WO2004112056A1 - 積層体ユニット - Google Patents
積層体ユニット Download PDFInfo
- Publication number
- WO2004112056A1 WO2004112056A1 PCT/JP2004/008664 JP2004008664W WO2004112056A1 WO 2004112056 A1 WO2004112056 A1 WO 2004112056A1 JP 2004008664 W JP2004008664 W JP 2004008664W WO 2004112056 A1 WO2004112056 A1 WO 2004112056A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bismuth
- support substrate
- layered compound
- dielectric layer
- oriented
- Prior art date
Links
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 107
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 106
- 150000001875 compounds Chemical class 0.000 claims abstract description 96
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 239000003990 capacitor Substances 0.000 claims abstract description 61
- 239000010409 thin film Substances 0.000 claims abstract description 44
- 239000003989 dielectric material Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000000203 mixture Substances 0.000 claims description 52
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 35
- 239000002887 superconductor Substances 0.000 claims description 22
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 239000013078 crystal Substances 0.000 claims description 18
- 229910052697 platinum Inorganic materials 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 12
- 239000010948 rhodium Substances 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 9
- 229910052707 ruthenium Inorganic materials 0.000 claims description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000005751 Copper oxide Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011575 calcium Substances 0.000 claims description 6
- 229910000431 copper oxide Inorganic materials 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052741 iridium Inorganic materials 0.000 claims description 6
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052703 rhodium Inorganic materials 0.000 claims description 6
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- VAWSWDPVUFTPQO-UHFFFAOYSA-N calcium strontium Chemical compound [Ca].[Sr] VAWSWDPVUFTPQO-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 238000005401 electroluminescence Methods 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 7
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- 238000000354 decomposition reaction Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005242 forging Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- LNYQYQFDAYWLAM-UHFFFAOYSA-N BSCC Chemical compound BSCC LNYQYQFDAYWLAM-UHFFFAOYSA-N 0.000 description 1
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- -1 Pd) Chemical class 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052773 Promethium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000001182 laser chemical vapour deposition Methods 0.000 description 1
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- VQMWBBYLQSCNPO-UHFFFAOYSA-N promethium atom Chemical compound [Pm] VQMWBBYLQSCNPO-UHFFFAOYSA-N 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052722 tritium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/65—Electrodes comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)
Definitions
- the present invention relates to a laminate unit including an electrode layer and a dielectric layer, and is particularly suitable for producing a small-sized and large-capacity thin-film capacitor having excellent dielectric characteristics.
- LSI Large Scale Integrated circuit
- CPU Central Processing Unit
- a decoupling capacitor is generally connected between the power supply terminals of LSI.
- the impedance required for power supply wiring is proportional to the operating voltage of LSI, and inversely proportional to the degree of integration, switching current, and operating frequency of LSI. Therefore, the impedance required for power supply wiring is extremely small in recent LSIs with high integration, low operating voltage, and high operating frequency.
- the capacity of the decoupling capacitor must be increased, and the power supply terminal of the LSI and the decoupling capacitor must be connected. It is necessary to sufficiently reduce the inductance of the wiring connecting to the capacitor.
- Electrolytic capacitors and multilayer ceramic capacitors are generally used as large-capacity decoupling capacitors.
- the size of the electrolytic capacitor / multilayer ceramic capacitor is relatively large, integration with LSI is difficult. Therefore, it is necessary to mount the LSI on a circuit board separately from the LSI, and the wiring connecting the power supply terminal of the LSI and the decoupling capacitor is inevitably lengthened.
- an electrolytic capacitor or a multilayer ceramic capacitor is used as the decoupling capacitor, it is difficult to reduce the inductance of the wiring connecting the power supply terminal of the LSI and the decoupling capacitor. was there.
- a thin film capacitor smaller than an electrolytic capacitor or a multilayer ceramic capacitor In order to make the wiring connecting the power supply terminal of the LSI and the decoupling capacitor shorter, it is preferable to use a thin film capacitor smaller than an electrolytic capacitor or a multilayer ceramic capacitor.
- Japanese Patent Laid-Open Publication No. 2000-1—153828 discloses that PZT, PLZT, (B a, S r) Ti O 3 (BST), Ta 2 O 5 It discloses a small-sized, large-capacity thin-film capacitor using such a method.
- the thin film capacitor formed by these materials has a disadvantage that the temperature characteristics are inferior.
- the dielectric constant of BST is 100000000 ppm. Because of the temperature dependence of C, when BST is used as the dielectric material, the capacitance at 80 ° C is smaller than that at 20 ° C. It varies by 16 to 24%. Therefore, a thin film capacitor formed using BST is a decoupling capacitor for LSIs with a high operating frequency where the ambient temperature can often reach 80 ° C or more due to heat generated by power consumption. , Not appropriate.
- the dielectric thin film formed by these materials not only reduces the dielectric constant when the thickness is reduced, but also, for example, when an electric field of 100 kVZ cm is applied, the capacitance becomes small.
- the dielectric thin film formed by these materials not only reduces the dielectric constant when the thickness is reduced, but also, for example, when an electric field of 100 kVZ cm is applied, the capacitance becomes small.
