Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/22—Di-epoxy compounds
  • C08G59/226—Mixtures of di-epoxy compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
  • C08G59/4014—Nitrogen containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J3/00—Processes of treating or compounding macromolecular substances
  • C08J3/20—Compounding polymers with additives, e.g. colouring
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/13—Phenols; Phenolates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2201/00—Properties
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications

Definitions

• the present invention relates to a high modulus epoxy resin composition
• a high modulus epoxy resin composition comprising a polyvalent epoxy compound, a curing agent, a polyvalent phenol compound and a spherical filler having a modulus of elasticity of 30 OGPa or more, and more particularly to It is preferably obtained by subjecting a compound filled with a large amount of a filler having a high elastic modulus and containing a curing agent such as a polyvalent epoxy compound or a sine compound and a polyvalent phenol compound to degassing under reduced pressure. And a high elastic modulus epoxy resin composition.
• the epoxy resin composition is particularly suitable for a prepredder.
• An epoxy resin composition in which an epoxy resin is reinforced with a filler such as glass fiber, alumina, or silica has been used as an epoxy resin pre-preda.
• Conventional epoxy resin compositions reinforced with these various fillers usually have an elastic modulus of several GPa.
• a resin composition having an elastic modulus of several GPa causes distortion when components are mounted on a base. If the modulus of elasticity is high, components can be mounted without distortion even when the substrate is thinned, and therefore an epoxy resin composition having a high modulus of elasticity has been desired.
• polyvalent amine compounds polyvalent isocyanate compounds, acid anhydrides, polyvalent phenols and the like are generally used.
• Japanese Patent Application Laid-Open No. 54-53197 describes that a hardened product using a polyvalent epoxy compound and a polyvalent cyanate compound has an oxazoline ring and a triazine ring structure and has a high heat resistance. It is described as being excellent.
• the polyvalent cyanate compound forms a triazine ring by self-trimerization, and the epoxy group and the cyanate group react to form an oxazoline ring.
• the above-mentioned hard swords did not have such a high elastic modulus as required for a prepredder. Disclosure of the invention
• an object of the present invention is to provide an epoxy resin composition having a high elastic modulus.
• the present inventors have conducted intensive studies in view of the above situation, and as a result, have found that a polyhydric epoxy compound containing at least 80% by weight of spherical filler having an elastic modulus of 3 O OGPa or more, a polyepoxy compound, a specific hardener and The present inventors have found that an epoxy resin composition containing a trivalent phenol compound exhibits an elastic modulus of 80 GPa or more, and have reached the present invention.
• the present invention provides (A) 1 to 10% by weight of a polyvalent epoxy compound, (B) 1 to 10% by weight of a curing agent selected from a cyanate compound and a benzoxazine compound, and (C) a polyphenol compound 0.1. (D) To provide an epoxy resin composition containing 80 to 97.9% by weight of a spherical filler having an elastic modulus of 30 OGPa or more and having a porosity of 3% or less. ⁇ Best Mode for Carrying Out the Invention
• Examples of the polyvalent epoxy compound used for the above component ( ⁇ ) include ethylene glycol, propylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,2-dimethyl-1,3.
• Glycidyl ethers of polyhydric alcohols such as propanediol, 1,6-hexanediol, diethylene glycol, glycerin, 1,4-cyclohexanediol, 1,4-bis (hydroxymethyl) cyclohexane, hydroquinone, resorcinol, 4 , 4, dihydroxybiphenyl, 2,2-bis (4-hydroxyphenyl) propane, bis (4-hydroxyphenyl) methane, bis (4-hydroxysulfone), 1,1,2,2-tetrakis (4-hydroxy Polyvalents such as phenyl, ethaneol, phenol nopolak, and cresol lunopolak Glycidyl ether of phenol, 2,2-bis (3,4-epoxycyclohexyl) propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy 6-Methylcyclohexy
• These polyepoxy compounds are used in the epoxy resin composition of the present invention in an amount of 1 to 10% by weight, preferably 2 to 8% by weight, and more preferably 3 to 7% by weight. If the amount is less than 1% by weight, the obtained cured product becomes brittle, and if the amount is more than 10% by weight, the elastic modulus becomes low.
