WO2005088713A1 - Kühleinrichtung - Google Patents
Kühleinrichtung Download PDFInfo
- Publication number
- WO2005088713A1 WO2005088713A1 PCT/EP2005/002068 EP2005002068W WO2005088713A1 WO 2005088713 A1 WO2005088713 A1 WO 2005088713A1 EP 2005002068 W EP2005002068 W EP 2005002068W WO 2005088713 A1 WO2005088713 A1 WO 2005088713A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- heat sink
- heat exchange
- exchange means
- cooling device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a cooling device of an electrical device, in particular a power supply device, comprising a heat sink, which is arranged in an airtight or substantially airtight housing of the electrical device, through which a coolant can flow and on which heat generators, in particular electronic components, are mounted that transfer heat to the heat sink through contact transfer.
- An essentially airtight housing is understood to mean a housing which is ideally airtight but inadvertently has leaks or small gaps through which small amounts of air can penetrate or escape. In any case, no air flow for cooling is intentionally supplied to these housings or larger quantities of heated air are removed from the housing.
- housings of voltage transformers for example for plasma excitation, often have to be airtight. This is necessary because such devices are often used in clean rooms. Particles that are present inside the housing after assembly must not get into the clean rooms. For this reason, fans that cause an air exchange between the housing and the environment are not suitable for cooling. However, applications are also conceivable in which the devices are used in a dirty environment, where it must be avoided that ambient air gets into the housing. It is known to conduct the heat generated by components arranged in the housing out of the housing through coolant systems. The coolant usually flows through a heat sink, which is arranged in the housing. Components that heat up during operation are thermally coupled to this heat sink.
- the components that cannot or cannot be fully coupled to the heat sink are usually cooled by the ambient air. This cannot leave the housing. There is a build-up of heat that heats up the device internally. To avoid overheating of the device and components, the air must be cooled again. For this purpose, separate heat exchangers with a separate coolant circuit are often used.
- a cooling system is known from DE 195 24 115 C2, which dissipates thermal energy from the air in a closed system to a coolant circuit.
- the air that heats up on the electronic components, which are arranged in a housing, is cooled in an intermediate duct.
- the intermediate duct then dissipates its heat to the atmospheric air via a second air circulation.
- a coolant circuit is provided, with which converters arranged in the housing are cooled and the coolant of which is cooled by a cooler with atmospheric air.
- the applicant has set himself the task of improving a cooling device of the type mentioned at the outset and to provide a method for producing a cooling body of such a cooling device.
- this object is achieved by a cooling device of the type mentioned at the outset, in which heat-additionally heat exchange means connected to the heat sink are arranged for cooling air contained in the housing.
- Such a cooling device combines in a compact design a cooling body, which can be designed as a water cooling plate, for cooling directly mounted components and a heat exchanger for cooling the interior of the device. With such a cooling device, an additional air / water heat exchanger for cooling the air in the housing is no longer necessary. Additional water connections are eliminated, which reduces the risk of a leak.
- the device can be adapted very flexibly to the thermal requirements and mechanical conditions, particularly in compact devices. Appropriate construction of the heat exchange means makes three-dimensional designs easy and inexpensive to implement.
- the geometry of the heat exchange medium can be selected depending on the application. No separate coolant circuit is required to cool the heat exchange medium.
- the heat sink and the heat exchange medium can be implemented in one component in a space-saving manner.
- a fan is arranged in the housing.
- the heated air can circulate and the heated air can be swept well by the heated air.
- the cooling of the housing internal air can thus be made more effective.
- the heat exchange means are advantageously of lamellar design. This maximizes the heat exchange area for absorbing heat from the air inside the device.
- the heat sink is designed as a cooling plate, from which the heat exchange means protrude. This makes it compact Construction ensured. Electrical components that generate heat can be arranged in a particularly space-saving manner on a plate-like heat sink.
- the heat exchange means are arranged on one side and the heat generators on the opposite side of the heat sink.
