WO2004064468A1 - Element de tableau, tableau de connexions composite utilisant cet element, et dispositif a ouverture/fermeture - Google Patents

Element de tableau, tableau de connexions composite utilisant cet element, et dispositif a ouverture/fermeture Download PDF

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Publication number
WO2004064468A1
WO2004064468A1 PCT/JP2004/000024 JP2004000024W WO2004064468A1 WO 2004064468 A1 WO2004064468 A1 WO 2004064468A1 JP 2004000024 W JP2004000024 W JP 2004000024W WO 2004064468 A1 WO2004064468 A1 WO 2004064468A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
substrate
housing
flexible wiring
composite
Prior art date
Application number
PCT/JP2004/000024
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Murayama
Original Assignee
Sony Chemicals Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp. filed Critical Sony Chemicals Corp.
Publication of WO2004064468A1 publication Critical patent/WO2004064468A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards

Definitions

  • the present invention relates to the technical field of wiring boards, and more particularly to a composite wiring board comprising a rigid wiring board and a flexible wiring board.
  • Reference numeral 101 in FIG. 42 is a composite wiring board according to the related art of the present invention.
  • FIG. 44 is an exploded view showing the structure of the composite wiring board 10 ⁇ , and reference numerals 17 1 ⁇ , ⁇ 72 A, 17 1 B, and 17 2 B are laminated rigid wiring boards.
  • Reference numeral 178 indicates a single-layer or laminated flexible wiring board.
  • the flexible wiring board 178 is made of resin and has a flexible base film 111 and a wiring film 112 arranged on the base film 111.
  • Wiring film ⁇ 21 is connected to wiring film 1 1 2 of flexible wiring board 1 78, flexible wiring Plates 178 are fixed to the front and back surfaces at both ends.
  • Rigid laminated board 1 7 1 ⁇ , ⁇ 7 2 ⁇ , 1 7 1 ⁇ , 1 7 2 ⁇ are shorter than flexible wiring board 1 7 8, and rigid laminated board 1 7 ⁇ , 1 7 2 at one end
  • the ⁇ ⁇ and the rigid laminated boards 17 1 B and 17 2 B at the other end are connected by a central portion of a flexible wiring board 178.
  • the electronic component 144 when the electronic component 144 is mounted on the rigid laminates 17 1 A, 17 A, 17 B, 17 B, the electronic component 14 They are interconnected by wiring films 1 1 2 and 1 2,1.
  • the rigid laminated boards 17 1 A and 17 2 A located at one end of the composite wiring board 101 are placed inside the housing on the keyport side.
  • the rigid laminate 17 1 B and 17 2 B located at the other end are placed inside the housing on the liquid crystal display panel side, the keyboard and liquid crystal display are displayed while the liquid crystal display panel is openable and closable. Panels can be connected by flexible wiring boards 17 8.
  • the present invention has been made to solve the disadvantages of the related art described above, and its object is to provide a low-cost composite wiring board that is easy to handle. Disclosure of the invention
  • the present invention provides a substrate element in which at least one flexible wiring board and a plurality of rigid wiring boards are laminated, wherein the flexible wiring board and the rigid wiring board And a connection portion protruding from a side surface of the substrate piece main body, which is an end portion of the flexible wiring board, wherein the connection portion includes: At least a part of the wiring film of the flexible wiring board is an exposed substrate piece.
  • the wiring film of the adjacent rigid wiring board is a substrate piece connected by a conductive projection.
  • the present invention is a substrate piece in which the length of the connection portion is shorter than the length of the substrate piece body.
  • the present invention has first and second substrate pieces and a flexible wiring board for connection, wherein the first and second substrate pieces are at least one flexible wiring board and a plurality of flexible wiring boards.
  • the connection portion of the second substrate piece is a composite wiring board connected to an end of the flexible wiring board for connection.
  • the present invention is a composite wiring board having a reinforcing film affixed between the connection flexible wiring board and the connection portions of the first and second substrate pieces.
  • the present invention is the composite wiring board, wherein a length of the flexible wiring board for connection is longer than a length of the connection portion of the first and second substrate pieces.
  • the present invention is a composite wiring board having an electronic component mounted on at least one of the first and second substrate pieces.
  • the substrate piece of the first invention is configured as described above, and an adhesive film is disposed on the surface of a single-layer rigid wiring board ⁇ a flexible wiring board, and laminated by heating and pressing. Then, the wiring film of each rigid wiring board is connected to the wiring film of the flexible wiring board.
  • the composite wiring board of the first invention is configured as described above, Both of the two substrate pieces are connected by a flexible wiring board for connection. Assuming that the two substrate pieces are first and second substrate pieces, the wiring films of the first and second substrate pieces are connected via a wiring film of a flexible wiring board for connection. I have.
  • one of the substrate pieces can be arranged on the display side of the portable computer and the other can be freely opened and closed.
  • the composite wiring board is bent and the bending is extended with the opening / closing operation of the first and second housings.
  • the portion where is connected is bent and is not arranged in the portion where the bending is returned, so that no stress is applied.
  • the first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and the first and second substrate pieces are connected to a flexible connection.
  • a composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing.
  • first and second substrate pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, and wherein the flexible wiring A board piece main body composed of a portion where a board and the rigid wiring board are overlapped with each other, and a connection portion that is an end of the flexible wiring board and protrudes from a side surface of the board piece main body.
  • the connecting portion at least a wiring film of the flexible wiring board is provided.
  • connection portion of the first and second substrate pieces is connected to an end of the flexible wiring board for connection, and at least one of the first and second substrate pieces is An electronic component is mounted, and a portion where the first and second substrate pieces and the flexible wiring board for connection are connected, An openable / closable device disposed at a position where the first and second housings are opened and closed and the connection flexible wiring board is not bent when the connection flexible wiring board is bent.
  • the first housing and the second housing are configured to be relatively rotatable by a predetermined angle about an axis, and the first and second substrate pieces are connected to a flexible connection.
  • a composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing.
  • An openable / closable device wherein the first and second board pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, A substrate piece main body composed of a portion where the wiring board and the rigid wiring board are overlapped; and a connection portion that is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body.
  • connection portion has at least a wiring film of the flexible wiring board.
  • the connection part of the first and second substrate pieces is connected to an end of the connection flexible wiring board, and at least one of the first and second substrate pieces is An electronic component is mounted, the connection flexible wiring board passes through the shaft, and a portion where the connection portion of the first and second substrate pieces is connected to the connection flexible wiring board Is an openable / closable device in which one is located inside the first housing and the other is located inside the second housing.
  • the first housing and the second housing are configured to be relatively rotatable about an axis by a predetermined angle, and the first and second substrate pieces are connected to a flexible connection.
