WO2004108397A1 - 積層体の製造方法 - Google Patents
積層体の製造方法 Download PDFInfo
- Publication number
- WO2004108397A1 WO2004108397A1 PCT/JP2004/007889 JP2004007889W WO2004108397A1 WO 2004108397 A1 WO2004108397 A1 WO 2004108397A1 JP 2004007889 W JP2004007889 W JP 2004007889W WO 2004108397 A1 WO2004108397 A1 WO 2004108397A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- roll
- metal
- metal foil
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7428—Transition metals or their alloys
- B29C66/74281—Copper or alloys of copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7428—Transition metals or their alloys
- B29C66/74283—Iron or alloys of iron, e.g. steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7422—Aluminium or alloys of aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
- B29C66/7428—Transition metals or their alloys
- B29C66/74285—Noble metals, e.g. silver, gold, platinum or their alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/55—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Definitions
- the present invention relates to a laminate using a film made of a liquid crystal polymer capable of forming an optically anisotropic molten phase (hereinafter referred to as a liquid crystal polymer film). It relates to the manufacturing method.
- a liquid crystal polymer film is known as a material excellent in high heat resistance, hygroscopic dimensional stability, high frequency characteristics, and the like. Focusing on these characteristics of the liquid crystal polymer film, it has been studied to use it as an insulating material for electronic circuit boards. When used for electronic circuit board applications, a laminate of a liquid crystal polymer film and a metal foil represented by copper foil is suitable as a laminate for a wiring board.
- a liquid press polymer film and a metal foil that are cut into a predetermined size between the upper and lower hot plates using a hot press device are used.
- a method of stacking and thermocompression bonding in a vacuum state can be mentioned.
- this method is a batch method, there is a problem that it is not possible to produce a laminate having a uniform quality in terms of peel strength, etc.
- the production speed is slow and the cost is high. Have. Therefore, in order to increase the production speed at a low cost, a method for continuously producing a metal-clad laminate has been proposed.
- Japanese Patent Application Laid-Open No. 5-4260 has disclosed a method of passing a pressure roll in a state where a liquid crystal polymer film and a metal foil are overlapped. Therefore, setting the crimping temperature 5-80 ° C lower than the melting point of the liquid crystal polymer maintains the mechanical properties and heat resistance inherent in the film layer, and makes the film layer and the metal foil layer strong. This is desirable in terms of proper adhesion.
- the form of the pressure roll for crimping the liquid crystal polymer film and the metal foil is as follows: 1) Metal roll, 2) Rubber roll, 3) Metal coated with resin such as rubber or polyimide on the surface It is also described that there is a roll, and a rubber roll having a specific range of hardness or a metal roll having a rubber coating layer is preferable on at least one of the pressure rolls.
- a combination of a rubber roll and a metal roll is also conceivable, but in this case, a pair of metal rolls
- the film will be heated, if the heat resistance of the rubber is low, the temperature of the film cannot be raised sufficiently, and there is a problem that it is difficult to control the temperature of the rubber roll.
- the film and the metal foil It is difficult to obtain a material with sufficient adhesive strength, and a laminate manufactured using a rubber roll is used as a printed wiring board or the like that requires adhesion between a film and a metal foil. There was a hindrance.
- the resin-coated metal roll of 3 since the resin-coated metal roll of 3) above has a coating layer thickness of about 10 mm, the temperature difference between the metal roll inside the resin coating layer and the surface of the coating layer becomes large, and the temperature of the roll surface is reduced. There was a problem that it could not be high enough.
- An object of the present invention is to provide a laminate having a good appearance and having a sufficient adhesion between a liquid crystal polymer film and a metal foil, particularly a laminate suitably used for a printed wiring board. There is.
- the inventors of the present invention have found that it is important to prevent direct contact between the metal surface of the metal roll and the laminate material composed of the liquid crystal polymer film and the metal foil on at least one surface. It has been found that it is effective to cover the surface of one metal roll with a resin or to interpose a heat-resistant film between at least one laminate material and the metal mouth.
- a film made of a liquid crystal polymer that forms an optically anisotropic melt phase and a metal foil are superimposed and passed between pressure rolls.
- the liquid crystal polymer film used in the laminate of the present invention comprises a liquid crystal polymer that forms an optically anisotropic melt phase.
- the liquid crystal polymer is also called a thermopick liquid crystal polymer.