- the rear of the heat sink, on which no components are arranged can be equipped almost completely with heat exchange means for cooling air contained in the housing. This means that the heat sink absorbs the heat of the components on one side and dissipates it directly to the coolant and on the opposite side it absorbs heat from the air surrounding the heat sink and dissipates it to the coolant.
- the effect of the cooling device can be further improved if the heat exchange means are arranged on two, in particular opposite, sides of the heat sink. This means that almost all of the free space on the heat sink, i.e. places on the heat sink that are not occupied by components can be equipped with heat exchange media and maximum heat can be extracted from the air in the housing. Due to the arrangement on two opposite sides, the heat sink can be designed as a plate and an overall relatively flat arrangement can be realized.
- the heat exchange means are arranged between heat generators.
- This measure allows heat to be dissipated directly from the immediate vicinity of the heat generator.
- a coolant channel is formed in the heat sink, which extends along the mounting positions of heat generators. This measure allows heat to be dissipated directly from the heat generators. This makes the cooling effect more effective.
- the coolant channel can be arranged and guided in the heat sink specific to the application. The coolant channel is preferably guided past the components with the greatest heat generation.
- heat exchange means of different heights are provided.
- the air flow in the housing can be influenced by this measure and an optimal heat transfer from the air into the heat exchange means and thus into the heat sink can take place.
- heat exchangers have different heights along their extension, i.e. protrude at different distances from the heat sink.
- the lamellar heat exchange means are soldered in heat exchange grooves of the heat sink. Because the heat exchange means are soldered in heat exchange grooves of the heat sink, the heat exchange medium is connected to the heat sink over a large area. This ensures good heat transfer from the heat exchangers to the heat sink.
- the air can flow through between the heat exchange means and a large amount of heat can be transferred from the air into the heat exchange means.
- the heat sink and / or the heat exchange means are preferably formed from copper or a higher-quality metal. This ensures good heat conduction.
- the heat exchangers and the heat sink can be soldered to one another in a particularly simple manner.
- the area defining the coolant channel should be made of copper or a higher-quality metal in order to prevent corrosion when the coolant flows through it. If lower-quality metals were used, electrochemical potentials would arise, which would lead to corrosion in the entire coolant circuit, ie not only in the area of the coolant channel.
- the object is also achieved by a method for producing a heat sink with the method steps: a. Creating a coolant channel groove in the heat sink; b. Forming a coolant channel by closing the coolant channel groove with a cover part; c. Arranging heat exchangers on the heat sink.
- a coolant can circulate or flow in the coolant channel in order to remove heat from the heat sink.
- heat can be transferred from the ambient air into the heat sink and thus to the coolant.
- the coolant channel groove can be produced, for example, by creating a coolant channel groove by milling in a heat sink.
- the shape of the cover part can essentially correspond to the shape or the course of the coolant channel groove.
- the coolant channel groove can be milled or created in some other way.
- the arrangement of the heat exchange means comprises the removal of a plurality of heat exchange grooves in the heat sink and the insertion of the heat exchange means in the heat exchange grooves.
- the heat exchange means can be arranged more stably on the heat sink and on the other hand that a large-area connection of the heat exchange means to the heat sink is realized. This would not be the case if, for example, heat exchange means designed as fins were simply placed on the heat sink with a narrow side.
- the connection, for example by soldering, of the heat exchange medium to the heat sink is facilitated.
- the cover part is soldered to the heat sink at a first soldering temperature, for example in the range from 270 ° to 350 ° C., in particular in the range from 290 to 307 ° C., and the heat exchange means at a second, lower soldering temperature, for example ⁇ 230 ° C, in particular ⁇ 200 ° C, are soldered to the heat sink.
- a first soldering temperature for example in the range from 270 ° to 350 ° C., in particular in the range from 290 to 307 ° C.
- the heat exchange means at a second, lower soldering temperature, for example ⁇ 230 ° C, in particular ⁇ 200 ° C, are soldered to the heat sink.
- soldering is carried out by induction heating.
- This procedure guarantees especially when used of a geometrically optimized inductor a quick heat input into the material and a very even heat distribution regardless of the heat sink geometry.
