WO2004038786A1 - プローブ痕読取装置およびプローブ痕読取方法 - Google Patents
プローブ痕読取装置およびプローブ痕読取方法 Download PDFInfo
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- WO2004038786A1 WO2004038786A1 PCT/JP2003/013256 JP0313256W WO2004038786A1 WO 2004038786 A1 WO2004038786 A1 WO 2004038786A1 JP 0313256 W JP0313256 W JP 0313256W WO 2004038786 A1 WO2004038786 A1 WO 2004038786A1
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- Prior art keywords
- electrode
- probe
- mark
- imaging
- probe mark
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Definitions
- the present invention relates to a probe mark in: picking device for reading a probe mark formed on an electrode of a semiconductor chip by inspecting electrical characteristics of the semiconductor chip, and a method of clearing a probe mark.
- the electrode pad is typically formed of a gallon or a dome, so that this electrode pad is oxidized at the time of detection. It is covered with an insulating aluminum oxide film formed by>-and. Therefore, the inspection probe is pressed against the electrode with a certain force so as to pierce the coating, and as a result, the electrode is connected to the inspection probe. Traces (contact traces) are formed. By reading the state of the probe mark such as the position of the probe mark and the depth of the probe, it is possible to determine whether or not the inspection probe was correctly ⁇ pressed against the electrode. Is determined
- a probe mark removing device that reads the state of the pump mark is used for observing the state of the pump mark with a microscope, capturing the probe mark on a photograph, and using a CCD force camera. Some images of the probe marks are captured by the camera.
- Japanese Patent Application Laid-Open Publication No. Hei 5-23230 discloses that a semiconductor chip on which a semiconductor chip is formed is mounted on a stage, and that a mark formed on an electrode is formed by a CCD force camera.
- the mouthpiece reading device that stores the image obtained by shooting and displays it as needed is not opened. Inspection and control over time such as probe pressure and probe displacement of the inspection probe can be performed.
- a device that detects a pair different from the above electrode, such as a repetitive pattern can be used.
- a tape inspection device that reads for example, see Patent Document 2)
- a mark position detection device that detects alignment marks on a eno see, for example, Patent Document 2)
- a veno a surface
- a material surface inspection device for example, see Patent Document 3 for inspecting foreign substances and scratches can move an object and synchronize the light emission of the flash with the position of the object to thereby detect the object.
- the inspection may be performed while shifting the position of the inspection probe little by little in parallel so that the electrode having a thickness of about 1 micron is not pierced.
- a plurality of probe marks are formed on the electrode after such multiple inspections. Therefore, it is difficult to determine which of the plurality of probe marks the probe mark formed in the last inspection is.
- By calculating the difference between the image after the detection and the image in pixel units it is possible to determine the position of the probe mark or the like from the captured image of the electrode.
- such a difference operation takes a very long time.
- an object of the present invention is to provide a method for removing a pulp mark and a method for removing a pulp mark, and a BJC removing method, which can read a pub mark in a short time without requiring a user.
- a probe trace removing device for removing a probe trace formed on an electrode to be inspected having a plurality of electrodes when inspecting electrical characteristics of the electrode.
- Q o This device is provided with: a light-emitting mechanism for illuminating an electrode to be imaged among the plurality of electrodes; a light-emitting element illuminated by the light-emitting mechanism; In particular, an imaging mechanism that captures a part of the image at the 1AZ. Position and obtains polar image information.
- the imaging mechanism includes at least one at least a predetermined time at the imaging position.
- An image of the pole is provided to the imaging mechanism; an imaging target position change for sequentially arranging at least one of the electrodes to be imaged at the imaging position of the imaging mechanism from among the plurality of electrodes.
- H mechanism to change the image information obtained by the imaging mechanism
- a probe trace removing device for reading probe traces formed on electrodes when inspecting electrical characteristics of a test object having a plurality of electrodes.
- the probe mark removing device is provided with: a lighting device for illuminating an electrode to be imaged among the plurality of electrodes; An imaging mechanism for imaging at least a part of the at least one of the electrodes to be illuminated at the imaging position to obtain image information of the electrodes; At the imaging position, an image of at least one of the electrodes is provided to the imaging mechanism for a predetermined time; at least one electrode to be imaged is sequentially imaged from among the plurality of electrodes.
- An imaging target position changing mechanism for arranging the mechanism at the imaging position; a memory for storing the image information obtained by the imaging mechanism.
- the probe mark reading device preferably includes at least one or any of the following (a) and ().
- the imaging target position changing mechanism sequentially selects electrodes to be imaged from among the plurality of electrodes at intervals of time equal to or longer than the time required for the imaging mechanism to image the electrodes; It is arranged at the imaging position.
- the illumination mechanism is a flash mechanism that emits a flash, and emits the flash for a predetermined time while the electrode to be imaged is arranged at the imaging position.
