WO2004049055A1 - 分極反転構造の形成方法および分極反転構造を有する光学素子 - Google Patents
分極反転構造の形成方法および分極反転構造を有する光学素子 Download PDFInfo
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- WO2004049055A1 WO2004049055A1 PCT/JP2003/014952 JP0314952W WO2004049055A1 WO 2004049055 A1 WO2004049055 A1 WO 2004049055A1 JP 0314952 W JP0314952 W JP 0314952W WO 2004049055 A1 WO2004049055 A1 WO 2004049055A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/355—Non-linear optics characterised by the materials used
- G02F1/3558—Poled materials, e.g. with periodic poling; Fabrication of domain inverted structures, e.g. for quasi-phase-matching [QPM]
Definitions
- the present invention relates to a method for forming a domain-inverted structure using electric field application, and an optical element having a domain-inverted structure and applicable to an optical wavelength conversion element, a polarization element, an optical switch, a phase modulator, and the like.
- a domain inversion structure in which domain inversion regions are periodically arranged inside the ferroelectric can be formed.
- the domain-inverted structure formed in this way is an optical frequency modulator using surface elastic waves, an optical wavelength conversion element using non-linear polarization inversion, and light using a prism-shaped or lens-shaped inverted structure. Used for polarizers.
- an optical wavelength conversion device with extremely high conversion efficiency can be manufactured. If this is used to convert the wavelength of light from a semiconductor laser or the like, a small, short-wavelength light source that can be applied to printing, optical information processing, optical measurement and control fields, etc. can be obtained.
- a ferroelectric has a charge bias in a crystal due to spontaneous polarization.
- the direction of spontaneous polarization can be changed by applying an electric field opposing spontaneous polarization.
- the direction of spontaneous polarization depends on the type of crystal (material). L i T a 0 3 , L i N b ⁇ 3 , or a mixed crystal of L i T a u — x ) N b x 0 3 (0 ⁇ x ⁇ 1) Due to spontaneous polarization, in these crystals the polarization is in the + direction along the C axis and vice versa There are only two ways in one direction. When an electric field is applied, the polarization of these crystals is rotated by 180 degrees, and the direction is reversed. This phenomenon is called polarization reversal.
- L i Nb_ ⁇ 3 L i T A_ ⁇ 3 such crystals, about 20 k V / mm at room temperature, MgO: about by L i Nb0 3 Take a value of 5 kV / mm.
- Single domain polarization Making a ferroelectric crystal with a single polarization direction is called "single domain polarization".
- single domain polarization a method of applying an electric field at high temperature after crystal growth is generally performed.
- the 1 9 7 1 9 discloses a comb electrode formed on the L i Nb0 3 (lithium niobate) substrate, pulses thereto It describes a method of applying a field-like electric field.
- the comb-shaped electrode is formed on the + C surface of the L i Nb_ ⁇ 3 substrate to form a flat electrode to a C-plane.
- the + C plane is grounded, a pulse voltage with a pulse width of 100 s is applied to the plane electrode on the 1C plane, and polarization inversion is caused by the pulse electric field applied to the substrate.
- the electric field required to reverse the polarization is about 20 kVZmm or more.
- the substrate When an electric field of such a value is applied, if the substrate is thick, the crystal of the substrate may be destroyed by the applied electric field.
- the thickness of the substrate by setting the thickness of the substrate to about 200 m, it is possible to avoid crystal breakage due to the application of an electric field, and to form a domain-inverted region at room temperature. Thereby, a deep domain inversion region penetrating the substrate is obtained.
- a short-period polarization reversal structure in the range of 3 to 4 m is required.
- the conventional method uses a pulse width of about 100 s and applies a short pulse voltage to the electrodes to form a short-period domain-inverted structure. Is possible.
- MgLN L i Nb_ ⁇ 3 substrate
- JP-A-6 _ 24247 8 JP-periodic polarization to MgLN of Z plate A method for forming an inverted structure is shown. According to this, a comb-shaped electrode is formed on the + Z surface of Mg LN, and a corona is irradiated from the back surface, thereby obtaining a domain-inverted structure having a period of 4 / m and penetrating a substrate with a thickness of 0.5 mm.
- JP-A-9-128431 a method of forming a domain-inverted structure in off-cut MgLN is described in JP-A-9-128431.
- An electrode is formed on an off-cut MgLN substrate whose polarization direction is slightly inclined from the substrate surface, and a voltage is applied to this electrode to form a needle-like polarization inversion structure.
- the domain-inverted region grows in the crystal polarization direction, and a domain-inverted structure with a period of about 5 zm is formed.
- the Mg de one-flop L i T a (1 _ x ) Nb x 0 3 (0 ⁇ x ⁇ 1) substrate Z plate it is difficult to form a fine domain-inverted structure.
- the formation of the domain-inverted structure on the off-cut substrate was possible by applying an electric field.
- a complicated method such as corona poling has been known as a method for forming a uniform fine inverted structure on a Z-plate substrate.
- Corona poling is a method in which charged particles are deposited on a substrate to generate an electric field, thereby inverting the polarization.
- the thickness of the substrate on which the domain-inverted structure can be formed is limited to about 0.5 mm. Formation was difficult.
- the method of applying a voltage using electrodes is effective for forming a domain-inverted structure on an off-cut substrate, but it has been difficult to form a domain-inverted structure widely and uniformly on a Z-plate by this method.
- a comb-shaped electrode is It is disclosed that a periodic domain-inverted structure can be formed by applying a voltage to the Mg LN. This method has the feature that a periodically poled structure can be formed uniformly.
- the polarization reversal formed is limited to a part of the electrode tip, and there is a problem that it is difficult to form a polarization reversal structure deeply and uniformly over a wide range under the electrode. Disclosure of the invention
- An object of the present invention is to provide a method for forming a deep and uniform domain-inverted structure with a short period and a wide width on a ferroelectric substrate.
- a ferroelectric substrate having a main surface substantially perpendicular to the Z axis of the crystal is used, and a plurality of electrodes periodically arranged on the main surface of the ferroelectric substrate.
- a first electrode having a pattern on which a finger is formed; a counter electrode facing the first electrode on another surface of the ferroelectric substrate; a ferroelectric substance interposed between the first electrode and the counter electrode; An electric field is applied to the substrate to form a polarization inversion region corresponding to the pattern of the first electrode on the ferroelectric substrate.
- the method of the present invention is characterized in that the electrode fingers are arranged such that a direction from a base of the electrode finger of the first electrode to a tip thereof is along a Y-axis direction of the crystal of the ferroelectric substrate.
- the optical element of the present invention includes: a ferroelectric substrate having a plane substantially perpendicular to the Z axis of the crystal; and a plurality of domain-inverted regions periodically formed on the ferroelectric substrate. Each has an axially symmetric plane shape, and is arranged so that the symmetry axes are parallel to each other.
- a feature of the optical element of the present invention is that the domain-inverted region is formed such that the direction of the symmetry axis is along the Y ′ axis of the crystal of the ferroelectric substrate, and the domain-inverted region is one-way from the + Z plane.
- FIG. 1A is a plan view showing an electrode structure used for a method of forming a domain-inverted structure in Embodiment 1 of the present invention
- FIG. 1B is a cross-sectional view
- FIG. 2A is a plan view showing a state of a domain-inverted region formed by the method of forming the domain-inverted structure
- FIG. 2B is a side view
- Fig. 3A is a perspective view for explaining the superiority of an electrode with a fine tip
- Fig. 3B is a cross-sectional view
- Fig. 3C changes the characteristics of the ferroelectric substrate as the domain-inverted region expands. A graph showing the situation
- 4A and 4B are a plan view and a sectional view, respectively, showing a method for enlarging a domain-inverted region
- FIGS. 5A and 5B are similarly a plan view and a sectional view showing a method for enlarging the domain-inverted region
- FIG. 6 is a characteristic factor diagram showing the relationship between the length r of the domain-inverted region manufactured by the method of forming the domain-inverted structure and the crystal orientation of the substrate.
- FIG. 7A is a plan view showing another electrode structure
- FIG. 7B is a sectional view
- FIG. 8A is a plan view showing a method of forming a domain-inverted structure of the present invention
- FIG. 8B is a cross-sectional view
- FIG. 9A is a plan view showing a method of forming a domain-inverted structure of the present invention
- FIG. 9B is a cross-sectional view
- Fig. 1 OA shows the temperature curve of the anneal process for explaining the characteristic factors indicating the stability of the domain-inverted region.
- Fig. 10 B shows the relationship between the heating rate and the decay rate of the domain-inverted region.
- FIG. 11A is a plan view showing a method of forming a domain-inverted structure according to the third embodiment.
- Figure 1 1B is a sectional view,
- FIG. 12 is a cross-sectional view showing a state where a polarization inversion region is formed in a first electrode and a second electrode in the same embodiment.
- FIG. 13 is a diagram showing a relationship between the distance L between the first electrode and the second electrode and the length Lr of the domain-inverted region in the embodiment.
- FIG. 14 is a diagram showing the relationship between the temperature of the insulating solution and the length r of the domain-inverted region in the embodiment.
- FIG. 15 is a diagram showing the relationship between the substrate thickness and the polarization inversion period in the same embodiment
- FIG. 16A is a plan view showing a method of forming a domain-inverted structure in Embodiment 4,
- FIG. 16B is a cross-sectional view,
- FIG. 17 is a diagram showing the relationship between the pulse width of the applied voltage and the length Lr of the domain-inverted region in the third and fourth embodiments.
- FIG. 18 is a perspective view showing an optical element according to the sixth embodiment.
- FIG. 19A is a plan view showing an optical deflector which is an example of the optical element
- FIG. 19B is a sectional view.
- the direction of the electrode finger of the first electrode for applying an electric field to the ferroelectric substrate is set such that the direction from the base to the tip is the Y axis of the crystal of the ferroelectric substrate.
- a fine domain-inverted region can be formed. This effect is based on the fact that the spread of domain inversion in the Y-axis direction is several times larger and more uniform than in the X-axis.
- a voltage is concentrated on each tip of a plurality of electrode fingers arranged periodically, when domain inversion is caused on the substrate of the Z plate by such an electrode, a domain inversion region is efficiently formed.
- the ratio of the area of the domain-inverted region penetrating from the front surface to the rear surface of the ferroelectric substrate is 50% with respect to the entire area of the domain-inverted region.
- An electric field is applied to the ferroelectric substrate as described below.
- a fine domain-inverted structure can be formed uniformly.
- a domain-inverted region was partially formed in a ferroelectric substrate where the crystal Z-axis was almost perpendicular to the substrate plane, and when that portion penetrated the substrate and short-circuited between the electrodes, the spread of the domain-inverted region penetrated Concentration in the inversion region prevents the formation of uniform polarization inversion. Therefore, suppressing the area of such a domain-inverted region that penetrates is effective to ensure the uniformity of the domain-inverted structure.
- the thickness of the ferroelectric substrate is preferably 1 mm or more.
- the above method is particularly suitable when the ferroelectric substrate is M g doping L i T a (1 _ x ) N b x ⁇ 3 (0 ⁇ x ⁇ 1).
- the first electrode may be a comb-shaped electrode, and the electrode fingers may have a stripe shape.
- the electrode finger of the first electrode may be triangular, and the tip of the electrode finger may be formed by the apex of the triangle.
- the electrode fingers have a shape symmetrical with respect to an axis in a direction from the base to the tip, and the electrode fingers are arranged such that the axis of symmetry is along the Y-axis direction of the crystal of the ferroelectric substrate. May be.
- the width of the tip of the electrode finger is 5 m or less.
- the step of applying an electric field to the ferroelectric substrate includes a step of applying a pulse voltage having an electric field intensity of E1, and a step of applying a DC voltage having an electric field intensity of E2.
- the pulse waveform of the applied voltage can be controlled so that a uniform inversion region is formed as widely as possible along the electrode under the designed electrode.
- domain inversion is caused on the Z-plate substrate using an electrode having a tip, a voltage is concentrated on the tip of the electrode, and a domain-inverted region in this portion is efficiently formed.
- it is effective to use both a pulse voltage and a DC voltage as an applied electric field. That is, a domain-inverted nucleus can be formed by a pulse voltage, and a domain-inverted region can be expanded around a domain-inverted nucleus by a DC voltage.
- the electric field E1 is larger than 6 kV / mm, and the electric field E2 is smaller than 5 kV / mm. Further, it is preferable that the pulse voltage is composed of two or more pulse trains.
- the ferroelectric substrate is subjected to a heat treatment at 20 Ot: or more, and during the heat treatment, The generation of pyroelectric charges on the body substrate is suppressed. Thereby, the stability of the domain-inverted region formed by applying an electric field is improved, and scattering due to domain-inverted is reduced.
- the front and back surfaces of the ferroelectric substrate are electrically short-circuited during the heat treatment. Further, it is preferable that the rate of temperature increase in the heat treatment is 1 ° C. or less.
- the method for forming a domain-inverted structure of the present invention is suitable when the domain-inverted electric field of the ferroelectric substrate is 5 kV / mm or less. Further, the crystal of the ferroelectric substrate can have a substantially stoichiometric composition.
- a second electrode is provided on the main surface so as to face the tips of the plurality of electrode fingers of the first electrode at intervals.
- the second electrode concentrates the electric field at the tip of the first electrode Serves to assist An inversion nucleus is formed by the concentration of the electric field at the tip of the first electrode, and the growth of the domain inversion starts quickly.
- the relationship between the shortest distance L between the tip of the electrode finger and the second electrode and the thickness T of the ferroelectric substrate satisfies L ⁇ TZ2.
- the relationship between the electrode distance L and the substrate thickness T affects the electric field distribution at the tip of the electrode finger.
- the effect of the second electrode becomes too small.
- a voltage is applied between the first electrode and the counter electrode to form a domain-inverted region below the first and second electrodes. By separately applying electrodes in the same plane, a polarization inversion region is formed under each adjacent electrode. Therefore, it is very effective for forming a wide range of domain-inverted regions.
- a first electric field applying step of applying a voltage between the first electrode and the counter electrode, and a second electric field applying step of applying a voltage between the second electrode and the counter electrode Have. Further, it is preferable that a domain-inverted region is formed under the first and second electrodes by the first electric field applying step and the second electric field applying step. Also preferably, the first electric field applying step and the second electric field applying step are performed separately.
- the second electrode has a plurality of electrode fingers, the tip of which faces the tip of the electrode finger of the first electrode, and the direction of the electrode finger of the second electrode from the base to the tip is the ferroelectric substrate. May be arranged along the Y-axis direction of the crystal.
- a distance L between the first electrode and the second electrode is 50 m ⁇ L ⁇ 200.
- the step of applying an electric field to the ferroelectric substrate is performed in an insulating solution of 10 ° C. or more.
- an angle 0 formed by the main surface and the Z axis is in a range of 80 ° ⁇ 0 ⁇ 100 °.
- a domain-inverted region in which the thickness T of the ferroelectric substrate is 1 mm or more and the period 2 is 2 z / m or less is produced. More preferably, it is manufactured such that the depth D of the domain-inverted region satisfies the relationship of D ⁇ T with the substrate thickness T.
- the thickness T of the ferroelectric substrate is T ⁇ lmm
- an insulating layer is formed between the counter electrode and the ferroelectric substrate
- a pulse width is defined between the first electrode and the counter electrode. Applies a pulse voltage of 1 ms ec to 50 ms ec.
- the insulating layer may be a S i 0 2 film, T i 0 2 film or T a 2 0 5 films.
- a thickness T of the ferroelectric substrate is T ⁇ 1 mm
- a semiconductor film is formed between the counter electrode and the ferroelectric substrate, and a pulse width between the first electrode and the counter electrode is 1
- a pulse voltage of msec to 50 ms ec may be applied.
- the semiconductor film can be a Si film, a ZnSe film, or a GaAs film.
- the ratio of the area of the domain-inverted region penetrating from the front surface to the rear surface of the ferroelectric substrate with respect to the entire area of the domain-inverted region is 50% or less, or When the average depth of the region is in the range of 40 to 95% of the thickness of the ferroelectric substrate, a fine domain-inverted structure can be formed uniformly.
- the domain-inverted region penetrates the substrate and shorts between the electrodes Then, the spread of the domain-inverted regions concentrates on the penetrated domain-inverted regions, thereby preventing uniform domain-inverted formation. Therefore, suppressing the area of such a domain-inverted region that penetrates is effective in ensuring uniformity of the domain-inverted structure.
- the ferroelectric substrate is Mg doped L i T a (1 _ x ) Nb x 0 3 (0 ⁇ x ⁇ l). More preferably, the period of the domain-inverted region is 4 m or less. Also preferably, the thickness of the ferroelectric substrate is lmm or more. Also preferably, the substrate thickness T of the ferroelectric substrate is lmm, and the period ⁇ ⁇ of the domain-inverted region is 2 Hm or less. Also preferably, the depth D of the domain-inverted region satisfies the relationship of D ⁇ T with the substrate thickness T. Also preferably, an angle 0 formed by the main surface and the Z axis is within a range of 80 ° ⁇ 0 ⁇ 100 °.
- FIG. 1A is a plan view showing an electrode structure for implementing a method of forming a domain-inverted structure according to the first embodiment of the present invention
- FIG. 1B is a sectional view.
- a first electrode 3 having a comb-shaped pattern is formed on a main surface 2 of an Mg LN substrate 1.
- the plurality of electrode fingers 5 constituting the first electrode 3 have an elongated stripe shape and are arranged periodically. Thereby, the fine tips 5a of the electrode fingers 5 are periodically arranged.
- the second electrode 4 is formed on the main surface 2 at a predetermined distance from the tip 5 a of the first electrode 3.
- the first electrode 3 and the second electrode 4 are electrically insulated.
- a counter electrode 6 is provided so as to face the first electrode 3 and the second electrode 4.c
- the counter electrode 6 has a region corresponding to the first electrode 3 and the second electrode 4.
- Each of the plurality of electrode fingers 5 forming the first electrode 3 is arranged with the symmetry axis of the stripe along the Y-axis direction of the crystal of the MgLN substrate 1. In other words, the tip 5a extends from the base of the electrode finger 5 in the Y-axis direction.
- the controlled voltage is a pulse voltage or a DC voltage having a predetermined voltage level or duration, which will be specifically described later.
- a DC voltage is applied.
- a current (referred to as “reversal current”) proportional to the spontaneous polarization of the ferroelectric and the electrode area flows between the first electrode 3 and the second electrode 4.
- the uniformity of the periodic structure of the domain inversion means the stability of the period or the duty ratio. Uniformity affects the conversion efficiency when the domain-inverted structure is used for wavelength conversion. For example, when a periodic domain-inverted structure is formed over a length of about 10 mm, a part where the periodic structure is partially disordered is formed. The main cause of the non-uniformity is that the lateral direction of the domain-inverted region partially expands, and a portion where the duty ratio is greatly disturbed is locally formed. In the conventional method, such non-uniform portions are formed at several tens of force points per 10 mm of the inverted structure, and when the period is 3 im or less, almost non-uniformly over the front surface.
- the conversion efficiency was only about several percent to 50% of the theoretical value.
- good uniformity in the present embodiment means, for example, that the number of non-uniform portions is several or less over a length of 10 mm. This also means that a very high efficiency close to the theoretical value can be obtained, with the conversion efficiency of 90% or more of the theoretical value when used for wavelength conversion.
- An ideal domain-inverted structure is one in which the width W of the domain-inverted region is small and the length Lr of the domain-inverted region is long. As the width W is smaller, it becomes easier to finely control the domain-inverted region. For example, if the width W is small, a short-period polarization inversion structure can be formed. Also, the longer the length Lr, the wider the domain-inverted region can be formed.
- a domain-inverted region cannot be formed uniformly with a pattern electrode that has a wide tip instead of a fine one. Since the electric field is formed uniformly under the electrode, the domain-inverted nucleus is generated at the point where the domain-inverted region spreads around this nucleus. It is. According to the electrode structure of the present embodiment, the domain in which the domain-inverted nuclei are formed can be specified and formed at the tip of the electrode, so that the controllability of domain-inverted area formation is improved and a uniform domain-inverted structure can be formed. It becomes.
- a comb-shaped electrode 11 is formed on the + Z face of the Mg LN substrate 10, and a flat electrode 12 is formed on the -Z face, and when a voltage is applied between the electrodes, an electric field 13 is generated. Since the concentration is at the tip of 1, the electric field strength at the tip is higher than at other parts. As a result, a domain-inverted nucleus is generated, and the domain-inverted region 14 is spread around the domain-inverted nucleus.
- the fact that the tip of the electrode finger is fine means that the width at the tip is small enough that the electric field applied by the electrode can be sufficiently concentrated. Concentrating the electric field sufficiently means the degree necessary to uniformly form the domain-inverted structure.
- the width of the tip is preferably 5 x m or less, and if it is 2 m or less, the uniformity of the domain-inverted structure to be formed is improved, so that it is more preferable.
- the tip is 1 m or less, a fine domain-inverted structure can be formed, which is more preferable.
- the electric resistance of the domain-inverted region significantly decreases. Therefore, the resistance decreases as the domain-inverted region expands. Therefore, if the amount of current of the applied pulse is kept constant, the applied voltage decreases as the domain-inverted region expands, as shown in Fig. 3C.
- the applied voltage decreases and becomes equal to or lower than the domain-inverted voltage Vc, the growth of the domain-inverted region is automatically reduced.
- FIGS. 4A and 4B FIGS. 5A and 5B
- a polarization inversion method for further expanding the domain inversion region will be described.
- the domain-inverted region 14 stops as it expands. If the current value is set large to avoid this, the initial resistance In a high state, a large current flows in the domain-inverted region, causing dielectric breakdown due to a rise in temperature and a sudden lateral expansion of the domain-inverted region. To prevent this, do the following.
- a relatively low current for example, a maximum current of about 0.1 mA is applied to form a domain-inverted region as shown in FIGS. 4A and 4B.
- the maximum current is further increased to promote the growth of the domain-inverted region, as shown in Figs. 5A and 5B.
- the second electrode 4 is formed at a position separated from the tip of the first electrode 3 by a distance L.
- the second electrode 4 plays a role of helping the electric field to concentrate on the tip 5 a of the first electrode 3.
- Mg LN is a uniaxial crystal. In the plane perpendicular to the z-axis, the crystal was considered to be symmetric. In particular, it was thought that there was no dependence on the polarization reversal characteristics in the X and Y axis directions. However, it was found that the polarization reversal characteristics of the Z-plate substrate largely depend on the X and Y axes of the crystal.
- FIG. 6 shows the crystal axis dependence of the length Lr of the domain-inverted region to be formed.
- the direction of the electrode finger 5 is rotated in the directions of the X and Y axes, and the length L r of the polarization inversion formed in each direction is indicated by the distance from the origin.
- the tip of the electrode finger 5 is oriented in the Y-axis direction and the axial direction of the electrode finger 5 is aligned with the Y-axis direction, the length L r of the domain-inverted region becomes very long.
- the electrode finger 5 was moved along the X-axis direction, the length L r was reduced to less than half.
- the non-uniformity of the magnitude of the polarization reversal becomes larger than when the electrode fingers 5 are formed in the Y-axis direction.
- the variation in the size of the domain-inverted regions formed is several percent or less, and a practically uniform domain-inverted structure can be obtained.
- the direction of the electrode finger 5 is ⁇ 10 ° or less with respect to the Y axis, the length Lr is relatively long, and a domain-inverted structure that is practically satisfactory and uniform can be obtained. . Below ⁇ 5 ° the uniformity is better. It was found that when the angle exceeded ⁇ 10 ° with respect to the Y axis, the length L r was significantly reduced, and at the same time, the non-uniformity was increased.
- forming electrode fingers with fine tips with their axial directions aligned with the Y-axis direction of the crystal is an important condition for forming a uniform domain-inverted structure.
- the electric field concentrates on the tip of the electrode finger, the surface electric field in this part becomes higher than in other parts, and the domain-inverted nucleus is formed first. Thereafter, the domain-inverted region spreads below the electrode finger centering on the nucleus, and domain-inversion is formed.
- the axis direction of the electrode finger is oriented in the Y-axis direction, the spread of domain inversion spreads in the Y-axis direction of the crystal. Utilizing easy characteristics, uniform polarization reversal is formed.
- domain-inverted nuclei are formed irregularly, so the domain-inverted region expands irregularly, and a fine domain-inverted shape, especially an inverted structure of 10 m or less, is formed uniformly. It is difficult.
- the tip is formed in the X-axis direction, it is difficult to secure a sufficient length Lr and to form a fine structure uniformly.
- a triangular shape as shown in FIGS. 7A and 7B can be used in addition to the stripe shape of the comb-shaped electrode.
- a triangular domain-inverted region 9 can be periodically formed. Triangular periodically poled regions can be applied to prisms, deflectors, etc.
- the domain inversion region can be enlarged by setting the symmetry axis along the Y-axis direction of the substrate crystal. In that case, the vertex of the triangle becomes the tip, polarization inversion occurs around the vertex, and the triangle grows.
- a fine domain-inverted structure could be formed uniformly.
- the applied electric field was preferably a pulse electric field having a pulse width of ⁇ 10 msec.
- a uniform domain-inverted structure can be formed.
- the applied voltage was 6 kVZmm or less, no domain-inverted region was formed.
- the application of a pulse train made it possible to form a domain-inverted structure.However, the domain-inverted region formed was limited to the vicinity of the tip of the electrode finger, and a large length Lr extending along the electrode finger. No inversion region was formed.
- the optimal number of pulses can be determined while observing the voltage waveform shown on the oscilloscope.
- the voltage amplitude at the start of voltage application is monitored, and the voltage amplitude decreases as the number of d- pulses increases, and the voltage amplitude stops decreasing at a certain number of times.
- the saturation of the voltage amplitude and the minimum number of applied pulses can be determined by monitoring the amount of decrease in the voltage amplitude.
- the inversion region did not expand even if more pulses were given.
- the minimum number of applied pulses depends on the set current, and the number decreases as the current value increases.
- the application time is about 1 to 100 sec. It was difficult to form a uniform domain-inverted structure only by applying DC, but when a DC voltage was applied following the application of a pulse train, the domain-inverted region expanded along the electrodes, and the length r was smaller than when only a pulse was applied. Increased several times. In other words, by applying a DC voltage after applying a pulse train, it was possible to form a uniform domain-inverted structure over a wide area.
- the applied electric field pulse has a pulse width of 0.5 ms, the number of pulses is about 200 to 500,000 times, and the applied voltage is 5 to 6 kV when the substrate thickness is 2 mm. Good results were obtained.
- the maximum value of the current is about 0.2 to 1 mA.
- the magnitude of the DC voltage is much smaller than the pulse voltage, and good results can be obtained when the DC voltage is 0.2 to 4 kV / mm or less.
- Polarization inversion is formed at a very low voltage because a domain-inverted nucleus is formed by applying a pulse train, and application of a DC voltage contributes to the action of expanding the domain-inverted region around the domain-inverted nucleus. Conceivable. When a DC voltage of 5 kV or more was applied after the pulse application, the domain-inverted region became too wide and it became difficult to form a fine domain-inverted region.
- MgLN if the current value is not controlled, a large current will flow and crystal breakage will occur. To prevent this, a mechanism is needed to control the applied voltage automatically so that the current value does not exceed the set maximum value. In the case of actual MgLN, it depends on the area of the electrode, but the maximum current is preferably 10 mA or less. In the case of a short period structure with a period of 3 m or less, it is necessary to control it to 5 mA or less.
- the substrate thickness of MgLN is preferably 1 mm or more.
- the substrate thickness was lmm or more, good results were obtained for the uniformity of the domain-inverted structure and the length Lr of the domain-inverted region under the electrode. The reason for this is that the use of a thick substrate can prevent the polarization reversal region from penetrating the substrate.
- the domain-inverted region penetrates the substrate, the non-uniformity of the domain-inverted region increases, and it becomes difficult to form a fine domain-inverted structure.
- By increasing the thickness of the substrate it was possible to suppress the penetration of the domain-inverted region and to form a uniform domain-inverted structure.
- the thickness of the substrate has been reduced to 0.5 mm or less to facilitate the formation of domain-inverted regions, and to enable the formation of finer inverted structures.
- the phenomenon that the inversion region can be made uniform and finer by making the substrate thicker is due to the Mg-doped Li T a (1 _ x ) N b x 0 3 (0 ⁇ x ⁇ 1) substrate. This is particularly noticeable.
- the reverse voltage of the Mg-doped substrate Li T a (1 _ x) Nb x 0 3 (0 ⁇ x ⁇ 1) is less than 1 Z4 of normal LN. In the case of ordinary LN, etc., when the substrate is thickened, dielectric breakdown occurs due to the reversal voltage. However, the lower reversal voltage allows the application of the polarization reversal voltage without dielectric breakdown.
- the method of forming the domain-inverted structure in the case of using the Z-plate Mg LN is described as an example. Since the Z-plate substrate has the crystal C-axis perpendicular to the substrate, it can efficiently apply an electric field using the electro-optic effect. In addition, it has an advantage that the depth of the domain-inverted region is increased, and is an ideal substrate for a bulk-type optical element. However, a similar effect was observed on off-cut substrates close to the Z-plate.
- the method of forming the domain-inverted structure of the present embodiment except MgLN of Kondaruento sets formed, Mg-doped L i T a (1 _ x ) Nb x ⁇ 3 (0 ⁇ x ⁇ 1) substrate, Mg of Sutoikio composition It is also applicable to the substrate L i T a (1 _ x ) Nb x ⁇ 3 (0 ⁇ x ⁇ 1).
- the Mg doping amount and the polarization reversal characteristics of the congruent Mg LN were evaluated.
- the thickness of the substrate was lmm.
- the doping amount of Mg greatly affected the polarization inversion characteristics.
- the change in electrical resistance due to domain inversion increases depending on the amount of Mg doping, and the formation of a short-period domain-inverted structure also depends on the amount of Mg doping.
- Short-period structures with a period of 3 im or less were formed only when the Mg doping amount was in the range of 4 to 5.5 zm.
- a large periodic structure with a period of 10 / zm or more could be formed even with a Mg doping amount of 2 to 7 mol 1%.
- the mo 1 concentration is preferably 2 to 7 mo 1%. In order to realize a short period structure, 4 to 5.5 mol% is more preferable.
- the composition of the substrate As for the composition of the substrate, a comparison was made between the condurant composition and the stoichiometric composition, but there was no significant difference in the relationship between the Mg doping amount and the polarization reversal characteristics.
- Mg stoichiometric Mg LN, MgLT, and the mixture of Mg dope Li T a (1 _ x) Nb x 0 3 (0 ⁇ x ⁇ 1) Mg doping amount and polarization
- Mg doping amount and polarization The relationship of the reversal characteristics was similar.
- the depth of the domain-inverted region formed is great for the uniformity of the domain-inverted region. It was found to have a significant effect.
- the domain-inverted region is formed to penetrate from the front surface to the back surface.
- a domain-inverted region is formed with a similar configuration, non-uniformity will increase significantly when a domain-inverted structure having a short period, particularly a periodic structure of 4 m or less, is formed.
- the formed polarization region has a rectification characteristic, and a current flows at an applied voltage equal to or lower than a voltage at which polarization inversion occurs.
- the domain-inverted depth D can be controlled so as not to reach the substrate thickness T because the domain-inverted state is generated by pulse application.
- the number of pulse applications can be controlled to control the polarization inversion depth D so as not to reach the substrate thickness T, thereby limiting the rate at which the domain inversion region penetrates to the back surface, and thereby controlling the domain inversion. Uniformity can be improved.
- the average value of the domain-inverted depth D is 40 to 95% of the substrate thickness T. It is effective to control so that When the average value of the polarization reversal depth D exceeded 95%, the penetration rate of the domain reversal region exceeded 50%, and the non-uniformity of reversal increased significantly. On the other hand, if it is less than 40%, the portion where no domain-inverted region is formed increases, resulting in a non-uniform domain-inverted structure. When the average value of the polarization reversal depth D is suppressed to 50 to 80% of the substrate thickness T, the uniformity is further improved.