- an energy-saving heat input is possible with a high degree of efficiency and with an exactly adjustable temperature.
- induction heating can ensure that, during the second soldering process, the temperature at all points of the heat sink is reliably kept so low that the first soldered connection does not come loose again.
- the soldering of the heat exchange means is simplified if the heat exchange grooves are provided with a soldering aid, for example with a soldering flux and / or a soldering paste, before the heat exchange means are inserted.
- a soldering aid for example with a soldering flux and / or a soldering paste
- the side of the heat sink on which the heat exchange means are to be arranged is coated or covered with a soldering aid, so that at least when the heat exchange means are inserted into the heat exchange grooves, soldering aid gets into the heat exchange grooves.
- a second, wider depression is created along the coolant channel groove, the height of which corresponds approximately to the thickness of the cover part.
- the cover part can be inserted into this second, wider depression.
- the cover part does not protrude or only slightly protrudes from the surface of the heat sink. This creates an almost flat surface of the heat sink on which components can be easily arranged.
- the depression can also be created first, for example as a first groove, in the groove base of which a second narrower groove can be created for the coolant channel.
- the grooves are preferably milled. As a result, the coolant channel and the heat exchange grooves can be produced exactly.
- the cover part fits well when the cover part is produced by laser cutting.
- the cover part can for example consist of brass or a higher quality material. If the heat sink is made of copper, the cover part can be soldered to the heat sink particularly well. In addition, no corrosion can occur through a coolant, especially water.
- mounting aids in particular mounting holes, are introduced or attached in or on the heat sink.
- the components can thus be fixed in place on the heat sink.
- Such a face milling is only necessary in areas where components are mounted on the cooling plate. Such a face milling is not necessary in the areas where lamellas are applied.
- a layer stack consisting of a first layer, a second layer, in which the coolant channel groove is formed, and the cover part is soldered before the heat exchange grooves are introduced.
- the coolant channel groove does not have to be milled into the heat sink.
- no cover part has to be produced by laser cutting.
- the cover part can be a plate which essentially corresponds to the dimensions of the first layer.
- a soldering aid can be applied between the individual layers.
- the first and second layers and the cover part can be pressed together before soldering.
- To form the coolant channel a plurality of copper parts which form the second layer can be arranged on the first layer, the coolant channel being formed by the space between the parts.
- the heat exchange grooves can be milled in and the heat exchange means can be soldered to the heat sink.
- the cover part or the first layer can already have cooling fins, which would simplify production.
- FIG. 1 shows a perspective view of a heat sink with a coolant channel of a cooling device, but without a heat exchange medium
- FIG. 2 is a perspective view of the heat sink of FIG. 1 with the heat exchange grooves introduced;
- 3 is a perspective view of the heat sink of FIGS. 1, 2 after a further manufacturing step;
- Fig. 4 is a plan view of part of a heat sink to illustrate another manufacturing variant.
- the coolant channel 2 can be connected to an open coolant circuit, for example a water circuit. It is limited by a coolant channel groove 3 milled into the coolant body 1 and a cover part 4.
- the cover part 4 lies in a recess 5, the height of which corresponds approximately to the thickness of the cover part 4. This results in a flat surface 6 of the heat sink 1 when the cover part 4 is inserted.
- the heat sink 1 is preferably made of copper and the cover part 4 is made of brass.
- the cover part 4 is soldered to the heat sink 1. If copper or higher-quality metals are used, the coolant channel 2 is designed to be corrosion-resistant.
- FIG. 2 Another process step in the manufacture of the heat sink 1 of the cooling device according to the invention is shown in FIG. 2. After the cover part 4 has been soldered to the heat sink 1 in the widening 5, heat exchange grooves 8 are milled into the surface of the heat sink 1. Heat can be introduced into the coolant particularly well via heat exchange grooves 8, which are arranged above the coolant channel 2.
- a heat exchange medium 9.1 designed as a lamella is inserted, for example, into the heat exchange groove 8 and there with the heat sink 1 soldered. Due to the fact that the heat exchange medium 9.1 is inserted a little way into the heat exchange groove 8, heat can not only be introduced into the heat sink 1 at a point of the heat sink 1 opposite the narrow side 10, but also laterally via groove flanks 11.
