WO2005057650A1 - Appareil de separation par jet d'eau pour fabrication de semiconducteurs et procede de separation de semiconducteurs - Google Patents

Appareil de separation par jet d'eau pour fabrication de semiconducteurs et procede de separation de semiconducteurs Download PDF

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Publication number
WO2005057650A1
WO2005057650A1 PCT/KR2004/001589 KR2004001589W WO2005057650A1 WO 2005057650 A1 WO2005057650 A1 WO 2005057650A1 KR 2004001589 W KR2004001589 W KR 2004001589W WO 2005057650 A1 WO2005057650 A1 WO 2005057650A1
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WO
WIPO (PCT)
Prior art keywords
lead frame
bbck
water jet
vacuum fixing
cutting
Prior art date
Application number
PCT/KR2004/001589
Other languages
English (en)
Inventor
Seo Il Yang
Original Assignee
Sunyang Tech Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2003-0090773A external-priority patent/KR100538939B1/ko
Priority claimed from KR10-2004-0010924A external-priority patent/KR100538943B1/ko
Application filed by Sunyang Tech Co., Ltd. filed Critical Sunyang Tech Co., Ltd.
Publication of WO2005057650A1 publication Critical patent/WO2005057650A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the invention relates to a water jet singulation apparatus for semiconductor manufacture and singulation method thereof, more particularly, relates to a water jet singulation apparatus for semiconductor manufacture and a singulation method thereof wherein the damage or drift of the semiconductor package may be prevented during cutting step so that the product of high quality may be manufactured as well as the productivity may be increased.
  • a semiconductor singulation apparatus is the apparatus to angulate the respective semiconductor packages which have been disposed on a lead frame and molded by resin compound into separate units.
  • the disk saw type signuaMon apparatus has been applied for precise cutting.
  • the disk saw type singulation apparatus has problem that the disk saw is rotated in high speed and cuts the semiconductor package so that heat may be generated during the cutting step and the quality of the semiconductor may be worsened owing to heat. And, the amount of the production may be limited owing to heat generated during the cutting step and the quality of the product is not satisfactory because burr and etc may be caused at the cutting surface of the singulated unit.
  • a water jet cutting apparatus shoots the water mixed with abrasives(it will be described as water jet bebw) to a workpiece in high pressure and makes the workpiece cut by the water jet.
  • the water jet cutting apparatus has the advantage that next finishing step is not required because it could cut the workpiece into a predetermined size clearly.
  • a semiconductor fixing apparatus which could keep the semiconductor package in a fixed state after the semiconductor package is singulated into separate units as well as the water jet may be drained smoothly without being interference.
  • the cutting method by which even the semiconductor positioned at the side of the molding portion 8 may be cut precisely.
  • the invention is created to solve the above described problems and so the object of the invention is to provide a water jet singulation apparatus for semiconductor package and the singulation method thereof wherein the semiconductor package is not damaged or drifted during cutting step so that the product of high quality may be manufactured as well as the productivity may be increased.
  • a water jet singulation apparatus for semiconductor manufacture which may shoot a water jet through a nozzle 3 in high pressure and may cut a semiconductor lead frame 7 fixed on a vacuum fixing bbck 10 into separate package 9 units ;
  • a seat portion 13 is formed at the upper surface of the vacuum fixing bbck 10
  • a plurality of vacuum lines 30 connected to a vacuum generator 37 and a plurality of sits 20 to pass the water jet are formed parallel to each other, a plurality of vacuum holes 15 are formed at the sits 20 in predetermined interval, and wherein the slits 20 have been penetrated from the upper surface to the bwer surface of the vacuum fixing bbck 10 so that the water jet may be drained to a water collector 5 positioned at the bwer side of the vacuum fixing bbck 10.
  • the water jet singulation apparatus for semiconductor manufacture wherein the vacuum fixing bbck 10 is divided into a first vacuum fixing bbck 10 in which a plurality of parallel slits 20 are formed abng X axis direction and a second vacuum fixing bbck 10 in which a plurality of parallel slits 20 are formed abng Y axis direction, and wherein a picker 40 is mounted over the upper surface of the first and the second vacuum fixing bbck 10s so that a lead frame 7 may be moved from the first bbck 10b to the second bbck 10a by the picker 40.
  • the water jet singulation apparatus for semiconductor manufacture wherein the vacuum fixing bbck 10 is formed with a single bbck in which a plurality of parallel sits 20 have been formed abng one direction, and wherein a picker 40 is positioned over the upper surface of the vacuum fixing bbck 10 and the lead frame 7 is lifted and seated again on the upper surface of the vacuum fixing bbck 10 by the picker 40, and a rotation means 45 is connected to the picker 40 so that the picker 40 may be rotated by the rotation means 45 in 90j/Ewhen the lead frame 7 has been lifted by the picker 40.