- the question is that If these materials are used as dielectric materials for thin-film capacitors, it is difficult to obtain small-sized and large-capacity thin-film capacitors.
- the dielectric thin film formed by these materials has low surface smoothness, there is a problem that if the thickness is reduced, insulation failure or the like is likely to occur.
- Bismuth layered compounds have anisotropic crystal structure and basically exhibit ferroelectric properties.However, in certain orientation axis directions, ferroelectric properties are small, and as paraelectric substances. It is known to exhibit the properties of
- the properties of the bismuth layered compound as a ferroelectric substance are not preferable when the bismuth layered compound is used as a dielectric of a thin film capacitor, because it causes a change in the dielectric constant. It is preferable that the property is sufficiently exhibited.
- the bismuth layered compound has a small ferroelectric property, and has a dielectric layer in which the bismuth layered compound is oriented in the direction of the orientation axis showing the property as a paraelectric substance.
- the development of thin film capacitors with excellent characteristics is desired.
- the present invention is suitable for producing a small-sized, thin-film capacitor having excellent large-capacity dielectric properties, and has high brightness inorganic E
- An object of the present invention and other objects is to form a dielectric material containing a bismuth layered compound, which is electrically conductive, on which a bismuth layered compound can be epitaxially grown.
- a support substrate oriented in the azimuth direction; and a dielectric material containing a bismuth layered compound formed on the support substrate by epitaxial growth.
- the [001] orientation refers to the [001] orientation in cubic, tetragonal, monoclinic, and orthorhombic.
- the support substrate is formed of a material having conductivity and capable of epitaxially growing a dielectric material containing a bismuth layer compound on the support substrate, and at least the surface is formed of [ 0 0 1] Since it is oriented in the direction, it also functions as an electrode layer and a buffer layer. Therefore, the dielectric material containing the bismuth layered compound is epitaxially grown on the supporting substrate, and thus it is ensured. It becomes possible to form a dielectric layer containing a bismuth layered compound oriented in the [001] direction.
- the c-axis of the bismuth layered compound contained in the dielectric layer can be oriented perpendicular to the supporting substrate.
- the direction of the electric field substantially matches the c-axis of the bismuth layered compound contained in the dielectric layer, and is therefore included in the dielectric layer. Since the properties of the bismuth layered compound used as ferroelectrics can be suppressed and the properties as paraelectrics can be fully exhibited, it is possible to produce small, large-capacity thin-film capacitors. Will be possible.
- the dielectric layer made of a dielectric material containing a compound has a high insulating property, the dielectric layer can be made thinner, and thus the thin film capacitor can be further miniaturized. .
- the dielectric layer of the laminate unit according to the present invention has The inorganic EL element is arranged, another electrode is arranged on the inorganic EL element, and a voltage is applied between the support substrate and another electrode, so that the inorganic EL element emits light as desired. This makes it possible to manufacture a high-luminance inorganic EL device.
- the dielectric material containing the bismuth layer compound may contain unavoidable impurities.
- the material for forming the supporting substrate is not particularly limited as long as it has conductivity and is a material on which a dielectric material containing a bismuth layered compound can be epitaxially grown.
- platinum Pt
- ruthenium Ru
- rhodium Rh
- palladium Pd
- iridium Ir
- gold Au
- silver Ag
- copper C u
- alloy or of the metal and the main component of these such as nickel (N i), N d O , N b O, R H_ ⁇ 2, O s O 2, I r O 2, R u 0 2, S r Mo O 3 , S r R u 0 3, C a R u O 3, S r V0 3, S r C r O 3, S r C o O 3, L a N i O 3, N b dope S mixture of r T i O 3 Oyo conductive oxide such Pikorera and oxide superconductor and, in order to form
- the oxide superconductor used for forming the support substrate a copper oxide superconductor having a CuO 2 plane is preferable.
- an example of a copper oxide superconductor having a CuO 2 plane that is particularly preferably used for forming a supporting substrate includes a stoichiometric composition formula: Biz Srz Can - i CU n O 2 n + 4 in BSCCO shown (bismuth * be sampled port Nchiumu calcium force wrapper-Okisai de.), the stoichiometric compositional formula: YB a 2 C u 3 0 7 - represented by ⁇ YB CO Tritium, bismuth, kappa, oxide).
- the composition ratio of the copper oxide superconductor in the above composition formula is not particularly limited, and the composition ratio may be different as long as the crystal structure of the copper oxide superconductor can be maintained. .
- the degree F should be 80% or more.
- the c-axis orientation degree F is preferably 90%, and more preferably the c-axis orientation degree is 95% or more.
- the c-axis orientation degree F of the conductive material is defined by the following equation (1).
- (A k 1) ⁇ ) is the c-axis orientation ratio of the conductive material calculated using the X-ray diffraction intensity, that is, the (0 0 plane) of the conductive material.
- h, k, and zo can each take any integer value of 0 or more.
- the electrode layer is likely to be oriented in the [111] direction. Therefore, a dielectric material containing a bismuth layered compound is epitaxially grown on the electrode layer to form a dielectric layer made of the dielectric material containing the bismuth layered compound, and the bismuth layered compound is oriented in the [01] direction. In other words, it is extremely difficult to orient in the c-axis direction.