- 1 heat generator 12 are arranged on the opposite side of the heat sink, in particular are screwed to it by means of screws 13. Instead of screws, any other component holder can be used, such as clamps. The heat of the heat generator 12 is at least partially absorbed by the heat sink 1.
- the heat exchange medium 9.2 shows, by way of example, that the heat exchange medium 9.2 can have different heights along its extent. In order to be able to better dissipate the heat from the surroundings of a component which can be mounted via the mounting aids 14 designed as mounting bores, the heat exchange medium 9.2 has a greater height in the section adjacent to the mounting aids 14. If fins similar to lamella 9.2 are used with different heights, they can make optimal use of the space in the housing and can be optimally adapted to components that are not mounted on the cooling plate in the housing and that have different heights.
- FIG. 4 shows a top view of a second layer 15 of the heat sink 1, which is produced in an alternative manufacturing method.
- the second layer 15 has the parts 15.1, 15.2 which are placed on a first layer 16.
- a coolant channel 2 is formed between parts 15.1, 15.2.
- a cover part, not shown, which has essentially the same base area as the first layer 16, can be placed on the first and second layers 15, 16. The layer stack formed in this way can then be soldered to a heat sink 1 before heat exchange grooves are milled.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Transformer Cooling (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007502229A JP2007529883A (ja) | 2004-03-11 | 2005-02-26 | 冷却装置 |
KR1020067021052A KR100874178B1 (ko) | 2004-03-11 | 2005-02-26 | 냉각 장치 |
EP05707651A EP1723670A1 (de) | 2004-03-11 | 2005-02-26 | Kühleinrichtung |
US11/530,242 US20070217148A1 (en) | 2004-03-11 | 2006-09-08 | Power supply cooling |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004012026.9 | 2004-03-11 | ||
DE102004012026A DE102004012026B3 (de) | 2004-03-11 | 2004-03-11 | Anordnung zum Kühlen |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/530,242 Continuation US20070217148A1 (en) | 2004-03-11 | 2006-09-08 | Power supply cooling |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005088713A1 true WO2005088713A1 (de) | 2005-09-22 |
Family
ID=34961007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/002068 WO2005088713A1 (de) | 2004-03-11 | 2005-02-26 | Kühleinrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070217148A1 (de) |
EP (1) | EP1723670A1 (de) |
JP (1) | JP2007529883A (de) |
KR (1) | KR100874178B1 (de) |
DE (1) | DE102004012026B3 (de) |
WO (1) | WO2005088713A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1770774A2 (de) * | 2005-09-29 | 2007-04-04 | Samsung Electronics Co., Ltd. | Kühlkörperanordnung |
DE102011052707A1 (de) * | 2011-08-15 | 2013-02-21 | Pierburg Gmbh | Kühlvorrichtung für ein thermisch belastetes Bauteil |
EP2701190A3 (de) * | 2012-08-21 | 2017-05-03 | Autokühler GmbH & Co. KG | Kühlkörper für mindestens ein zu kühlendes Bauelement sowie Verfahren zur Herstellung eines Kühlkörpers |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8614390B2 (en) * | 2008-06-10 | 2013-12-24 | Watts Thermoelectric, Llc | Automatic configuration of thermoelectric generation system to load requirements |
KR101630009B1 (ko) | 2013-03-29 | 2016-06-13 | 삼성전기주식회사 | 카메라 모듈 |