- the domain-inverted nuclei are formed directly below and around the electrode on the crystal surface, and the domain-inverted portions grow around the domain-inverted nuclei.
- the generation of this inversion nucleus can be reduced by performing ion exchange on the crystal surface and deteriorating the ferroelectricity of the crystal. For example, by performing proton exchange, a type of ion exchange, the lateral expansion of the domain-inverted region is suppressed, and a short-period domain-inverted structure can be formed.
- the exchange depth is desirably 0.5 m or less.
- At least one of the first electrode 3 and the second electrode 4 has a multilayer structure of a metal 16 and a dielectric 17 so that the uniformity of the polarization reversal can be improved. It is possible to increase the size and the domain-inverted region formed under the electrode. This is because, when a pulse voltage is applied between the electrodes, the transient characteristics of the pulse waveform change due to an increase in the capacitance of the electrodes. As a method of increasing the capacity, it is effective to form the electrode into a multilayer film of a metal and a dielectric. As the dielectric, the dielectric constant large S I_ ⁇ 2, T a 2 ⁇ 5, N b 2 0 5, the material of the other high dielectric constant is preferable.
- the method for forming the domain-inverted structure in the second embodiment relates to an improvement for stabilizing domain-inverted structure.
- the experiment used a Mg 5mo 1 -doped Z plate Li Nb ⁇ 3 substrate.
- An electrode was formed on the z-plane of a 1 mm thick substrate, and a pulse voltage of about 10 kV was applied to form a domain-inverted region under the electrode.
- a pulse voltage of about 10 kV was applied to form a domain-inverted region under the electrode.
- the substrate on which the domain-inverted regions are formed is heat-treated at about 100 ° C. for 30 minutes, and then subjected to HF etching again to observe the domain-inverted portions. It was observed to have decreased by nearly half. Other observed phenomena are as follows.
- the inversion region is reduced even by heat treatment at a low temperature of about 80 ° C.
- the domain-inverted region is reduced, so that it is not possible to process a substrate with domain-inverted by heating.
- the polarization reversal changes with time
- the device characteristics change with time.
- the method for forming the domain-inverted structure according to the present embodiment solves the above problem.
- the feature of this method is that, for example, the same structures as those of the first embodiment are used as the structure of the substrate and the electrodes, and after the domain-inverted region is formed by applying a voltage, an annealing process is performed. Annie after domain-inverted region formation By appropriately setting the conditions of the annealing process, the decrease in the domain-inverted region can be suppressed.
- FIG. 10A shows the temperature profile of the annealing process. After reaching the annealing temperature at a constant heating rate, annealing is performed for 1 hour at 100 ° C, and then cooled to room temperature at a constant cooling rate.
- FIG. 10B shows the result of measuring the relationship between the rate of temperature rise in the annealing treatment and the rate of decrease in the inversion region. As can be seen from Fig. 10B, as the heating rate increases, the inversion region decreases more. When the heating rate exceeds 20 ° C / min, the inversion region attenuates by 50% or more.
- the heating rate becomes 10 ° C / min or less
- the attenuation rate becomes 10% or less
- the heating rate becomes 5 ° C / min or less
- the instability of the domain-inverted region was found to be caused by re-inversion of the domain inversion due to pyroelectric charge, and other methods for preventing this were examined.
- pyroelectric charges appear on the front and back surfaces of the substrate, forming an electric field in the Z-axis direction. To prevent this, the front and back surfaces of the substrate may be electrically short-circuited. Therefore, a metal paste was applied to the front and back surfaces of the substrate on which the domain-inverted regions were formed, and the front and back surfaces were electrically short-circuited.
- the annealing process was performed in this state.
- the annealing temperatures were 400, 600 and 800 ° C.
- the domain-inverted region decreased at 800 ° C, but at 600 ° C or lower, the stability of domain-inverted was confirmed for any high-speed heat treatment. It has been certified. As described above, by short-circuiting the front and back surfaces of the substrate to eliminate the electric field due to the pyroelectric charge, high-speed annealing can be performed.
- Heat treatment at 400 ° C or higher reduced the scattering loss existing in the substrate to six widths, enabling the formation of a domain-inverted structure with high transparency. For this reason, for example, when applied to an optical wavelength conversion device utilizing the nonlinear optical effect, the conversion efficiency has been greatly increased. Also, when applied to a polarizing element, the propagation loss in the crystal is reduced to 1/2 or less, so that a polarizer with small loss can be realized.
- the polarization inversion electric field of Mg LN is equal to or less than 5 k V ZMM, by conventional L i Nb0 3, L i T A_ ⁇ very small 1/4 or less, such as 3 is there. Since the polarization reversal voltage is low, the reversal part after polarization reversal is unstable, and re-reversal occurs due to a slight pyroelectric effect. The same heat treatment is required for stoichiometric crystals because the inversion voltage is low. In addition, the upper limit of the heat treatment temperature depends on the Curie temperature of the substrate.
- the heat treatment temperature must be limited to 800 ° C or less. Above 800 ° C, the domain-inverted region became smaller. In the case of L i T a 0 3 for the Curie temperature of about 60 (TC, the upper limit of the heat treatment is not more than 500 ° C.
- the heat treatment of the present embodiment is particularly effective for the domain-inverted structure formed by the method of Embodiment 1, but is applied to stabilize the domain-inverted structure formed by another method. Is also possible.
- the method of forming the domain-inverted structure according to the third embodiment is characterized by a method of applying a voltage when an electrode structure as shown in FIGS. 11A and 11B is used.
- a voltage is applied using the first electrode 3 and the second electrode 4 formed on the + Z surface of the MgLN substrate 1 having the main surface 2 perpendicular to the Z axis. That is, by applying a voltage to one of the electrodes and forming a domain-inverted region under the other electrode, a wide range of domain-inverted regions can be formed.
- a case where a domain-inverted region is formed in a 1 mm thick Z-plate MgLN substrate will be described as an example.
- the same elements as those in Embodiment 1 are denoted by the same reference numerals, and description thereof will not be repeated.
- the plurality of electrode fingers 5 forming the comb-shaped first electrode 3 are arranged at a predetermined period with the symmetric axis of each elongated shape along the Y-axis direction of the crystal of the MgLN substrate 1.
- the tip 5 a extends from the base of the electrode finger 5 in the Y-axis direction.
- the second electrode 4 also has a comb-shaped electrode finger 15, and the tip 15a extends from the base in the Y-axis direction.
- a domain-inverted region is formed between the electrodes. It has a predetermined voltage level, and can apply a pulse voltage or a DC voltage to the MgLN substrate 1 as necessary. To avoid discharge onset raw when a voltage is applied, a voltage is applied to place the Mg LN substrate 1 in an insulating liquid or in a vacuum (10- 6 To rr below).
- a method for applying a voltage specific to this embodiment will be described. First, a pulse voltage is applied between the second electrode 4 and the counter electrode 6, and then a DC voltage is applied. Next, a pulse voltage is applied between the first electrode 3 and the counter electrode 6, and then a DC voltage is applied. As a result, domain-inverted nuclei are generated below the tips 5a and 15a of the first electrode 3 and the second electrode 4, and domain-inverted nuclei are formed. It is.
- FIG. 12 is a cross-sectional view showing how a domain-inverted region is formed.
- a domain-inverted region R2 is formed below the electrode of the second electrode 4 and below the electrode of the first electrode 3.
- the domain-inverted regions formed below both electrodes further grow, and the domain-inverted region R1 is formed. This shows that it is effective to apply a voltage using the other electrode formed on the same plane to enlarge the domain-inverted region.
- (a) a method of applying a voltage will be described.
- the voltage application method simultaneous application to the first electrode 3 and the second electrode 4 and individual application to separately apply to each electrode were examined.
- the simultaneous application the current flowing near the + Z plane increases, and a large current easily flows in the same plane of the first electrode 3 and the second electrode 4, so that the rate of occurrence of discharge is extremely high. . Therefore, the individual application is more preferable as the voltage application method. This will be described in detail below.
- the electric field concentrated at the tip of each electrode decreases, and the growth of the domain-inverted region is hindered. For this reason, it is more effective to apply electric fields separately in the initial electric field application.
- the electric field applied by the adjacent electrodes causes the polarization inversion to occur under the electrode to which no voltage is applied. This has the effect of greatly expanding the domain-inverted region formed in the substrate. Also, by applying the electric field alternately, the effect of lengthening the inversion region can be obtained as compared with the case where the electric field is applied with a single electrode.
- a first electric field application step of applying a voltage between the first electrode 3 and the counter electrode 6 and a second electric field application of a voltage between the second electrode 4 and the counter electrode 6 An electric field is applied by the steps.
- a pulse voltage of electric field intensity E l and a pulse width of ⁇ 10 msec is applied
- a DC voltage of electric field intensity E 2 and a pulse width of ⁇ 1 sec is applied. Apply voltage and set E 1> E 2.
- FIG. 4 is a diagram illustrating a relationship between L r.
- the length Lr increases as the electrode spacing L decreases. Further, the length Lr starts to be saturated from the vicinity of the electrode interval L of 200 m.
- the electrode spacing L was too short (L ⁇ 50 z m)
- the rate of occurrence of discharge increased.
- the shape of the second electrode 4 As the shape of the second electrode 4, a shape in which the tip 15a extends in the Y-axis direction from the base of the electrode finger 15 is effective. However, since the second electrode 4 is used as a dummy electrode for enlarging the domain-inverted region under the first electrode, if the domain-inverted region under the first electrode 3 is expanded by applying an electric field, other electrodes are used. It may be an electrode shape. In fact, even when a rectangular electrode was used as the second electrode 4, the inversion region of the first electrode 3 was enlarged by applying an electric field to the second electrode 4.
- FIG. 14 is a diagram showing the relationship between the temperature of the insulating solution and the length Lr of the domain-inverted region.
- the temperature of the insulating solution is preferably set to 150 or less for forming the short-period domain inversion. This condition is different from the method in the first embodiment. The same applies to the same.
- a short-period domain-inverted structure with a period of 10 or less was obtained uniformly and with a wide area of inversion on a Z-plate MgLN substrate with a thickness of lmm.
- good results were obtained when the substrate thickness of MgLN was 1 mm or more. That is, when the uniformity of the domain-inverted region and the extension Lr of the domain-inverted portion under the electrode were equal to or greater than the substrate thickness lmm, the results were good. This is because the use of a thick substrate can prevent the domain-inverted region from penetrating the substrate.
- FIG. 15 shows the relationship between the substrate thickness T and the polarization inversion period at which domain inversion can be formed.
- periodic polarization reversal of less than 7 m is very difficult.
- fine polarization inversion can be achieved. This is because, as will be described later, when the domain-inverted region penetrates the substrate, the non-uniformity of the domain-inverted region increases and it becomes difficult to form a fine domain-inverted structure.
- By increasing the thickness of the substrate it is possible to suppress the penetration of the domain-inverted region and to form a uniform domain-inverted region.
- a method for forming a domain-inverted structure according to the fourth embodiment will be described with reference to FIGS.
- the electrode structure in the present embodiment is substantially the same as that in the third embodiment. The difference is that sandwich the S I_ ⁇ 2 film as the insulating film 1 8 during one Z plane and the counter electrode 6 of MgLN substrate 1, also, by applying a pulse voltage of a low frequency between the electrodes, Formed on the + Z plane A wide range of domain-inverted regions is formed under the electrode.
- M g LN has a unique rectification characteristic.
- a part of the polarization is reversed and penetrates between the M g LN substrates 1, a current flows through that portion, and Polarization grows larger than other portions.
- the desired voltage is not applied to the entire MgLN substrate 1 and the inversion region stops growing or the inversion becomes non-uniform.
- a domain-inverted structure having a periodic structure of 4 zm or less is formed, non-uniformity is greatly increased.
- the Z-plane and the counter electrode are used.
- An S i 0 2 film is interposed between 6 as an insulating film 18.
- the inversion region expanded when the pulse width was in the range of 1 msec to 50 msec.
- the inversion region was remarkably enlarged.
- the polarization reversal width W is about 0.5 ⁇ ( ⁇ is the polarization reversal period)
- the duty ratio is close to 50%, and the efficiency is highest.
- the inversion region was expanded using a 2 mm-thick MgLN substrate, the dependence of the inversion characteristics on the pulse width was also confirmed. That is, in the region where the pulse width is 10 ms to 2 sec, the inversion region with a period of 4 m was expanded.
- the insulating film in addition to S I_ ⁇ 2 film, it is possible to use T i 0 2 film, Ta 2 ⁇ 5 film, Nb 2 0 5 film.
- a pulse waveform to be applied when a semiconductor film is used based on the present embodiment was examined.
- a pulse waveform with a pulse width of 10 to 100 sec was applied.However, even if the current value was set low, periodic polarization inversion was not obtained. It was observed. This is due to the long applied pulse width.
- 1 A pulse waveform with a pulse width of ms ec was applied, but the inversion region did not expand even if the number of pulses and the current were increased.
- the pulse width was optimized, it was found that the inversion region expanded when the pulse width was in the range of 10 ms ec to 1 sec. In particular, in the range of 20 ms ec to 50 ms ec, the inversion region was significantly enlarged.
- the dependence of the inversion characteristics on the pulse width was also confirmed. That is, in the region where the pulse width is 10 ms to 2 seconds, the inversion region with a period of 4 m was expanded.
- a ZnSe film, a GaP film, or the like can be used as the semiconductor film other than the Si film.
- the optical element according to Embodiment 6 can be manufactured by using the method for forming a polarization reversal structure according to the above-described embodiment.
- a wavelength conversion element which is an example of the optical element according to the present embodiment will be described with reference to FIG.
- FIG. 18 is a perspective view of a wavelength conversion element.
- Periodically domain-inverted regions 21 are formed on an Mg LN substrate 20 of a Z plate.
- the fundamental wave having the wavelength ⁇ can be converted into a harmonic wave having a wavelength ⁇ 2 by performing wavelength conversion using a periodic polarization inversion structure.
- the polarization inversion period can be, for example, 4 m, and the wavelength of 900 nm light can be converted to 450 nm wavelength light.
- the thickness of the substrate 20 is, for example, 1 mm, and the depth of the domain-inverted region 21 is about 0.8 mm.
- the domain-inverted region 21 extends along the Y axis of the substrate crystal.
- the domain-inverted region 21 is also formed from the + Z plane to the ⁇ Z plane side of the substrate 20.
- the depth of the domain-inverted regions 21 is formed such that most of the domain-inverted regions 21 are shallower than the thickness of the substrate 20. Although some of the domain-inverted regions 21 are formed through the substrate 20, The area of the region 21 is 50% or less of the entire domain-inverted region area.
- a domain-inverted region 21 was formed over a length of 10 mm in the X-axis direction, and when 900 nm light was incident on the lens, the wavelength was converted at a conversion efficiency of 5% ZW. nm harmonics were obtained. It can be seen that a uniform domain-inverted region is formed, and highly efficient wavelength conversion is performed.
- the thickness of the substrate 20 By setting the thickness of the substrate 20 to 1 mm or more, the beam waist of the fundamental wave and the harmonic wave can be increased. As a result, the power density of light can be reduced, and high output can be obtained.
- the output can be increased by a factor of 4 compared to a case where a domain-inverted region is formed on a 0.5 mm thick substrate.
- the domain-inverted regions 21 in the Y-axis direction it is possible to form a uniform and short-period domain-inverted structure. It is possible to form a polarization reversal structure with a period of 2 ⁇ m or less, thereby generating ultraviolet light with a wavelength of 400 nm or less. By forming the domain-inverted region 21 in the Y-axis direction, short-wavelength light can be generated. On the other hand, when the domain-inverted region 21 was formed in the X-axis direction, it was difficult to form a short-period domain-inverted structure, and only light having a wavelength of 500 nm or more was obtained. ⁇
- a uniform domain-inverted structure can be formed by forming the domain-inverted region to be shallower than the substrate and keeping the area of the penetrating domain-inverted region to 50% or less.
- the ratio of the domain-inverted regions penetrated was in the range of 1% to 50%, uniform domain-inverted regions were obtained.
- the domain-inverted region was less than 1%, the instability of the domain-inverted structure was increased, and a phenomenon was observed in which the fabricated domain-inverted region changed over time.
- the domain-inverted region exceeds 50%, it becomes difficult to form a short-period domain-inverted structure. Therefore, it was difficult to generate the second harmonic having a wavelength of 500 nm or less by the manufactured wavelength conversion element.
- a uniform domain-inverted region can be obtained with a domain-inverted period of 3 or less, and a wavelength of 40 Ultraviolet light of 0 nm or less can be generated.
- a polarizer can be formed by forming a domain-inverted structure in a prism shape or a grating shape, for example, in addition to the above-described light wavelength conversion element.
- it can be applied to phase shifters, optical modulators, lenses, etc.
- the change in the refractive index due to the electro-optic effect can be controlled, so that switches, polarizers, modulators, phase shifters, beam shaping, etc. can be configured as optical elements using this. .
- the method of the present embodiment makes it possible to form a fine domain-inverted structure, so that the performance of these optical elements can be improved.
- Figures 19A and 19B show optical deflectors using prism-shaped polarization reversal.
- a ferroelectric substrate 22 On a ferroelectric substrate 22, a periodically prism-shaped domain-inverted region 23 is formed. Electrodes 24 and 25 are formed above and below the domain-inverted region 23.
- Electrodes 24 and 25 By applying an electric field to the electrodes 24 and 25, a change in the refractive index is generated, and the direction of the beam 26 is controlled (for example, the angle can be changed. Therefore, when an electric field is applied as shown in the figure, the sign of the refractive index change is reversed between the domain-inverted region 23 and the non-inverted region, and it is possible to control the refraction direction of light at the prism portion.
- the present embodiment can be similarly applied to the case of a substrate or the like.
- the substrate made of a Nd-doped crystal is capable of laser oscillation, so generation of a fundamental wave by laser oscillation and generation of a second harmonic by wavelength conversion of the fundamental wave occur. Can be performed simultaneously. Therefore, a short wavelength light source having high efficiency and stable operation characteristics can be configured.
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US8630322B2 (en) * | 2010-03-01 | 2014-01-14 | Board Of Trustees Of Michigan State University | Laser system for output manipulation |
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2003
- 2003-11-21 AU AU2003284646A patent/AU2003284646A1/en not_active Abandoned
- 2003-11-21 US US10/535,975 patent/US7230753B2/en not_active Expired - Lifetime
- 2003-11-21 WO PCT/JP2003/014952 patent/WO2004049055A1/ja active Application Filing
- 2003-11-21 EP EP03774164.2A patent/EP1566689B1/en not_active Expired - Lifetime
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JP2001066652A (ja) * | 1999-08-27 | 2001-03-16 | Matsushita Electric Ind Co Ltd | 分極反転構造の形成方法並びにそれを利用した波長変換素子の製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
US7230753B2 (en) | 2007-06-12 |
US20060051025A1 (en) | 2006-03-09 |
EP1566689A4 (en) | 2007-10-10 |
AU2003284646A1 (en) | 2004-06-18 |
EP1566689A1 (en) | 2005-08-24 |
EP1566689B1 (en) | 2013-07-17 |
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