  • the water jet singulation apparatus for semiconductor manufacture wherein the sits 20 are extending to the position out of the outermost package 9a of the lead frame 7 which has been seated on the vacuum fixing bbck 10.
  • the water jet singulation apparatus for semiconductor manufacture wherein start point holes 26 are formed at both ends of the slit positioned at one end side among the sits 20 and the width of the start point holes 26 are wider than that of the sits 20.
  • the water jet singulation apparatus for semiconductor manufacture wherein a pluralty of absorption members 14 wih a plurality of vacuum holes 15 are mounted on the seat portion 13 of the vacuum fixing bbck 10 in order that they may not be interfered with the slits 20.
  • the water jet singulation apparatus for semiconductor manufacture wherein the vacuum fixing bbck 10 is divided into a plurality of bbcks corresponding to the respective molding portion 8 of the lead frame 7.
  • a water jet singulation apparatus for semiconductor manufacture which firstly cutsa lead frame 7 on a vacuum fixing bbck 10 abng one direction, and secondly cuts the lead frame 7 abng the direction crossing the first cutting direction,
  • [18] comprising a taping means 70 which is positioned over the vacuum fixing bbck 10 and is moved horizontally to attach a tape 77 on the upper surface of the lead frame 7 which has been cut firstly;
  • the water jet singulation apparatus for semiconductor manufacture wherein the taping means 70 comprises a moving bbck 74 which is mounted over the vacuum fixing bbck 10 and is moved abng horizontal direction, a pressing roller 73 which is mounted at the moving bbck 74 and presses the supplied tape 77 on the upper surface of the lead frame 7, and a cutter 75 which may cut the tape 77 in a predetermined length.
  • the water jet singulation apparatus for semiconductor manufacture wherein the peeling means 80 comprises a pusher 85 which is mounted at one side of the vacuum fixing bbck 10 to be movable upwardly and detaches one end of the tape 77 attached on the lead frame 7, a moving bbck 74 which is positioned over the vacuum fixing bbck 10 and may be moved forward and backward, and a gripper 81 which is mounted at the moving bbck 74 and grips one end of the peeled tape 77 and removes the tape 77 from the lead frame 7 during the moving bbck 74 is moved.
  • the peeling means 80 comprises a pusher 85 which is mounted at one side of the vacuum fixing bbck 10 to be movable upwardly and detaches one end of the tape 77 attached on the lead frame 7, a moving bbck 74 which is positioned over the vacuum fixing bbck 10 and may be moved forward and backward, and a gripper 81 which is mounted at the moving bbck 74 and grips one
  • the water jet singulation apparatus for semiconductor manufacture wherein a support roller 84 is mounted at one side of the peeling means 80 in order to be contacted to the upper surface of the lead frame 7 and the support roller 84 may prevent the singulated package units 9 from being attached to the tape 77 which is being peeled and from being removed together with the tape 77.
  • a water jet singulation method for semiconductor manufacture wherein a lead frame 7 is seated on a vacuum fixing bbck 10 having a plurality of vacuum lines 30 and a plurality of parallel sits 20, a water jet is shot in high pressure and the lead frame 7 is singulated into separate packages 9,
  • [24] comprising a cutting step 51a, 53a wherein the nozzle 3 is moved abng the slits 20 in predetermined cutting speed and the lead frame 7 is cut in straight line;
  • the water jet singulation method for semiconductor manufacture wherein the lead frame 7 is passed through a first cutting step in which a plurality of parallel cutting lines may be formed by the nozzle 3 moving abng the direction crossing the direction to which resin compound have been injected during chip molding step or abng the direction crossing the virtual line connecting the both pin hole 7 a of the lead frame 7, and a second cutting step in which the nozzle 3 is moved abng the direction crossing that of the first cutting step so that a plurality of second cutting lines 53 crossing the first cutting line 51s may be formed at the lead frame 7,
  • the respective semiconductor packages 9 may be cut in grid pattern through the first and the second cutting step.
  • the water jet singulation method for semiconductor manufacture wherein the lead frame 7 is moved by different vacuum fixing bbck 10s so that the first and the second cutting step may be performed.
  • the water jet singulation method for semiconductor manufacture wherein the lead frame 7 passed through the first cutting step may be lifted from the vacuum fixing bbck 10 by the picker 40 to be rotated in 90j/E, and the lead frame 7 is seated again on the vacuum fixing bbck 10 and is cut secondly.