DE102013212724B3 (de) | 2013-06-28 | 2014-12-04 | TRUMPF Hüttinger GmbH + Co. KG | Kühlvorrichtung zur Kühlung eines Elektronikbauteils und Elektronikanordnung mit einer Kühlvorrichtung |
JP6378038B2 (ja) * | 2014-10-23 | 2018-08-22 | 株式会社Ihiエアロスペース | 中空構造体とその製造方法 |
FR3030331B1 (fr) * | 2014-12-18 | 2017-06-09 | Commissariat Energie Atomique | Procede de fabrication d'un radiateur comprenant un corps ayant une gorge de circulation de fluide fermee par une bande de tole |
JP6576182B2 (ja) * | 2015-09-17 | 2019-09-18 | 株式会社日立国際電気 | 放熱器の製造方法 |
CN107017728B (zh) * | 2017-05-27 | 2019-11-26 | 中山大洋电机股份有限公司 | 一种相变散热电机机壳及其应用的风冷电机 |
KR102218849B1 (ko) * | 2020-10-08 | 2021-02-23 | 주식회사 아이스트로 | 에너지 절감을 위한 오거식 제빙기의 냉매 파이프 부착 방법 및 오거식 제빙기 |
RU2760884C1 (ru) * | 2020-12-29 | 2021-12-01 | Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук | Двухфазная, гибридная, однокомпонентная система охлаждения электронного оборудования |
DE102021112415A1 (de) * | 2021-05-12 | 2022-11-17 | Erwin Quarder Systemtechnik Gmbh | Kühleinrichtung zum Abführen von Wärme |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01115146A (ja) * | 1987-10-29 | 1989-05-08 | Fanuc Ltd | 大電力トランジスタ用ヒートシンク |
US5293070A (en) * | 1991-04-08 | 1994-03-08 | General Electric Company | Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules |
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
DE19524115A1 (de) * | 1995-07-03 | 1997-01-16 | Abb Patent Gmbh | Stromrichtergerät mit unterteilten Funktionsräumen |
EP0985999A1 (de) * | 1998-08-11 | 2000-03-15 | Fujitsu Limited | Flüssigkeitsgekühltes elektronisches Gerät |
US20010008071A1 (en) * | 1999-11-04 | 2001-07-19 | Macias Jose Javier | Computer enclosure cooling unit |
US20010017763A1 (en) * | 2000-02-11 | 2001-08-30 | Stefan Kaufmann | Cooling device for a high-power semiconductor module |
US20020117291A1 (en) * | 2000-05-25 | 2002-08-29 | Kioan Cheon | Computer having cooling apparatus and heat exchanging device of the cooling apparatus |
EP1524692A2 (de) * | 2003-10-08 | 2005-04-20 | Hitachi, Ltd. | Flüssigkeitsdurchströmter Kühlmantel zum Kühlen einer elektronischen Vorrichtung |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3961666A (en) * | 1972-11-24 | 1976-06-08 | Sony Corporation | Heat dispersion device for use in an electronic apparatus |
DE8703080U1 (de) * | 1987-02-27 | 1987-04-23 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
JP2519088B2 (ja) * | 1988-07-13 | 1996-07-31 | 花王株式会社 | 洗浄剤組成物 |
DE4416616C2 (de) * | 1994-05-11 | 1997-05-22 | Fichtel & Sachs Ag | Gehäuse |
US5774334A (en) * | 1994-08-26 | 1998-06-30 | Hitachi, Ltd. | Low thermal resistant, fluid-cooled semiconductor module |
US6305463B1 (en) * | 1996-02-22 | 2001-10-23 | Silicon Graphics, Inc. | Air or liquid cooled computer module cold plate |
US5915463A (en) * | 1996-03-23 | 1999-06-29 | Motorola, Inc. | Heat dissipation apparatus and method |
US5930113A (en) * | 1996-06-03 | 1999-07-27 | Scientific-Atlanta, Inc. | Housing for electronic devices including internal fins for volumetric cooling |
DE19643717A1 (de) * | 1996-10-23 | 1998-04-30 | Asea Brown Boveri | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul |
EP0954210A1 (de) * | 1998-04-28 | 1999-11-03 | Lucent Technologies Inc. | Kühlung für elektronisches Gerät |
DE19924957B4 (de) * | 1999-05-31 | 2004-07-29 | Siemens Ag | Vorrichtung zur Kühlung eines in einem Gehäuse befestigten elektronischen Bauteils |
