WO2004089822A1 - ガス原子内包フラーレンの製造装置及び製造方法並びにガス原子内包フラーレン - Google Patents
ガス原子内包フラーレンの製造装置及び製造方法並びにガス原子内包フラーレン Download PDFInfo
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- WO2004089822A1 WO2004089822A1 PCT/JP2004/005012 JP2004005012W WO2004089822A1 WO 2004089822 A1 WO2004089822 A1 WO 2004089822A1 JP 2004005012 W JP2004005012 W JP 2004005012W WO 2004089822 A1 WO2004089822 A1 WO 2004089822A1
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- Prior art keywords
- fullerene
- gas
- atom
- producing
- encapsulated
- Prior art date
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- 229910003472 fullerene Inorganic materials 0.000 title claims abstract description 227
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical group C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 title claims abstract description 205
- 238000000034 method Methods 0.000 title claims abstract description 12
- -1 atom ions Chemical class 0.000 claims abstract description 40
- 239000007789 gas Substances 0.000 claims description 96
- 125000004429 atom Chemical group 0.000 claims description 59
- 238000004519 manufacturing process Methods 0.000 claims description 31
- 150000002500 ions Chemical class 0.000 claims description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 12
- 229910052736 halogen Inorganic materials 0.000 claims description 10
- 150000002367 halogens Chemical class 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 4
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 4
- 238000002161 passivation Methods 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000010408 film Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000007667 floating Methods 0.000 description 6
- 230000007935 neutral effect Effects 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 229910052751 metal Chemical group 0.000 description 5
- 239000002184 metal Chemical group 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000000859 sublimation Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 230000008022 sublimation Effects 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 125000004436 sodium atom Chemical group 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/152—Fullerenes
- C01B32/154—Preparation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/152—Fullerenes
- C01B32/156—After-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/4697—Generating plasma using glow discharges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
- H05H1/4652—Radiofrequency discharges using inductive coupling means, e.g. coils
Definitions
- the present invention relates to an apparatus and a method for producing a gas atom-containing fullerene and a gas atom-containing fullerene.
- the gas atoms referred to here include hydrogen, nitrogen, fluorine, and the like which are gases at ordinary temperature, and also include sodium, power lime, etc. which are solid or liquid at ordinary temperature but can be treated as a gas at high temperature. Background art
- Non-Patent Document 1 Journal of Plasma and Fusion Research, Vol. 75, No. 8, P. 927-933 (August 1999)
- Fig. 7 As a production technology for endohedral fullerenes, the technology shown in Fig. 7 is proposed in Non-Patent Document 1. Has been done.
- This technology involves producing fullerenes by injecting fullerenes into the plasma flow of the atoms to be included in a vacuum vessel and depositing the fullerenes on a deposition plate located downstream of the plasma flow.
- this technique has a problem that the encapsulation rate is not good in the center of the deposition plate.
- the endohedral fullerene is deposited almost entirely on the radially outer portion of the plasma flow, and there is a problem that the endohedral fullerene is hardly deposited on the radially inner side of the plasma flow.
- the above technology is a technology relating to metal-encapsulated fullerenes, and at present, no technology relating to gas atom-encapsulated fullerenes is known.
- An object of the present invention is to provide an apparatus and a method for producing an endohedral fullerene capable of producing gas atom-encapsulated fullerene with higher yield, and to provide a gas atom-enclosed fullerene. aimed to. Disclosure of the invention
- An apparatus for producing a gas-atom-encapsulated fullerene of the present invention has a plasma generation chamber for generating a plasma having a gas inlet for introducing a gas containing an atom to be included therein, and communicating with the plasma generation chamber.
- a vacuum vessel capable of forming a plasma flow to introduce fullerene into the plasma flow, and having means for controlling the energy of electrons in the plasma flow on the side of the plasma generation chamber in the vacuum vessel.
- a gas atom-encapsulating fullerene producing apparatus characterized in that a potential body for forming an encapsulating fullerene by being combined with a fullerene ion by adjusting the velocity of an encapsulating target atomic ion is provided on the downstream side.