  • a water jet singulation method for semiconductor manufacture wherein a lead frame 7 is seated on a vacuum fixing bbck 10 having a plurality of vacuum line 30 and a plurality of parallel sits 20, a water jet is shot in high pressure and the lead frame 7 is singulated in separate packages 9,
  • the water jet singulation method for semiconductor manufacture wherein the lead frame 7 is passed through a first cutting step in which a plurality of parallel cutting lines may be formed by the nozzle 3 moving abng the direction crossing the direction to which resin compound have been injected during chip molding step or abng the direction crossing the virtual line connecting the both pin hole 7 a of the lead frame 7, and a second cutting step in which the nozzle 3 is moved abng the direction crossing that of the first cutting step so that a plurality of second cutting lines 53 crossing the first cutting line 51s may be formed at the lead frame 7,
  • the respective semiconductor packages 9 may be cut in grid pattern through the first and the second cutting step.
  • the water jet singulation method for semiconductor manufacture wherein the first and the second cutting step may be performed by moving the lead frame 7 with different vacuum fixing bbck 10.
  • the water jet singulation method for semiconductor manufacture wherein the lead frame 7 passed through the first cutting step may be lifted from the vacuum fixing bbck 10 by the picker 40 to be rotated in 90j/E, and the lead frame 7 is seated again on the vacuum fixing bbck 10 and is cut secondly.
  • a water jet singulation method for semiconductor manufacture wherein a lead frame 7 is singulated by a singulation apparatus and the singulation apparatus comprises a vacuum fixing bbck 10 which may fix a lead frame 7, a taping means 70 which attaches a tape 77 on the upper surface of the lead frame 7, and a peeling means 80 which peels the tape 77 from the lead frame 7;
  • [38] comprising a first cutting step in which the lead frame 7 is cut abng the one direction, a first taping step wherein a tape 77 of a predetermined length is attached on the upper surface of the lead frame 7 which has been cut firstly, a second cutting step wherein the lead frame 7 which the tape 77 is attached on its upper surface is cut abng the direction crossing that of the first cutting step and the lead frame 7 is singulated into the respective package units 9, and a peeling step in which the tape 77 on the upper surface of the lead frame 7 is peeled by the peeling means 80.
  • the water jet singulation method for semiconductor manufacture wherein a second taping step is further provided between the second cutting step and the peeling step, and a tape 77 of a predetermined length is additionally attached on the upper surface of the lead frame 7 by the taping means 70.
  • Figure 1 is a top view of a semiconductor lead frame.
  • Figure 2 is a perspective view of one embodiment.
  • Figure 3 is a perspective view of another embodiment.
  • Figure 4 is a dissembled perspective view of the vacuum fixing bbck of the invention.
  • FIG. 5 is a perspective showing another embodiment of the vacuum fixing bbck of the invention.
  • Figure 6 is a process view of a first cutting step.
  • Figure 7 is a process view of a second cutting step.
  • Figure 8 is a schematic view of the nozzle.
  • Figure 9 is another embodiment of the invention.
  • Figure 10 is a process view of Figure 9.
  • FIG. 2 is a perspective view of one embodiment of the invention.
  • the lead frame 7 of Figure 1 is seated on the upper surface of a vacuum fixing bbck 10 10
  • a water jet of high pressure is shot through a nozzle 3 moving over the upper position of the lead frame 7, and the water jet cuts the lead frame 7 as being passed through the slits 20 of the vacuum fixing bbck 10 so that it is drained to the water collector 5 positioned at the bwer side of the vacuum fixing bbck 10.
  • the vacuum fixing bbck 10 is to fix a lead frame 7 seated on its upper surface by vacuum force, and a seat portion 13 of molding portion of lead frame 7 is mounted on the upper surface of the vacuum fixing bbck 10. And, the vacuum lines 30 of Figure 4 connected to a vacuum generator 37 and sits 20 for passing a water jet have been alternately formed in the vacuum fixing bbck 10. And, a plurality of vacuum holes 15 connected to the seat portion 13 are formed at the sits 20s.
  • the seat portion 13 are formed on the upper surface of the vacuum fixing bbck 10 in a predetermined interval in order that they may correspond to the molding portion 8 of the lead frame 7 of Figure 1. And, the respective seat portion 13 is formed wih a pluralty of absorption members 14 of strip shape which have been attached on the upper surface of the vacuum fixing bbck 10. Here, the absorption members 14 are not interfered wih the slits 20 of the vacuum fixing bbck 10.
  • the vacuum lines 30 are formed with main lines of both sides and a plurality of sub lines.
  • the main lines are formed in the vacuum fixing bbck 10 and connected to the vacuum generator 37 of Figure 2.
  • the sub lines are formed abng the direction crossing the main lines and connected to one main line.
  • the adjacent sub lines are alternately formed in order to be connected to the main lines which are formed at the opposite side.
  • the slits 20 are penetrated from the upper side to the bwer side of the vacuum fixing bbck 10 so that the water jet of high pressure cuts the lead frame 7 and is drained to the water collector 5 positioned at the bwer side.