- a liquid crystal polymer is a polymer that transmits polarized light when a sample in a molten state is observed under a direct microscope with a polarizing microscope equipped with a heating device.
- the raw material of the liquid crystal polymer used in the present invention is not particularly limited, but there are raw material compounds and derivatives thereof classified into (1) to (4) exemplified below.
- Aromatic diamines, aromatic hydroxyamines or aromatic amino acids are aromatic diamines, aromatic hydroxyamines or aromatic amino acids.
- liquid crystal polymer derived from these examples include known thermotropic liquid crystal polyesters and polyester amides. However, in order to form a liquid crystal polymer, there is an appropriate range for each combination of raw material compounds.
- liquid crystal polymer obtained from these raw material compounds Mention may be made of copolymers having the structural units shown.
- the liquid crystal polymer film used in the present invention has an optically anisotropic melting in the range of 2400 to 400 ° C, particularly 2550 to 3500 ° C in terms of heat resistance and workability. Those having a transition temperature to the phase are preferred.
- a lubricant, an antioxidant, a filler and the like may be blended as long as the characteristics of the film are not impaired.
- the liquid crystal polymer film is obtained by, for example, extrusion molding.
- any method can be applied to the extrusion method, the known T-die method, laminate stretching method, inflation method, etc. are industrially advantageous.
- the inflation method since the laminate stretching method applies stress not only in the machine axis direction of the film (MD direction) but also in the direction perpendicular to it (TD direction), it is mechanical in the MD and TD directions.
- a film with balanced properties can be obtained.
- the preferred thickness range of the liquid crystal polymer film is 500 m or less, more preferably 10 to 500 m, and particularly preferably 15 to 250 m. If the film thickness exceeds, the film becomes stiff and difficult to handle, such as being difficult to wind into a roll. Also, if the film thickness is less than 10 im, the film is easily torn and difficult to handle.
- the material of the metal foil used in the present invention is not particularly limited. Examples include gold, silver, copper, stainless steel, nickel, aluminum, and alloys thereof.
- As the metal foil preferably used copper foil (copper alloy mainly composed of copper) (Including gold leaf), stainless steel foil. Any copper foil produced by a rolling method or an electrolysis method can be used.
- physical surface treatment such as roughening treatment or chemical surface treatment such as acid cleaning is performed within a range where the effects of the present invention are not impaired. It may be given.
- the preferred thickness range of the metal foil is 5 to 150 m, more preferably 10 to particularly preferably 10 to 35 / im. It is preferable to reduce the thickness of the metal foil from the viewpoint that a fine pattern can be formed. However, if the thickness is too thin, the metal foil may be wrinkled in the manufacturing process, and a circuit may be used as a wiring board. Even if it is formed, the wiring may be broken or the reliability of the circuit board may be reduced. On the other hand, when the thickness of the metal foil is increased, when the metal foil is etched, a taper is generated on the side surface of the circuit, which is disadvantageous for fine pattern formation. In the present invention, the liquid crystal polymer film and the metal foil are overlapped and passed between the pressure rolls at the same time or after the overlap.
- the form of the liquid crystal polymer film and the metal foil used here is preferably in the form of a roll wound up from the viewpoint of productivity.
- a film and metal foil in the form of a roll wound up are prepared, and this is continuously conveyed by a roll-to-roll, and heat-pressed in the process to make the process highly productive. it can.
- Thermocompression bonding between the liquid crystal polymer film and the metal foil is performed between the pressure rolls, and usually a pair of pressure rolls is used.
- the present invention prevents direct contact between the metal surface of the metal roll and the laminate material comprising the liquid crystal polymer film and the metal foil on at least one surface. a) The surface of at least one metal roll is resin-coated, or b) A heat-resistant film is interposed between the laminate material on at least one side and the metal roll.
- At least one of the pressure rolls has a resin coating layer having a thickness of 0.02 to 5 mm on the surface of the metal roll.
- the other is a rubber roll, a metal roll, or a resin-coated metal roll, but it is in the same thickness range as above in order to develop the adhesion between the liquid crystal polymer film and the metal foil.
- the metal roll portion in the resin coating layer is heated by an appropriate means.
- a metal roll equipped with an induction heating method or a heating medium circulation type heating mechanism for example, it is preferable from the viewpoint of the uniformity of the surface temperature to use a metal roll equipped with an induction heating method or a heating medium circulation type heating mechanism.