- fullerenes that contain atoms that are ionized to a positive potential such as fullerenes containing hydrogen, nitrogen, and metal atoms
- a gas containing atoms to be included is introduced from the gas inlet.
- a plasma is generated in the plasma generation chamber, which is composed of ions of the target atoms and electrons, which are charged to a positive potential.
- the plasma flow is controlled in one direction to form a plasma flow, and a negative voltage is applied to the electron energy control means to reduce the speed of the electrons.
- the fullerene takes in electrons and is charged to a negative potential.
- the speed of the ions of the inclusion target atoms charged to a positive potential is reduced to the moving speed of the fullerene ions, and is combined with the fullerene ions to facilitate formation of the included fullerene.
- a halogen gas compound for example, CF 4
- a halogen gas and an inert gas are introduced from a gas inlet.
- a plasma is generated which is composed of positively charged compound ions (for example, CF 3 +) or inert gas ions and negatively charged charged cations.
- the plasma flow is formed by controlling the plasma flow in one direction, and the electron energy control means is kept in a floating state.
- the electrons of the fullerene are beaten out and fullerene ions charged to a positive potential are obtained.
- Halogen charged to negative potential by applying negative voltage to potential body Of the fullerene ions is reduced to the moving speed of the fullerene ions, and is combined with the fullerene to facilitate the formation of the encapsulated fullerene.
- the method for producing a gas atom-encapsulated fullerene according to the present invention includes a step of introducing a gas having an atom to be included into a plasma generation chamber, a step of generating plasma in the plasma generation chamber, and a step of flowing the plasma in one direction. Controlling to form a plasma stream; introducing fullerene into the plasma stream to ionize the fullerene; and combining the encapsulation target atomic ion and the fullerene ion to form an encapsulated fullerene.
- a method for producing a gas atom-encapsulated fullerene characterized by comprising:
- fullerenes that include atoms that are ionized to a positive potential, such as fullerenes containing hydrogen atoms and nitrogen atoms
- the speed of the electrons that make up the plasma flow is controlled to adhere to the introduced fullerenes. It forms fullerene ions charged to a negative potential.
- fullerenes that contain atoms that are ionized to a negative potential, such as halogen-containing fullerenes
- a negative potential such as halogen-containing fullerenes
- the fullerenes when they are introduced into the plasma flow, they are charged to a positive potential by knocking out the fullerene electrons with the accelerated plasma flow. Fullerene ions are formed.
- the gas atom-containing fullerene of the present invention is a gas atom-containing fullerene characterized in that a part of the fullerene contains hydrogen ions, nitrogen ions, alkali metal atom ions, or halogen gas ions.
- FIG. 1 is a conceptual diagram showing an apparatus for producing an endohedral fullerene according to an embodiment of the present invention.
- FIG. 2 is a diagram showing an example of how a coil is wound in a plasma generation chamber.
- FIG. 3 is a diagram showing an example of another winding method of the coil in the plasma generation chamber.
- FIG. 4 is a diagram showing an example of a potential body composed of a base.
- FIG. 5 is a diagram showing an example of a potential body composed of a mesh-like body.
- FIG. 6 is a diagram showing a storage container for the internal fullerene.
- FIG. 7 is a conceptual diagram showing a conventional apparatus for producing a metal-encapsulated fullerene. (Explanation of code)
- FIG. 1 shows an apparatus for producing an endohedral fullerene according to an embodiment of the present invention.
- the apparatus includes a plasma generation chamber 6 11 for generating a plasma having a gas inlet 6 50 for introducing a gas 6 30 containing an atom to be included therein, and the plasma
- a vacuum vessel 610 communicating with the generation chamber so that the fullerenes 651 can be introduced into the plasma flow 660, and an energy capable of attaching electrons to the fullerenes 651;
- a means (energy control means) 604 for controlling the energy of the electrons in the plasma was provided on the side of the plasma generation chamber 611 in the vacuum vessel 610 so that the energy was controlled.