- at least the surface is formed of a material having conductivity and capable of epitaxially growing a dielectric material containing a bismuth layered compound thereon.
- a support substrate that is oriented in the direction and also functions as an electrode layer is used. At least on the support substrate whose surface is oriented in the [001] direction, the dielectric material containing the bismuth layered compound is epitaxy. Since the dielectric layer is formed by growth, it is possible to surely form the dielectric layer oriented in the [00 1] direction, that is, the c-axis direction.
- a support substrate is formed from a metal such as nickel (Ni) or an alloy containing these as a main component, first, an amorphous substrate such as fused quartz, a polycrystalline substrate such as ceramic, or a heat-resistant glass substrate On another supporting substrate, such as a resin substrate, and anisotropically, and furthermore, a metal such as platinum (Pt) or ruthenium (Ru) or an alloy containing these metals as a main component.
- a buffer layer oriented in the [01] direction is formed of a material capable of forming a support substrate having the function of an electrode layer by epitaxially growing a crystal.
- Pt platinum
- Ru ruthenium
- a support substrate oriented in the [001] direction can be formed.
- a support substrate having at least its surface oriented in the [00 1] direction is formed by a single-crystal conductive oxide, a mixture of conductive oxides, or an oxide superconductor.
- a conductive oxide Has a conductive oxide, Select the plane in which the conductive oxide mixture or the oxide superconductor single crystal is oriented in the [001] direction, and select the conductive oxide, the conductive oxide mixture or the oxide superconductor.
- a support substrate oriented in the [001] direction can be formed.
- a polycrystalline conductive oxide, a mixture of conductive oxides, or an oxide superconductor may be used to form a support substrate having at least its surface oriented in the [001] direction.
- a conductive oxide, a mixture of conductive oxides, or polycrystalline particles of an oxide superconductor are formed by a hot forking method such as a hot forging method or a hot pressing method. Orientation in the orientation, selecting a plane oriented in the [001] orientation, and cutting out a conductive oxide, a mixture of conductive oxides, or a polycrystal of oxide superconductor, 1]
- a support substrate oriented in the direction can be formed.
- the laminate unit includes a dielectric layer made of a dielectric material containing a bismuth layered compound oriented in the [001] direction, that is, the c-axis direction, on the supporting substrate.
- the dielectric layer is formed by epitaxially growing a dielectric material containing a bismuth layered compound on a supporting substrate.
- the dielectric layer is formed by epitaxially growing a dielectric material containing a bismuth layered compound on a supporting substrate oriented in the [001] direction, and thus is included in the dielectric layer.
- Bismuth layered compound
- the bismuth layer compound functions not as a strong dielectric but as a paraelectric, so it is small and This makes it possible to form a large-capacity thin-film capacitor having excellent dielectric properties.
- the bismuth layered compound forming the dielectric layer a bismuth layered compound excellent in characteristics as a capacitor material is selected.
- the bismuth layered compound has a stoichiometric composition: (B i 2 O 2 ) 2 + (A a _
- the symbol 2 ⁇ in the stoichiometric composition formula is a positive integer, and the symbol ⁇ is sodium (Na), potassium (K), lead (Pb), barium (Ba), It is at least one element selected from the group consisting of strontium (Sr), calcium (Ca) and bismuth (Bi), and the symbols are iron (Fe), cobalt (Co), ROM (Cr), Gallium (Ga), Titanium (Ti), Niobium (Nb), Tantalum (Ta), Antimony (Sb), Manganese (Mn), Vanadium (V), Molybdenum ( Mo) and at least one element selected from the group consisting of tungsten (W).
- the bismuth layered compound is not limited to those represented by the above composition formula, and is not particularly limited as long as the bismuth layered compound retains the crystal structure of the bismuth layered compound.
- a bismuth layer compound, and each 45 O 3 1 consists of a (/ .pi. 1) pieces of Bae Ropusukai bets grating continuous layered base Ropusukai coat layer 1, (B i 2 O 2 ) 2 + layer 2 has a layered structure alternately stacked.
- the number of layers of the layered perovskite layer 1 and (B i 2 O 2 ) 2+ layer 2 is not particularly limited, and at least a pair of (B i 2 O 2 ) 2+ layer 2 and It is sufficient to have one layered perovskite layer 1 sandwiched.
- the c-axis of the bismuth layered compound means the direction connecting the pair of (B i 2 O 2 ) 2+ layers 2, that is, the [001] orientation.
- the degree of orientation of the [001] orientation of the bismuth layered compound contained in the dielectric layer that is, the c-axis orientation degree is not necessarily 100%, and the c-axis orientation degree is not necessarily 100%. Should be 80% or more.
- the c-axis orientation is preferably 90%, and more preferably 95% or more.
- the degree of c-axis orientation of the bismuth layered compound is defined by equation (1).
- the thickness of the dielectric layer is set to, for example, 100 nm or less.
