WO2004112091A2 - Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk - Google Patents

Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk Download PDF

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Publication number
WO2004112091A2
WO2004112091A2 PCT/US2004/016353 US2004016353W WO2004112091A2 WO 2004112091 A2 WO2004112091 A2 WO 2004112091A2 US 2004016353 W US2004016353 W US 2004016353W WO 2004112091 A2 WO2004112091 A2 WO 2004112091A2
Authority
WO
WIPO (PCT)
Prior art keywords
conditioning
disk
pad
slurry
debris
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/016353
Other languages
English (en)
French (fr)
Other versions
WO2004112091A3 (en
Inventor
Stephen J. Benner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TBW Industries Inc
Original Assignee
TBW Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TBW Industries Inc filed Critical TBW Industries Inc
Priority to CNB2004800145857A priority Critical patent/CN100469528C/zh
Priority to JP2006533386A priority patent/JP2007500087A/ja
Priority to KR1020057022693A priority patent/KR100750771B1/ko
Priority to DE602004017170T priority patent/DE602004017170D1/de
Priority to EP04753223A priority patent/EP1633527B1/en
Publication of WO2004112091A2 publication Critical patent/WO2004112091A2/en
Publication of WO2004112091A3 publication Critical patent/WO2004112091A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Definitions

  • Polishing pad surfaces which typically contain pores, holes or grooves for channeling the slurry between the wafer and the pad, require conditioning to create a consistent polishing interface. Slurry and debris from the wafer must be removed by continually “abrading” or “conditioning” the pad surface. Additionally, oxidizing slurries sometimes used in this process contribute to the contamination of the pad by interacting with device layer metals forming harder oxide compounds; or layer delaminations, causing potential contamination and scratching of the wafer. .
  • a stream of polishing slurry 14 generally containing an oxidizer, abrasive and/or ultra-pure water (UPW) is poured on the polishing pad surface 12a and in cooperation with the rotating motion of wafer 1 1 acts to remove a few tenths of microns of surface unevenness on wafer 11 after each layer of integrated circuit fabrication.
  • Pad conditioning apparatus 15 operates to restore and maintain polishing pad surface 12a as it is changed by the polishing action.
  • Motor 17, as seen in Figure 2 pivots end effector arm 16 in an arc about fixed shaft 18 while simultaneously providing rotational motion and a downward force 40 to pad conditioning apparatus 15, Debris from the polishing operation is removed through outlet 41.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
PCT/US2004/016353 2003-05-29 2004-05-25 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk Ceased WO2004112091A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CNB2004800145857A CN100469528C (zh) 2003-05-29 2004-05-25 真空辅助垫清理系统及采用开孔清理盘的方法
JP2006533386A JP2007500087A (ja) 2003-05-29 2004-05-25 開口部を備えたコンディショニングディスクを利用する真空補助パッドコンディショニングシステム及び方法
KR1020057022693A KR100750771B1 (ko) 2003-05-29 2004-05-25 천공된 컨디셔닝 디스크를 이용한 진공 보조 패드 컨디셔닝 방법
DE602004017170T DE602004017170D1 (de) 2003-05-29 2004-05-25 Mit öffnungen versehene abrichtescheibe verwendendes verfahren
EP04753223A EP1633527B1 (en) 2003-05-29 2004-05-25 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/447,373 US7052371B2 (en) 2003-05-29 2003-05-29 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US10/447,373 2003-05-29

Publications (2)

Publication Number Publication Date
WO2004112091A2 true WO2004112091A2 (en) 2004-12-23
WO2004112091A3 WO2004112091A3 (en) 2005-03-24

Family

ID=33451205

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/016353 Ceased WO2004112091A2 (en) 2003-05-29 2004-05-25 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk

Country Status (7)

Country Link
US (3) US7052371B2 (enExample)
EP (1) EP1633527B1 (enExample)
JP (1) JP2007500087A (enExample)
KR (1) KR100750771B1 (enExample)
CN (2) CN101444900A (enExample)
DE (1) DE602004017170D1 (enExample)
WO (1) WO2004112091A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018098422A1 (en) * 2016-11-28 2018-05-31 Baker Hughes Incorporated Magnetic sample holder for abrasive operations and related methods

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US8398463B2 (en) * 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US8142261B1 (en) * 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
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Cited By (2)

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WO2018098422A1 (en) * 2016-11-28 2018-05-31 Baker Hughes Incorporated Magnetic sample holder for abrasive operations and related methods
US10357861B2 (en) 2016-11-28 2019-07-23 Baker Hughes, A Ge Company, Llc Magnetic sample holder for abrasive operations and related methods

Also Published As

Publication number Publication date
CN1795074A (zh) 2006-06-28
US7052371B2 (en) 2006-05-30
KR100750771B1 (ko) 2007-08-20
US7575503B2 (en) 2009-08-18
EP1633527A2 (en) 2006-03-15
US20040241989A1 (en) 2004-12-02
CN100469528C (zh) 2009-03-18
US7258600B1 (en) 2007-08-21
DE602004017170D1 (de) 2008-11-27
WO2004112091A3 (en) 2005-03-24
EP1633527A4 (en) 2007-05-09
EP1633527B1 (en) 2008-10-15
CN101444900A (zh) 2009-06-03
KR20060024781A (ko) 2006-03-17
JP2007500087A (ja) 2007-01-11
US20070281592A1 (en) 2007-12-06

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