• the polyvalent epoxy compound is preferably an alicyclic epoxy compound represented by the following formula (I) or ( ⁇ ) in that the viscosity of the epoxy resin composition at the time of degassing decreases. More preferably, 50% by weight or more, particularly 70% by weight or more of the polyvalent epoxy compound used in the component (A) is an alicyclic epoxy compound represented by the following formula (I) or (II). .
• a polyvalent cyanate is preferable.
• the polyvalent cyanate for example, 1,4-dicyanatebenzene, 1,3-dicyanatebenzene, 1,2-disocyantobenzene, 2,2-bis (4-cyanatephenyl) propane, 4, 4'-dicyanatebiphenyl, 4,4, -dicyanatediphenyl ether, 4, 4, -dicyanatediphenylmethane, 4,4, -dicyanatediphenylsulfone, 4,4,1-dicyanatebenzophenone, 1,1-bis (4-cyanatephenyl) cyclohexane, 4,4,1-dicyanate-P-terphenyl, 2,6-dicyanate-naphthylene, 2,7-dicyanate-naphthalene, 2,7-dicyanate-anthracene, 1,4-bis (4-cyanatephenyl) Kiss) Zen, 4, 4 'sing
• Benzoxazine compounds used in component (B) include, for example, 1,1,1 tris (N-phenyl-1,3-benzoxazine) ethane, 1,3-bis (2- (N-phenyl-1,3 benzoxazine) ) Isopropyl) benzene, N-phenyl 1,3-benzoxazine and condensates of benzene and formaldehyde.
• the hardener selected from the above-mentioned cyanate compound and the above-mentioned oxazine compound accounts for 1 to 10% by weight, preferably 2 to 8% by weight, more preferably 3 to 7% by weight in the epoxy resin composition of the present invention. Used. If the amount is less than 1% by weight, the obtained cured product becomes brittle, and if the amount is more than 10% by weight, the elastic modulus becomes low.
• the polyvalent phenol compound used for the component (C) include 2,2, -dihydroxybiphenyl, 4,4'dihydroxybiphenyl, 1,6-dihydroxyxinaphthalene, and phenol nopolak.
• 2,2, dihydroxypiphenyl is preferred because of a large decrease in viscosity.
• These polyhydric phenol compounds are used in the epoxy resin composition of the present invention in an amount of from 0.1 to 5% by weight, preferably from 0.2 to 3% by weight, and more preferably from 0.2 to 3% by weight. If the amount is less than 0.1% by weight, the porosity is large even after degassing because the viscosity at the time of mixing the epoxy resin composition is high, and the elasticity of the obtained cured product is low. The elasticity of the cured product obtained due to insufficient crosslinking in the reaction decreases.
• Examples of the filler used in the component (D) include aluminum oxide (alumina), aluminum nitride, crystalline silica, and silicon nitride. Of these, alumina is preferable.
• the method for producing these fillers is not particularly limited, but the shape of the filler is spherical, and preferably spherical, so that the physical properties of the obtained epoxy resin composition do not vary depending on the direction.
• the filler is used in the epoxy resin composition of the present invention in an amount of 80 to 97.9% by weight, preferably 85 to 95% by weight, and more preferably 90 to 95% by weight.
• Elastic modulus of the cured product filler is obtained in less than 8 0% by weight is low, 9 7.9 cured product obtained is more than% by weight becomes brittle Q
• the mixing ratio of the component (A) and the component (B) is within the range of 80 to 97.9% by weight of the filler, and the number of functional groups of the polyepoxy compound of the component (A) and the component are as follows. It is preferable to use (B) such that the ratio to the number of functional groups of the curing agent (polyhydric epoxy compound curing agent) is 0.9 to 1.1, and 0.98 to 1.02 is particularly preferable. preferable.
• a flame retardant to the epoxy resin composition of the present invention, if necessary.
• the flame retardant include added halogen-based flame retardants such as decabromodiphenyl ether, reactive halogen-based flame retardants such as tetrabromobisphenol A, polyvalent phenols such as resorcinol and bisphenol A, and phenol and 2, Phosphorus such as phosphoric acid ester obtained by reacting monophenol such as 6-dimethylphenol with phosphorus oxychloride or phosphoric amide compound obtained by reacting m-xylylenediamine with diphenylphosphoric acid chloride Melamine cyanurate Any of the nitrogen-containing flame retardants and antimony-based flame retardant auxiliaries are preferred. Phosphorus-based flame retardants that have a low environmental impact are preferred, and have a reactivity with epoxy resins represented by the following formula (III): Compounds are particularly preferred.
• the epoxy resin composition of the present invention may optionally contain optional components such as an antioxidant, an ultraviolet absorber, a hindered amine-based stabilizer, and a leveling agent.
• the epoxy resin composition of the present invention has a porosity of 3% or less, preferably 1% or less.