  • the sits 20 are formed between the respective sub lines.
  • the slits 20 are extending to the position out of the outermost package 9a of the lead frame 7(shown in Figure 1) which are seated on the vacuum fixing bbck 10. Accordingly, although the cutting speed is bw as the nozzle 3 starts to move or stop and the cutting width may be widened, the semiconductor package 9 may not be damaged.
  • Start point holes 26 are formed at both ends of the slit 20 positioned at outer end.
  • the start point holes 26 are penetrated from the upper surface to the bwer surface of the vacuum fixing bbck 10 and the width of the start points are wider than that of the slits 20. Therefore, the water jet may be shot through the start point holes 26 before the lead frame 7 is cut so that the position or the width and so on of the water jet may be watched directly.
  • the vacuum lines 30 and the sits 20 may be formed in a single bbck or they may be formed in a pair of bbcks so that the two bbcks are combined with each other and one vacuum fixing bbck 10 may be formed.
  • the vacuum fixing bbck 10 may be divided into a first bbck 10b and a second bbck 10a.
  • the first bbck 10b has a plurality of slits 20 which are formed abng the bngitudinal direction (it will be descried as Y axis direction) of the bbck.
  • the second bbck 10a has a plurality of slits 20 which are formed abng the wide direction (it will be described as X axis direction) of the bbck.
  • single bbck in which the slits 20 be formed only abng X axis or Y axis direction may be used.
  • the lead frame 7 may be moved from the first bbck 10b to the second bbck 10a by the picker 40 so that it may be cut by the water jet. So to speak, the lead frame 7 is cut abng Y axis direction on the first bbck 10b and it may be cut again abng X axis direction on the second bbck 10a so that the package 9 may be cut into separate units.
  • a picker 40 is positioned over the vacuum fixing bbck 10, by which the lead frame 7 may be lifted over the vacuum fixing bbck 10 and be seated again on the vacuum fixing bbck 10.
  • a rotation means 45 is connected to the picker 40 so that the picker 40 may be rotated in 90j/Eby the rotation means 45 when the lead frame 7 is lifted by the picker 40.
  • the vacuum fixing bbck 10 may be formed in single bbck which has a plurality of seat portion 13 on its upper surface. However, as shown in Figure 5, the vacuum fixing bbck 10 is divided into a plurality of bbck units which have a seat portion 13 on their upper surface so that the bbck units may be connected and be used as the vacuum fixing bbck 10 according to the structure of the lead frame 7.
  • a pair of positioning pins 12 are respectively formed on both sides of the upper surface of the vacuum fixing bbck 10 and pin holes 7a at both sides of the lead frame 7 may be inserted into the positioning pins 12 so that the lead frame 7 may be stably placed at right position.
  • the water collector 5 is a tank which is positioned bebw the vacuum fixing bbck 10. Therefore, the water jet for cutting the lead frame 7 may be drained through the slits 20 and the water jet collected in the water collector 5 may be again supplied to the nozzle 3.
  • a mixing vane 61 rotated by a motor 60 is positioned in the water collector 5 in order that it may be sunk in the drained water. Accordingly, the abrasives may be uniformly mixed with water and be supplied to the nozzle 3.
  • the nozzle 3 shoots the water jet in high pressure and makes the lead frame 7 cut by pressure of the water jet.
  • the nozzle 3, as shown in Figure 8, includes a main pipe 3a which supplies the water jet in high pressure, a distributor 3c which is connected to the main pipe and has a plurality of branch holes 3b in its inner space, and a plurality of nozzle 3 connected to the respective branch holes 3b. And, the position of the nozzle 3 may be exactly adjusted by an adjustment screw 3d of micrometer type.
  • the semiconductor lead frame 7 is supplied to the vacuum fixing bbck 10 to be absorbingly fixed on the vacuum fixing bbck 10 and the lead frame 7 is cut by the water jet of high pressure which has been shot through the nozzle 3 moving over the vacuum fixing bbck 10.
  • the water jet shot through the nozzle 3 cuts the lead frame 7 and is drained into the water collector 5 positioned at the bwer side through the slits 20 of the vacuum fixing bbck 10.
  • the water jet collected in the water collector 5 may be pumped again to the nozzle 3 so that the cutting step may be repeated.
  • the nozzle 3 is passed through a first cutting step and a second cutting step so that it singulates the lead frame 7 into separate units .
  • the nozzle 3 is moved between the respective semiconductor packages 9 in zigzag direction and forms a plurality of the first cutting lines 51 only abng one direction.
  • the nozzle 3 is moved abng the direction crossing that of the first cutting step and forms a plurality of the second cutting line 53 crossing the first cutting line 51. Accordingly, the lead frame 7 is singulated into separate units of grid pattern.
  • the nozzle 3 is forwardly moved abng the slits 20 of the vacuum fixing bbck 10 in predetermined cutting speed, and as shown in Figure 6 and Figure 7, the nozzle 3 repeats a cutting step 51a,53a in which the area between the rows of the respective semiconductor package 9 are cut in straight line, a non cutting step 5 lb, 53b in which the nozzle 3 is rapidly moved from the end of the cutting line to the next row of the package 9 abng the direction crossing that of the cutting step 51a,53a, a cutting step 51a,53a in which the nozzle 3 is backwardly moved between the area between the rows of the semiconductor package 9, and a non cutting step 51b,53b in which the nozzle 3 is rapidly moved from the end of the cutting line to the next package row of the package 9 abng the direction crossing that of the cutting step 51a,53a so that the nozzle 3 is repeatedly moved in zigzag direction and the lead frame 7 is cut abng only one direction.
  • the nozzle 3 shoots the water jet with rapidly moving at the speed three times or more(preferably, over five times) that of the cutting step 51a,53a so that the lead frame 7 is not cut by the water jet during non cutting step 51b,53b.
  • the lead frame 7 is passed through the first and the second cutting step 51a,53a and is cut into package units 9 of grid pattern by the first and the second cutting line 51,53, and the starting and the ending points of the first and the second cutting line 51,53 are overcut 55 in order that they may be formed at the position out of the outermost package 9a.
  • the moving speed of the nozzle 3 goes sbwer than that of the other moment so that the cutting width of these points is wider than that of the other moment.
  • the nozzle 3 is started to move and stop at the position out of the outermost package 9a so that the outermost semiconductor package 9 may be cut in the same width as that of the semiconductor package 9 positioned at the inner side and the semiconductor package 9 may not be damaged by irregularity of the cutting width.
  • a plurality of the first cutting lines 51 are firstly formed at the first cutting step in such a way that they may be cut abng the direction crossing the direction where the resin compound is injected during molding step of the semiconductor chip, and the second cutting lines 53 are formed abng the direction crossing that of the first cutting line 51s during the second cutting step. Therefore, although the resin molding portion 8 is cut in a plurality of narrow and bng strips at the first cutting step, the strips may not be bent owing to the inner stress.
  • the direction crossing the first cutting direction (the direction to which the resin compound is injected) is equal to the virtual straight lines which connect the pin holes 7 a positioned at both sides of the lead frame 7.
  • the cutting step 51a,53a may be performed because the direction of the first cutting line 51 may be set on the baas of the direction crossing the virtual straight lines which connect the pin holes 7a of both sides.
  • the molding portion 8 which have been narrowly and bng is lifted from the vacuum fixing bbck 10 and the vacuum fixing force is released so that the cutting step may not be continued because the lead frame 7 is easiy drifted and the semiconductor package 9 may be damaged owing to the water jet of high pressure.
  • the cutting step may be previously performed abng the direction crossing the direction to which the resin compound is injected during molding step and the inner stress may be applied only abng the narrow width direction of the molding portion 8 which have been cut narrowly and bng, the bending force is not accumulated at the lead frame 7 and the vacuum force is not released.
  • the first and the second cutting step may be performed by moving the lead frame 7 to different vacuum fixing bbck 10, or, as shown in Figure 3, they may be performed through the method in which the lead frame 7 is firstly cut on one vacuum fixing bbck 10 and the lead frame 7 is rotated in 90j/Eto be cut secondly.
  • a method for cutting the lead frame 7 by changing the vacuum bbck is the method for singulating the respective semiconductor packages 9 in grid pattern by forming a plurality of the first cutting line 51 of Figure 6 abng one direction on the firs bbck whose sits 20 are formed abng one direction, and by forming a plurality of the second cutting line 53 of Figure 7 abng the direction crossing that of the first cutting line 51 on the second bbck 10a whose sits 20 are formed abng the direction crossing those of the first bbck 10b.
  • a method for cutting the lead frame 7 on one vacuum fixing bbck 10, as shown in Figure 3 is the method for singulating the respective semiconductor package 9 by firstly forming a plurality of cutting lines at the lead frame 7 abng one direction, then lifting and rotating the lead frame 7 in 90; /E, and placing the lead frame 7 again on the vacuum fixing bbck 10 and forming a plurality of the second cutting line 53 abng the direction crossing that of the first cutting line 51.
  • Figure 9 and Figure 10 are respectively a perspective view and a process view of another embodiment of the invention.
  • the lead frame 7 fixed on the vacuum fixing bbck 10 is cut abng Y axis direction by the water jet of high pressure, and a tape 77 is attached on the upper surface of the lead frame 7 by a taping means 70, and the lead frame 7 is cut abng X axis direction secondly. Therefore, the package units 9 of small size may be firmly fixed by vacuum fixing force as well as the bonding force of the tape 77 so that the package units 9 are not drifted in cutting step 51a,53a. And, the tape 77 may be detached by a peeling means 80 after singulation step.
  • the vacuum fixing bbck 10 the picker 40, the nozzle 3, and the water collector 5 and so on are same to those of the above described embodiments, these will not be described in detail.
  • the taping means 70 is for attaching a tape 77 on the upper surface of the lead frame 7 which has been cut abng Y axis direction. Further, the taping means 70 may additionally attach a tape 77 on the upper surface of the lead frame 7 which has been cut secondly in order that the tape 77 may be easily peeled from the lead frame 7.
  • the taping means 70 includes a moving bbck 74 which is positioned over the vacuum fixing bbck 10 and is moved forward and backward, a pressing roller 73 which is mounted at the moving bbck 74 and attaches pressingly the supplied tape 77 on the upper surface of the lead frame 7, and a cutter 75 which cuts the tape 77 in a predetermined length.
  • the moving bbck 74 is positioned over the vacuum fixing bbck 10 and is moved to and for abng the horizontal direction by a cylinder or a lead screw (not shown). And, a tape roll 71 is mounted at the moving bbck 74 and supplies a tape 77.
  • the peeling sheet 76 attached to the tape 77 is winded at the winding roll to be retrieved, and the tape 77 from which the peeling sheet has been removed is supplied to the pressing roller 73 and is pressingly attached on the upper surface of the lead frame 7.
  • a cutter 75 is liftably connected to the cylinder 75a of one side of the pressing roller 73. Therefore, the tape 77 to be attached on the lead frame 7 may be cut in desired length when the moving bbck 74 is moved.
  • the peeling means 80 is to peel the tape 77 attached on the upper surface of the lead frame 7 after the lead frame 7 on which a tape 77 has been attached has been secondly cut abng X axis direction.
  • the peeling means 80 includes a pusher 85 which is positioned at one side of the vacuum fixing bbck 10 to be movable upwardly and lifts one end of the tape 77 attached on the upper surface of the lead frame 7, a moving bbck 74 which is positioned over the vacuum fixing bbck 10 to be moved forward and backward, and a gripper 81 which is mounted at the moving bbck 74 and grips one end of the peeled tape 77 and makes the peeled tape 77 removed from the lead frame 7 as the moving bbck 74 is moved.
  • the gripper 81 is composed of a pair of members which are connected to the cylinder(not shown) and are cbsed and stretched each other. And, the respective gripper 81 has a plurality of fingers 82 extending toward the bwer direction, and a groove is formed on the upper portion of the pusher 85 corresponding to the fingers 82 in order that the fingers 82 are not interfered with each other when they are cbsed for gripping the tape 77. Therefore, the finger 82 of the gripper 81 may easily grip one end of the tape 77 which have been lifted by the pusher 85.
  • a support roller 84 is mounted at one side of the gripper 81 and is contacted on the upper surface of the lead frame 7. This support roller 84 prevents the singulated package units 9 from being attached to the tape 77 which is being peeled so that the package units 9 may not be removed together with the tape 77.
  • the cleaning and drying unit 90 has a washing water nozzle 3 and a hot air dryer 91. It makes the taping step performed smoothly at the next step by washing and removing alien material like as the jetted water remained on the upper surface of the lead frame 7 which have been cut firstly and by drying the lead frame 7 with hot air.
  • the washing and drying unit 90 is moved toward the upper position of the vacuum fixing bbck 10 and washes the alien material like as the jetted water remained on the upper surface of the lead frame 7 which have been firstly cut abng Y axis direction, and the lead frame 7 is dried by hot air so that the taping step may be performed easiy at the next step.
  • the taping means 70 is moved toward the upper position of the vacuum fixing bbck 10, and presses the tape 77 supplied from the tape 77 roll by pressing roller 73.
  • the taping means 70 attaches the tape 77 to the upper surface of the lead frame 7, and the tape 77 is cut by the cutter 75 in a predetermined length.
  • the picker 40 lifts the lead frame 7 and places the lead frame 7 again on another vacuum fixing bbck 10 of Figure 9 in which slits 20 are formed abng X axis direction so that the lead frame 7 may be absorbingly fixed on the vacuum fixing bbck 10.
  • the water jet of high pressure is shot through the nozzle 3 and the lead frame 7 is cut abng X axis direction secondly so that the lead frame 7 is singulated in the respective package units 9.
  • the respective package units 9 are fixed on the vacuum fixing bbck 10 as well as they are fixed by the tape 77. Therefore, even the package units 9 of small size may be firmly fixed and kept at right position so that the rate of the flawed product may be decreased remarkably.
  • the washing and drying unit 90 is moved over the vacuum fixing bbck 10, washes to remove the alien material like as the water jet remained at the upper surface of the lead frame 7 which has been secondly cut abng X axis direction, and dries the lead frame 7 by hot air.
  • the pusher 85 at one side of the vacuum fixing bbck 10 pushes one end of the tape 77,78 upwardly and peels one end of the tape 77,78 and the tape 77,78 attached to the lead frame 7 is removed as one end of the peeled tape 77 is gripped to be moved abng horizontal direction by the gripper 81.
  • the support roller at one side of the peeling means 80 is contacted to the upper surface of the lead frame 7 so that the sigulated package units 9 are not removed together with the tape 77 which is being removed.
  • the semiconductor package 9 is singulated into separate units , it is firmly fixed by the vacuum fixing bbck 10 and is kept at the aligned state and the water jet is shot through the sits 20 of the vacuum fixing bbck 10 and is drained into the water collector 5 positioned at the bwer side of the vacuum fixing bbck 10 so that the cutting step may be performed without being interfered with the vacuum fixing bbck 10.
  • the respective cutting lines may be formed in grid pattern without the overlap section so that the product may be cut in regular size and the productivity may be increased. Further, the starting and the ending pants of the respective cutting lines are formed at the position out of the outermost package 9a so that even the outermost package 9a may be cut in regular size like as the inner side packages 9 and the rate of the flawed product may be decreased remarkably.
  • the lead frame 7 is firmly fixed by the bonding force of the tape 77 as well as the bonding force of the tape 77.
  • the package unts 9 of small size may be fixed at the right position during cutting step and the rate of the flawed product may be decreased much more.

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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention porte sur un appareil de séparation par jet d'eau pour boîtiers semiconducteurs et sur un procédé de séparation desdits boîtiers qui n'endommage pas le boîtier semiconducteur et qui ne provoque pas de déviation de ce dernier pendant l'étape de découpe. Selon un aspect, l'invention concerne un appareil de séparation par jet d'eau destiné à la fabrication de semiconducteurs, qui comprend : une buse (3), un bloc de fixation par dépression (10) comportant une partie siège (13), une pluralité de conduites à dépression, une pluralité de fentes (20) munies de trous à dépression (15) et un générateur de dépression (37), l'eau pénétrant dans les fentes (20) depuis la surface supérieure jusqu'à la surface inférieure du bloc de fixation par dépression (10), et le jet d'eau éjecté par la buse (3) pouvant être évacué par un collecteur d'eau (5) placé du côté inférieur du bloc de fixation par dépression (10).
PCT/KR2004/001589 2003-12-12 2004-06-29 Appareil de separation par jet d'eau pour fabrication de semiconducteurs et procede de separation de semiconducteurs WO2005057650A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2003-0090773 2003-12-12
KR10-2003-0090773A KR100538939B1 (ko) 2003-12-12 2003-12-12 반도체 제조용 워터젯 싱귤레이션장치
KR10-2004-0010924A KR100538943B1 (ko) 2004-02-19 2004-02-19 반도체 싱귤레이션방법
KR10-2004-0010924 2004-02-19

Publications (1)

Publication Number Publication Date
WO2005057650A1 true WO2005057650A1 (fr) 2005-06-23

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PCT/KR2004/001589 WO2005057650A1 (fr) 2003-12-12 2004-06-29 Appareil de separation par jet d'eau pour fabrication de semiconducteurs et procede de separation de semiconducteurs

Country Status (1)

Country Link
WO (1) WO2005057650A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1029171C2 (nl) * 2005-06-02 2006-12-05 Fico Bv Inrichting en werkwijze voor het met een dubbele snijstraal bewerken van elektronische componenten.