- a gas generator is installed in front of the gas inlet port 65, and the metal generator is used to produce metal or other metals. What is necessary is just to make it gaseous and to introduce it from the gas inlet 650.
- the plasma generation chamber 6 11 is made of an insulating material (for example, quartz).
- a coil 62 is wound around the outer periphery of the plasma generation chamber.
- the coil 62 is composed of, for example, two coils, and a high-frequency current flows from the high-frequency power supplies 62 1 and 62 2 respectively.
- both coil element nonaques 6a and 6b are supplied.
- a larger electric field difference occurs between b. If only one coil is wound, the heat generated by electromagnetic induction radiates outward, and energy is wasted.
- the non-induction winding as in this example, the divergence of energy due to induction heating can be prevented, and the energy can be used intensively for plasma generation. Therefore, the plasma generated in the plasma generation chamber 6 11 Has a higher density throughout the entire region, thereby further improving the generation efficiency of products such as ions and radicals, and increasing the number of electrons adhering to fullerene in the vacuum vessel 610.
- a first coil element 16 and a second coil element 17 forming a pair of discharge coils are arranged in parallel and spirally wound, and the first and second coil elements High-frequency powers having mutually different phases may be applied to the coil elements.
- the high frequency is applied to each of the coil 16 on one side and the coil 17 on the other side.
- W 200 is applied to each of the coil 16 on one side and the coil 17 on the other side.
- a high-density plasma flow of 10 17 / cm 3 or more can be obtained.
- Plasma with an electron temperature of 20 eV or less and even 10 eV or less can be easily generated. Further, plasma having a high aspect ratio can be easily obtained. That is, a plasma flow that continues in the vacuum container is obtained.
- RF or RF 2 for example, one having a frequency of 1 kHz to 20 MHz may be used. Further, power of 0.1 kW or more may be used.
- the number of coil elements wound around the plasma generation chamber 4 is not limited to two. Three or more coil elements may be wound, and high-frequency powers having different phases may be applied.
- a vacuum vessel 6 10 is connected to the plasma generation chamber 6 11.
- a means (electromagnetic coil) 603 for generating a magnetic field B1 is provided on the plasma generation chamber 611 side of the vacuum vessel 610.
- the vacuum vessel 610 is provided with a vessel 606 containing fullerenes.
- fullerenes may be stored in a crucible, and fullerenes 651 may be introduced by sublimation.
- Means 604 for controlling the electron energy in the plasma is provided between the fullerene inlet and the plasma generation chamber 611.
- the energy control means 604 may be provided with a grid in which conductive wires are connected in a mesh pattern, and a negative potential may be applied to the dalid 604.
- the power supply 641 is connected to the dalid 604. This potential may be variable. Alternatively, the energy of electrons on the downstream side (right side in the drawing) of the grid 604 may be measured, and the potential may be automatically or manually controlled based on the energy.
- the grid 604 is used to contain a gas that emits electrons in plasma to become positively charged ions, for example, atoms such as hydrogen, nitrogen, and alkali metals.
- a gas that emits electrons in plasma to become positively charged ions for example, atoms such as hydrogen, nitrogen, and alkali metals.
- the energy of the electrons on the downstream side of the grid 604 is preferably 10 eV or less, more preferably 5 eV or less.
- the desired electron energy can be obtained by controlling with the potential applied to the grid.
- the electron energy By setting the electron energy to one, the electrons in the plasma stream easily adhere to the fullerene 651. Therefore, negative fullerene ions can be obtained at a high concentration.
- the lower limit is preferably 0.5 eV. If it exceeds 20 eV, the electrons in the plasma flow strike out the electrons in the fullerene.
- a substrate 609 is provided as a potential body. It is preferable to apply a bias voltage having the same polarity as the potential at which the atom ions to be included in the plasma flow are charged to the potential body 609.
- this bias voltage is applied, the relative velocity between the fullerene ions and the atom ions to be included is reduced. By reducing the relative velocity, a Coulomb interaction acts between the two ions, and the atoms to be included enter the fullerene.