- a thin film capacitor having a relatively high dielectric constant and a low loss (ta ⁇ ⁇ ) can be obtained, a thin film having excellent leakage characteristics, improved withstand voltage, excellent temperature characteristics of dielectric constant, and excellent surface smoothness. It becomes possible to obtain a capacitor.
- the bismuth layered compound contained in the dielectric layer has a composition represented by a stoichiometric composition formula: C a 'S iT d-B i T Ois. Where 0 ⁇ 1.
- a bismuth layer compound having such a composition is used, a dielectric layer having a relatively large dielectric constant can be obtained, and the temperature characteristics thereof are further improved.
- a part of the element represented by the symbol ⁇ or in the stoichiometric composition formula of the bismuth layered compound contained in the dielectric layer is composed of scandium (S c;), yttrium (Y), Lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd) , Terbium (Tb), dysprosium (Dy), holmium (Ho), erupium (Er), thulium (Tm), ytterbium (Yb) and lutetium (Lu) It is preferable to be substituted by at least one element e (yttrium (Y) or rare earth element) selected from the group consisting of:
- the preferable substitution amount differs depending on the value of ⁇ .
- the Curie temperature of the dielectric layer is preferably _100 ° C or higher, ° C or lower, and more preferably 150 ° C or higher and 50 ° C or lower.
- one Curie point is 110 ° C.
- the dielectric constant of the dielectric layer is improved.
- Curie temperature can be measured by DSC (differential scanning calorimetry) or the like. When the Curie point becomes lower than room temperature (25 ° C), ta ⁇ ⁇ further decreases, and as a result, the loss Q value further increases.
- the dielectric layer of the laminate unit according to the present invention has excellent leak characteristics, some of the elements represented by the symbol ⁇ or 5 in the stoichiometric composition formula of the bismuth layered compound are used. However, when the element is replaced by the element? E, the leakage characteristics of the dielectric layer can be further improved, which is preferable. For example, even when part of the element represented by the symbol or 5 in the stoichiometric composition formula of the bismuth layered compound is not replaced by the element /?
- the laminate unit according to the present invention the dielectric layer, the leakage current when measured at electric field intensity 5 0 k V / cm, preferably, 1 X 1 0- 7 a / cm 2 or less, more preferably, 5 X 1 0 8 AZ cm 2 or less, and the short-circuit rate can be preferably 10% or less, more preferably 5% or less, but the stoichiometric composition of the bismuth layer compound in the stoichiometric composition formula some of the elements represented by the symbol or H is, the element W e, if it is substituted, the leakage current when measured under the same conditions, preferably, 5 X 1 0- 8 AZ cm 2 or less, more preferably, it can be in 1 X 1 0- 8 a / cm 2 or less, the short rate Preferably 5% or less, more preferably, it may be 3% or less.
- the dielectric layer is formed by a vacuum deposition method, a sputtering method, a pulse laser deposition method (PLD), a metal organic chemical vapor deposition (MOC VD), an organic metal decomposition method (metal- organic decomposition (MOD) ⁇
- PLD pulse laser deposition method
- MOC VD metal organic chemical vapor deposition
- MOD organic metal decomposition method
- It can be formed using various thin film forming methods such as liquid phase method (CSD method) such as Zonore and Genole methods.
- CSD method liquid phase method
- the laminate unit including the support substrate and the dielectric layer according to the present invention can be used not only as a component of a thin film capacitor but also as a laminate unit for emitting an inorganic EL element. That is, in order to emit light from the inorganic EL element, an insulating layer is required between the supporting substrate and the inorganic EL element, but a dielectric containing a bismuth layered compound with improved c-axis orientation is used. A dielectric layer made of a material has a low insulating property. Therefore, an inorganic EL element is disposed on the dielectric layer, and another electrode is disposed on the inorganic EL element to separate the electrode from the supporting substrate. By applying a voltage between the electrodes, the inorganic EL element emits light as desired It becomes possible.
- FIG. 1 is a diagram schematically showing the structure of a bismuth layered compound.
- FIG. 2 is a schematic partial cross-sectional view of a laminated unit according to a preferred embodiment of the present invention.
- FIG. 3 is a schematic partial cross-sectional view of a thin-film capacitor produced by using a laminated body cut according to a preferred embodiment of the present invention. DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION
- FIG. 2 is a schematic cross-sectional view of a laminate unit according to a preferred embodiment of the present invention.
- the laminate cut 1 includes a dielectric layer 3 on a support substrate 2.
- the support substrate 2 of the laminate unit 1 is formed of platinum (Pt) and oriented in the [001] direction.
- the support substrate 2 functions to mechanically support the multilayer unit 1 and also functions as an electrode layer of the multilayer unit 1.
- the supporting substrate 2 is formed of platinum (Pt) and is oriented in the [001] direction, the supporting substrate 2 functions as an electrode, and furthermore, a dielectric material including a bismuth layered compound is used. It has a function as a buffer layer that guarantees that the dielectric layer 3 containing the bismuth layered compound oriented in the [001] direction, that is, the c-axis direction, can be reliably formed by the epitaxial growth. I have.
- the thickness of the support substrate 2 is determined so that a sufficient mechanical strength for mechanically supporting the laminate unit 1 is obtained.