- the imaging mechanism is provided with a photographed image of at least one of the electrodes.
- a memory for storing array information on the arrangement positions of the plurality of electrodes on the test object, and an arrangement of the electrodes imaged by the imaging mechanism based on the array information stored in the memory
- a trigger mechanism for specifying a position and instructing the imaging mechanism to perform imaging when the imaging target position changing mechanism moves the electrode of the imaging target to the imaging position.
- a probe mark inspection mechanism for judging pass / fail of a predetermined probe mark included in the image based on the image information stored in the memory, wherein the probe mark inspection mechanism is an initial vector.
- a calculation mechanism and a probe mark quality judgment mechanism are provided, and the initial vector calculation mechanism calculates a probe mark formed on a predetermined electrode among the plurality of electrodes from a position of a probe mark of a model registered in advance.
- the probe mark quality determination mechanism which calculates an initial vector up to the position of the probe, determines the initial vector of the initial vector from the position of the probe mark which is a model registered in advance with respect to an electrode different from the predetermined electrode. It is determined whether or not a probe mark formed on the electrode imaged by the imaging mechanism is located within a predetermined determination range including a position at a direction and a distance.
- the probe mark detection mechanism determines whether or not the probe mark of the electrode imaged by the imaging mechanism is located in a predetermined region set near the periphery of the electrode. mechanism.
- the probe mark inspection mechanism further includes a classification header creation mechanism, the classification header creation mechanism further includes identification information for identifying each electrode among the plurality of electrodes, and the probe mark quality determination.
- the classification header information including the determination result information of the means mechanism and is generated, and the classification header information is stored in the means memory in association with the image information of each electrode.
- the initial vector calculation mechanism calculates the image information of the electrode whose electrical characteristics have been inspected as stored in the memory and the image information before inspecting the electrical characteristics. By calculating the difference between the obtained image information of the electrode and the image information of the electrode, it is formed by the inspection of the electrical characteristics.
- the initial vector calculation mechanism calculates the position of each pre-registered mark of the probe associated with the four electrodes located near the corner of the test object.
- the initial vector up to the position of the probe mark formed on each of the two electrodes is calculated.
- the mechanism for determining whether or not the probe mark is good is separated by the direction and the distance of the initial vector. It is determined whether a probe mark formed on the electrode is located within a predetermined determination range including the position.
- the apparatus is provided with a probe mark detection apparatus of-comprising: an initial vector calculation mechanism, the initial vector calculation mechanism detects a probe mark position of a pre-registered microscope from a probe mark position. Calculating an initial vector up to the position of a probe mark formed on a predetermined electrode among a plurality of electrodes; a probe mark good / bad determination mechanism; Within a predetermined judgment range including a position at a direction and a distance of the initial vector from a position of a probe mark which is a pre-registered model related to a different electrode. On the i-pole imaged by the imaging mechanism. Determine whether or not the formed probe mark is located. Make
- a probe formed on the electrodes is inspected.
- a probe trace reading method for reading a lobe trace is provided. This probe mark reading method comprises: (al) imaging mechanism
- the invention provided according to the third aspect of the present invention is as follows.
- the (al) is a predetermined movement so as to secure a time interval equal to or longer than a photographing time for acquiring one image; a plurality of electrodes are sequentially arranged at the imaging position in degrees. .
- ⁇ >-And gives an image of the electrode to the imaging mechanism.
- the initial vector is calculated from the position of the probe mark of the model registered in advance to the position of the probe mark formed on a predetermined electrode among the plurality of electrodes.
- (A5-2) Checking the quality of the probe trace by checking the quality of the probe trace. The determination of the quality of the trace is performed on an electrode different from the predetermined electrode: From the position of the probe mark to be within a predetermined determination range including a position in the direction and distance of the initial vector, It is determined whether or not a probe mark formed on the electrode imaged by the imaging mechanism is located.
- the imaging mechanism photographs the predicted position of the probe mark on the electrode to be imaged.
- a probe mark inspection method for inspecting probe marks formed on electrodes when inspecting electrical characteristics of an object to be inspected including a plurality of electrodes.
- This probe mark detection method includes the following (bl) and (b2): (bl) Calculate the initial vector The initial vector is determined in advance by the From the position to the position of the pub mark formed on the electrode in the plurality of electrodes.
- a probe mark inspection provided in accordance with the fourth aspect of the invention, which determines whether or not a pump mark formed within a predetermined determination range including a vector and a position at a distance is located. It is preferable to provide one or more of the following (m) to (P) in combination.
- (n) Further, (b4) generating classification header information including information for identifying each of the plurality of electrodes and information relating to the determination in (b2), and generating the classification header information. Is stored in association with each electrode.