  • a composite wiring board having a wiring board is built in, one of the first and second base plate pieces is disposed in the first housing, and the other is disposed in the second housing.
  • An openable / closable device wherein the first and second board pieces are board pieces on which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, Wiring board and the rigid arrangement
  • a substrate piece main body composed of a portion where a wire plate is overlapped; and a connection part which is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body.
  • connection portion of the first and second substrate pieces is connected to an end of the connection flexible wiring board.
  • An electronic component is mounted on at least one of the first or second substrate element, and the connection portion of one of the first or second substrate element is connected in the axis.
  • a portion of the first and second substrate pieces where the connection portion and the connection flexible wiring board are connected is disposed inside one of the first and second housings. It is a switchgear type device.
  • the present invention is a composite wiring board in which at least one flexible wiring board and a plurality of rigid wiring boards are stacked, and the first and second substrate pieces are connected to each other.
  • the substrate piece is a substrate piece body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped, and an end of the flexible wiring board, And a bridge portion protruding from a side surface. In the bridge portion, a contact portion is formed at a portion where at least a part of the wiring film of the flexible wiring board is exposed, and the contact portion is formed.
  • the first and second substrate pieces are composite wiring boards in which the contact portions are electrically connected to each other.
  • the present invention is a composite wiring board in which wiring films of the rigid wiring board adjacent to the first and second substrate pieces are connected by conductive protrusions.
  • the present invention is a composite wiring board in which a reinforcing film is attached between the bridge portions of the first and second substrate pieces.
  • one of the bridge portions of the first and second flexible wiring boards is longer than the other, and the difference between the lengths is two times the length of the portion where the contact portions overlap.
  • This is a composite wiring board that has been doubled or more.
  • the present invention is a composite wiring board having an electronic component mounted on at least a part of its surface.
  • the third substrate piece is a substrate piece body composed of a portion where the flexible wiring board and the rigid wiring board are overlapped, An end portion, and a bridge portion protruding from a side surface of the substrate piece main body.
  • the bridge portion has a wiring film of the flexible wiring board, at least a part of which is exposed and contacted.
  • the fourth substrate element is configured such that at least a part of the wiring film is exposed on the surface, and the third and fourth substrate elements are the third substrate element.
  • the wiring film exposed at the bridge portion; And the wiring layer exposed on the surface of the board piece is electrically connected a composite wiring board.
  • the present invention is a composite wiring board having electronic components mounted on at least a part of its surface.
  • the first housing and the second housing are configured to be relatively rotatable about an axis by a predetermined angle, and at least one flexible wiring board and a plurality of rigid wiring boards are provided.
  • a fourth board element in which a plurality of rigid wiring boards are stacked, and a composite wiring board in which a plurality of rigid wiring boards are stacked.
  • One of the element pieces is disposed in the first housing, and the other is an open / close type device disposed in the second housing, wherein the third substrate element includes the flexible wiring board and A substrate piece main body composed of a portion where the rigid wiring board is overlapped; and a bridge part which is an end of the flexible wiring board and protrudes from a side surface of the substrate piece main body.
  • the bridge portion has a wiring film of the flexible wiring board, At least a part is exposed to form a contact portion.
  • the fourth substrate element has at least a part of a wiring film exposed on the surface thereof, and the third and fourth substrate element has the contact part.
  • the wiring film exposed on the bridge portion of the third substrate element is electrically connected to the wiring film exposed on the surface of the fourth substrate element, and the composite wiring board is reduced in number.
  • An electronic component is mounted on a part of the surface of the first and second contact pieces of the first and second substrate pieces, the first and second housings are opened and closed, and the bridging is performed. This is an open / close type device that is placed in a position where it does not bend when the joint bends and stretches.
  • the first housing and the second housing are configured to be relatively rotatable about a shaft by a predetermined angle, and at least one flexible wiring board and a plurality of rigid wirings are provided.
  • a third board element in which a plurality of rigid wiring boards are stacked and a composite wiring board in which a fourth board element in which a plurality of rigid wiring boards are stacked is built in;
  • One of the substrate pieces is disposed in the first housing, and the other is an opening / closing device disposed in the second housing, wherein the third substrate piece is a flexible wiring board.
  • the rigid wiring board are overlapped with each other, and a substrate piece main body is formed of a portion overlapped with the rigid wiring board;
  • the wiring film of the flexible wiring board is less At least a part of the wiring film is exposed at the surface of the fourth substrate element, and the third and fourth substrate elements are at least partially exposed at the surface.
  • the wiring film exposed at the bridge portion of the third substrate element is electrically connected to the wiring film exposed at the surface of the fourth substrate element, and at least the composite wiring board is
  • An electronic component is mounted on a part of the surface, the bridge portion passes through the shaft, and the portion of the first and second substrate pieces where the contact portions are connected to each other is the shaft. And an openable / closable type disposed inside one of the first and second housings. Equipment.
  • the substrate piece of the second invention is configured as described above, and the rigid wiring boards are arranged between the flexible wiring boards or between the rigid wiring boards and the flexible wiring boards. It is connected by an adhesive film.
  • the length of the flexible wiring board of the board piece is longer than the length of the rigid wiring board, and part of the flexible wiring board is the side of the board piece body on which the flexible wiring board and the rigid wiring board are laminated. Sticking out of.
  • the protruding portion is used as a bridge portion, and the substrate pieces are connected by the bridge portion to form a composite wiring board.
  • Board pieces can be assembled into composite wiring boards just before electronic components are mounted, making them easy to handle and store.
  • the flexible wiring board can be bent freely, it is possible to configure a portable computer that can open and close the display freely by using one substrate piece that constitutes the composite wiring board for the display and the other board piece for the keyboard. In monkey.
  • the composite wiring board is bent and the bending is extended with the opening / closing operation of the first and second housings.
  • the portion where is connected is bent and is not arranged in the portion where the bending is returned, so that no stress is applied.
  • FIG. 1 is a cross-sectional view for explaining a state before assembling a substrate piece according to an example of the present invention.
  • FIG. 2 is a cross-sectional view for explaining a substrate piece according to an example of the present invention.
  • FIG. 3 is a cross-sectional view (1) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 4 is a cross-sectional view (2) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 5 is a sectional view (3) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 6 is a cross-sectional view (4) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 7 is a sectional view (5) for explaining a step of assembling the composite wiring board of one example of the present invention.
  • FIG. 8 is a cross-sectional view for explaining a substrate piece according to a second example of the present invention.
  • FIG. 9 is a sectional view of a composite wiring board of a second example using the substrate piece.
  • FIG. 10 is a sectional view of a substrate piece according to a third embodiment of the present invention.
  • FIG. 11 is a sectional view of a composite wiring board of a third example using the substrate piece.
  • FIG. 12a, FIG. 12b, and FIG. 12c are diagrams (1) for explaining a process of connecting a connection portion and a flexible wiring board.
  • FIG. 13a, FIG. 13b, and FIG. 13c are diagrams (2) for explaining a process of connecting the connection portion and the flexible wiring board.
  • FIG. 14a, FIG. 14b, and FIG. 14c are diagrams (3) for explaining a step of connecting the connection portion and the flexible wiring board.
  • FIG. 15a is a plan view of a part of the substrate piece main body and a connection portion
  • FIG. 15b is a plan view of an end portion of a flexible wiring board for connection.
  • FIG. 16 is a sectional view of a composite wiring board according to a fourth example of the present invention.
  • FIG. 17 is a cross-sectional view showing a state before assembling a substrate piece that can be used for the composite wiring board of the present invention.
  • FIG. 18 is a cross-sectional view showing a state where the substrate pieces are assembled.
  • FIG. 19 is a cross-sectional view (1) for explaining a manufacturing process of a composite wiring board assembled using the first and second substrate pieces.
  • FIG. 20 is a cross-sectional view (2) for explaining the manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
  • FIG. 21 is a cross-sectional view (3) for explaining a manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
  • FIG. 22 is a cross-sectional view (4) for explaining the manufacturing process of the composite wiring board assembled using the first and second substrate pieces.
  • FIG. 23 is a cross-sectional view showing another substrate piece that can be used for the composite wiring board of the present invention.
  • FIG. 24 is a sectional view showing a state in which an anisotropic conductive film is arranged on the substrate piece.
  • FIG. 25 is a sectional view showing an example of the composite wiring board of the present invention assembled using the substrate pieces.
  • FIG. 26 is a cross-sectional view (1) for explaining a process of a composite wiring board assembled using the substrate pieces of the modified example.
  • FIG. 27 is a cross-sectional view (2) for explaining a process of a composite wiring board assembled using the substrate pieces of the modified example.
  • FIG. 28 is a cross-sectional view (1) illustrating a step of a composite wiring board assembled using the third and fourth substrate pieces.
  • FIG. 29 is a cross-sectional view (1) for explaining a step of the composite wiring board assembled using the third and fourth substrate pieces.
  • FIG. 30 is a plan view of a part of the bridge part and a connector part.
  • FIG. 31a, FIG. 31b, and FIG. 31c are diagrams for explaining an example of alignment of bridge portions having the same width.
  • FIG. 5 is a diagram for describing an example of alignment between bridge portions.
  • FIGS. 33a, 33b, and 33c are diagrams for explaining an example of alignment of circular bridge portions in which one width is wider than the other. .
  • Fig. 34 is a cross-sectional view of an example of a substrate piece having a ridge portion having a difference in length.
  • FIG. 35 is a cross-sectional view of an example of a composite wiring board using the substrate piece.
  • FIG. 36 is a sectional view showing a closed state of the first example of the switchgear of the present invention.
  • FIG. 37 is a sectional view showing an open state of the first example of the switchgear of the present invention.
  • FIG. 38 is a sectional view showing a closed state of the second example of the switchgear of the present invention.
  • FIG. 39 is a sectional view showing an open state of the second example of the switchgear of the present invention.
  • FIG. 40 is a sectional view showing a closed state of the third example of the switchgear of the present invention.
  • FIG. 41 is a sectional view showing an open state of the third example of the switchgear of the present invention.
  • FIG. 42 is a cross-sectional view of a composite wiring board according to the related art.
  • FIG. 43 is a cross-sectional view of a related-art composite wiring board with electronic components mounted.
  • FIG. 44 is a cross-sectional view for explaining the structure of the composite wiring board of the related art.
  • FIGS. 1 to 16 and FIGS. 38 to 41 show the first invention.
  • reference numeral 8 denotes a flexible wiring board for connection;
  • 0, 4 0 represents a flexible wiring board,
  • reference numeral 2 0 ⁇ 2 0 3, 3 0 ⁇ 3 0 3 indicates Riji' de wiring board,
  • Reference numeral 3 denotes a wiring film of a rigid substrate
  • reference numerals 2 to 4 denote substrate pieces
  • reference numerals 41 and 43 denote a substrate piece main body
  • reference numerals 42, 4 and 4 and 8 denote connection portions.
  • reference numeral 2 2 - 2 2 3 2 ⁇ 3 2 3 represents the wiring film
  • reference numeral 2 4 ⁇ 2 4 3 3 4 ⁇ 3 4 3 shows conductive protrusions
  • reference numeral 4-9 electronic Indicates parts Reference numeral 67 denotes a switchgear type device
  • reference numerals 71 to 74 denote composite wiring boards.
  • Fig. 17 to Fig. 37 show the second invention.
  • reference numerals 2, 2A, 2B, 2'A, 2'B, 3, 4, 6A, 6B represents a board piece
  • reference numeral 1 0, 4 0 indicates Furekishipuru wiring board
  • ⁇ 3 2 3 represents the wiring film
  • reference numeral 1 3 contactor shows the door unit
  • reference numeral 1 7 shows an anisotropic conductive film
  • 5 0, - 5 0 5 indicates Riji' de wiring board
  • reference numeral 2 4 ⁇ 2 4 3 3 4 ⁇ 3 4 3 shows conductive protrusions
  • reference numeral 4 1, 4 3 represents a board piece body
  • numeral 4 2, 4 4, 4 8 pre Tsu di unit
  • Reference numeral 49 indicates an electronic component
  • reference numerals 81 to 85 indicate a composite wiring board
  • reference numeral 60 indicates a switchgear
  • Reference numeral 2 in FIG. 2 shows an example of a substrate piece of the present invention
  • FIG. 1 shows components of the substrate piece 2 before assembly.
  • Board piece 2 has 1 to a plurality of flexible wiring boards 1 0, more re jitter de-wiring board 2 0 ⁇ 2 0 3, 3 0, a ⁇ 3 0 3.
  • the flexible wiring board 10 has a base film 11 made of a resin film, and a wiring film 12 routed on the front and back surfaces of the base film 11.
  • the wiring film 12 is formed by patterning a metal thin film into a predetermined shape.
  • the wiring films 12 located on the front side and the back side are connected by a conductive plug 14 made of a conductive material such as a metal filled in the through hole.