- the support substrate 2 oriented in the [001] direction, first, On another supporting substrate such as an amorphous substrate such as fused quartz, a polycrystalline substrate such as ceramics, a heat-resistant glass substrate, a resin substrate, etc., there is anisotropy, and platinum (Pt), A material capable of forming a support substrate having the function of an electrode layer by epitaxially growing a crystal of a metal such as ruthenium (Ru) or an alloy containing these metals as a main component. 0 1] A buffer layer oriented in the c-axis direction is formed. Next, platinum (Pt) crystals are epitaxially grown on the buffer layer, and platinum (Pt) is formed on the buffer layer. t) is formed, and then the buffer layer is peeled off from the support substrate.
- amorphous substrate such as fused quartz, a polycrystalline substrate such as ceramics, a heat-resistant glass substrate, a resin substrate, etc.
- platinum (Pt) A material capable of forming a support
- a support substrate oriented in the [001] direction is formed.
- the laminate unit 1 includes a dielectric layer 3 formed on a support substrate 2.
- the dielectric layer 3 is formed on the supporting substrate 2 by a metal-organic decomposition (MOD) method.
- MOD metal-organic decomposition
- a toluene solution of 2-ethylhexanoic acid Sr, a 2-ethylhexanoic acid solution of 2-ethylhexanoic acid B i, and a toluene solution of 2-ethylhexanoic acid Ti are mixed.
- 1-mol of 2-ethylhexanoic acid S r, 4-mono of 2-ethylhexanoic acid B i, and 4-mol of 2-ethylhexanoic acid T i are mixed in a stoichiometric ratio, and toluene is mixed.
- the obtained raw material solution is applied onto the supporting substrate 2 by spin coating, dried, and temporarily fired at a temperature at which the obtained dielectric layer 3 does not crystallize.
- the dielectric layer 3 is fully baked, and is coated, dried, and pre-baked until a dielectric layer 3 having a required thickness, for example, a dielectric layer 3 having a thickness of 100 nm is obtained.
- a series of operations consisting of coating, drying, preliminary baking and main baking are repeated.
- the dielectric material containing the bismuth layer compound grows epitaxially, and the dielectric layer 3 oriented in the [001] direction, that is, the c-axis direction is formed.
- the laminate unit 1 includes the support substrate 2 and the dielectric layer 3 formed on the support substrate 2, and the support substrate 2 has conductivity, and On top of that, the substrate 2 has a property that a dielectric material containing a bismuth layered compound can be epitaxially grown, and its surface is oriented in the [001] direction. Therefore, the dielectric material containing the bismuth layered compound is epitaxially grown on the support substrate 2 to include the bismuth layered compound oriented in the [001] direction, that is, the c-axis direction. It is possible to reliably form the dielectric layer 3 made of a dielectric material.
- the laminate unit 1 includes the dielectric layer 3 formed of the dielectric material including the bismuth layered compound oriented in the [001] direction, that is, the c-axis direction. Therefore, for example, an upper electrode is provided on the dielectric layer 3 of the multilayer unit 1 according to the present embodiment to produce a thin film capacitor, and a thin film capacitor is formed between the support substrate 2 and the upper electrode.
- the direction of the electric field approximately matches the c-axis of the bismuth layered compound contained in the dielectric layer 3, and therefore, the bismuth layered compound ferroelectric contained in the dielectric layer 3 Since it is possible to suppress the property as a paraelectric and sufficiently exhibit the property as a paraelectric, it is possible to produce a small-sized and large-capacity thin-film capacitor.
- the laminate unit 1 includes the dielectric layer 3 formed of a dielectric material containing a bismuth layered compound oriented in the [001] direction, that is, the c-axis direction.
- the dielectric layer 3 has high insulation properties, the dielectric layer 3 can be made thinner, so that the thin film capacitor can be further miniaturized.
- FIG. 3 is a schematic partial cross-sectional view of a thin-film capacitor manufactured by using the multilayer unit 1 according to a preferred embodiment of the present invention.
- the thin film capacitor 10 is composed of the multilayer unit 1 shown in FIG. 2 and the upper electrode layer 1 formed on the dielectric layer 3 of the multilayer unit 1. Has one.
- the support substrate 2 of the multilayer unit 1 has a function of ensuring the mechanical strength of the entire thin film capacitor 10.
- the support substrate 2 of the multilayer unit 1 functions as one electrode of the thin film capacitor 10 and also moves the c-axis of the bismuth layered compound contained in the dielectric layer 3 with respect to the electric field. It has a function as a buffer layer for making the orientation substantially parallel.
- the dielectric layer 3 of the multilayer unit 1 has a function as a dielectric layer of the thin film capacitor 10.
- an upper electrode layer 11 functioning as the other electrode of the thin-film capacitor 10 is formed on the dielectric layer 3 of the multilayer unit 1.
