WO2004068150A1 - Universal-messadapter-system - Google Patents
Universal-messadapter-system Download PDFInfo
- Publication number
- WO2004068150A1 WO2004068150A1 PCT/DE2003/004176 DE0304176W WO2004068150A1 WO 2004068150 A1 WO2004068150 A1 WO 2004068150A1 DE 0304176 W DE0304176 W DE 0304176W WO 2004068150 A1 WO2004068150 A1 WO 2004068150A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- base
- adapter
- package
- pga
- measuring system
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Definitions
- the invention relates to a universal measuring system for adapting or contacting semiconductor components in a wide variety of packages for electrical operation, measurement and analysis thereof, in which the packages are electrically contacted in a specially adapted base.
- the sockets available as purchased parts are precisely tailored to the respective package and take over the primary electrical contact. This means that in addition to the DOUT in Package with pin contacts also SMD components, such as FBGA and other components can be contacted in special sockets. These bases are in turn provided with solder contacts, which, however, depict the pin assignment of the mounted components 1: 1.
- the invention is based on the object of creating a universal measuring system for adapting or contacting semiconductor component members in a wide variety of packages for electrical operation, measurement and analysis of the same, with which the pin numbers on the device side can always be tapped at the same point regardless of the package and that is suitable for expansion stages with any number of pins and pin configurations.
- the object is achieved according to the invention in a measuring adapter system of the type mentioned at the outset by arranging a base adapter, consisting of adapter boards, between the base and a PGA base (PGA: Pin Grid Array), which comprises the rewiring of each individual Connection of the package in a special, always identically oriented grid.
- PGA Pin Grid Array
- a package, the semiconductor component of which is to be measured electrically, is inserted into the base adapter at the beginning and can be adapted to a wide variety of devices, in particular top measuring stations, testers or curve tracers, and operated, measured and / or analyzed in a wide variety of ways without having to make any further complex and costly adjustments.
- pin 1 of the PGA-side adapter board is always mapped to connector 1 of the package
- pin 2 of the PGA-side adapter board is always mapped to connector 2 of the package, etc.
- pin 1 of any package is always shown connected to the same place on the PGA socket.
- each of the adapter boards being provided with rewiring in such a way that the distribution of the plug contacts of the base is transformed into the standardized grid of the PGA base, is a favorable embodiment because in addition to the smaller space requirement compared to contacting via contact areas, depending on the application, both a detachable contact through the plug connection, as well as a soldered plug connection to increase the contact reliability.
- the use of a measurement board which comprises the PGA base and has line structures which do Contacts rewired to contact pins.
- the measuring or analysis arrangement can be connected to these contact pins.
- Such contact pins can be designed in the form of contact bars or a further base. With the plugging in or connecting the base adapter, all connections of the package to the contact pins are immediately available in standardized assignment.
- slots on the measuring board can be contacted with the named line structures, at which all connections of the package are also available in standardized assignment and which can accommodate further boards (e.g. saddle boards).
- the semiconductor component can be operated or peeled either by setting jumpers, by clamping pins or by a circuit built on them.
- the measuring board is connected to a copper plate (chuck), which is brought directly or indirectly to the desired temperature and is thermally connected to the package via further copper connecting parts ,
- a copper plate chuck
- the invention will be explained in more detail below on the basis of an exemplary embodiment.
- the associated drawing shows in
- Figure 1 is a side view of the schematic structure of the measuring system, shown as an exploded view.
- FIG. 2 shows the top view of a schematic structure of the measuring system according to claim 12.
- the package 1 has laterally protruding pins 2 which are angled downwards twice in order to make contact with the base 3.
- This base 3 maps the pin assignment of the pins 2 of the package 1 1: 1 to the first plug contacts 4 protruding from its underside.
- first plug contacts 4 are plugged, soldered and thus electrically connected into first plated-through holes 5 of the upper adapter board 6 of a system of two connected adapter boards, hereinafter referred to as base adapters 8.
- the upper adapter board 6 has on its underside a first interconnect structure 9, which rewires the first plated-through holes 5 to second plated-through holes 11 in the outer region of the upper adapter board 6.
- the contacts of the second plated-through holes 11 located in the edge area are rewired to a grid of third plated-through holes 13 present in the central area of the lower adapter board 7, which corresponds to the standardized grid 14 of contacts of the PGA Socket 15 speaks.
- the electrical connection of the base adapter 8 to the PGA base 15 is made by third plug contacts 16.
- the mechanical locking of the base adapter 8 in the PGA base 15 takes place in the exemplary embodiment described, since the PGA base 15 is designed as a zero force base, by flipping the Locking lever 17, which causes locking parts, not shown, engage releasably.
- FIG. 2 shows the arrangement of a system constructed in accordance with FIG. 1 on a measuring board 18.
- the measuring board 18 is a circuit board on which the PGA base 15 is fastened and the standardized grid 14 of electrical contacts through a conductor path structure (not shown in more detail) on a row of contact pins 19, which serve to connect the measuring system to external measuring and analysis arrangements, and is simultaneously rewired to slots, not shown, which allow the inclusion of a saddle board 20.
- the measuring board 18 also has a round copper plate 21 (chuck) located on its underside, in the area of the PGA base 15.
- a cuboid copper block 22 is in thermal contact with the copper plate 21 and through corresponding recesses 23 in the PGA base 15, in the base adapter 8 and in the present exemplary embodiment also in the base 3 with the package 1, so that measurements are carried out over a defined temperature regime of the copper plate 21. Analyzes or BurnlN of Package 1 can be carried out at different temperatures.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03785584A EP1583975A1 (de) | 2003-01-14 | 2003-12-18 | Universal measuring adaptor system |
US11/179,344 US7355426B2 (en) | 2003-01-14 | 2005-07-12 | Universal measuring adapter system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10301124A DE10301124A1 (de) | 2003-01-14 | 2003-01-14 | Universal-Messadapter-System |
DE10301124.2 | 2003-01-14 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/179,344 Continuation US7355426B2 (en) | 2003-01-14 | 2005-07-12 | Universal measuring adapter system |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004068150A1 true WO2004068150A1 (de) | 2004-08-12 |
Family
ID=32602527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/004176 WO2004068150A1 (de) | 2003-01-14 | 2003-12-18 | Universal-messadapter-system |
Country Status (6)
Country | Link |
---|---|
US (1) | US7355426B2 (de) |
EP (1) | EP1583975A1 (de) |
CN (1) | CN100492018C (de) |
DE (1) | DE10301124A1 (de) |
TW (1) | TWI264539B (de) |
WO (1) | WO2004068150A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006284274A (ja) * | 2005-03-31 | 2006-10-19 | Renesas Technology Corp | 半導体装置の製造方法 |
US7118385B1 (en) * | 2005-09-22 | 2006-10-10 | International Business Machines Corporation | Apparatus for implementing a self-centering land grid array socket |
KR101341566B1 (ko) * | 2007-07-10 | 2013-12-16 | 삼성전자주식회사 | 소켓, 검사 장치, 그리고 적층형 반도체 소자 제조 방법 |
US8188760B2 (en) * | 2009-08-04 | 2012-05-29 | Applied Micro Circuits Corporation | Curve tracer signal conversion for integrated circuit testing |
CN102621463B (zh) * | 2011-02-01 | 2014-12-10 | 致茂电子(苏州)有限公司 | 用于半导体测试装置具有气密式导通孔的载板及制造方法 |
US20130069685A1 (en) * | 2011-09-16 | 2013-03-21 | Mark A. Swart | Integrated circuit test socket having test probe inserts |
CN103645351A (zh) * | 2013-12-14 | 2014-03-19 | 佛山市中格威电子有限公司 | 一种带有转接板的ict针床 |
KR102211488B1 (ko) | 2014-10-31 | 2021-02-03 | 삼성전자주식회사 | 어댑터 구조물 및 이를 포함하는 반도체 패키지 검사 장치 |
CN104316859A (zh) * | 2014-11-06 | 2015-01-28 | 山东华芯半导体有限公司 | 一种具有高通用性的芯片测试设备 |
US20170079140A1 (en) * | 2015-09-11 | 2017-03-16 | Intel Corporation | System, apparatus and method for interconnecting circuit boards |
US10103463B1 (en) * | 2017-09-28 | 2018-10-16 | ColdQuanta, Inc. | In-place clamping of pin-grid array |
US11293974B2 (en) * | 2019-09-27 | 2022-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for semiconductor device testing |
CN112557871A (zh) * | 2020-11-27 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | 一种芯片角度转换结构 |
CN117751291A (zh) * | 2021-07-15 | 2024-03-22 | 史密斯互连美洲公司 | 用于同轴测试插座和印刷电路板接口的系统和方法 |