JP2012109327A (ja) * 2010-11-16 2012-06-07 Disco Abrasive Syst Ltd 分割方法
JP2016111282A (ja) * 2014-12-10 2016-06-20 株式会社ディスコ 切削装置

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JPS61295637A (ja) * 1985-06-24 1986-12-26 Tamura Seisakusho Co Ltd Ｉｃリ−ドフレ−ムの過剰モ−ルド除去方法
JPS62288400A (ja) * 1986-06-06 1987-12-15 Mitsubishi Electric Corp ウオ−タジエツトノズル
FR2626209A1 (fr) * 1988-01-26 1989-07-28 Aerospatiale Machine de decoupe de matiere en bande par jets fluides haute pression
JPH0372654A (ja) * 1989-08-11 1991-03-27 Fujitsu Ltd 基板の分割方法
JPH05283575A (ja) * 1992-03-31 1993-10-29 Toowa Kk 封止済リードフレームにおけるリード加工方法と加工装 置及び成形品
EP0594091A1 (fr) * 1992-10-17 1994-04-27 SÄCHSISCHE WERKZEUG UND SONDERMASCHINEN GmbH Alimentation en liquide - et matériau abrasif pour un dispositif de découpage à jet de fluide
JPH06275758A (ja) * 1993-03-19 1994-09-30 Chichibu Fuji:Kk 半導体装置の製造方法
JPH0831783A (ja) * 1994-07-14 1996-02-02 Fujitsu Ltd 基板のダイシング方法とその装置
WO1999046211A1 (fr) * 1998-03-11 1999-09-16 Hitachi, Ltd. Substrat en verre a cristaux liquides, procede de decoupe de ce substrat, coupeuse destinee a ce substrat et ecran utilisant ce substrat
JP2000061003A (ja) * 1998-08-19 2000-02-29 Yasuki Sonobe ボール
US6319354B1 (en) * 1998-07-06 2001-11-20 Micron Technology, Inc. System and method for dicing semiconductor components
JP2002110874A (ja) * 2000-09-29 2002-04-12 Edl:Kk ヒートシンクとその製造方法
US6467278B1 (en) * 2000-11-15 2002-10-22 National Semiconductor Corporation Cooling for singulation of composite materials in molded semiconductor packages
US6676486B1 (en) * 2000-10-20 2004-01-13 Lightwave Microsystems Corporation Polymeric chemical injection into a water jet to improve cut quality while cutting very brittle materials

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61295637A (ja) * 1985-06-24 1986-12-26 Tamura Seisakusho Co Ltd Ｉｃリ−ドフレ−ムの過剰モ−ルド除去方法
JPS62288400A (ja) * 1986-06-06 1987-12-15 Mitsubishi Electric Corp ウオ−タジエツトノズル
FR2626209A1 (fr) * 1988-01-26 1989-07-28 Aerospatiale Machine de decoupe de matiere en bande par jets fluides haute pression
JPH0372654A (ja) * 1989-08-11 1991-03-27 Fujitsu Ltd 基板の分割方法
JPH05283575A (ja) * 1992-03-31 1993-10-29 Toowa Kk 封止済リードフレームにおけるリード加工方法と加工装 置及び成形品
EP0594091A1 (fr) * 1992-10-17 1994-04-27 SÄCHSISCHE WERKZEUG UND SONDERMASCHINEN GmbH Alimentation en liquide - et matériau abrasif pour un dispositif de découpage à jet de fluide
JPH06275758A (ja) * 1993-03-19 1994-09-30 Chichibu Fuji:Kk 半導体装置の製造方法
JPH0831783A (ja) * 1994-07-14 1996-02-02 Fujitsu Ltd 基板のダイシング方法とその装置
WO1999046211A1 (fr) * 1998-03-11 1999-09-16 Hitachi, Ltd. Substrat en verre a cristaux liquides, procede de decoupe de ce substrat, coupeuse destinee a ce substrat et ecran utilisant ce substrat
US6612910B1 (en) * 1998-03-11 2003-09-02 Hitachi, Ltd. Liquid crystal glass substrate, method of cutting the liquid crystal glass substrate, cutter for the liquid crystal glass substrate and display using the liquid crystal glass substrate
US6319354B1 (en) * 1998-07-06 2001-11-20 Micron Technology, Inc. System and method for dicing semiconductor components
JP2000061003A (ja) * 1998-08-19 2000-02-29 Yasuki Sonobe ボール
JP2002110874A (ja) * 2000-09-29 2002-04-12 Edl:Kk ヒートシンクとその製造方法
US6676486B1 (en) * 2000-10-20 2004-01-13 Lightwave Microsystems Corporation Polymeric chemical injection into a water jet to improve cut quality while cutting very brittle materials
US6676485B1 (en) * 2000-10-20 2004-01-13 Lightwave Microsystems Corporation Wet injecting fine abrasives for water jet curved cutting of very brittle materials
US6467278B1 (en) * 2000-11-15 2002-10-22 National Semiconductor Corporation Cooling for singulation of composite materials in molded semiconductor packages

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1029171C2 (nl) * 2005-06-02 2006-12-05 Fico Bv Inrichting en werkwijze voor het met een dubbele snijstraal bewerken van elektronische componenten.
WO2006135237A2 (fr) * 2005-06-02 2006-12-21 Fico B.V. Dispositif et procede pour traiter des composants electroniques avec un flux de coupe double
WO2006135237A3 (fr) * 2005-06-02 2007-03-29 Fico Bv Dispositif et procede pour traiter des composants electroniques avec un flux de coupe double
JP2012109327A (ja) * 2010-11-16 2012-06-07 Disco Abrasive Syst Ltd 分割方法
JP2016111282A (ja) * 2014-12-10 2016-06-20 株式会社ディスコ 切削装置

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