- the resin coating layer includes rubber, and specifically, a material having high heat resistance and elasticity such as fluorine rubber, silicon rubber, and polyimide is preferably used.
- the thermocompression bonding to the liquid crystal polymer film is usually performed at a temperature 20 to 60 ° C. lower than the melting point of the liquid crystal polymer, the heat resistance temperature of the resin coating layer is also required to be heat resistant in this temperature range. .
- the resin coating layer on the metal roll surface must have a thickness in the range of 0.02 to 5 mni. If the thickness of the resin coating layer is 5 mm or more, the temperature difference between the metal roll and the roll surface will increase, making it difficult to control the temperature to make the conditions suitable for manufacturing the laminate, and the heat resistance of the coating layer. Roll surface temperature is sufficient due to restrictions It may be difficult to increase the speed. On the other hand, if the thickness of the resin coating layer is less than 0.02 mm, uniform pressurization due to the elastic effect of the resin coating layer becomes difficult.
- the thickness of the resin coating layer is preferably in the range of 0.02 to 2 miii, and particularly preferably in the range of 0.05 to 2 nim. preferable.
- the resin coating layer can be formed as a single layer, or a plurality of materials can be stacked to form a plurality of layers. Even in the case of a plurality of layers, the thickness of the resin coating layer is as described above. It is necessary to set the thickness range, and the preferable thickness range is the same.
- the hardness of the resin coating layer is preferably in the range of 60 to 95 degrees in terms of spring hardness (J I SA) based on the A-type spring hardness test according to J I S K6301 in order to apply pressure uniformly.
- the heat-resistant film is further overlapped with the surface that comes into contact with the pressure roll when passing between the pressure rolls at the same time or thereafter. Pass between.
- a heat-resistant film is overlaid on at least one surface, preferably both surfaces of the surface side surface (there are two surfaces, an upper surface and a lower surface).
- the liquid crystal polymer film, metal foil, or both should not be in direct contact with the pressure roll.
- Thermocompression bonding between the liquid crystal polymer film and the metal foil is performed between the pressure rolls, and usually a pair of metal pressure rolls is used.
- a heat-resistant resin film As the heat-resistant film that is passed along with the metal foil and the liquid crystal polymer film during pressurization, there is a heat-resistant resin film or a heat-resistant resin composite film.
- heat resistant resin film examples include resin films such as polyimides, polyamides, aromatic polyamides, polyphenylene sulfide, polyethylene naphtharate, fluororesins, and liquid crystal polymers. And composite films made of materials combined with metal, other resins, (inorganic) fibers, and the like.
- Specific examples of the heat resistant resin composite film include a composite of a liquid crystal polymer and a copper foil, a composite of a fluororesin and an aluminum fiber, and the like.
- a heat-resistant film is a non-adhesive film that does not adhere to the metal pressure roll and the resulting laminate at least at a surface temperature of the metal pressure roll of 250 ° C and a pressure of 150 kN / in. It is an efficient process to manufacture.
- the thickness range of the heat resistant film is 25 to 300 m, more preferably 50 to 250 ⁇ m, and particularly preferably 75 to 240 mm. If this thickness is too thin, the metal foil may be wrinkled during the manufacturing process, and when a circuit is formed as a wiring board, the wiring may be broken or the reliability of the circuit board may be reduced.
- the thickness increases, the temperature difference between the roll surface temperature and the metal foil as the raw material and the liquid crystal polymer film increases, and the adhesive strength of the laminate decreases.
- the range of the tensile modulus of the heat-resistant film is preferably 1 to 30 GPa, more preferably 1 to 15 GPa, and particularly preferably 1 to 10 GPa. If this tensile modulus is high, the metal foil is likely to wrinkle during the manufacturing process. On the other hand, when the tensile elasticity is low, the film is easily deformed due to pressurization with a metal roll, which may deteriorate the appearance of the laminate.
- a liquid crystal polymer film and a metal foil are passed through a metal pressure roll together with a heat resistant film to obtain a laminate of the liquid crystal polymer film and the metal foil.
- Metal pressurization After passing through the mouth, the heat-resistant film is peeled off from the laminate immediately or after several steps. Therefore, the heat-resistant film must not be attached to the metal pressure roll, and must not adhere firmly to the laminate so that it cannot be peeled off. Is done.
- the heat-resistant film to be used has a melting point that is at least higher than the surface temperature of the metal pressure roll, and when pressed at a pressure of 150 kN / m, the film is smooth without being deformed by heat and pressure.
