therein
TW200620384A (en) Light source and method for mechanically stabilizing the filament or electrode of a light source
JP2014003023A5 (en)
KR20000023596A (en) Cleaning gas
MX2022004334A (en) Systems and methods for treating a metal substrate.
TW200727091A (en) Composition and method for removing a photoresist
AU2003254654A1 (en) System and method for sterilising by low temperature gaseous plasma
PL1742719T3 (en) A method for removing mercury from waste gas
TH88220A (en) Equipment and processes for treating substrate surfaces using activated reactive gas

Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired