WO2004066319A1 - 白金被覆粉末およびその製造方法、ならびに導電性ペースト - Google Patents
白金被覆粉末およびその製造方法、ならびに導電性ペースト Download PDFInfo
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- WO2004066319A1 WO2004066319A1 PCT/JP2004/000449 JP2004000449W WO2004066319A1 WO 2004066319 A1 WO2004066319 A1 WO 2004066319A1 JP 2004000449 W JP2004000449 W JP 2004000449W WO 2004066319 A1 WO2004066319 A1 WO 2004066319A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Definitions
- the present invention relates to a powder comprising a collection of platinum-coated particles in which the periphery of a base particle made of a material such as ceramic is coated with platinum, and a method for producing the same.
- the present invention also relates to a conductive paste that can be advantageously used particularly for forming a platinum electrode.
- Platinum is widely used as an electrode material for various electronic components such as multilayer ceramic capacitors because of its high conductivity. Platinum also has a high catalytic effect on various chemical reactions such as hydrogenation, dehydrogenation, and oxidation reactions, so it can be used as a catalyst for synthesizing organic compounds and for decomposing ammonia and carbon monoxide as harmful substances. It is also used as a catalyst. In recent years, exhaust gas of a diesel engine is One Do question, platinum as NO x and force one carbon cracking catalyst of which are contained in the exhaust gas is very effective. More recently, platinum has been used as a catalyst for various gas sensing elements and a catalyst for fuel cell electrodes, utilizing its high conductivity and catalytic action.
- Platinum electrodes for various electronic components such as multilayer ceramic capacitors are usually prepared by kneading platinum powder, an organic solvent, and an organic or inorganic binder to prepare a conductive paste, which is then heat-resistant to a ceramic substrate or the like. It is formed by coating on a substrate, followed by drying and firing.
- the platinum electrode thus formed is generally a thin layer and has excellent conductivity.
- Patent No. 3,316,235 discloses a method for producing a noble metal-coated ceramic powder using an electroless plating method, in which a reducing agent is added to a dispersion in which ceramic powder is dispersed in an aqueous solution of a noble metal salt.
- Example 8 of this document describes a production example of a platinum-coated PZT fine powder in which the periphery of a PZT fine powder having a platinum thin film layer formed on its surface is coated with platinum.
- OmQ / sq. was manufactured from a conductive paste prepared using platinum-coated PZT fine powder. .
- the amount of net platinum used is reduced, so that the manufacturing cost is lower than when using platinum powder.
- the core particles (ceramic particles) of the platinum-coated ceramic particles are usually non-conductive, the platinum electrode formed using the platinum-coated ceramic powder is compared with the platinum electrode formed using the platinum powder.
- its resistance value tends to be high (that is, the conductivity is low).
- an object of the present invention is to provide a platinum-coated powder that can be advantageously used to form a platinum electrode having a low resistance value with a small amount of platinum used, a low production cost, and a method for producing the same. It is in.
- Another object of the present invention is to provide a conductive paste which is particularly advantageous for forming a platinum electrode.
- the inventors of the present invention have conducted intensive studies on the above-mentioned problems, and have found that platinum particles are applied to base particles (substrate particles with a palladium layer) of a material such as ceramics having a palladium layer formed on the surface by using an electroless plating method. Deposition, a homogeneous platinum coating layer can be formed around it.Furthermore, platinum electrodes produced from conductive pastes prepared using the platinum-coated particles thus obtained are known in the art. And The present invention was confirmed to exhibit a lower resistance value than a platinum electrode manufactured using a platinum-coated ceramic powder, and completed the present invention.
- the present invention resides in a platinum-coated powder comprising platinum-coated base particles in which a palladium layer is formed on the entire surface of the base particles and the periphery of the base-particle-coated base particles is coated with platinum.
- the palladium layer may be formed as a continuous layer that uniformly covers the entire surface of the particle, or locally, such as in a point state or island state (sea-island structure), but substantially uniformly over the entire surface of the base particle. It may be formed so as to be dispersed.
- the present invention also relates to a method for simultaneously adding a platinum compound aqueous solution and a reducing agent to a dispersion of a base particle with a palladium layer in which a palladium layer is formed on the entire surface of the base particles of a material such as ceramics.
- a method for producing a platinum-coated powder characterized in that platinum is deposited around particles.
- the base particles with a palladium layer used in the method for producing a platinum-coated powder according to the present invention are preferably formed by forming a noradium layer on the surfaces of particles whose surfaces have been subjected to an activation treatment.
- the present invention further resides in a conductive paste containing the platinum-coated powder of the present invention.
- the platinum-coated powder of the present invention is composed of platinum-coated particles in which a palladium layer-coated substrate particle having a palladium layer formed on the entire surface of the substrate particle is coated with platinum.
- the amount of palladium is preferably in the range of 0.001 to 1 part by mass per 1 part by mass of the base particles, and more preferably in the range of 0.001 to 0.01 part by mass. More preferred.
- the amount of platinum is preferably in the range of 0.1 to 100 parts by mass, more preferably in the range of 0.5 to 10 parts by mass, based on 1 part by mass of the base particles. .
- the material of the base particles serving as the core of the platinum-coated particles can be appropriately selected depending on the use of the platinum-coated particles.
- examples include: ceramics such as metal oxides, inorganic particles such as carbon and metal, and synthetic materials.
- Organic particles such as a resin are exemplified.
- ceramics include alumina, silica, zirconia, titanium dioxide, barium titanate, and glass.
- examples of metals include nickel, cobalt, copper, iron, titanium, and the like.
- Synthetic resins include acrylic. Resin, poly power And general-purpose resins such as polyethylene, polypropylene and the like. Of these, ceramics are preferred, and alumina is particularly preferred.
- the average particle size of the base particles is usually in the range of 0.1 to 100 m, preferably in the range of 0.1 to 10 zm, particularly preferably in the range of 0.1 to 1 zm.
- the shape of the base particles is preferably spherical.
- the term “spherical” here does not necessarily mean a true sphere, but includes deformed spherical particles such as an elliptical shape or a rock shape having an uneven surface.
- the platinum-coated powder of the present invention can be produced by forming a palladium layer on the entire surface of the above-mentioned substrate particles, and then forming a platinum coating layer on the surface of the substrate particles with the palladium layer. Before forming a palladium layer on the substrate particles, it is preferable to activate the surface physically or chemically.
- a method for physically activating the surface of the base particles there is a method of polishing the surface of the base particles using a vibration mill or a ball mill.
- a method for chemically activating the surface of the base particles the surface of the base particles is contacted with an acid (eg, hydrochloric acid, nitric acid, sulfuric acid) or an alkaline solution (eg, aqueous sodium hydroxide solution, aqueous hydroxide solution).
- an acid eg, hydrochloric acid, nitric acid, sulfuric acid
- an alkaline solution eg, aqueous sodium hydroxide solution, aqueous hydroxide solution.
- an alkali solution particularly, an aqueous solution of potassium hydroxide
- an aqueous solution of an alkaline solution having a concentration of 1 to 1 ON (preferably 3 to 8 N) is applied to the surface of the base particles at a temperature of 10 to 80 ° C (preferably 30 to 60 ° C). It is preferable to heat to a temperature and contact it for 10 minutes to 5 hours (preferably 30 minutes to 2 hours).
- a method of forming a palladium layer on the entire surface of the substrate particles a method of contacting a palladium compound and a reducing agent on the surface of the substrate particles to precipitate (spot) palladium on the surface of the substrate particles is used. be able to. Specifically, it is preferable to use a method in which a reducing agent is added to a dispersion of base particles containing a palladium compound to form a palladium layer on the surface of the base particles. Substrate containing palladium compound.
- the particle dispersion may be prepared by first preparing a dispersion of the base particles and adding the palladium compound thereto, or preparing the aqueous solution of the palladium compound first. It may be manufactured by dispersing substrate particles in this.
- Examples of the palladium compound used as a raw material for forming the palladium layer include palladium chloride. Palladium bromide, palladium sulfate, palladium nitrate, palladium acetate, dichlorotetraamminepalladium, dibromotetraamminepalladium, dinitrate tetraamminepalladium, disulfitetetraamminepalladium, disulfatetetraamminepalladium, dichlorodiamminepalladium, dibromodiammine Divalent palladium (II) compounds such as palladium, dinitrate diammine palladium, disulfite diammine palladium, disulfate diammine palladium, and monovalent palladium (I) compounds such as tetrachlorodiammine palladium and tetrabromodiammine palladium Can be done. Further, ammonium salts of these palladium compounds can also be used. These palladium compounds may be used alone or in combination of
- the reducing agent examples include sodium hypophosphite, sodium borohydride, dimethylamine porane, sodium formate, hydrazine, hydrazine hydrochloride, and the like, with hydrazine being preferred. These are usually used as aqueous solutions.
- the concentration of the palladium compound in the dispersion of the base particles at the time of forming the palladium layer (that is, when the reducing agent is added) is preferably in the range of 0.1 to 5 OmgZL as the metal palladium concentration, More preferably, it is in the range of 1 O mg / L.
- the thickness of the generated palladium layer is too large (that is, if the amount of deposited palladium is too large), the agglomeration of the base particles tends to easily occur.
- the amount is preferably in the range of 0.001 to 1 part by mass, more preferably in the range of 0.001 to 0.01 part by mass, per 1 part by mass of the base particles.
- the pH of the base particle dispersion is preferably in the range of 5 to 10.
- the pH adjuster As the pH adjusting agent, hydrochloric acid, sulfuric acid, tetraborate, phthalate, acetate, citrate and the like can be used.
- the liquid temperature of the substrate particle dispersion may be within a range in which the palladium compound can be dissolved, and is usually 0 to 80 ° C, preferably 20 to 80 ° C. 40 temperature.
- the base particles When the palladium layer is formed, if the base particles are agglomerated, it is difficult to form a palladium layer on the entire surface of the particles.Therefore, the dispersion state of the base particles should be enhanced by stirring or ultrasonic vibration. Is preferred.
- the substrate particles with a palladium layer obtained as described above are washed with pure water or the like as necessary, and separated from the dispersion by filtration or decantation as necessary. Further, heat treatment can be performed if necessary. By performing the heat treatment, the palladium layer is firmly fixed on the surface of the base particles.
- a platinum compound and a reducing agent are brought into contact with the palladium layer-attached substrate particles to deposit (spot) platinum on the surface of the substrate particles.
- a method is available. Specifically, a platinum compound aqueous solution and a reducing agent are simultaneously added to the dispersion of the base layer-coated base particles to form a platinum coating layer around the base particles (simultaneous addition coating method).
- a method of forming a platinum coating layer around the base particles by adding an aqueous solution of a platinum compound to the dispersion of the base particles with the reducing agent solution containing the reducing agent solution, and particularly the former simultaneous addition coating method. It is preferable to use
- platinum compound a water-soluble di- or tetravalent platinum salt or platinum complex salt can be used.
- platinum compounds include dinitrodiamine platinum, hexahydroxoplatinum, hexacloplatinate, tetracloplatinate, tetrabromoplatinate, tetraammineplatinate, hexaammineplatinate, bisoxalato Platinate and the like. These platinum conjugates may be used alone or in combination of two or more.
- divalent platinum compounds are preferred, and particularly preferred are the same reducing agents used when forming the palladium layer as the hexaclocloplatinate and tetracloplatinate reducing agents. It can be used, and is preferably hydrazine.
- the reducing agent used for forming the platinum coating layer and the reducing agent used for forming the palladium layer need not necessarily be the same.
- water-soluble dispersant Any of water-soluble natural polymer, water-soluble semi-synthetic polymer, and water-soluble synthetic polymer can be used.
- An example of a water-soluble natural product polymer is gelatin.
- water-soluble semi-synthetic polymers include water-soluble celluloses such as methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, gum arabic, and saccharose.
- water-soluble synthetic polymers examples include polyvinyl alcohol, polyvinyl acetate, polyethylene glycol, unsaturated carboxylic acid polymers (eg, polyacrylic acid, polymethacrylic acid, polymaleic acid), and salts thereof (eg, ammonium polyacrylate). And its esters (eg, polyacrylic acid ester), isobutylene-maleic anhydride copolymer, phenol modified with ethylene oxide and ethylene oxide or propylene oxide polymer.
- water-soluble dispersants may be used alone or in combination of two or more.
- water-soluble dispersants water-soluble natural polymers and water-soluble semi-synthetic polymers are preferably water-soluble celluloses, and water-soluble synthetic polymers are preferably polyvinyl alcohol.
- the base particle concentration of the base particle-dispersed dispersion with a palladium layer is preferably in the range of 0.05 to 10 gZL, more preferably in the range of 0.1 to 5 gZL.
- the pH of the substrate particle-dispersed liquid with a palladium layer is preferably 5 or less, more preferably 3 or less. If the pH is higher than 5, the platinum compound becomes unstable, and it becomes difficult to form a uniform platinum coating layer. Therefore, it is preferable to add a pH adjuster, if necessary, together with the addition of the aqueous platinum compound solution and the reducing agent to the dispersion of the substrate particles with a palladium layer.
- the liquid temperature of the dispersion may be within a range in which the platinum compound can be dissolved, and is usually 0 to 100 ° C, preferably 20 to 80 ° C; particularly preferably 50 to 70 ° C.
- the supply rates of the aqueous platinum compound solution and the reducing agent are each 0.1 g of the platinum compound aqueous solution per 1 g of the base particles.
- the reducing agent is in the range of 0.1 to 10 mLZ, and the reducing agent is in the range of 0.1 to 10 mLZ. If the supply rates of the aqueous solution of the platinum compound and the reducing agent are respectively higher than the above ranges, pure platinum particles will not be produced around the base particles, and pure platinum particles will be produced. It is easy to achieve.
- the temperature of the reaction system when forming the platinum coating layer by the reduction reaction is usually 0 to 90 ° C., preferably 10 to 80 ° C., and particularly preferably 30 to 7 ′ 0 °. C.
- the supply rate and concentration of the platinum compound aqueous solution and the reducing agent, and the temperature of the reaction system are controlled to simultaneously form the base surface platinum coating layer. It is also possible to form pure pure platinum particles which are not coated on the substrate surface. At this time, it is desirable to control the formed amount and the particle size of the formed platinum-coated particles and the pure platinum particles. For example, the platinum-coated particles and the pure platinum particles are formed to have different particle sizes. Thus, by simultaneously forming the platinum-coated killer and the pure platinum particles and using this as a conductive paste, it is possible to improve the conductivity when the electrodes are formed.
- the platinum coating layer When forming the platinum coating layer, it is difficult to form a uniform platinum coating layer if the base particles are agglomerated, so that the dispersion state of the base particles can be enhanced by stirring or ultrasonic vibration. preferable.
- the platinum-coated powder formed as described above is washed with pure water or the like to remove unreacted platinum compounds and reducing agents, and dried if necessary.
- the condition of the heat treatment is a temperature lower than the temperature at which sintering of the platinum-coated particles starts, usually 100 to 600 ° C., preferably 300 to 500 ° C. Is 1 to 100 hours, preferably 5 to 50 hours.
- the platinum-coated powder formed as described above may be dried and replaced with a solvent used for forming a conductive paste by removing the dispersion medium from the aqueous dispersion.
- a solvent used for forming a conductive paste such as Yuichi Vineol is added to the aqueous dispersion, Then the water is removed.
- a surfactant it is preferable to add a surfactant at any stage because the aqueous solvent and the organic solvent are easily replaced.
- an anionic surfactant, a cationic surfactant, a nonionic surfactant and the like are used.
- lipophilic ones are preferable, and nonionic surfactants having an HLB (hydrophilic-lipophilic balance) value of usually 3 to 20 are preferably used, and hydrophilicity having an HLB value of 10 to 20 is preferable.
- HLB hydrophilic-lipophilic balance
- polyoxyethylene alkyl ethers such as nonylphenol ether and their phosphates, phosphates or mixtures thereof, and polyoxyethylene sorbitan such as polyoxyethylene sorbitan monostearate
- fatty acid esters, polyglycerin fatty acid esters such as polyglycerin monostearate, and sorbitan fatty acid esters such as sorbitan monostearate are particularly preferably used.
- Particularly preferred surfactants are polyoxyethylene alkylphenyl ethers and their phosphates or mixtures thereof.
- ethyl cellulose ethylene glycol, toluene, xylene, mineral oil, High-boiling organic solvents such as butyl carbitol, Yuichi Pineoyl, and ethyl carbitol acetate are used.
- An organic or inorganic binder is used as the binder, and an organic binder such as ethyl cellulose or an epoxy resin is preferable. It is preferable that solid substances be removed from these binders by filtration or the like before use.
- the above-mentioned surfactants such as polyoxyethylene alkylester phosphate, and amine-based or polyamine-based dispersants such as aliphatic amine salts are used.
- the conductive paste may be made of glass frit such as lead-based glass, zinc-based glass, or silicate-based glass, manganese oxide, magnesium oxide, or oxidized bismuth as necessary.
- a metal oxide filler such as a mass may be added.
- a heat-resistant substrate such as ceramics and sintered to form an electrode
- an electrode having excellent adhesion to the substrate and high conductivity can be formed.
- the wettability with solder is improved.
- a plasticizer such as fluoric acid ester and stearic acid, a dispersant, and the like can be added to the conductive paste.
- a conductive paste When a conductive paste is applied to an unfired substrate (green sheet), firing of the conductive paste (forming a platinum electrode layer) and firing of the substrate are performed simultaneously to produce a platinum electrode, In order to adjust the degree of shrinkage of the substrate and the electrode and to prevent the occurrence of delamination and cracks, it is preferable to add a powder made of the same material as the material of the substrate to the conductive paste.
- ceramic powder is added to the conductive paste and dispersed well with the platinum-coated powder.
- the addition amount of this powder is usually in the range of 0.01 to 10 parts by mass, preferably in the range of 0.1 to 1 part by mass with respect to 1 part by mass of the platinum-coated powder.
- platinum powder (powder of pure platinum particles) may be mixed with the conductive paste.
- the amount of the platinum powder to be added is generally in the range of 0.1 to 100 parts by mass, preferably in the range of 1 to 50 parts by mass, per 1 part by mass of the platinum-coated powder.
- a conductive paste is formed by mixing a platinum-coated powder and, if necessary, a powder of alumina or the like, or a platinum powder.In this case, rather than mixing particles having a uniform particle size, a wider particle size distribution is obtained. Therefore, it is preferable to mix powders having different average particle diameters. For example, two or more types of platinum-coated powders having different average particle sizes are formed and mixed in an appropriate amount, or platinum-coated powder, alumina powder and platinum powder having different average particle sizes are mixed to form a conductive paste. I do.
- a conductive paste is formed by mixing l ⁇ 2 ⁇ m platinum-coated powder, 0.1 ⁇ 0.50m alumina ceramic powder such as alumina, and 0.3 ⁇ 1.5 ⁇ m platinum powder. Let it. In this way, the dispersibility of the conductive paste is improved by blending so as to broaden the particle size distribution of the entire powder contained in the conductive paste, and as a result, the packing density is reduced when the electrode is formed. And the conductivity is improved. W
- spherical alumina powder having an average particle diameter of 0.5 m by a laser diffraction method and 18 OmL of a 6N potassium hydroxide solution were charged into a 1 L flask equipped with a reflux condenser. Next, the temperature of the aqueous potassium hydroxide solution was heated to .50 ° C. for 1 hour, and then cooled. After cooling, the alumina powder was taken out from the aqueous potassium hydroxide solution, thoroughly washed with pure water, and dried.
- the dispersion is allowed to stand, the supernatant is removed by decantation, pure water is added to adjust the alumina concentration of the dispersion to 10 g / 3 L, and stirring is started again to disperse the alumina powder. I let it. Then, 2 mL of a hydrazine aqueous solution having a concentration of 10 OmL ZL was added to the dispersion, and stirring was continued at room temperature for 30 minutes to precipitate palladium on the surface of the alumina particles ⁇ . The ⁇ of the dispersion when the aqueous hydrazine solution was added was 7. Finally, the powder was washed with pure water and dried to obtain an alumina powder with a palladium layer.
- the amount of palladium was 0.001 part by mass and the amount of platinum was 9 parts by mass with respect to 1 part by mass of alumina.
- the obtained platinum-coated alumina powder was observed with an electron microscope, it was confirmed that a uniform platinum coating layer was formed on the entire surface of each particle.
- the average particle size of the platinum-coated alumina powder measured from the image of the electron microscope was 0.6 zm.
- the mixture is mixed using a three-roll kneader to prepare a conductive paste.
- the above-mentioned conductive paste was linearly applied to an alumina substrate and dried at 150 ° C. Then, it was baked at 1450 ° C. for 2 hours to form a linear platinum electrode.
- the length, cross-sectional area, and sheet resistance of this linear platinum electrode were measured, and the specific resistance was calculated from the following equation (1).
- the cross-sectional area of the linear platinum electrode was measured using an ultra-depth shape measuring microscope (manufactured by KEYENCE CORPORATION, VK-8550), and the sheet resistance was measured using a multi-meter manufactured by Toyo Tech Nikki Co., Ltd. It measured using.
- Example 2 The same operation as in (1) of Example 1 was performed to activate the alumina powder. was.
- Example 1 was repeated except that 4 ml of an aqueous solution of platinum chloride having a concentration of 5 g / L was added as a platinum component, instead of adding the aqueous solution of palladium salt in the night of the alumina powder.
- Example 2 The same operation as in (3) of Example 1 is performed on the alumina powder with a platinum layer obtained in (2) to deposit platinum around the alumina particles with a platinum layer, to obtain a platinum-coated alumina powder.
- a platinum layer obtained in (2) The same operation as in (3) of Example 1 is performed on the alumina powder with a platinum layer obtained in (2) to deposit platinum around the alumina particles with a platinum layer, to obtain a platinum-coated alumina powder.
- the amount of platinum relative to 1 part by mass of alumina was 0.2 part by mass.
- the obtained platinum-coated alumina powder was observed with an electron microscope, it was confirmed that a large number of particles having a non-uniform platinum layer were present.
- a conductive paste was prepared according to the method described in Example 1, and then an electrode was formed from the conductive paste.
- the specific resistance value of this electrode was calculated, it was 348 ⁇ ⁇ cm, which was higher than that of the electrode made in Example 1.
- Example 2 The same operation as in (1) of Example 1 was performed, except that a spherical alumina powder having an average particle diameter of 1.2 m was used, to activate the alumina powder.
- Example 2 The same operation as in (1) of Example 1 was performed to produce an alumina powder having a palladium layer.
- Alumina powder was dispersed therein, 25 OmL of a 10 g / L aqueous solution of carboxymethyl cellulose was added, and the mixture was stirred at 60 ° C for 30 minutes. Then, simultaneously, 25 OmL of hexaclo-mouth platinic acid aqueous solution with a concentration of 36 g / L and 25 OmL of hydrazine aqueous solution with a concentration of 4 OmL / L as a platinum content were added at a rate of 2.5 mLZ per minute. Then, stirring was further continued at 60 ° C. for 1 hour to precipitate platinum around the alumina particles with the palladium layer.
- the pH of the dispersion after the addition of the aqueous tetrachloroplatinic acid solution and the aqueous hydrazine solution was 1. Finally, the powder was washed with pure water, dried, and then heated at 400 ° C. for 3 hours to obtain about 10 g of a platinum-coated alumina powder.
