WO2005046926A1 - レーザマーキング装置、レーザマーキング方法、及び被マーキング体 - Google Patents
レーザマーキング装置、レーザマーキング方法、及び被マーキング体 Download PDFInfo
- Publication number
- WO2005046926A1 WO2005046926A1 PCT/JP2004/017035 JP2004017035W WO2005046926A1 WO 2005046926 A1 WO2005046926 A1 WO 2005046926A1 JP 2004017035 W JP2004017035 W JP 2004017035W WO 2005046926 A1 WO2005046926 A1 WO 2005046926A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- dot
- information
- marking
- laser
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
- G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
- G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/267—Marking of plastic artifacts, e.g. with laser
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04799712A EP1685920A4 (en) | 2003-11-10 | 2004-11-10 | LASER MARKING DEVICE, LASER MARKING METHOD AND MARKING OBJECT |
US10/578,249 US7705870B2 (en) | 2003-11-10 | 2004-11-10 | Laser marking device, laser marking method, and object to be marked |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003379777A JP2005138169A (ja) | 2003-11-10 | 2003-11-10 | レーザマーキング装置、レーザマーキング方法、及び被マーキング体 |
JP2003-379777 | 2003-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005046926A1 true WO2005046926A1 (ja) | 2005-05-26 |
Family
ID=34587235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/017035 WO2005046926A1 (ja) | 2003-11-10 | 2004-11-10 | レーザマーキング装置、レーザマーキング方法、及び被マーキング体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7705870B2 (ja) |
EP (1) | EP1685920A4 (ja) |
JP (1) | JP2005138169A (ja) |
WO (1) | WO2005046926A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8084713B2 (en) | 2006-07-27 | 2011-12-27 | Keyence Corporation | Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable medium and recording device on which laser processing conditions are recorded |
US8121717B2 (en) | 2005-10-21 | 2012-02-21 | Keyence Corporation | Three dimensional processing data setting system, method for setting three-dimensional processing data, computer program for setting three-dimensional processing data, medium with three-dimensional processing data stored therein that is readable by computer and laser processing equipment operated by the three-dimensional data |
US8153931B2 (en) | 2006-06-30 | 2012-04-10 | Keyence Corporation | Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable media and recording device on which laser processing conditions are recorded |
US8235296B2 (en) * | 2006-06-28 | 2012-08-07 | Keyence Corporation | Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable medium and recording device on which laser processing conditions are recorded |
US20140004318A1 (en) * | 2005-09-08 | 2014-01-02 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
CN116100159A (zh) * | 2023-03-07 | 2023-05-12 | 湖北同源科技有限公司 | 一种激光标刻的自动化铭牌打标装置 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7951409B2 (en) | 2003-01-15 | 2011-05-31 | Newmarket Impressions, Llc | Method and apparatus for marking an egg with an advertisement, a freshness date and a traceability code |
JP4570389B2 (ja) * | 2004-04-26 | 2010-10-27 | アライ株式会社 | レーザマーキングによる2次元コードの形成方法、及びレーザマーキング装置 |
KR100612609B1 (ko) * | 2005-06-03 | 2006-08-14 | 광성전자(주) | 레이저 마킹기로 시각적으로 홀로그램화되는 표식을 금속재부품의 표면에 가공하는 방법 및 그에 의해 제조된 금속재부품 |
EP1964622B1 (en) * | 2005-12-13 | 2013-01-23 | NGK Insulators, Ltd. | Method of forming an image pattern on surface of a metallic glass member |
JP4943069B2 (ja) * | 2006-06-29 | 2012-05-30 | 株式会社キーエンス | レーザ加工装置、レーザ加工条件設定装置 |
JP4795887B2 (ja) * | 2006-07-27 | 2011-10-19 | 株式会社キーエンス | レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム |
JP4956107B2 (ja) * | 2006-09-15 | 2012-06-20 | 株式会社キーエンス | レーザ加工データ生成装置、レーザ加工データ生成方法、コンピュータプログラム及びレーザマーキングシステム |
US8084712B2 (en) * | 2007-03-16 | 2011-12-27 | TEN Medias LLC | Method and apparatus for laser marking objects |
US7623941B2 (en) * | 2007-05-09 | 2009-11-24 | Great Computer Corporation | Method for adjusting the relative position of device of laser engraver |
CN101318263B (zh) * | 2007-06-08 | 2011-12-07 | 深圳富泰宏精密工业有限公司 | 激光雕刻系统及采用其进行激光雕刻的方法 |
JP5027606B2 (ja) * | 2007-09-26 | 2012-09-19 | 株式会社キーエンス | レーザ加工装置、加工データ生成方法及びコンピュータプログラム |
US20100040836A1 (en) * | 2008-08-12 | 2010-02-18 | Shenping Li | Method for providing sub-surface marks in polymeric materials |
US8647721B2 (en) | 2008-11-05 | 2014-02-11 | Exatec, Llc | Part marking of coated plastic substrates |
DE102008058535A1 (de) * | 2008-11-21 | 2010-05-27 | Tesa Se | Verfahren zur Materialbearbeitung mit energiereicher Strahlung |
DE102009031871B4 (de) * | 2009-07-06 | 2013-10-24 | Nanosec Gesellschaft Für Nanotechnologie In Der Sicherheitstechnik MBH | Verfahren und Vorrichtung zur Laserbeschriftung |
US20110200802A1 (en) * | 2010-02-16 | 2011-08-18 | Shenping Li | Laser Welding of Polymeric Materials |
EP2721698B1 (en) * | 2011-06-17 | 2019-01-02 | I-Property Holding Corp. | 3d laser coding in glass |
CN102275389A (zh) * | 2011-06-25 | 2011-12-14 | 江苏宏宝锻造有限公司 | 一种应用于激光打标机上的防错装置 |
US20130140286A1 (en) * | 2011-12-06 | 2013-06-06 | Herbert Chidsey Roberts, III | Systems and methods for internal cavity formation using laser manipulation |
WO2013120248A1 (zh) * | 2012-02-14 | 2013-08-22 | 深圳市杰普特电子技术有限公司 | 一种脉冲激光器及脉冲激光器打标系统 |
WO2013139028A1 (zh) * | 2012-03-22 | 2013-09-26 | 深圳市杰普特电子技术有限公司 | 一种脉冲光纤激光器打标系统 |
US8853577B1 (en) * | 2012-08-08 | 2014-10-07 | Google Inc. | Keycap for use in backlit keyboards |
JP6401248B2 (ja) * | 2013-05-15 | 2018-10-10 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 基板内に散乱機構を有するled |
WO2019093194A1 (ja) * | 2017-11-07 | 2019-05-16 | 住友電工焼結合金株式会社 | 鉄系焼結体とそのレーザーマーキング方法並びに製造方法 |
DE102018113913A1 (de) * | 2018-06-11 | 2019-12-12 | Mühlbauer Gmbh & Co. Kg | Kartenmarkiersystem und Verfahren zum automatisierten Ermitteln einer optimierten Einstellung eines Kartenmarkiersystems |
JP2020011268A (ja) * | 2018-07-19 | 2020-01-23 | Dgshape株式会社 | 照射経路データの作成方法、加工方法、camシステム |
JP7251283B2 (ja) | 2019-04-16 | 2023-04-04 | 大日本印刷株式会社 | 2次元コード、2次元コードの形成方法、2次元コードを印刷した印刷物及び包装体 |
Citations (5)
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JPS60221186A (ja) * | 1984-03-30 | 1985-11-05 | バイエル・アクチエンゲゼルシヤフト | プラスチツク部品の記号付け方法 |
JPH03124486A (ja) * | 1989-10-07 | 1991-05-28 | Hoya Corp | レーザマーキング方法 |
JPH0776167A (ja) * | 1993-09-08 | 1995-03-20 | Miyachi Technos Kk | レーザマーキング方法 |
JP2001276985A (ja) * | 2000-01-27 | 2001-10-09 | Sumitomo Heavy Ind Ltd | マーキング方法、装置及びマーキングされた光学部材 |
JP2003088966A (ja) * | 2001-09-14 | 2003-03-25 | Hoya Photonics Corp | レーザマーキング装置 |
Family Cites Families (17)
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US4683371A (en) | 1981-02-27 | 1987-07-28 | Drexler Technology Corporation | Dual stripe optical data card |
DE3624959A1 (de) * | 1986-07-23 | 1988-01-28 | Mannesmann Ag | Automatisches verfahren zur beruehrungslosen dreidimensionalen vermessung von objekten grosser ausdehnung |
GB8803560D0 (en) * | 1988-02-16 | 1988-03-16 | Wiggins Teape Group Ltd | Laser apparatus for repetitively marking moving sheet |
US5293539A (en) * | 1991-10-25 | 1994-03-08 | Eastman Kodak Company | Method and apparatus for calibrating tone reproduction in a proofing system |
US5389196A (en) * | 1992-01-30 | 1995-02-14 | Massachusetts Institute Of Technology | Methods for fabricating three-dimensional micro structures |
JPH05337659A (ja) | 1992-06-11 | 1993-12-21 | Fuji Electric Co Ltd | レーザによるマーキング方法 |
JP3431933B2 (ja) * | 1992-10-21 | 2003-07-28 | キヤノン株式会社 | インク、これを用いたインクジェット記録方法及びかかるインクを備えた記録機器 |
AU5872994A (en) * | 1992-12-18 | 1994-07-19 | Firebird Traders Ltd. | Process and apparatus for etching an image within a solid article |
US6037968A (en) | 1993-11-09 | 2000-03-14 | Markem Corporation | Scanned marking of workpieces |
US6087617A (en) * | 1996-05-07 | 2000-07-11 | Troitski; Igor Nikolaevich | Computer graphics system for generating an image reproducible inside optically transparent material |