- the material for forming the upper electrode layer 11 is not particularly limited as long as it has conductivity. Platinum (Pt), ruthenium (Ru), rhodium (Rh), palladium ( Metals such as Pd), iridium (Ir), gold (Au), silver (Ag), copper (Cu), nickel (Ni) and alloys containing these as main components, NdO, N b O, R h O 2, O s O 2, I r O 2, R u O 2, S rMo O 3, S r R U_ ⁇ 3, C a R u O 3 , S r VO 3, S r C r O 3, S r C o O 3, L a N i O 3, N b de one-flop S r T i O 3 conductive oxide such and mixtures thereof, a etc.
- the material for forming the upper electrode layer 11 is considered in terms of lattice matching with the material for forming the dielectric layer 3. It is possible to form a film at room temperature without using a base metal such as iron (Fe) or covanolate (Co), or an alloy such as WSi or MoSi. One can also be formed.
- the thickness of the upper electrode layer 11 is not particularly limited as long as the function as the other electrode of the thin film capacitor 10 can be ensured.For example, the thickness is about 10 to 1000 nm. Can be set.
- the method for forming the upper electrode layer 11 is not particularly limited, but includes a vacuum evaporation method, a sputtering method, a pulse laser evaporation method (PLD), and an organic metal-organic chemical vapor deposition method.
- Vapor deposition: MOCVD), metal-organic decomposition (MOD) ⁇ Can be formed using various thin film forming methods such as liquid phase method (CSD method) such as sol-gel method.
- the sputtering method is preferred from the viewpoint of the film formation rate.
- the bismuth layer compound contained in the dielectric layer 3 has its c-axis substantially perpendicular to the support substrate 2 and the upper electrode layer 11. Oriented. Therefore, when an electric field is applied between the support substrate 2 and the upper electrode layer 11, the direction of the electric field almost coincides with the c-axis of the bismuth layered compound contained in the dielectric layer 3. However, by suppressing the ferroelectric properties of the bismuth layer compound contained in the dielectric layer 3, it is possible to sufficiently exhibit the properties as a paraelectric substance. It becomes possible to obtain a thin film capacitor 10.
- the thin film capacitor 10 having such characteristics can be preferably used as a decoupling capacitor, particularly as a decoupling capacitor for an LSI having a high operating frequency.
- the support substrate 2 of the laminate unit 1 is formed of platinum (Pt), but the support substrate 2 is formed of platinum (Pt).
- t is not necessarily required, and is formed of a material having conductivity and capable of epitaxially growing a dielectric material including a bismuth layered compound thereon, and at least a surface formed of the material.
- the material is not particularly limited as long as the material is oriented in the azimuth and has mechanical strength as a supporting substrate.
- platinum Pt
- ruthenium Ru
- rhodium Rh
- palladium Pd
- iridium Ir
- gold Au
- silver Ag
- copper Cu
- alloy or mainly metals and these such as nickel (N i), N d O , N b O, R h 0 2, O s 0 2, I r O 2, R u 0 2, S r Mo O 3, S r R u O 3, C a R u 0 3, S r V0 3, S r C R_ ⁇ 3, S r C o OL a N i O 3, N b doped S r T i 0 3 conductive oxides and mixtures thereof, such as, stoichiometric compositional formula: B i 2 S r 2 C a n i C u n O 2 n + BSCC o
- the support substrate 2 may be made of platinum (Pt) in the same manner as the case of forming the support substrate. it can.
- the support substrate 2 is formed from a single-crystal conductive oxide, a mixture of conductive oxides, or an oxide superconductor, the conductive oxide, a mixture of conductive oxides, or an oxide is used.
- the support substrate 2 oriented in the direction can be formed. Further, when the supporting substrate 2 is formed of a polycrystalline conductive oxide, a mixture of conductive oxides, or an oxide superconductor, the conductive oxide, the mixture of conductive oxides, or the oxide superconductivity is used. Hot forging method Orientation in [01] direction by hot working method such as
- the [001] direction is oriented.
- the formed supporting substrate 2 can be formed.
- a conductive oxide, a mixture of conductive oxides, or polycrystalline particles of an oxide superconductor are oriented by a hot-king method such as a hot forging method or a hot pressing method.
- a hot-king method such as a hot forging method or a hot pressing method
- the degree of orientation in the [001] direction that is, the degree of c-axis orientation is 90% or more, it can be used as the supporting substrate 2 as it is.
- logical composition formula: is provided with the S r B i 4 T i 4 O 15 dielectric layer 3 formed of a dielectric material containing a bismuth layer compound having a composition that is i Table in, on the support substrate 2
- the dielectric layer 3 is formed with a dielectric material containing a bismuth layered compound having m other than 4.
- dielectric layer 3 is formed with a dielectric material containing a bismuth layered compound having m other than 4.
- dielectric layer 3 is formed with a dielectric material containing a bismuth layered compound having
- the dielectric layer 3 of the multilayer unit 1 is formed by the organic metal splitting method (.metal-organic decomposition: MOD). It is not always necessary to form by metal decomposition method. Vacuum evaporation method, sputtering method, pulsed laser evaporation method (PLD), metal-organic chemical vapor deposition (MOCVD), ⁇
- the dielectric layer 3 can also be formed by other thin film forming methods such as the Gnolet method or another liquid phase method (CSD method).
- the laminate unit 1 is a thin film capacitor.