- the (bl) comprises the following (b1-1) and (bl-2):
- the (bl) is based on the four electrodes located near the corners of the test object, and from the positions of the probe traces that are registered in advance as a model, each of the four electrodes is Calculating the initial vector up to the position of the probe mark formed thereon, wherein (b2) is a predetermined determination range including a position separated by the direction and the distance of the initial vector. To determine whether or not a probe mark formed on the electrode is located.
- FIG. 1 is a block diagram showing a configuration of a probe mark reading device according to one embodiment of the present invention.
- FIGS. 2A and 2B are diagrams for explaining the imaging operation according to the embodiment.
- FIG. 3 is a block diagram showing a schematic configuration of the computer according to the embodiment.
- FIG. 4 is a block diagram showing a functional configuration of a computer according to the embodiment.
- FIG. 5 shows the generation of the trigger signal St in the above embodiment.
- FIG. 6 is a schematic diagram for explaining the relationship between the imaging position and the memo V address in the embodiment of FIG.
- FIG. 7 is a schematic diagram for explaining a trimming process according to the embodiment.
- FIG. 8 is a flowchart showing a processing procedure related to the imaging operation of the computer in the above-described embodiment.
- FIG. 9 is a diagram illustrating an image 51 including captured images of two electrodes 92 a and 92 b according to a modification of the embodiment.
- FIG. 9 is a diagram illustrating an image 51 including images taken of 92 a to 92 e.
- FIG. 1 is a block diagram showing a configuration of a probe pick-up device 1 according to an embodiment of the present invention. This device 1
- Reference numeral 1 denotes a device for detecting a probe mark formed on an electrode of a semiconductor chip included in the semiconductor chip 90, and a CCD camera 20 for imaging the semiconductor wafer 90 and the CCD camera.
- 20 is an optical unit that optically magnifies the image of the target location to be imaged.
- the camera 20 does not include an XY stage 40 for changing the position to be imaged by the camera 20 and a computer 10 for controlling them. In this case, there is no light source other than the light source 30 described above.
- the CCD camera 20 is fixed at a predetermined position above the XY stage 40 on which the semiconductor antenna 90 is mounted, and is provided at a predetermined position of the semiconductor antenna 90 enlarged by the optical unit 21.
- An image of a portion, that is, the vicinity of a predetermined electrode included in a plurality of semiconductor chips formed in the semiconductor wafer 90 is captured as a two-dimensional image based on the trigger signal St from the computer 10. ⁇ ⁇
- the CCD power camera 20 outputs the CCD power at the time when the trigger signal St is given.
- the shutter is opened by the camera 20 and the light source 3 described later is opened.
- the shutter is closed after the flash is emitted by 0.
- the CCD force camera 20 is used to image a black and white or empty load-coupled device (CCD).
- An imaging device used as a disensor, but instead of a metal oxide semiconductor (MO)
- An imaging device using S) or an imaging device having another photoelectric conversion function may be used.
- the optical section 21 is an optically enlarged image (at about 10 to 20 times) of a predetermined portion of the semiconductor laser 90 by one or more built-in lenses. An image is formed on the force camera 20.
- the optical unit 21 may be omitted if the resolution of the CCD force camera 20 is sufficiently high.
- the light source 30 is fixed at a predetermined position above the semiconductor antenna 90, and controls a predetermined portion to be imaged by the CCD force camera 20. ⁇ >-Lighting in Xenon lamps.
- the light source 30 is supplied with a flash signal Sf output immediately after the trigger signal St is output from the computer 10 to the flash signal Sf for a period of about a few max.
- a high-intensity flash is emitted.
- the above-mentioned area is illuminated with->-.
- the time illuminated by this flash is the shutter speed of a normal force camera (several V
- the light source 30 may be a light source that can emit high-brightness light only for a certain time.- For example, L ⁇ ⁇ D or a laser light source may be used. Then, after the trigger signal St is output,
- the flash signal S f is, specifically, Generated by inputting a trigger signal St to a delay circuit with time
- the motor for moving in the X direction and the Y direction for example, a stepping motor, a servo motor, a linear motor, etc.
- the distance for moving the table in the X direction and the ⁇ ⁇ direction for example, a stepping motor, a servo motor, a linear motor, etc.
- the motor included in the XY stage 40 is controlled based on the motor control signal S from the computer 10 so as to move the above-mentioned position to a predetermined position.
- the end of the XY stage 40 of >>- ⁇ is a pulse signal that is generated each time the mounting unit moves a unit distance in the X direction.
- P u 1 se hereinafter abbreviated as “X panelless signal J”
- Y 1 Up P u 1 se hereinafter abbreviated as “pulse signal” generated every time the mounting table moves a unit distance in the Y direction.
- Y-pulse signal Abbreviated as “Y-pulse signal”) and a signal generated at the entrance located on the X-axis, which is the reference position in the X direction.