US6417486B1 (en) * | 1999-04-12 | 2002-07-09 | Ticona Gmbh | Production of conductor tracks on plastics by means of laser energy |
US6207344B1 (en) * | 1999-09-29 | 2001-03-27 | General Electric Company | Composition for laser marking |
TW503188B (en) | 2000-08-29 | 2002-09-21 | Sumitomo Heavy Industries | Marking method, device the optical member marked |
US6509548B1 (en) * | 2000-10-04 | 2003-01-21 | Igor Troitski | Method and laser system for production of high-resolution laser-induced damage images inside transparent materials by generating small etch points |
DK1478321T3 (da) * | 2002-02-28 | 2005-08-29 | Gamma Croma Spa | Fremgangsmåde til reproduktion af billeder på kosmetiksammensætninger |
US7396493B2 (en) * | 2002-05-21 | 2008-07-08 | 3M Innovative Properties Company | Multilayer optical film with melt zone to control delamination |
US6951375B2 (en) * | 2003-05-20 | 2005-10-04 | Eastman Kodak Company | Large area marking device and method for printing |
-
2003
- 2003-11-10 JP JP2003379777A patent/JP2005138169A/ja active Pending
-
2004
- 2004-11-10 EP EP04799712A patent/EP1685920A4/en not_active Withdrawn
- 2004-11-10 US US10/578,249 patent/US7705870B2/en not_active Expired - Fee Related
- 2004-11-10 WO PCT/JP2004/017035 patent/WO2005046926A1/ja active Application Filing
Patent Citations (5)
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JPS60221186A (ja) * | 1984-03-30 | 1985-11-05 | バイエル・アクチエンゲゼルシヤフト | プラスチツク部品の記号付け方法 |
JPH03124486A (ja) * | 1989-10-07 | 1991-05-28 | Hoya Corp | レーザマーキング方法 |
JPH0776167A (ja) * | 1993-09-08 | 1995-03-20 | Miyachi Technos Kk | レーザマーキング方法 |
JP2001276985A (ja) * | 2000-01-27 | 2001-10-09 | Sumitomo Heavy Ind Ltd | マーキング方法、装置及びマーキングされた光学部材 |
JP2003088966A (ja) * | 2001-09-14 | 2003-03-25 | Hoya Photonics Corp | レーザマーキング装置 |
Non-Patent Citations (1)
Title |
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See also references of EP1685920A4 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140004318A1 (en) * | 2005-09-08 | 2014-01-02 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
US9751154B2 (en) * | 2005-09-08 | 2017-09-05 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
US8121717B2 (en) | 2005-10-21 | 2012-02-21 | Keyence Corporation | Three dimensional processing data setting system, method for setting three-dimensional processing data, computer program for setting three-dimensional processing data, medium with three-dimensional processing data stored therein that is readable by computer and laser processing equipment operated by the three-dimensional data |
US8235296B2 (en) * | 2006-06-28 | 2012-08-07 | Keyence Corporation | Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable medium and recording device on which laser processing conditions are recorded |
US8153931B2 (en) | 2006-06-30 | 2012-04-10 | Keyence Corporation | Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable media and recording device on which laser processing conditions are recorded |
US8084713B2 (en) | 2006-07-27 | 2011-12-27 | Keyence Corporation | Method of and system for setting laser processing conditions, laser processing system, computer program for setting laser processing conditions, computer readable medium and recording device on which laser processing conditions are recorded |
US8399802B2 (en) | 2006-07-27 | 2013-03-19 | Keyence Corporation | Laser processing system with a display device |
US8399803B2 (en) | 2006-07-27 | 2013-03-19 | Keyence Corporation | Laser processing system |
CN116100159A (zh) * | 2023-03-07 | 2023-05-12 | 湖北同源科技有限公司 | 一种激光标刻的自动化铭牌打标装置 |
CN116100159B (zh) * | 2023-03-07 | 2023-06-30 | 湖北同源科技有限公司 | 一种激光标刻的自动化铭牌打标装置 |
Also Published As
Publication number | Publication date |
---|---|
US7705870B2 (en) | 2010-04-27 |
JP2005138169A (ja) | 2005-06-02 |
EP1685920A4 (en) | 2008-12-10 |
EP1685920A1 (en) | 2006-08-02 |
US20070086822A1 (en) | 2007-04-19 |
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