- the multilayer unit 1 is used not only as a component of a thin film capacitor but also for emitting an inorganic electro-luminescence (EL) element. It can also be used as That is, in order to emit light from the inorganic EL element, an insulating layer is required between the support substrate 2 and the inorganic EL element. However, a dielectric material containing a bismuth layer compound having improved c-axis orientation is required.
- the dielectric layer 3 has a high insulating property.Therefore, an inorganic EL element is disposed on the dielectric layer 3, and another electrode is disposed on the inorganic EL element, thereby forming an inorganic EL element. By applying a voltage, the inorganic EL element can emit light as desired.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Inorganic Insulating Materials (AREA)
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005507013A JPWO2004112056A1 (ja) | 2003-06-12 | 2004-06-14 | 積層体ユニット |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/460,763 | 2003-06-12 | ||
US10/460,763 US6930875B2 (en) | 2003-06-12 | 2003-06-12 | Multi-layered unit |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004112056A1 true WO2004112056A1 (ja) | 2004-12-23 |
Family
ID=33511077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/008664 WO2004112056A1 (ja) | 2003-06-12 | 2004-06-14 | 積層体ユニット |
Country Status (3)
Country | Link |
---|---|
US (1) | US6930875B2 (ja) |
JP (1) | JPWO2004112056A1 (ja) |
WO (1) | WO2004112056A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1598871A1 (en) * | 2003-02-27 | 2005-11-23 | TDK Corporation | Thin-film capacitative element and electronic circuit or electronic equipment including the same |
KR100561840B1 (ko) * | 2003-07-09 | 2006-03-16 | 삼성전자주식회사 | 전극층, 이를 구비하는 발광소자 및 전극층 제조방법 |
KR100576849B1 (ko) * | 2003-09-19 | 2006-05-10 | 삼성전기주식회사 | 발광소자 및 그 제조방법 |
WO2007010768A1 (ja) * | 2005-07-15 | 2007-01-25 | Murata Manufacturing Co., Ltd. | コンデンサおよびその製造方法 |
US8184426B2 (en) * | 2006-12-25 | 2012-05-22 | National Institute For Materials Science | Dielectric element and method for producing the dielectric element |
US20110082045A1 (en) * | 2009-10-02 | 2011-04-07 | Gilbert Douglas J | Extremely low resistance materials and methods for modifying and creating same |
US8211833B2 (en) * | 2010-06-04 | 2012-07-03 | Ambature, Llc | Extremely low resistance composition and methods for creating same |
WO2011041766A1 (en) * | 2009-10-02 | 2011-04-07 | Ambature L.L.C. | High temperature superconducting films and methods for modifying and creating same |
US8404620B2 (en) * | 2011-03-30 | 2013-03-26 | Ambature, Llc | Extremely low resistance compositions and methods for creating same |
CN104538539B (zh) * | 2014-12-25 | 2017-06-27 | 内蒙古科技大学 | 一种电卡效应致冷复合厚膜材料 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04132615A (ja) * | 1990-09-25 | 1992-05-06 | Hokuriku Electric Ind Co Ltd | ビスマス層状構造化合物薄膜の製造方法 |
JPH08330304A (ja) * | 1995-03-30 | 1996-12-13 | Sony Corp | 酸化物膜成膜方法、半導体装置の製造方法、並びに超伝導体薄膜の成膜方法 |
JPH0974169A (ja) * | 1995-09-05 | 1997-03-18 | Toshiba Corp | 薄膜キャパシタ |
JPH11103024A (ja) * | 1997-09-29 | 1999-04-13 | Hitachi Ltd | 強誘電体素子および半導体装置 |
JP2003151976A (ja) * | 2001-08-28 | 2003-05-23 | Tdk Corp | 高誘電率絶縁膜、ゲート絶縁膜および半導体装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2000A (en) * | 1841-03-12 | Improvement in the manufacture of starch | ||
US56A (en) * | 1836-10-15 | Dock-plate | ||
US11A (ja) * | 1836-08-10 | |||
US5A (en) * | 1836-08-10 | Thomas blancharjq | ||
JPS56144523A (en) | 1980-04-11 | 1981-11-10 | Tdk Electronics Co Ltd | Method of manufacturing laminated capacitor |
US5206788A (en) * | 1991-12-12 | 1993-04-27 | Ramtron Corporation | Series ferroelectric capacitor structure for monolithic integrated circuits and method |
JPH05335174A (ja) | 1992-05-28 | 1993-12-17 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JPH05335173A (ja) | 1992-05-28 | 1993-12-17 | Murata Mfg Co Ltd | 積層セラミック電子部品及びその製造方法 |
