TWI333966B - - Google Patents

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Publication number
TWI333966B
TWI333966B TW093105909A TW93105909A TWI333966B TW I333966 B TWI333966 B TW I333966B TW 093105909 A TW093105909 A TW 093105909A TW 93105909 A TW93105909 A TW 93105909A TW I333966 B TWI333966 B TW I333966B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
compound
weight
epoxy
Prior art date
Application number
TW093105909A
Other languages
English (en)
Chinese (zh)
Other versions
TW200427771A (en
Inventor
Yoshinori Takahata
Takahiro Mori
Setsuko Hirakawa
Seiichi Saito
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW200427771A publication Critical patent/TW200427771A/zh
Application granted granted Critical
Publication of TWI333966B publication Critical patent/TWI333966B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
TW093105909A 2003-03-07 2004-03-05 Highly elastic epoxy resin composition TW200427771A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003060794A JP4245377B2 (ja) 2003-03-07 2003-03-07 高弾性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
TW200427771A TW200427771A (en) 2004-12-16
TWI333966B true TWI333966B (enExample) 2010-12-01

Family

ID=32958941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105909A TW200427771A (en) 2003-03-07 2004-03-05 Highly elastic epoxy resin composition

Country Status (6)

Country Link
US (1) US20060173101A1 (enExample)
EP (1) EP1602689B1 (enExample)
JP (1) JP4245377B2 (enExample)
KR (1) KR101079930B1 (enExample)
TW (1) TW200427771A (enExample)
WO (1) WO2004078843A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5234584B2 (ja) * 2005-05-31 2013-07-10 株式会社Ａｄｅｋａ エポキシ樹脂硬化性組成物
US7851052B2 (en) 2005-08-23 2010-12-14 Awi Licensing Company Coating system for sag resistant formaldehyde-free fibrous panels
EA201000948A1 (ru) 2007-12-19 2011-02-28 Бёрингер Ингельхайм Интернациональ Гмбх Ингибиторы вирусной полимеразы
WO2009137144A2 (en) * 2008-02-21 2009-11-12 Huntsman Advanced Materials Americas Inc. Halogen-free benzoxazine based curable compositions for high tg applications
JP5349143B2 (ja) * 2008-06-03 2013-11-20 三菱レイヨン株式会社 繊維強化複合材料用樹脂組成物およびそれを用いた繊維強化複合材料
ES2622874T3 (es) * 2009-02-12 2017-07-07 Jx Nippon Oil & Energy Corporation Composición de resina de benzoxazina
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5431849B2 (ja) * 2009-09-25 2014-03-05 株式会社Ａｄｅｋａ 無溶剤一液型シアン酸エステル−エポキシ複合樹脂組成物
JP5526820B2 (ja) * 2010-01-29 2014-06-18 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ及び積層板
TWI400292B (zh) * 2010-06-14 2013-07-01 Nanya Plastics Corp Used in glass fiber laminates high glass transition temperature resin varnish composition
EP2814802B1 (en) * 2012-02-17 2020-12-16 Huntsman Advanced Materials Americas LLC Mixture of benzoxazine, epoxy and anhydride
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
JP2016071336A (ja) * 2014-09-26 2016-05-09 富士フイルム株式会社 光学フィルム及びそれを備えた偏光板、液晶表示装置、及び光学フィルムの製造方法
US9766378B2 (en) 2014-09-26 2017-09-19 Fujifilm Corporation Optical film, polarizing plate equipped with the optical film, liquid crystal display device, and method for producing an optical film
AU2016274314B2 (en) * 2015-06-12 2020-05-21 Cytec Industries Inc. Curable compositions containing benzoxazine epoxy blend and use thereof
US10294341B2 (en) 2016-01-13 2019-05-21 Lg Chem, Ltd. Thermosetting resin composition for semiconductor package and prepreg using the same
CN118725518B (zh) * 2024-07-18 2025-02-07 江苏诺德新材料股份有限公司 一种基于覆铜板的高导热环氧树脂组合物及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3242108A (en) * 1961-04-04 1966-03-22 Union Carbide Corp Compositions for producing polyurethane resins and resinous foams and products prepared therefrom
US4645805A (en) * 1984-03-14 1987-02-24 Mitsubishi Gas Chemical Company, Inc. Adhesive composition and adhesive film or sheet on which the composition is coated
EP0230631B2 (en) * 1985-12-20 1996-03-20 Mitsubishi Rayon Co., Ltd. Intermediate for composite material
EP0266986A3 (en) * 1986-11-06 1989-09-06 Amoco Corporation Resin compositions comprising aromatic cyanate esters, polyepoxide compounds and thermplastic polymers and prepreg made therefrom
US4904760A (en) * 1987-04-27 1990-02-27 Mitsubishi Gas Chemical Co., Inc. Thermosetting resin composition from cyanate ester and non-branched aromatic compound
SG90029A1 (en) * 1997-03-31 2002-07-23 Sumitomo Chemical Co Epoxy resin composition and resin-encapsulated semiconductor device
JP3591758B2 (ja) * 1997-10-09 2004-11-24 住友ベークライト株式会社 液状注入封止アンダーフィル材
JP4124295B2 (ja) * 1998-08-20 2008-07-23 株式会社Ａｄｅｋａ 硬化性組成物
US6207077B1 (en) * 2000-02-18 2001-03-27 Orion 21 A.D. Pty Ltd Luminescent gel coats and moldable resins
JP2001207031A (ja) * 2000-01-28 2001-07-31 Nitto Denko Corp 半導体封止用樹脂組成物及び半導体装置
JP4358505B2 (ja) * 2000-06-21 2009-11-04 三井化学株式会社 プラスチック製液晶表示セル用シール剤組成物
US6451931B1 (en) * 2000-12-29 2002-09-17 Asahi Denki Kogyo Kabushiki Kaisha Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate
US6437026B1 (en) * 2001-01-05 2002-08-20 Cookson Singapore Pte Ltd. Hardener for epoxy molding compounds
JP2003213081A (ja) * 2002-01-21 2003-07-30 Kyocera Chemical Corp エポキシ樹脂組成物および半導体装置

Also Published As

Publication number Publication date
EP1602689A1 (en) 2005-12-07
TW200427771A (en) 2004-12-16
KR101079930B1 (ko) 2011-11-04
US20060173101A1 (en) 2006-08-03
KR20050107608A (ko) 2005-11-14
JP2004269641A (ja) 2004-09-30
JP4245377B2 (ja) 2009-03-25
EP1602689B1 (en) 2012-04-04
WO2004078843A1 (ja) 2004-09-16
EP1602689A4 (en) 2007-07-25

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MM4A Annulment or lapse of patent due to non-payment of fees