TWI818548B (zh) * | 2022-05-23 | 2023-10-11 | 久元電子股份有限公司 | 測試套件及測試設備 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5387861A (en) * | 1993-06-16 | 1995-02-07 | Incal Technology, Inc. | Programmable low profile universally selectable burn-in board assembly |
US5712768A (en) * | 1992-12-30 | 1998-01-27 | Interconnect Systems, Inc. | Space-saving assemblies for connecting integrated circuits to circuit boards |
US5859538A (en) * | 1996-01-31 | 1999-01-12 | Hewlett-Packard Company | Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both |
US5982635A (en) * | 1996-10-23 | 1999-11-09 | Concept Manufacturing, Incorporated | Signal adaptor board for a pin grid array |
US6294920B1 (en) * | 1999-06-07 | 2001-09-25 | Wayne K. Pfaff | Test mounting for surface mount device packages |
US20010050569A1 (en) * | 2000-06-09 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method of inspecting semiconductor integrated circuit |
US6351392B1 (en) * | 1999-10-05 | 2002-02-26 | Ironwood Electronics, Inc, | Offset array adapter |
US6394820B1 (en) * | 1999-10-14 | 2002-05-28 | Ironwood Electronics, Inc. | Packaged device adapter assembly and mounting apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2104669A (en) * | 1981-08-06 | 1983-03-09 | Int Computers Ltd | Apparatus for testing electronic devices |
US5123850A (en) * | 1990-04-06 | 1992-06-23 | Texas Instruments Incorporated | Non-destructive burn-in test socket for integrated circuit die |
US6835898B2 (en) * | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5896037A (en) * | 1996-10-10 | 1999-04-20 | Methode Electronics, Inc. | Interface test adapter for actively testing an integrated circuit chip package |
JP3046015B1 (ja) * | 1998-12-28 | 2000-05-29 | 株式会社メルコ | 集積回路素子用ソケット、集積回路素子用アダプタ、および集積回路素子アッセンブリ |
-
2003
- 2003-01-14 DE DE10301124A patent/DE10301124A1/de not_active Withdrawn
- 2003-12-17 TW TW092135881A patent/TWI264539B/zh not_active IP Right Cessation
- 2003-12-18 EP EP03785584A patent/EP1583975A1/de not_active Ceased
- 2003-12-18 WO PCT/DE2003/004176 patent/WO2004068150A1/de active Application Filing
- 2003-12-18 CN CNB2003801088062A patent/CN100492018C/zh not_active Expired - Fee Related
-
2005
- 2005-07-12 US US11/179,344 patent/US7355426B2/en not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5712768A (en) * | 1992-12-30 | 1998-01-27 | Interconnect Systems, Inc. | Space-saving assemblies for connecting integrated circuits to circuit boards |
US5387861A (en) * | 1993-06-16 | 1995-02-07 | Incal Technology, Inc. | Programmable low profile universally selectable burn-in board assembly |
US5859538A (en) * | 1996-01-31 | 1999-01-12 | Hewlett-Packard Company | Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both |
US5982635A (en) * | 1996-10-23 | 1999-11-09 | Concept Manufacturing, Incorporated | Signal adaptor board for a pin grid array |
US6294920B1 (en) * | 1999-06-07 | 2001-09-25 | Wayne K. Pfaff | Test mounting for surface mount device packages |
US6351392B1 (en) * | 1999-10-05 | 2002-02-26 | Ironwood Electronics, Inc, | Offset array adapter |
US6394820B1 (en) * | 1999-10-14 | 2002-05-28 | Ironwood Electronics, Inc. | Packaged device adapter assembly and mounting apparatus |
US20010050569A1 (en) * | 2000-06-09 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method of inspecting semiconductor integrated circuit |
Non-Patent Citations (1)
Title |
---|
HYDEN L: "PROGRAMMING AND TESTING SMDS", ELECTRONIC ENGINEERING, MORGAN-GRAMPIAN LTD. LONDON, GB, vol. 67, no. 819, 1 March 1995 (1995-03-01), pages 107 - 108,110-111, XP000507373, ISSN: 0013-4902 * |
Also Published As
Publication number | Publication date |
---|---|
CN100492018C (zh) | 2009-05-27 |
EP1583975A1 (de) | 2005-10-12 |
US7355426B2 (en) | 2008-04-08 |
TW200424529A (en) | 2004-11-16 |
TWI264539B (en) | 2006-10-21 |
DE10301124A1 (de) | 2004-07-29 |
CN1739033A (zh) | 2006-02-22 |
US20060024990A1 (en) | 2006-02-02 |
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