- a probe for plasma measurement is provided in the vacuum vessel 610, and the inclusion is performed while detecting the velocities of the fullerene ions and the atom ions to be included. It is preferable to control the voltage applied to the potential body 609 so that the relative speed becomes small.
- the radius of the plasma generation chamber 6 11 is almost equal to the radius of the plasma flow 6 60. Therefore, the radius of the plasma flow 660 can be arbitrarily selected to an appropriate size in accordance with the size of the apparatus by changing the radius of the plasma generation chamber 611. Also, the radius of the plasma flow 660 can be adjusted by changing the magnetic field strength of the uniform magnetic fields B1, B2 formed by the magnetic field generating means 603, 608. W
- cooling means (not shown) is provided on the outer periphery of the vacuum vessel 610.
- the inner wall inside the vacuum vessel 610 is cooled by the cooling means, and neutral gas molecules are trapped on the inner wall of the vacuum vessel 610.
- the inner wall temperature of the vacuum vessel 61 is preferably set to room temperature or lower, more preferably 0 ° C or lower. At such a temperature, trapping of neutral molecules is facilitated, and it becomes possible to obtain a higher purity endohedral fullerene in a high yield.
- a copper cylinder 607 is provided in the middle of the plasma flow 660 so as to cover the plasma flow 660.
- the cylinder 607 is provided with a hole through which fullerene is introduced into the plasma stream 660.
- the cylinder 607 is heated to a temperature at which sublimation can be performed. 400-650 ° C is preferred. Fullerene that has not been ionized in the plasma after being introduced into the cylinder 607 and adhered to the inner surface is sublimated again.
- the temperature of the cylinder 607 is lower than 400 ° C., re-sublimation is not efficiently performed, and when the temperature is higher than 650 ° C., C 6 .
- the temperature of the cylinder 607 is set to 400 to 65 ° C.
- the temperature is 480 to 62 ° C.
- the density of fullerene ions decreases, and the yield of endohedral fullerene decreases. If the temperature exceeds 62 ° C, the amount of neutral fullerene that is not ionized increases, and the encapsulation rate decreases.
- the inner diameter of the cylinder 607 is preferably set to be 2.5 to 3.0 times the diameter of the plasma flow 660. More preferably, it is 2.7 to 2.8 times.
- the yield differs for each device.
- the inventor has found that the inner diameter of the cylinder affects the yield. In particular, it has been found that it depends on the relationship between the diameter of the plasma flow 660 and the diameter of the cylinder 607. Furthermore, they have found that the yield is significantly increased in the limited range of 2.5 to 3.0.
- a fullerene inlet 652 is provided in the cylinder 607.
- the divergence angle 0 of the introduction angle at the fullerene introduction port 652 is preferably 90 to 120 °. By setting 0 to this range, the efficiency of introduction of fullerenes 651 into the plasma flow 660 is increased, and the yield of endohedral fullerenes is improved.
- ⁇ for example, the ratio between the diameter and the length of the fullerene introduction nozzle may be changed.
- fullerene is introduced from below in the drawing, but may be introduced from the side in the drawing. Moreover, you may introduce from both.
- the cylinder 607 does not have to have the same diameter as a whole. For example, by making the diameter at the position of the fullerene inlet 652 3.0 times as large as the plasma flow and making the downstream diameter 2.5 times smaller, the diameter decreases toward the downstream. Spreading can be prevented, and the yield of endohedral fullerenes can be improved.
- the fullerene introduction speed may be controlled by the temperature rise rate of the fullerene sublimation oven.
- the rate of temperature rise is preferably 10 ° C./min or more.
- the upper limit is the temperature rise rate at which bumping does not occur.
- -An ion measuring probe for measuring ion distribution may be provided in the vacuum vessel 610 before the potential body 609. A signal from the probe is sent to a probe circuit and a computer, and a bias voltage applied to the potential body 609 is controlled based on the signal.
- the potential body 609 is divided concentrically as shown in FIG. In the example shown in FIG. 4, it is divided into three potential bodies 5a, 5b and 5c.
- the potential body 5a at the center has a circular shape
- ring-shaped potential bodies 5b and 5c are arranged on the outer periphery of the potential body 5a while being electrically insulated from the potential body 5a.
- the number of potential bodies is not limited to three.
- Bias voltage applying means 7a, 7b, 7 so that the bias voltage can be applied independently to each potential body 5a, 5b, 5c. c is provided.
- the shape of the potential body is not limited to a circular or circular ring as long as the shape of the vacuum vessel 610 is not limited, and may be a square or rectangular ring or another shape.
- the radius of the central portion of the potential body 5 a is a radius of the plasma generation chamber R, the Larmor radius of encapsulating target atoms as R L, Shi preferred to design a range of R + 2 R L and R + 3 R L les ,.
- Fullerene that is introduced from the hole of the cylinder 607 and is not ionized moves along the plasma flow and adheres to the potential body 5a at the center.
- the ionized inclusion target atom moves while drawing a spiral under the influence of the magnetic field, and collides with the non-ionized fullerene attached to the potential body 5a at the center, thereby converting the included fullerene.
- the Larmor radius of the entrapping target atomic ion moving in a spiral Then, the radius of the plasma flow increases by 2 with respect to the radius of the plasma generation chamber. .
- the Larmor radius RL is inversely proportional to the magnetic field strength B.
- B 0.3 T and a plasma temperature of 2500 ° C
- RL 0.27 mm for hydrogen atoms
- RL 1.0 mm for nitrogen atoms
- the Larmor radius is proportional to the moving velocity V of the atom to be included.
- V is the standard moving speed of the target atoms derived from the strength of the magnetic field. From the statistical mechanical considerations, the moving speed V is 0.5 v. ⁇ L.5V.
- the probability in the range is 0.5 or more. That is, when the radius R + 3 of the potential body 5a at the center is set, 50% or more of the included atoms collide with the potential body 5a.
- the radius of the potential body 5 a of the central portion is preferably designed in the range of R + 2 R L and R + 3 R L.
- fullerene ions have a distribution having a concentration peak at the center of the plasma flow 660 in the central potential body 5a.
- the bias voltage may be controlled. The optimum bias voltage varies depending on the atoms to be included, the type of fullerene, and other film forming conditions, but it is better to know it in advance through experiments.
- a bias voltage of 5 V ⁇ > ap + 20 V to the central potential body 5a.
- 0 ⁇ ⁇ ⁇ & ⁇ + 18 V is particularly preferred.
- a halogen gas is used as an atom to be included, it is preferable to apply a negative bias voltage of 120 V or less to the central potential body 5a.
- the endohedral fullerene can be formed by optimizing the deposition conditions.
- the outer potential bodies 5b and 5c may be set to a floating potential state or a bias voltage application. Even when both of the outer potential bodies 5b and 5 are in a floating state, the same amount of endohedral fullerene as in the conventional case is deposited on the potential body 5b. Therefore, the yield as a whole increases as the yield increases in the potential body 5a at the center.
- a bias voltage may be applied to the potential body 5b to increase the density of the fullerene ions.
- the distribution may be constantly measured during film formation using the ion measurement probe, and the bias voltage applied to the potential elements 5b and 5c may be automatically controlled by a computer. The same applies to the automatic control of the application to the potential body 5a.
- the vacuum vessel 610 is provided with an exhaust pump 10 so that the inside of the vacuum vessel 610 can be evacuated to a vacuum.
- the vacuum chamber 6 1 initial vacuum in the 0 preferably less 1 0- 4 P a les.
- a passivation film made of a chromium oxide film (a passivation film substantially not containing an iron oxide film) on the surfaces of the vacuum vessel 610 to the cylinder 607.
- a passivation film made of a chromium oxide film (a passivation film substantially not containing an iron oxide film)
- the concentration of impurities (particularly, moisture and oxygen) in the gas to be introduced be 10 ppb or less. It is more preferably 1 ppb or less, and further preferably 100 ppt or less.
- n 60, 70, 74, 82, 84,...
- the concentration of neutral fullerene in the film can be further reduced. That is, the concentration of the endohedral fullerene in the film can be further increased.
- FIG. 5 shows a second embodiment
- the potential body is a substrate.
- a mesh body 680 is used as a potential body. It is the same as in the first embodiment that it is preferable to use it in a divided manner.
- the endohedral fullerene is deposited on the substrate.
- the endohedral fullerene passes through the mesh-like potential body 680. If a storage container 690 is provided downstream of the potential body 680 as shown in FIG. 6, the internal fullerene is stored in the storage container 690.
- the amount deposited on the substrate is limited. Therefore, it was necessary to replace the substrate at that limit, and there was a limit to continuous operation.
- continuous operation is possible until the storage container 690 becomes full. If the storage container 690 of any size is used, continuous operation is possible until the fullerene in the raw material container 606 shown in FIG. 1 is exhausted. In addition, the fuller You may be able to replenish the fuel.
- the diameter of the storage container 690 is preferably the diameter of the potential body 5a in the first embodiment. Further, the storage container 690 may have a double structure or a triple structure. Each diameter may be the same as the diameter of the potential bodies 5a, 5b, 5c in the first embodiment.
- the vacuum vessel 610 was made of stainless steel having a passivation film made of chromium oxide formed on the surface.
- the dimensions were 10 Onim in diameter and 120 Omm in length.
- ⁇ 2 Omm quartz was used for the plasma generation chamber 6 11.
- a coil was wound, and a high frequency of 13.6 MHz was applied with a phase difference of 180 °.
- a stainless steel cylinder 607 having a hole was provided in the middle of the plasma flow 660.
- the cylinder 607 having an inner diameter of 55 mm was used.
- Tube 607 was heated to about 400 ° C.
- fullerene was introduced through the hole of the cylinder 607.
- the potential body 609 a three-division type was used.
- the diameter of the potential body 5a at the center was 14 mm
- the diameter of the outer potential body 5b was 32 mm
- the diameter of the outer potential body 5c was 50 mm.
- the potential bodies 5b and 5c were in a floating potential state.
- ⁇ ap is the DC voltage and ⁇ s is the plasma space potential.
- ⁇ The measured ion distribution that is being formed by the ion measuring probe, C 60 one result to concentrate in the central region were obtained.
- the thin film containing endohedral fullerene (in this example, H @ C 60 ) deposited on the potential body was analyzed.
- the endohedral fullerene was formed with a high content on the potential body 5a at the center.
- a deposited film containing endohedral fullerene was observed on the potential body 5b outside the center.
- the inner diameter D of the cylinder 607 was 30 mm, 40 mm, 48 mm, 50 mm, 60 mm, 70 mm, 80 mm, and 100 mm, and the same film formation as in Example 1 was performed. The yield of endohedral fullerene was examined.
- the ratio in parentheses is the ratio to the inner diameter of the plasma generation chamber.
- a reticulated potential body was used.
- Example 2 Also in this example, a good yield was obtained as in Example 2. In addition, continuous operation was possible.
- the degree of vacuum in the vacuum chamber 6 1 in 0 was 1 0- 6 P a.
- Example 1 When the obtained endohedral fullerene was analyzed without exposing it to the atmosphere, no OH group was attached to the outside of the fullerene. Also, it did not have any other modifying groups. In Example 1, the O H group was attached, but this O H group is considered to be caused by moisture or oxygen in the atmosphere during the manufacturing process.
- a non-encapsulated fullerene (a fullerene containing no atoms therein), the endohedral fullerene produced in Example 1, and an endohedral fullerene produced in Example 4 were added as dopants in the conductive polymer.
- an electrode was further formed to manufacture an electronic device.
- Contact name is that used in Example 4 was manufacturing an electronic device in a vacuum at 1 0- 6 P a.