- the amount of palladium was 0.001 part by mass and the amount of platinum was 5.7 parts by mass with respect to 1 part by mass of alumina.
- the obtained platinum-coated alumina powder was observed with an electron microscope, it was confirmed that a uniform platinum coating layer was formed on the entire surface of each particle. Further, the average particle size of the platinum-coated alumina powder measured from the image of the electron microscope was 1.5 zm.
- An electrode was formed in the same manner as in Example 1, and the specific resistance value was calculated to be 43 Q'cm.
- the conductive paste was prepared by mixing using a roll-type kneading apparatus.
- the platinum content in this conductive paste was 87% by weight, the same as that of the conductive paste prepared in Example 2, and the alumina content was 13% by weight.
- An electrode was formed in the same manner as in Example 1, and the specific resistance value was calculated to be 52 jQ ⁇ cm.
- the platinum-coated powder of the present invention can be advantageously used to form a platinum electrode having a low resistance value while using base particles of a material such as ceramics as core particles. Further, by using the method for producing a platinum-coated powder of the present invention, it is possible to uniformly coat the periphery of base particles of a material such as ceramics with platinum.
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Cited By (5)
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JP2007165063A (ja) * | 2005-12-13 | 2007-06-28 | Samsung Sdi Co Ltd | 導電性粒子、導電性ペースト及び電子部品 |
JP2008184679A (ja) * | 2007-01-31 | 2008-08-14 | Okuno Chem Ind Co Ltd | 無電解パラジウムめっき用活性化組成物 |
WO2012008373A1 (ja) * | 2010-07-12 | 2012-01-19 | 田中貴金属工業株式会社 | 電極形成用の導電微粒子及び金属ペースト並びに電極 |
JP2012117111A (ja) * | 2010-12-01 | 2012-06-21 | National Institute Of Advanced Industrial Science & Technology | 無電解白金めっき液、及び白金めっき製品の製造方法 |
RU2792330C1 (ru) * | 2022-12-07 | 2023-03-21 | Общество с ограниченной ответственностью "С-Компонент" | Платиновая резистивная паста |
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JP2007165063A (ja) * | 2005-12-13 | 2007-06-28 | Samsung Sdi Co Ltd | 導電性粒子、導電性ペースト及び電子部品 |
JP2008184679A (ja) * | 2007-01-31 | 2008-08-14 | Okuno Chem Ind Co Ltd | 無電解パラジウムめっき用活性化組成物 |
WO2012008373A1 (ja) * | 2010-07-12 | 2012-01-19 | 田中貴金属工業株式会社 | 電極形成用の導電微粒子及び金属ペースト並びに電極 |
CN102714072A (zh) * | 2010-07-12 | 2012-10-03 | 田中贵金属工业株式会社 | 电极形成用的导电粒子及金属糊料以及电极 |
KR101313982B1 (ko) | 2010-07-12 | 2013-10-01 | 다나카 기킨조쿠 고교 가부시키가이샤 | 전극 형성용의 도전 미립자, 금속 페이스트 및 전극 |
US8771553B2 (en) | 2010-07-12 | 2014-07-08 | Tanaka Kikinzoku Kogyo K.K. | Conductive fine particle and metal paste for electrode formation, and electrode |
CN102714072B (zh) * | 2010-07-12 | 2015-08-12 | 田中贵金属工业株式会社 | 电极形成用的导电粒子及金属糊料以及电极 |
US9556343B2 (en) | 2010-07-12 | 2017-01-31 | Tanaka Kikinzoku Kogyo K. K. | Conductive fine particle and metal paste for electrode formation and electrode |
JP2012117111A (ja) * | 2010-12-01 | 2012-06-21 | National Institute Of Advanced Industrial Science & Technology | 無電解白金めっき液、及び白金めっき製品の製造方法 |
RU2792330C1 (ru) * | 2022-12-07 | 2023-03-21 | Общество с ограниченной ответственностью "С-Компонент" | Платиновая резистивная паста |
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