  • Wiring film 2 2 ⁇ 2 2 3, 3 2, ⁇ 3 2 3, the base substrate 2 1 ⁇ 2 1 3 3 0, is disposed on one side of the ⁇ 3 0 3, on a surface opposite to in the state before lamination, a wiring layer 2 2, and 2 2 3, 3 2, ⁇ 3 2 3 connected to the conductive protrusions 2 4 ⁇ 2 4 3 3 4, the tip of ⁇ 3 4 3 It is sticking out.
  • Conductive protrusions 2 4 ⁇ 2 4 3 3 4 it is possible to 3 4 3 which may be formed by curing the conductive resin (conductive resin paste Bok), is grown metal formed.
  • a plurality of lysine, head circuit board 2 0, ⁇ 2 0 3, of SOSO s ', 1 to several sheets double Riji' de wiring board ZO' ZO s is disposed on the front side of the flexible wiring board 1 0, other of 1 to Riji' de wiring board 3 0 of multiple films, ⁇ 3 0 3 is disposed on the back side of the frame Kishipuru wiring board I 0.
  • the flexible wiring board 1 0 Riji' de wiring board 2 0 ⁇ 2 0 2, 3 0, - 3 0 2 is also a long than at least one end, Riji' de wiring board 2 0 which are stacked, 1-2 It protrudes from the sides of 0 2 and 30 1 to 30 2 .
  • Reference numeral 41 in FIG. 2 denotes a substrate piece body composed of a portion where rigid wiring boards 20, 20 , 30, 30, and 32 and a flexible wiring board 10 are overlapped.
  • Reference numeral 42 denotes an end portion of the flexible wiring board 10, which indicates a connection portion protruding from the substrate piece main body 41.
  • the length of the connecting portion 4 2 L is summer shorter than the length L 2 of the board piece body 4 1 (L, ⁇ L 2 ).
  • the surface of the wiring film 12 is covered with a cover film 6 except for a part.
  • the cover film 16 is not provided at the tip portion, and only the tip portion of the wiring film 12 is exposed.
  • FIG. 15a is a partial plan view of the substrate piece 2, showing a part of the substrate piece body 41 and the connection portion 42.
  • a plurality of wiring films 12 are arranged in parallel, and the exposed portion at the tip is widened.
  • Reference numerals 2A and 2B in FIG. 3 denote substrate pieces having the same structure as the above-mentioned substrate piece 2, respectively. Assuming that the piece 2B is, as shown in FIG. 3, first, the surface of the wiring film 12 exposed at the position of the connection portion 42 of the first and second substrate pieces 2A and 2B is anisotropically formed. Place the conductive film 17 on it.
  • Reference numeral 8 in FIG. 4 denotes a connection It is a flexible wiring board.
  • a wiring film 52 is disposed on at least one surface of the base film 51. Except for both ends of the flexible wiring board 8 for connection, a cover film 56 is disposed on the surface of the wiring film 52, and only the both ends of the wiring film 52 are exposed.
  • FIG. 15b is a plan view of the end of the flexible wiring board 8 for connection. The end of the wiring film 52 of the flexible wiring board 8 is exposed on the connection portion 4'2. It is patterned into a shape and position corresponding to the shape and position of 12.
  • the exposed portion of the wiring film 52 is pressed against the anisotropic conductive film 17 on the connection portion 42, and is heated and pressed as shown in FIG.
  • a composite wiring board 71 is obtained.
  • wiring layer 1 2, 2 2 of the first board piece 2 A, ⁇ 2 2 3, 3 2, ⁇ 3 2 3 and the wiring film of the second board piece 2 B 1 2, 2 2, ⁇ 2 2 3 , 3 2, to 3 2 3 are mutually connected via the wiring film 52 of the flexible wiring board 8 for connection.
  • the flexible wiring board 10 of the substrate pieces 2 A and 2 B and the flexible wiring board 8 for connection have flexibility, and the wiring films 1 of the first and second substrate pieces 2 A and 2 B are provided. 2, 2 2, and 2 2 3, 3 2, while maintaining the connection between 1-3 2 3, can be bent off Rekishiburu wiring board 8.
  • the connection portion 42 of the flexible wiring board 10 of the substrate pieces 2 A and 2 B also bends together, and the stress generated at the connection portion between the wiring films 12 and 52 of the flexible wiring boards 10 and 8. Is alleviated.
  • FIGS. 12a to 12c are diagrams for explaining a process of superposing and connecting a tip portion of the connection portion 42 and an end portion of the flexible wiring board 8 for connection. It is a drawing, and members such as the wiring film 52 and the cover films 16 and 56 are omitted.
  • the flexible wiring board 8 for connection and the connection portion 42 are firmly connected by the reinforcing film # 8, even if the flexible wiring board 8 for connection is greatly bent, the flexible wiring board 8 And the connection part 42 are not separated.
  • the width W c of the wide KuNatsu was part of one of the flexible wiring board 8, If the other flexible wiring board 10 is narrower than the width W A , B of the widened portion, as shown in FIG. 14b, the widened leading ends are overlapped, and FIG. As shown in the figure, the reinforcing film 18 wider than the tip of the narrower flexible wiring board 8 and narrower than the tip of the wider flexible wiring board 10 protrudes from the edge of the narrower flexible wiring board 8. Even if it is covered with the reinforcing film 18 so as not to be damaged, the strength is increased.
  • the electronic component 49 is arranged on the first and second substrate pieces 2A and 2B, and the electronic component 49 Riji' de wiring board 2 terminals, the outermost layer of 0 3, 3 0 3 of the wiring film 2 2 3, 3
  • Electronic component 4 9 Connecting to 2 3, first, the mounting tower to the second board piece 2 A, 2 B.
  • the electronic component 4 9, first, second board piece 2 A, 2 wiring film 1 2 B, 2 2 iota-2 23, 3 2, and ⁇ 3 2 3, conductive protrusions 2 4, to 2 4 3 ,
  • each electronic component 49 is also connected to another electronic circuit such as a power supply. Connected.
  • the base films 11 and 51 of the flexible wiring boards 10 and 8 and the cover films 16 and 56 are polyimide films of tens to tens of Atm.
  • the wiring layer 1 2, 5 2, 2 2, and 2 2 2 3, 3 2, ⁇ 3 2 3 is a copper foil having a thickness of ten to several tens of m is configured by being patterned into a predetermined shape, base It bends together with the films 11 and 51 and the cover films 16 and 56 so that the flexibility of the flexible wiring boards 8 and 10 is not impaired.
  • Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0, the base substrate 2 1 ⁇ 3 0 3 ⁇ 2 1 3 3 0 ⁇ 3 0 3 is made of a glass epoxy resin or the like, the thickness It is a thin plate of about 50 to 500 ⁇ m and does not have flexibility. Therefore, once the mounted electronic components 4 9, and summer as stress is not applied between the terminals of the electronic component 4 9 and the wiring film 2 2 3, 3 2.
  • Reference numeral 3 in FIG. 8 denotes a substrate piece of the second example of the present invention, and the substrate piece 2 of the first example is different from the substrate piece 2 of the flexible wiring board 40 in that The only difference is that they are longer.
  • the tip of the cover film 46 is not adhered to the wiring film 12 or the base film 11, and the surface of the wiring film 12 is exposed at that portion.
  • Reference numerals 3A and 3B in FIG. 9 denote two substrate pieces having such a configuration, and anisotropically conductive portions are provided on the exposed portions of the wiring films 12 of the substrate pieces 3A and 3B.
  • the flexible film 17 is disposed, the flexible wiring board 8 for connection is attached, and the peeled portion of the cover film 46 is further attached to the flexible wiring board 8 for connection.
  • a composite wiring board 72 is formed.
  • the peeled portion of the cover film 46 from the base film 11 or the like is used as a reinforcing film.
  • the peeled portion of the cover film 46 is affixed to the base film 51 of the flexible wiring board 8 for connection.
  • the end opposite to the peeled portion may end at the end of the substrate piece main body 41, or may extend to the inside of the substrate piece main body 41.
  • connection part 4 4 and cover film 4 of flexible wiring board 8 for connection On the opposite side, the reinforcing film 18 used in the composite wiring board 71 of the first example can be attached.
  • the length L of the connection portion 4 4 is equal to the substrate piece body 4
  • the length of 1 is shorter than 1_2.
  • the flexible wiring board 1 0, 4 0 of the substrate piece 2, 3 is Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0, and was located between 1-3 0 3 of the laminate
  • the present invention is not limited to this, and the present invention also includes a substrate piece located at the outermost layer.
  • Code 4 of the first 0 Figure is an example of such a board piece, a plurality of Riji' de wiring board 2 0 on one side of Furekishibu Le wiring board 1 0 ⁇ 2 0 6 are laminated, flexible wiring plate 1 0 and Riji' de wiring board 2 0 ⁇ 2 0 6 board piece body 4 5 is composed of stacked portions, connected by a portion of the flexible wiring board 1 0 protruding from board piece body 4 5
  • the part 48 is composed.
  • Reference numerals 4A and 4B in FIG. 11 denote board pieces having the above-described configuration, and are connected to each other by a flexible wiring board 8 for connection. It is configured.
  • the composite wiring boards 71 to 73 of the first to third examples can be appropriately selected according to the shape of the space of the electronic device to be used. Also, each substrate piece 4 ⁇ ! ⁇ 4 3 can be freely combined. For example, the substrate piece 2 of the first example and the substrate piece 4 of the third example may be connected by a flexible wiring board 8.
  • the fourth composite wiring board 74 of the present invention may be configured by connecting a component represented by 17 A.
  • the length of the flexible wiring board 8 for connection is Is longer than the connecting portions 42, 44, 48, but conversely, the shorter case is also included in the present invention. Further, the lengths of the connecting portions 42, 44, 48 may be longer than the substrate pieces 41, 43.
  • the electronic components 49 may be mounted after assembling the substrate pieces 2 to 4 and the flexible wiring board 8 for connection into composite wiring boards 71 to 73, or mounting the electronic components on the substrate element. After being mounted on the pieces 2 to 4, the flexible wiring board 8 for connection may be connected to form the composite wiring boards 71 to 73.
  • the flexible wiring board 8 used for the connection and the flexible wiring boards 10 and 40 constituting the connecting portions 42, 44 and 48 have a single layer, but a plurality of flexible wiring boards are laminated. You may comprise.
  • the composite wiring boards 71 to 73 of the present invention can be provided in an opening / closing device that opens and closes a lid of a mobile phone, a notebook personal computer, or the like.
  • a part of the composite wiring board 71 to 73 is bent with opening and closing, but the wiring film 52 of the flexible wiring board 8 for connection and the first and second substrate pieces 2 A If the portion of the 2B flexible wiring board 10 electrically connected to the wiring film 12 is not positioned at the bent portion, the reliability of the entire device is improved.
  • FIGS. 38 and 39 show a switchgear 66 incorporating the composite wiring board 71 of the present invention shown in FIG.
  • the opening / closing device 66 is a mobile phone.
  • the opening / closing device 66 includes a first housing 61 serving as a lid on the display device side, and a second housing 62 closely contacting the first housing 61 on the operation panel side. Have.
  • the shaft 63 has a diameter approximately equal to the thickness of the first and second housings 61 and 62, and penetrates a part of the first and second housings 61 and 62. I have.
  • the first and second housings 61 and 62 are mounted so as to be relatively rotatable about a central axis of the shaft 63 by a predetermined angle.
  • First and second housings 6 1 and 6 2 When rotated by a large angle, the lid is opened as shown in Fig. 37.
  • the composite wiring board 7 1 inside the switchgear type device 6 6 has one of the board pieces 2 A and 2 B located at both ends, and one of the board pieces 2 A is arranged inside the first housing 61.
  • the other substrate piece 2B is arranged inside the second housing 62.
  • the flexible wiring board 8 for connection passes through the inside of the shaft 63, and both ends thereof are located in the first and second housings 61 and 62.
  • the portion where the flexible wiring board 8 for connection and the connection portion 42 of the substrate pieces 2A and 2B are connected is not located within the shaft 63 and the first or second housing Located in 61,62.
  • one of the two interconnected portions 6 5 6 5 2 is disposed on the first housing 6 1 and the other was located in the second housing 6 within 2 but interconnect portion 6 5 ,, 6 5 2 is not disposed in the shaft 6 3, it is sufficient that bent such odd.
  • FIG. 2 shows an example in which the first housing 61 is disposed.
  • the composite wiring boards 72 and 73 shown in FIGS. 9 and 11 also have a flexible wiring board 8 for connection and two board pieces (reference numerals) when placed in the switchgear 66. 3A and 3B, 4A and 4B), the interconnecting part between them is not arranged in the shaft 63 and the first or second housing 61, 62 It may be located inside one or both, and no stress is applied to the interconnect.
  • the shaft 63 may be a member that rotatably connects at least a part of the first and second housings 61 and 62, and does not necessarily mean one rotating shaft. For example, it may be divided into a plurality in the length direction, or a slit or the like may be formed in the circumferential direction.
  • the composite wiring board of the second invention and a substrate element as a component thereof will be described with reference to FIGS. 17 to 42 using a surface.
  • Reference numeral 2 in FIG. 18 shows an example of a substrate piece that can be used in the composite wiring board of the present invention, and FIG. 17 shows a state before assembly of the substrate piece 2. .
  • Board piece 2 has 1 to a plurality of flexible wiring boards 1 0, more re jitter de-wiring board 2 0, a ⁇ 2 0 3, 3 0 ⁇ 3 0 3.
  • the flexible wiring board 10 is a base film 1 made of a resin film.
  • the wiring film 12 is formed by patterning a metal thin film into a predetermined shape.
  • the wiring films 12 located on the front side and the rear side are connected by a conductive plug 14 made of metal or the like filled in the through hole.
  • Wiring film 2 2 ⁇ 2 2 3, 3 2, ⁇ 3 2 3, the base substrate 2 1 ⁇ 2 1 3 3 0, is disposed on one side of the ⁇ 3 0 3.
  • These wiring film 2 2 ⁇ 2 2 3 3 2 1-3 2 3 conductive protrusions 2 4 1-2 4 3, the 3 4, - 3 4 3 is connected.
  • the flexible wiring board 1 0 and Riji' de wiring board 2 0 ⁇ 2 0 2, 3 0, - 3 0 2 of the wiring layer 1 2, 2 2, and 2 2 3, 3 2, ⁇ 3 2 3, based respectively substrate 2 1 ⁇ 2 1 3 3 0 ⁇ 3 0 3 Yabe on one Sufuirumu 1 1 is divided into a plurality of spaced from each other, with each other electrically conductive collision force predetermined ones of them 2 4 ⁇ 2 4 3 3 4 - 3 together against the 4 3 or the conductive plug 1 4 Has been continued.
  • Riji' flexible wiring board 1 0 Riji' de wiring board 2 0 ⁇ 2 0 2, 3 0, an elongated than ⁇ 3 0 2, at least one end of the flexible wiring board 1 0 stacked de-wiring board 2 0 ⁇ 2 0 2, 3 0, and protrudes from 1-3 0 2 sides.
  • Code 4 1 of the first 8 diagram Riji' de wiring board 2 0 ⁇ 2 0 2, and SOSO s and the flexible wiring board 1 0 indicates a board piece Body made of superposed summed portion.
  • Reference numeral 42 denotes an end portion of the flexible wiring board 10, which indicates a bridge portion which is a portion protruding from the substrate piece main body 41.
  • the surface of the wiring film 12 is covered with a cover film 16 except for a part.
  • the cover film 16 is not provided at the front end portion, and only the front end portion or a portion close to the front end of the wiring film 12 is exposed to form the contact portion 13.
  • FIG. 30 is a partial plan view of the substrate piece 2, showing a part of the substrate piece main body 41 and the bridge portion 42. A plurality of wiring films 12 are arranged in parallel with each other, and the exposed portion at the tip is widened.
  • Reference numerals 2A and 2B in FIG. 19 denote board pieces having the same structure as the above-described board piece 2, respectively. The left side of the drawing is the first board piece 2A, and the right side is the second board.
  • an anisotropic conductive film 17 is placed on the surface of the contact portion 13 of one or both of the base plate pieces 2A and 2B.
  • the anisotropic conductive film 17 is placed on the surface of the contact portion 13 of the first substrate piece 2A, but is placed on the contact portion 13 of the second substrate piece 2B. Also, the contact part of both substrate pieces 2A and 2B You may put on the surface of 13.
  • the edge portions 42 of the first and second substrate pieces 2A and 2B are aligned with each other, and the surface of the contact portion 13 of the second substrate piece 2B is made different.
  • the conductive film 17 is brought into close contact with the surface.
  • FIGS. 31a to 31c are drawings for explaining the alignment process, and members such as the wiring film ⁇ 2, the cover film 16 and the anisotropic conductive film 17 are omitted. is there.
  • Reference numeral 47 in this figure and other figures described later indicates a portion of the bridge portion 42 overlapped by alignment.
  • the contact portions 13 of the first and second substrate pieces 2 A and 2 B are heated and pressed together in a state of being in close contact, and the wiring films 12 constituting the contact portions 13 are anisotropically conductive.
  • a composite wiring board 81 is obtained as shown in FIG.
  • the wiring films 1 2,? ? , ⁇ ⁇ Yo? , ⁇ Yo? 3 and the wiring films 12, 2 2 1-2 2 3, 3 2, to 3 2 3 of the second substrate piece 2 B are electrically connected to each other.
  • the flexible wiring board 10 of the first and second substrate pieces 2 A and 2 B has flexibility or flexibility, and the first and second substrate pieces 2 A and 2 B
  • the flexible wiring board 10 of the first and second substrate pieces 2A, 2B can be bent while maintaining the electrical connection between the contact portions 13 of the flexible wiring board 10 of FIG.
  • the reinforcing film 18 is attached over the bridge portion 42 of the substrate pieces 2A and 2B.
  • the flexible wiring boards 10 constituting the bridge portions 42 of the first and second substrate pieces 2A, 2B are mechanically connected to each other.
  • the reinforcing film 18 is attached so that the tip of the flexible wiring board 10 is not exposed, the reinforcing film 18 may be attached to only one of the surfaces. Alternatively, a single reinforcing film 18 may be wound around the overlapping portion 47 to mechanically connect both the front side and the back side.
  • the width W A of the bridge portion 42 of the portion where the contact portion 13 of the first substrate piece 2A is located is equal to the width of the second substrate piece 2A. If the width of the bridge portion 42 of the segment 2B where the contact portion 13 is located is wider than the width WB (W A > WB, or vice versa, W A ⁇ WB may be used). As shown in Fig. 32b, the narrow part is positioned so that it is located inside the wide part, and the two parts are overlapped with each other. ⁇ Connect 3 electrically.
  • a reinforcing film 18 may be attached so as to cover the three sides at the front end of the narrower contact portion 42. Further, a reinforcing film 18 can be attached to the back side. Also, as shown in FIG. 33a, of the bridge portion 42, the tip portion where the contact portion 13 is located is wider than the root portion, and the widths W A and WB of the tip portion are smaller. If one is wider than the other, as shown in Fig. 33b, the narrower is positioned so that it is located inside the wider and then overlapped, and similarly electrically connected.
  • the electronic component 49 is placed on one or both of the first and second substrate pieces 2A and 2B. Can be mounted.
  • the electronic component 4 9 Since the electronic component 4 9 is connected to the terminals on the wiring layer 2 2 3, 3 2 3 of the outermost layer of Riji' de wiring board 2 0 3, 3 0 3, the electronic component 4 9, first, second board piece 2 a, 2 wiring film 1 2, 2 2 B ⁇ 2 2 3, 3 2, ⁇ 3 2 3 or a conductive protrusions 2 4 ⁇ 2 4 3 3 4 ⁇ 3 4 3 etc. Accordingly, the electronic components 49 are connected to each other, and are connected to another circuit such as a power supply.
  • the base film 11 and the cover film 16 of the flexible wiring board 10 are formed by cutting a polyimide film of tens to several tens of meters into a predetermined shape.
  • the wiring films 12, 22, to 22 3 , 32, to 32 3 are formed by patterning copper foil having a thickness of tens to several tens ⁇ m into a predetermined shape.
  • the copper foil forming the wiring films 1 2, 2 2, to 2 2 3 , 3 2, to 3 2 3 is thin, it bends together when the base film 11 and the cover film 16 bend, so a flexible wiring board The flexibility of 10 is not compromised.
  • Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0, the base substrate 2 1 ⁇ 3 0 3 ⁇ 2 1 3 3 0 ⁇ 3 0 3 is made of a glass epoxy resin or the like, Thick It is formed into a thin plate of about 50 to 500 Atm. Therefore, Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0 ⁇ 3 0 3 has no flexible and bendable. Me other, is not applied stress between equipped with a terminal of the electronic component 4 9 and the wiring film 2 2 3, 3 2 3.
  • the first portion is reduced to reduce the stress applied to the contact portion 13 of the first and second substrate pieces 2A, 2B.
  • the length of the ridge portion 42 of the second substrate pieces 2A and 2B can be made longer than the minus side, so that the contact portion 13 is not positioned at the bent portion.
  • Reference numerals 2'A and 2'B in FIG. 34 denote the first and second substrate elements except that they have a short bridge portion 42A and a long bridge portion 42B.
  • the contact pieces 13 of the two kinds of board pieces 2 A and 2 B are connected to each other to form a composite wiring board 85 as shown in FIG. 35. can get.
  • the central portion of the connected bridge portion 42 is usually bent.
  • the total length of the two bridge parts in the connected state is P
  • the length of the overlapping part of the two bridge parts is Q
  • the length of the short bridge section 42A is less than (P / 2-Q)
  • the length of the long bridge section 42B is (PZ2 + Q) or longer (the difference between the length of the short bridge 42 A and the length of the long bridge 2 B is 2 ⁇ Q or more).
  • the composite wiring board of the present invention 8! -85 When connecting to a portable device such as a mobile phone or notebook computer that can be opened and closed, If not, the reliability of the whole equipment will be improved.
  • FIGS. 36 and 37 show a switchgear type device 6 incorporating the composite wiring board 85 of the present invention.
  • the opening / closing device 60 is a mobile phone.
  • the opening / closing device 60 includes a first housing 61 serving as a lid on the display device side, and a second housing 62 closely contacting the first housing 61 on the operation panel side. Have.
  • the shaft 63 has a diameter approximately equal to the thickness of the first and second housings 61 and 62, and penetrates a part of the first and second housings 61 and 62. I have.
  • the first and second housings 61 and 62 are mounted so as to be relatively rotatable about a central axis of the shaft 63 by a predetermined angle. When the first and second casings 62 and 62 are rotated by the maximum angle, the lid is opened as shown in FIG.
  • a composite wiring board 85 shown in FIG. 35 is arranged inside the switchgear 60.
  • the composite wiring board 85 inside the opening / closing device 60 is configured such that one of the first and second substrate pieces 2 ′ ′ and 2 ′ ′ is disposed inside the first housing 61, The other is arranged inside the second housing 62.
  • a long bridge portion 42 ⁇ passes through the inside of the shaft 63, and inside one housing (here, the first housing 61), a short bridge portion 422 ⁇ . Is connected to. Therefore, when the first and second housings 61 and 62 are opened and closed, the portion of the bridge portion 42B located inside the shaft 63 is bent.
  • connection portion 65 in FIGS. 36 and 37 indicate a connection portion between the bridge portions 42A and 42B.
  • the connection portion is not located inside the shaft 63, and the connection portion 65 is bent. Not to be. Therefore, no stress is applied to the connection portions 65, and the contact portions 13 do not separate from each other.
  • the connecting portion 53 is not located inside the shaft 63, the lengths of the bridge portions 42A and 24B are not limited.
  • the connection portion where the contact portions 13 are connected to each other is not arranged in the shaft 63, but is arranged in the first or second housing 61, 62, so that no stress is applied. .
  • the shaft 63 may be a member that rotatably connects at least a part of the first and second housings 61 and 62, and does not necessarily mean one rotating shaft. For example, it may be divided into a plurality in the length direction, or a slit or the like may be formed in the circumferential direction.
  • Reference numeral 3 in FIG. 23 indicates a modification of the substrate piece that can be used in the composite wiring board of the present invention.
  • the flexible wiring board 40 of the substrate piece 3 of this modification is the flexible wiring board 40 described above. As in the case of the simple wiring board 10, it protrudes outward from the side surface of the substrate piece main body 41, and the portion constitutes a bridge portion 44.
  • the cover film 46 of the flexible wiring board 40 has the same length as or longer than the base film 11, and the leading end extends to the contact portion 13.
  • the tip portion is not bonded to the wiring film 12 or the base film 11, and therefore, the surface of the wiring film 12 at the tip portion is exposed, and the contact portion 13 is formed at that portion. Have been.
  • Other configurations are the same as the configurations of the first and second substrate pieces 2A and 2B.
  • the anisotropic conductive film 1 is placed on the contact portion 13 of the substrate piece 3. Then, the contact portion of the first or second substrate piece 2 is pressed onto the anisotropic conductive film 17 to electrically connect the flexible wiring boards 40 and 10 to each other.
  • the substrate element 3 of the modified example is attached to the base film 11 side of the flexible wiring board 10 of the first or second substrate element 2.
  • the tip of the cover film 46 is attached, the tip of the first or second substrate piece 2 is sandwiched between the cover film 46 of the modified substrate piece 3 and the base film 11. State.
  • the cover film 46 functions as a reinforcing film, and the flexible wiring boards 40 and 10 are mechanically connected to each other by the cover film 46, so that a strong composite wiring board 82 is obtained.
  • Another reinforcing film 18 may be attached to the back surface of the cover film 46.
  • the end of the cover film 46 of the modified example of the substrate piece 3 opposite to the contact portion 13 ends at the edge of the substrate piece body 41, and the entire cover film 46 is formed on the substrate. It may be located outside the element body 41, or the end of the cover film 46 opposite to the contact part 13 extends to the inside of the substrate element body 41, and the rigid wiring board 2 0, may be adhered.
  • Each board piece 2 A, 2 B, 3 A flexible wiring board 1 0, 4 0, Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0 ⁇ 3 0 3 of the laminate 2 0, 3 Although it was located between 0, the present invention is not limited to the composite wiring boards 81 and 82 constituted by such substrate pieces.