- a polyimide having a melting point exceeding 250 ° C. such as a polyimide resin composite material.
- the surface of the metal pressure roll must be heated by some means.
- heating by a dielectric heating system or a heating medium circulation system can be exemplified.
- the surface temperature of the mouth is preferably 5 to 100 ° C. lower than the melting point of the liquid crystal polymer film, more preferably 20 to 60 ° C. lower than the melting point. If the surface temperature of the heating roll is low, the film and the metal foil may not adhere sufficiently. Further, when the surface temperature of the heating roll approaches the melting point of the film, the flow of the film becomes remarkable at the time of pressure bonding, resulting in a laminate having a poor appearance.
- the melting point of the above liquid crystal polymer film is the melting peak temperature in the differential scanning calorimetry (DSC) when the film to be subjected to thermocompression bonding is heated at a rate of temperature increase of 10 ° C / min.
- the pressure during crimping is not particularly limited as long as it can be applied uniformly in the width direction. However, it is preferably 5 to 200 kN / m, more preferably 10 to 40 kN / m.
- the laminate obtained by the present invention is not limited to a two-layer structure of a liquid crystal polymer film and a metal foil. That is, it is sufficient that the laminate to be produced includes at least one liquid crystal polymer film and at least one metal foil.
- the laminate to be produced includes at least one liquid crystal polymer film and at least one metal foil.
- the three-layer structure shown in the following I) to ⁇ )) IV) 4 layer structure, V) 5 layer structure and the like in the following I) to V), in the case of a laminate having two or more films, at least one film in contact with the metal foil is a liquid crystal polymer film.
- the film and the metal foil can be bonded at two or more surfaces at the same time.
- two films of metal foil are bonded on both surfaces of the film.
- the laminate obtained by the production method of the present invention has a good form, the film layer retains the excellent mechanical strength, electrical properties and heat resistance of the liquid crystal polymer, and the film layer has It is useful as a material for manufacturing FPC, TAB tape, etc. because it is firmly bonded to the metal foil not only at room temperature but also at high temperature.
- BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to these examples.
- Appearance 1 Visual observation of the laminate with pressure-bonded liquid crystal polymer film and metal foil was carried out, and the presence or absence of film deformation was examined.
- Appearance 2 The laminate obtained by press-bonding the liquid crystal polymer film and the metal foil was visually observed and evaluated according to the following criteria.
- solder heat resistance The laminate after the metal foil was formed into a circular pattern with a diameter of 1 mm with the front and back integrated was immersed in a solder bath at 260 ° C, and the presence or absence of deformation was visually observed. . When the appearance of the laminate was the same as before the solder bath immersion, it was good. When blistering, peeling, etc. were observed on the appearance, it was judged as bad.
- liquid crystal polymer film and the copper foil used in Examples and Comparative Examples were used.
- Liquid crystal polymer film Trade name Bexi, melting point 280 ° C, thickness 50 zm.
- Copper foil Electrolytic copper foil, thickness 18 Aim. Examples 1-3
- Copper foils were superposed on both sides of the liquid crystal polymer film, and at the same time, they were continuously fed between a pair of pressure rolls at lm / min. Two resin-coated metal rolls uniformly coated with 1 mm-thick fluorine rubber were used for the pair of pressure rolls, and the roll surface was heated to a predetermined temperature by a heating mechanism inside the metal roll.
- a roll was used as a raw material, and a laminate was continuously produced by a roll-to-roll method in which pressurization was performed by thermocompression in an intermediate process.
- Table 1 shows the surface temperature of the resin coating on the pressure roll and the evaluation results of the resulting laminate. Examples 4-5
- Example 6 The same procedure as in Example 1 was performed except that a pair of pressure rolls in which a 3 mm-thick silicone rubber was coated on the resin coating layer of the resin-coated metal roll was used.
- Example 6 The same procedure as in Example 1 was performed except that a pair of pressure rolls in which a 3 mm-thick silicone rubber was coated on the resin coating layer of the resin-coated metal roll was used.
- Example 2 The same procedure as in Example 1 was performed, except that a pair of pressure rolls in which a resin coating layer of a resin-coated metal roll was coated with a polyimide layer was used. Comparative Examples 1 to 3
- Example 4 The same procedure as in Example 1 was performed except that two metal ports without a resin coating layer were used for the rolls constituting the pair of pressure rolls. Comparative Example 4
- Example 2 The same procedure as in Example 1 was performed except that the resin-coated metal roll constituting the pressure port was composed of two metal rolls coated with a fluorine rubber having a thickness of 10 mm.