JP3852253B2 (ja) * | 1999-10-21 | 2006-11-29 | 富士通株式会社 | 電子部品の冷却装置及び電子機器 |
US6414867B2 (en) * | 2000-02-16 | 2002-07-02 | Hitachi, Ltd. | Power inverter |
US6404628B1 (en) * | 2000-07-21 | 2002-06-11 | General Motors Corporation | Integrated power electronics cooling housing |
DE10039770A1 (de) * | 2000-08-16 | 2002-02-28 | Bosch Gmbh Robert | Kühlvorrichtung |
JP3552047B2 (ja) * | 2000-10-25 | 2004-08-11 | 古河電気工業株式会社 | ヒートシンク、その製造方法、および、押圧治具 |
WO2002049106A1 (en) * | 2000-12-11 | 2002-06-20 | Fujitsu Limited | Electronic device unit |
JP3676719B2 (ja) * | 2001-10-09 | 2005-07-27 | 株式会社日立製作所 | 水冷インバータ |
DE10161536B4 (de) * | 2001-12-10 | 2005-06-23 | e-motion Gesellschaft für Antriebstechnik mbH | Schaltungsanordnung |
JP3907580B2 (ja) * | 2002-12-11 | 2007-04-18 | 富士通株式会社 | 通信装置 |
TW200500838A (en) * | 2003-02-19 | 2005-01-01 | Nisvara Inc | System and apparatus for heat removal |
US20050083655A1 (en) * | 2003-10-15 | 2005-04-21 | Visteon Global Technologies, Inc. | Dielectric thermal stack for the cooling of high power electronics |
US20050128710A1 (en) * | 2003-12-15 | 2005-06-16 | Beiteimal Abdlmonem H. | Cooling system for electronic components |
US7222660B2 (en) * | 2004-10-04 | 2007-05-29 | Tellabs Petaluma, Inc. | Cabinet with an environmentally-sealed air-to-air heat exchanger |
-
2004
- 2004-03-11 DE DE102004012026A patent/DE102004012026B3/de not_active Expired - Fee Related
-
2005
- 2005-02-26 KR KR1020067021052A patent/KR100874178B1/ko not_active IP Right Cessation
- 2005-02-26 EP EP05707651A patent/EP1723670A1/de not_active Withdrawn
- 2005-02-26 WO PCT/EP2005/002068 patent/WO2005088713A1/de active Application Filing
- 2005-02-26 JP JP2007502229A patent/JP2007529883A/ja active Pending
-
2006
- 2006-09-08 US US11/530,242 patent/US20070217148A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01115146A (ja) * | 1987-10-29 | 1989-05-08 | Fanuc Ltd | 大電力トランジスタ用ヒートシンク |
US5293070A (en) * | 1991-04-08 | 1994-03-08 | General Electric Company | Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules |
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
DE19524115A1 (de) * | 1995-07-03 | 1997-01-16 | Abb Patent Gmbh | Stromrichtergerät mit unterteilten Funktionsräumen |
EP0985999A1 (de) * | 1998-08-11 | 2000-03-15 | Fujitsu Limited | Flüssigkeitsgekühltes elektronisches Gerät |
US20010008071A1 (en) * | 1999-11-04 | 2001-07-19 | Macias Jose Javier | Computer enclosure cooling unit |
US20010017763A1 (en) * | 2000-02-11 | 2001-08-30 | Stefan Kaufmann | Cooling device for a high-power semiconductor module |
US20020117291A1 (en) * | 2000-05-25 | 2002-08-29 | Kioan Cheon | Computer having cooling apparatus and heat exchanging device of the cooling apparatus |
EP1524692A2 (de) * | 2003-10-08 | 2005-04-20 | Hitachi, Ltd. | Flüssigkeitsdurchströmter Kühlmantel zum Kühlen einer elektronischen Vorrichtung |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 013, no. 356 (E - 803) 9 August 1989 (1989-08-09) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1770774A2 (de) * | 2005-09-29 | 2007-04-04 | Samsung Electronics Co., Ltd. | Kühlkörperanordnung |
EP1770774A3 (de) * | 2005-09-29 | 2008-08-06 | Samsung Electronics Co., Ltd. | Kühlkörperanordnung |
DE102011052707A1 (de) * | 2011-08-15 | 2013-02-21 | Pierburg Gmbh | Kühlvorrichtung für ein thermisch belastetes Bauteil |