US5248564A (en) | 1992-12-09 | 1993-09-28 | Bell Communications Research, Inc. | C-axis perovskite thin films grown on silicon dioxide |
US5426075A (en) * | 1994-06-15 | 1995-06-20 | Ramtron International Corporation | Method of manufacturing ferroelectric bismuth layered oxides |
KR100199095B1 (ko) | 1995-12-27 | 1999-06-15 | 구본준 | 반도체 메모리 셀의 캐패시터 구조 및 그 제조방법 |
JP3193302B2 (ja) | 1996-06-26 | 2001-07-30 | ティーディーケイ株式会社 | 膜構造体、電子デバイス、記録媒体および強誘電体薄膜の製造方法 |
JP3195265B2 (ja) * | 1997-01-18 | 2001-08-06 | 東京応化工業株式会社 | Bi系強誘電体薄膜形成用塗布液およびこれを用いて形成した強誘電体薄膜、強誘電体メモリ |
JP3472087B2 (ja) | 1997-06-30 | 2003-12-02 | Tdk株式会社 | 膜構造体、電子デバイス、記録媒体および酸化物導電性薄膜の製造方法 |
US5994276A (en) | 1997-09-08 | 1999-11-30 | Mcmaster University | Composite high Tc superconductor film |
JP3549715B2 (ja) * | 1997-10-15 | 2004-08-04 | 日本電気株式会社 | Bi層状強誘電体薄膜の製造方法 |
US6096343A (en) | 1997-10-27 | 2000-08-01 | Gerhard Gergely | Instant calcium/soybean granules, their use and process for their preparation |
JPH11214245A (ja) | 1998-01-23 | 1999-08-06 | Murata Mfg Co Ltd | 薄膜積層コンデンサおよびその製造方法 |
JP4228437B2 (ja) | 1998-10-21 | 2009-02-25 | 株式会社村田製作所 | 薄膜積層コンデンサおよびその製造方法 |
US6566698B2 (en) * | 2000-05-26 | 2003-05-20 | Sony Corporation | Ferroelectric-type nonvolatile semiconductor memory and operation method thereof |
JP2003209179A (ja) | 2002-01-15 | 2003-07-25 | Fujitsu Ltd | 容量素子及びその製造方法 |
JP4036707B2 (ja) * | 2002-08-12 | 2008-01-23 | 三洋電機株式会社 | 誘電体素子および誘電体素子の製造方法 |
-
2003
- 2003-06-12 US US10/460,763 patent/US6930875B2/en not_active Expired - Lifetime
-
2004
- 2004-06-14 JP JP2005507013A patent/JPWO2004112056A1/ja not_active Withdrawn
- 2004-06-14 WO PCT/JP2004/008664 patent/WO2004112056A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04132615A (ja) * | 1990-09-25 | 1992-05-06 | Hokuriku Electric Ind Co Ltd | ビスマス層状構造化合物薄膜の製造方法 |
JPH08330304A (ja) * | 1995-03-30 | 1996-12-13 | Sony Corp | 酸化物膜成膜方法、半導体装置の製造方法、並びに超伝導体薄膜の成膜方法 |
JPH0974169A (ja) * | 1995-09-05 | 1997-03-18 | Toshiba Corp | 薄膜キャパシタ |
JPH11103024A (ja) * | 1997-09-29 | 1999-04-13 | Hitachi Ltd | 強誘電体素子および半導体装置 |
JP2003151976A (ja) * | 2001-08-28 | 2003-05-23 | Tdk Corp | 高誘電率絶縁膜、ゲート絶縁膜および半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2004112056A1 (ja) | 2006-09-07 |
US6930875B2 (en) | 2005-08-16 |
US20040252440A1 (en) | 2004-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6876536B2 (en) | Thin film capacitor and method for fabricating the same | |
US20070279838A1 (en) | Composition for Thin Film Capacitive Device, Insulating Film With High Delectric Constant, Thin Film Capacitive Device, Thin-Film Laminated Capacitor and Process for Producing Thin Film Capacitive Device | |
JPWO2003021606A1 (ja) | 薄膜容量素子用組成物、高誘電率絶縁膜、薄膜容量素子および薄膜積層コンデンサ | |
EP1598872A1 (en) | High dielectric constant insulating film, thin-film capacitive element, thin-film multilayer capacitor, and method for manufacturing thin-film capacitive element | |
US6891714B2 (en) | Multi-layered unit including electrode and dielectric layer | |
WO2004112056A1 (ja) | 積層体ユニット | |
JP3856142B2 (ja) | 薄膜容量素子用組成物、高誘電率絶縁膜、薄膜容量素子および薄膜積層コンデンサ | |
US6977806B1 (en) | Multi-layered unit including electrode and dielectric layer | |
TWI234174B (en) | Thin film capacitive element, and electronic circuit and electronic device including the same | |
JP4761106B2 (ja) | 積層体ユニットおよび薄膜容量素子 | |
US6958900B2 (en) | Multi-layered unit including electrode and dielectric layer | |
US6788522B1 (en) | Multi-layered unit including electrode and dielectric layer | |
JP2004165370A (ja) | 電源ノイズ低減用薄膜コンデンサ | |
WO2004077462A1 (ja) | 電極層および誘電体層を含む積層体ユニット | |
WO2004077561A1 (ja) | 電極層および誘電体層を含む積層体ユニット | |
WO2004077563A1 (ja) | 電極層および誘電体層を含む積層体ユニット | |
WO2004077564A1 (ja) | 薄膜容量素子ならびにそれを含んだ電子回路および電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005507013 Country of ref document: JP |
|
122 | Ep: pct application non-entry in european phase |