KR100750771B1 - 천공된 컨디셔닝 디스크를 이용한 진공 보조 패드 컨디셔닝 방법 - Google Patents

천공된 컨디셔닝 디스크를 이용한 진공 보조 패드 컨디셔닝 방법 Download PDF

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Publication number
KR100750771B1
KR100750771B1 KR1020057022693A KR20057022693A KR100750771B1 KR 100750771 B1 KR100750771 B1 KR 100750771B1 KR 1020057022693 A KR1020057022693 A KR 1020057022693A KR 20057022693 A KR20057022693 A KR 20057022693A KR 100750771 B1 KR100750771 B1 KR 100750771B1
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South Korea
Prior art keywords
conditioning
polishing
pad
slurry
debris
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Expired - Fee Related
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KR1020057022693A
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English (en)
Korean (ko)
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KR20060024781A (ko
Inventor
스티븐 제이. 베너
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티비더블유 인더스트리즈, 인코포레이티드
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Publication of KR20060024781A publication Critical patent/KR20060024781A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020057022693A 2003-05-29 2004-05-25 천공된 컨디셔닝 디스크를 이용한 진공 보조 패드 컨디셔닝 방법 Expired - Fee Related KR100750771B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/447,373 US7052371B2 (en) 2003-05-29 2003-05-29 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US10/447,373 2003-05-29
PCT/US2004/016353 WO2004112091A2 (en) 2003-05-29 2004-05-25 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk

Publications (2)

Publication Number Publication Date
KR20060024781A KR20060024781A (ko) 2006-03-17
KR100750771B1 true KR100750771B1 (ko) 2007-08-20

Family

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Family Applications (1)

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KR1020057022693A Expired - Fee Related KR100750771B1 (ko) 2003-05-29 2004-05-25 천공된 컨디셔닝 디스크를 이용한 진공 보조 패드 컨디셔닝 방법

Country Status (7)

Country Link
US (3) US7052371B2 (enExample)
EP (1) EP1633527B1 (enExample)
JP (1) JP2007500087A (enExample)
KR (1) KR100750771B1 (enExample)
CN (2) CN101444900A (enExample)
DE (1) DE602004017170D1 (enExample)
WO (1) WO2004112091A2 (enExample)

Cited By (1)

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WO2014149676A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus

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US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US20060068687A1 (en) * 2004-09-29 2006-03-30 Peggy Butler Apparatus for dry footing and sanding ceramic pieces and method of using same
KR100693251B1 (ko) * 2005-03-07 2007-03-13 삼성전자주식회사 연마 속도와 연마 패드의 조도를 향상시킬 수 있는 패드 컨디셔너 및 이를 이용하는 화학기계적 연마 장치
US8398463B2 (en) * 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US8142261B1 (en) * 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US20080032609A1 (en) * 2006-03-08 2008-02-07 Benedict Jeffrey H Apparatus for reducing contaminants from a chemical mechanical polishing pad
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US7597608B2 (en) * 2006-10-30 2009-10-06 Applied Materials, Inc. Pad conditioning device with flexible media mount
US7658187B2 (en) * 2007-01-16 2010-02-09 John Budiac Adjustable stone cutting guide system
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
US8337279B2 (en) 2008-06-23 2012-12-25 Applied Materials, Inc. Closed-loop control for effective pad conditioning
US8221193B2 (en) * 2008-08-07 2012-07-17 Applied Materials, Inc. Closed loop control of pad profile based on metrology feedback
US8197306B2 (en) * 2008-10-31 2012-06-12 Araca, Inc. Method and device for the injection of CMP slurry
US8845395B2 (en) 2008-10-31 2014-09-30 Araca Inc. Method and device for the injection of CMP slurry
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WO2011028700A2 (en) 2009-09-01 2011-03-10 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
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CN102782814A (zh) * 2010-04-30 2012-11-14 应用材料公司 垫片状态化刮扫力矩模式化以达成恒定移除率
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
JP2012094659A (ja) * 2010-10-26 2012-05-17 Disco Abrasive Syst Ltd スピンナ洗浄装置
US10065288B2 (en) * 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
CN102873640B (zh) * 2012-09-18 2017-07-25 上海集成电路研发中心有限公司 研磨垫修整器
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CN105722641B (zh) * 2013-10-25 2019-05-28 应用材料公司 用于化学机械平坦化后的基板抛光预清洁的系统、方法和装置
US10328549B2 (en) * 2013-12-11 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing head, chemical-mechanical polishing system and method for polishing substrate
US9375825B2 (en) 2014-04-30 2016-06-28 Applied Materials, Inc. Polishing pad conditioning system including suction
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US9452506B2 (en) * 2014-07-15 2016-09-27 Applied Materials, Inc. Vacuum cleaning systems for polishing pads, and related methods
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
CN105538047B (zh) * 2015-12-11 2017-09-22 中国航空工业集团公司北京航空材料研究院 一种航空有机透明制件的表面研抛方法
JP6842859B2 (ja) * 2016-08-12 2021-03-17 株式会社荏原製作所 ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法
US10357861B2 (en) 2016-11-28 2019-07-23 Baker Hughes, A Ge Company, Llc Magnetic sample holder for abrasive operations and related methods
US10005170B1 (en) 2016-12-21 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of cleaning CMP polishing pads
CN114393523A (zh) * 2016-12-22 2022-04-26 3M创新有限公司 用于形成磨料颗粒层的设备以及形成磨料制品的方法
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
KR102037747B1 (ko) * 2018-01-08 2019-10-29 에스케이실트론 주식회사 웨이퍼 연마 장치
KR102561647B1 (ko) * 2018-05-28 2023-07-31 삼성전자주식회사 컨디셔너 및 이를 포함하는 화학 기계적 연마 장치
US10843307B2 (en) 2018-09-28 2020-11-24 Taiwan Semiconductor Manufacturing Company, Ltd. Vacuum assembly for chemical mechanical polishing
CN111571341B (zh) * 2020-05-29 2020-12-22 杭州勒格智能设备有限公司 一种泵体叶轮制造自动化精加工设备
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WO2014149676A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus
US9498866B2 (en) 2013-03-15 2016-11-22 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus

Also Published As

Publication number Publication date
CN1795074A (zh) 2006-06-28
US7052371B2 (en) 2006-05-30
US7575503B2 (en) 2009-08-18
WO2004112091A2 (en) 2004-12-23
EP1633527A2 (en) 2006-03-15
US20040241989A1 (en) 2004-12-02
CN100469528C (zh) 2009-03-18
US7258600B1 (en) 2007-08-21
DE602004017170D1 (de) 2008-11-27
WO2004112091A3 (en) 2005-03-24
EP1633527A4 (en) 2007-05-09
EP1633527B1 (en) 2008-10-15
CN101444900A (zh) 2009-06-03
KR20060024781A (ko) 2006-03-17
JP2007500087A (ja) 2007-01-11
US20070281592A1 (en) 2007-12-06

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