  • Code 6 A, 6 B of the second 6 diagram is an example of such a board pieces, deflection Kishiburu wiring board 1 0, Riji' de wiring board 2 0 ⁇ 2 0 6 laminate 2 0 'of the Affixed to the surface of the outermost layer.
  • an anisotropic conductive film 17 is arranged on the contact part 13 of one substrate piece 6A, and the contact part of the other substrate piece 6B 1 3 is pressed against the surface of the anisotropic conductive film 17 to electrically connect the wiring films 12 of the flexible wiring boards 10 of both substrate pieces 6 A and 6 B to each other. Subsequently, when the reinforcing films 18 are attached to both surfaces of the front end of the flexible wiring board 10, the composite substrate 83 of the present invention is obtained as shown in FIG.
  • the bridge section is provided so that the connection portions of the board pieces 6A and 6B are not located at the bent portions.
  • One of 48 can be short and the other long.
  • the length of the bridge section 48 on the short side is less than (P / 2-Q), and the longer side is longer than (P / 2 + Q). Good.
  • the combination of the above substrate pieces 2A, 2B, 3, 6A, and 6B is an example, and the composite wiring board of the present invention can be configured by freely combining them.
  • the composite wiring boards 81 to 83 were configured using the respective substrate pieces 2A, 2B, 3, 6A, and 6B having the flexible wiring boards 10 and 40.
  • Substrate pieces 2A, 2B, 3, 6A, and 6B are used as third substrate pieces, and a fourth base piece made of a laminate of rigid wiring boards without a flexible wiring board is used.
  • the composite wiring board of the present invention can be composed of the third substrate element and the fourth substrate element.
  • Code 4 of the second 8 diagram shows the fourth board piece constituted by the Riji' de-wiring board 2 0 - 2 0 5 and Riji' de wiring board 5 0 having the same structure, the ⁇ 5 0 5 laminated Reference numeral 6A indicates a third substrate piece.
  • the surface of the metal wiring film is exposed, and a part of the surface of the metal wiring film or the contact portion 13 of the third substrate element 6 A is formed.
  • the anisotropic conductive film 17 is arranged, and as shown in FIG. 29, the contact portion 13 of the third substrate piece 6A is placed between the anisotropic conductive film 17 and the When a metal wiring film on the surface of the fourth substrate piece 4 is electrically connected by heating and pressing, a composite wiring board 84 according to a modified example of the present invention is obtained.
  • the cover film 46 of the flexible wiring board 40 is combined with the fourth substrate piece 4. It can be extended to the top, and a cover film 46 can be affixed to the surface of the fourth substrate piece 4 to replace the reinforcing film.
  • the electronic components 49 mounted on the substrate element bodies 41 and 43 are assembled by assembling the substrate elements 2A, 2B, 3, 6A, 6B and 4 into a composite wiring board 8 "!
  • the electronic parts 49 may be mounted later, or mounted on the substrate pieces 2A, 2B, 3, 6A, 6B, 4 and then assembled to form the composite wiring boards 81 to 84. You may.
  • the flexible wiring boards 10 and 40 of the substrate pieces 28, 2B, 3, 6A, and 6B are single layers, a plurality of flexible wiring boards are stacked to form a bridge section 4. 2, 4, 4, and 48 may be configured.
  • the composite wiring board can be assembled from the substrate pieces when necessary, so that the workability is good.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne des tableaux de connexion rigides monocouche ou laminés (20, 30) et un tableau de connexion flexible (10) empilés de sorte qu'une partie de connexion (42) constituant une bordure du tableau de connexion flexible (10) soit en projection vers l'extérieur, depuis le côté de la pile. Cette pile et une autre pile de structure identique tiennent lieu de premier et second éléments de tableau (2A, 2B), respectivement. Les parties de connexion (42) des premier et second éléments de tableau (2A, 2B) sont interconnectées, constituant un tableau de connexion composite. Jusqu'à l'interconnexion, les premier et second éléments de tableau (2A, 2B) sont manipulés séparément, donnant une ouvrabilité élevée.
PCT/JP2004/000024 2003-01-09 2004-01-07 Element de tableau, tableau de connexions composite utilisant cet element, et dispositif a ouverture/fermeture WO2004064468A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003003439 2003-01-09
JP2003-003439 2003-01-09
JP2003-115489 2003-04-21
JP2003115489A JP2004266238A (ja) 2003-01-09 2003-04-21 複合配線板、基板素片

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Publication Number Publication Date
WO2004064468A1 true WO2004064468A1 (fr) 2004-07-29

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JP (1) JP2004266238A (fr)
TW (1) TWI249764B (fr)
WO (1) WO2004064468A1 (fr)

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US8354596B2 (en) 2008-05-19 2013-01-15 Ibiden Co., Ltd. Multilayer wiring board and method for manufacturing the same
CN105578752A (zh) * 2016-02-25 2016-05-11 广东欧珀移动通信有限公司 软硬结合板及移动终端
CN111508903A (zh) * 2019-01-30 2020-08-07 相互股份有限公司 电子装置的封装基板结构及其制造方法

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JP2007173477A (ja) * 2005-12-21 2007-07-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP5095117B2 (ja) * 2006-04-12 2012-12-12 日本メクトロン株式会社 ケーブル部を有する多層回路基板およびその製造方法
WO2008001462A1 (fr) * 2006-06-30 2008-01-03 Fujitsu Limited structure de montage pour carte à circuit imprimé
JP4834157B2 (ja) * 2007-07-13 2011-12-14 イビデン株式会社 配線基板及びその製造方法
CN104684281B (zh) * 2013-11-29 2018-02-23 深南电路有限公司 电路板系统的制作方法及电路板系统
TWI620481B (zh) * 2015-02-05 2018-04-01 Nippon Mektron Kk Method for manufacturing flexible printed circuit board and intermediate product for manufacturing flexible printed circuit board
JP6330956B2 (ja) * 2017-07-11 2018-05-30 株式会社村田製作所 樹脂多層基板構造体

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US8354596B2 (en) 2008-05-19 2013-01-15 Ibiden Co., Ltd. Multilayer wiring board and method for manufacturing the same
US8536457B2 (en) 2008-05-19 2013-09-17 Ibiden Co., Ltd. Multilayer wiring board and method for manufacturing the same
CN105578752A (zh) * 2016-02-25 2016-05-11 广东欧珀移动通信有限公司 软硬结合板及移动终端
CN111508903A (zh) * 2019-01-30 2020-08-07 相互股份有限公司 电子装置的封装基板结构及其制造方法

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