EP2701190A3 (de) * | 2012-08-21 | 2017-05-03 | Autokühler GmbH & Co. KG | Kühlkörper für mindestens ein zu kühlendes Bauelement sowie Verfahren zur Herstellung eines Kühlkörpers |
Also Published As
Publication number | Publication date |
---|---|
DE102004012026B3 (de) | 2005-11-17 |
EP1723670A1 (de) | 2006-11-22 |
KR100874178B1 (ko) | 2008-12-15 |
JP2007529883A (ja) | 2007-10-25 |
KR20070007136A (ko) | 2007-01-12 |
US20070217148A1 (en) | 2007-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005088713A1 (de) | Kühleinrichtung | |
DE102006057796B4 (de) | Kühlanordnung für Wärme erzeugende elektrische Komponenten und elektrisches Gerät damit | |
EP1961281B1 (de) | Gerät, baureihe von geräten, vorrichtung mit gehäuseteilen, verfahren, verwendung eines luftkühlers und verwendung eines flüssigkeitskühlers | |
EP1395098B1 (de) | Elektrische Heizung für Kraftfahrzeuge | |
DE102013212724B3 (de) | Kühlvorrichtung zur Kühlung eines Elektronikbauteils und Elektronikanordnung mit einer Kühlvorrichtung | |
EP1748484A2 (de) | Vorrichtung zur Kühlung von elektronischen Bauelementen | |
DE102007050405B4 (de) | Elektrische Leistungskomponente, insbesondere Leistungshalbleiter-Modul, mit einer Kühlvorrichtung und Verfahren zum flächigen und wärmeleitenden Anbinden einer Kühlvorrichtung an eine elektrische Leistungskomponente | |
DE102006019376A1 (de) | Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge | |
EP1649736A2 (de) | Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor | |
EP2114116B1 (de) | Hybridkühlung | |
EP0844808A2 (de) | Leiterplattenanordnung | |
DE102005026662A1 (de) | Lichtquelle für die Endoskopie oder Mikroskopie | |
DE112011101941B4 (de) | Verfahren zum Aufbauen eines Wärmetauschers sowie Wärmetauschervorrichtung | |
DE102007002492A1 (de) | Plattenförmig aufgebauter Wärmetauscher, Kühlvorrichtung und Verfahren zur Herstellung eines Wärmetauschers | |
WO2019243326A1 (de) | Diodenlaseranordnung und verfahren zur herstellung einer diodenlaseranordnung | |
DE102005001360A1 (de) | Kühlvorrichtung, insbesondere für ein elektrisches Leistungshalbleiterbauelement | |
DE102021202654A1 (de) | Wärmeableitvorrichtung und Steuergeräteanordnung | |
DE202010007872U1 (de) | Thermoelektrischer Generator | |
WO2021155997A1 (de) | Elektrische heizvorrichtung und verfahren zum herstellen einer heizvorrichtung | |
DE102020213849A1 (de) | Flüssigkeits-Kühlkörper, insbesondere zur Kühlung von Leistungselektronik-Bauelementen | |
DE4422114A1 (de) | Gehäusetopf für Elektronikmodule und Verfahren zur Herstellung desselben | |
DE102019213956A1 (de) | (Leistungs-)Elektronikanordnung mit einer effizienten Kühlung | |
DE102019207808A1 (de) | Kälteplatte für Elektronik | |
EP3025109A1 (de) | Wärmeübertrager und verfahren zu dessen herstellung und verwendung | |
CH377941A (de) | Anordnung zur Ableitkühlung einer wärmemässig stark belasteten Elektrode einer Elektronenröhre in einem Hochfrequenzgerät |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005707651 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 11530242 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007502229 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020067021052 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2005707651 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020067021052 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 11530242 Country of ref document: US |