- the surface temperature of the resin coating layer of the pressure roll could not be 2 10 ° C or higher.
- Table 1 summarizes the surface temperature of the resin coating layer of the pressure roll and the evaluation results of the resulting laminate.
- a copper foil (B) is placed on both sides of the liquid crystal polymer film (A), and a 75 mm thick polyimide film (C) is placed on top of these (C / B / A / B / C stacked structure). These were continuously supplied at a lmZ portion between a pair of metal pressure rolls (diameter 250 mm) heated to the surface temperature shown in Table 1, and pressurized at a pressure of 150 / ⁇ . And The polyimide film (C) was peeled off to obtain a laminate. The liquid crystal polymer film, electrolytic copper foil and polyimide film used were rolls. Table 2 shows the surface temperature of the metal pressure roll and the evaluation results of the resulting laminate. Example 1 0 to 1 2
- a copper foil was placed on one side of the liquid crystal polymer film, supplied at a lm / min between metal pressure rolls (diameter 250 mm) heated to a predetermined temperature, and pressurized at a pressure of 150 kN / m.
- Table 2 summarizes the surface temperature of the pressure roll and the evaluation results of the resulting laminate.
- the production method of the present invention it is possible to produce a laminate having excellent heat resistance in which a liquid crystal polymer film and a metal foil have sufficient adhesion, and with high productivity.
- the laminate produced here does not impair the high heat resistance, moisture absorption dimensional stability, high frequency characteristics, etc. possessed by the liquid crystal polymer, and also has excellent adhesion to the metal foil. It is useful as a laminate used for wiring boards represented by
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/559,130 US20060151106A1 (en) | 2003-06-02 | 2004-06-01 | Method for producing laminate |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003156343A JP4398179B2 (ja) | 2003-06-02 | 2003-06-02 | 積層体の製造方法 |
| JP2003-156343 | 2003-06-02 | ||
| JP2003156342A JP2004358677A (ja) | 2003-06-02 | 2003-06-02 | 積層体の製造方法 |
| JP2003-156342 | 2003-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004108397A1 true WO2004108397A1 (ja) | 2004-12-16 |
Family
ID=33513358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2004/007889 Ceased WO2004108397A1 (ja) | 2003-06-02 | 2004-06-01 | 積層体の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20060015333A (ja) |
| WO (1) | WO2004108397A1 (ja) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5912815A (ja) * | 1982-07-13 | 1984-01-23 | Denki Kagaku Kogyo Kk | 合成樹脂熱ラミネ−ト製品の製造方法 |
| JPH0542603A (ja) * | 1991-04-05 | 1993-02-23 | Kuraray Co Ltd | 積層体の製造方法 |
| JP2002064259A (ja) * | 2000-08-18 | 2002-02-28 | Kanegafuchi Chem Ind Co Ltd | 耐熱性フレキシブル基板の製造方法 |
| JP2002326280A (ja) * | 2001-04-27 | 2002-11-12 | Kanegafuchi Chem Ind Co Ltd | 耐熱性フレキシブルの製造方法 |
| JP2003127233A (ja) * | 2001-10-29 | 2003-05-08 | Hitachi Industries Co Ltd | フィルム貼付方法及び装置 |
-
2004
- 2004-06-01 KR KR1020057023164A patent/KR20060015333A/ko not_active Ceased
- 2004-06-01 WO PCT/JP2004/007889 patent/WO2004108397A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5912815A (ja) * | 1982-07-13 | 1984-01-23 | Denki Kagaku Kogyo Kk | 合成樹脂熱ラミネ−ト製品の製造方法 |
| JPH0542603A (ja) * | 1991-04-05 | 1993-02-23 | Kuraray Co Ltd | 積層体の製造方法 |
| JP2002064259A (ja) * | 2000-08-18 | 2002-02-28 | Kanegafuchi Chem Ind Co Ltd | 耐熱性フレキシブル基板の製造方法 |
| JP2002326280A (ja) * | 2001-04-27 | 2002-11-12 | Kanegafuchi Chem Ind Co Ltd | 耐熱性フレキシブルの製造方法 |
| JP2003127233A (ja) * | 2001-10-29 | 2003-05-08 | Hitachi Industries Co Ltd | フィルム貼付方法及び装置 |
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