- the winding of the coil in the plasma generation chamber was performed by the method shown in FIG. Other points are the same as in the first embodiment. In this example, a higher yield of endohedral fullerene was obtained than in Example 1.
- nitrogen gas was used instead of hydrogen gas.
- fullerenes containing nitrogen ions are expected to be applied to spin electronics and quantum computers due to the characteristic electronic structure of nitrogen atoms.
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Abstract
Description
Claims
Priority Applications (3)
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US10/552,709 US20070009405A1 (en) | 2003-04-07 | 2004-04-07 | Method and apparatus for producing gas atom containing fullerene, and gas atom containing fullerene |
KR1020057018965A KR101124178B1 (ko) | 2003-04-07 | 2004-04-07 | 가스 원자 내포 플러렌의 제조 장치 및 제조 방법 그리고가스 원자 내포 플러렌 |
JP2005505305A JP3989507B2 (ja) | 2003-04-07 | 2004-04-07 | ガス原子内包フラーレンの製造装置及び製造方法並びにガス原子内包フラーレン |
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US (1) | US20070009405A1 (ja) |
JP (1) | JP3989507B2 (ja) |
KR (1) | KR101124178B1 (ja) |
CN (1) | CN100564252C (ja) |
WO (1) | WO2004089822A1 (ja) |
Cited By (1)
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WO2005054127A1 (ja) * | 2003-12-03 | 2005-06-16 | Ideal Star Inc. | 誘導フラーレンの製造装置及び製造方法 |
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WO2006013936A1 (ja) * | 2004-08-04 | 2006-02-09 | Ideal Star Inc. | 誘導フラーレン製造装置及び製造方法並びに誘導フラーレン |
EP1748030B1 (en) * | 2005-07-07 | 2016-04-20 | Fei Company | Method and apparatus for statistical characterization of nano-particles |
US20080247930A1 (en) * | 2006-03-18 | 2008-10-09 | Robert Hotto | Nano-fusion reaction |
JP6244139B2 (ja) * | 2013-08-28 | 2017-12-06 | ヤンマー株式会社 | 遠隔サーバ |
RU2607403C2 (ru) * | 2014-05-27 | 2017-01-10 | Юрий Владимирович Горюнов | Способ получения эндоэдральных наноструктур на основе каналирования имплантируемых ионов |
US9839109B1 (en) * | 2016-05-30 | 2017-12-05 | Applied Materials, Inc. | Dynamic control band for RF plasma current ratio control |
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- 2004-04-07 WO PCT/JP2004/005012 patent/WO2004089822A1/ja active Application Filing
- 2004-04-07 JP JP2005505305A patent/JP3989507B2/ja not_active Expired - Fee Related
- 2004-04-07 KR KR1020057018965A patent/KR101124178B1/ko not_active IP Right Cessation
- 2004-04-07 CN CNB2004800093299A patent/CN100564252C/zh not_active Expired - Fee Related
- 2004-04-07 US US10/552,709 patent/US20070009405A1/en not_active Abandoned
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JPH0982495A (ja) * | 1995-09-18 | 1997-03-28 | Toshiba Corp | プラズマ生成装置およびプラズマ生成方法 |
JPH11345772A (ja) * | 1998-06-01 | 1999-12-14 | Sony Corp | 化学気相蒸着装置および半導体装置の汚染防止方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005054127A1 (ja) * | 2003-12-03 | 2005-06-16 | Ideal Star Inc. | 誘導フラーレンの製造装置及び製造方法 |
CN1890175B (zh) * | 2003-12-03 | 2010-04-07 | 理想星株式会社 | 衍生富勒烯的制造装置及制造方法 |
Also Published As
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JPWO2004089822A1 (ja) | 2006-07-06 |
CN1771194A (zh) | 2006-05-10 |
KR101124178B1 (ko) | 2012-03-28 |
KR20060008318A (ko) | 2006-01-26 |
JP3989507B2 (ja) | 2007-10-10 |
US20070009405A1 (en) | 2007-01-11 |
CN100564252C (zh) | 2009-12-02 |
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