• the epoxy resin composition of the present invention obtained by mixing the above essential components and optional components, heating and melting, and then decompressing and degassing the epoxy resin composition of the present invention, because the voids in the composition are small, has excellent elastic modulus. Things are obtained. It is essential that the temperature of the heating and melting be higher than the melting point of each of the components other than the filler, particularly the components (A) and (B), and lower than the curing temperature.
• the viscosity of the epoxy resin composition is low, so it is preferable to maintain the melting point of each component other than the filler at or above the melting point. It is not necessarily required to be higher than the melting point, and it is preferable that the viscosity of the epoxy resin composition at the temperature for degassing treatment be 100 ps or less.
• the treatment is performed at a temperature lower than the temperature at which the epoxy resin composition thermally cures. More preferably, the treatment is performed at a temperature lower than C. In the deaeration treatment, the pressure is preferably reduced to 1 mmTorr or less.
• the use of the epoxy resin composition of the present invention is not limited, it is particularly suitable for a prepreg.
• Examples 1 to 5 and Comparative Examples 1 to 6 The compounds described in Tables 1 and 2 (both in parts by weight) were kneaded with a three-roll mill to obtain a clay-like epoxy resin composition. The viscosity of the obtained epoxy resin composition was measured at 80. Further, the epoxy resin composition was heated and melted at 110 ° C. in an aluminum container, vibrated for 10 minutes, depressurized to 0.6 mmTorr and held for 15 minutes, and then the mass and weight of the epoxy resin composition were increased. The volume (VI) was measured. The volume (VI) was measured by curing the epoxy resin composition and immersing it in a water bath.
• the cured epoxy resin composition was heated at 180 ° C. for 1 hour, kept at 180 ° C. for 1 hour, and kept at 220 ° C. for 1 hour to obtain a cured product.
• the elastic modulus, glass transition temperature, linear expansion coefficient and water absorption of the obtained cured product were measured as follows. Tables 1 and 2 show these results.
• ⁇ -linear expansion coefficient (pm) The ratio of the length at 3 to the length at 100 C of a sample cut from a cured product in a strip 2 cm wide and 10 cm long at room temperature in parallel to the application direction, And the ratio of the length at 160 to the length at 200 was measured as the coefficient of linear expansion.
• the compounds (* 1 to 11 in Table 1) used in the formulation are as follows.
• Example 1 Example 2
• Example 3 Example 4
• Example 5 Compound No. 1 "3.6 5.0 1.6
• Example 1 and Comparative Example 1 From Example 1 and Comparative Example 1, it is clear that the elasticity of the obtained cured product can be improved by reducing the porosity by degassing. Further, from Example 1 and Comparative Example 2, it is clear that the viscosity is reduced by blending the polyvalent phenol compound, so that the porosity is sufficiently reduced by the deaeration treatment. Further, from Example 1, Comparative Example 3 and Comparative Example 5, as a curing agent, a cyanate compound or a benzoxazine compound was used. When compounds such as acid anhydrides and polyamines are used in place of the compounds, it is clear that only a cured product having a large porosity and a small elastic modulus can be obtained even if deaeration treatment is performed because of the high viscosity.
• an epoxy resin composition having a high elastic modulus can be provided. Therefore, it is possible to reduce the weight and thickness of the prepreg, and it is possible to reduce the size and weight of PDAs, mobile phones, mopile computing, etc.

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• Chemical & Material Sciences (AREA)
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• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
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• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Epoxy Resins (AREA)
• Reinforced Plastic Materials (AREA)

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• 2003
  • 2003-03-07 JP JP2003060794A patent/JP4245377B2/ja not_active Expired - Fee Related
• 2004
  • 2004-03-05 TW TW093105909A patent/TW200427771A/zh not_active IP Right Cessation
  • 2004-03-05 KR KR1020057016688A patent/KR101079930B1/ko not_active Expired - Fee Related
  • 2004-03-05 US US10/548,178 patent/US20060173101A1/en not_active Abandoned
  • 2004-03-05 EP EP04717817A patent/EP1602689B1/en not_active Expired - Lifetime
  • 2004-03-05 WO PCT/JP2004/002839 patent/WO2004078843A1/ja not_active Ceased

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