- Reset hereinafter referred to as “X-set signal”
- ⁇ Y is a signal generated when the mounting table is positioned on the Y axis, which is the reference position in the Y direction.
- Y : eset ( Less than
- the publishing unit 11 moves the semiconductor wafer 90 mounted on the mounting opening of the XY stage 40 at a constant speed in the X direction by the XY stage 40, and the light source 30.
- the electrodes illuminated at a predetermined timing by the flash light are sequentially imaged by the CCD camera 20. Further, each time the imaging operation in the X direction is completed, the semiconductor laser 90 is moved by a predetermined distance (ie, one line) in the Y direction, and the imaging operation in the X direction is repeated. Images of all electrodes included in the semiconductor chip of the semiconductor chip 90 are shown in Figs. 2A and 2B.
- FIG. 2A shows the X ⁇ stage 40 It is a schematic diagram showing the relationship with the body genome 90 o
- the XY coordinate system and its origin are shown in the upper left part of the figure, but these are the XY coordinates of the XY stage 40 It's the origin. Further, the XY coordinate system is set to be the same as the coordinate system of the image obtained by imaging by the CCD force camera 20. Center position
- the position of the CCD force mail 20 is referred to the stage 40 so that it is the same as J.
- the diagram shown in FIG. 2B shows that the electrodes (eg, electrodes,,, and) in the semiconductor chip 91 included in the semiconductor substrate 90 are connected to the CCD force meter 2.
- FIG. 7 is a diagram showing a locus of the imaging position 20a 21a when imaging is performed using 0.
- P1 in the figure indicates the imaging position 20a21a (hereinafter referred to as "start position") when the imaging operation is started.
- start position indicates the imaging position 20a21a (hereinafter referred to as "start position") when the imaging operation is started.
- Ar indicates P2 in the figure when the imaging operation is ended.
- CCD force camera 20 is moved from the mounting table included in XY stage 40 in one X direction.
- the electrodes 92 arranged in the direction (as one line) are arranged in a predetermined direction.
- the mounting position included in the XY stage 40 is moved in the ⁇ Y direction.
- the electrode 92 is moved by one line in the Y direction.
- the poles 92 arranged in the X direction are similarly imaged sequentially at a predetermined timing.
- the above imaging operation is repeated, and all the electrodes 92 in the semiconductor chip 91 are imaged.
- the position id 20a reaches the end position P2.
- Such an imaging operation is performed for all semiconductor chips.
- the position of each probe mark of the plurality of electrodes can be ascertained. Are located at almost the same position. Based on the information, it is possible to predict the position of the pump mark on each electrode in the next and subsequent shots. ⁇ For the next and subsequent shots, the plug on each electrode surface Shoot with the predicted position of the mark as a target.
- the computer 10 is a general computer system such as a personal computer or a personal computer.
- FIG. 3 is a block diagram showing a schematic configuration of the computer 10 of FIG.
- the computer 10 is a CPU (Centr a1PRoceSsi11gUnit) 11 that performs various arithmetic processing, and an input device such as an external keypad or a max.
- CC ess M emory) ROM (R ead O: 11 1 y M emor) where 13 and predetermined programs are pre-gd Ik y) 14 and a large-capacity p
- this computer 10 is an I / O interface: 1
- a CD camera 20 gives a trigger signal st
- a lighting mechanism (eg, light source) 30 gives a flash signal S f
- receives an encoder signal Se from the XY stage 40 and receives an XY stage signal.
- the processing to apply the motor control signal S m to 40 is realized.
- each functional configuration of the computer 10 including these software processes and the imaging operation will be described with reference to the drawings.
- FIG. 4 is a block diagram showing a functional configuration of the computer 10.
- the computer 10 receives theender signal Se and outputs a trigger signal st and a flash signal Sf to a predetermined tie.
- An XY stage control unit that receives the encoder signal S e and outputs a motor control signal S m and an image reading unit that receives the image signal s 1
- An image h trimming section 150 for performing a predetermined trimming process on the image data Di, and the trimmed image data Di ′ are performed later. Inspection is performed on the basis of the large-capacity storage section 160 stored for inspection of the pi-batch trace and the image data D i stored in the large-capacity storage section 160 of ⁇ ⁇ . Professional
- the probe trace inspection unit 1700 which is provided with a loop trace inspection unit 170, performs a probe trace inspection performed after the imaging operation described below, and the operation will be described later. .
- the input signal generator 110 performs an operation of writing predetermined data in the predetermined address of the RAM 13 in advance, and performs predetermined operations based on the encoder signal Se.
- the trigger signal St and the flash signal Sf are output in the following manner.
- FIG. 5 is a diagram for explaining the operation of generating the trigger signal st.
- the trigger signal generator 110 is a functional component related to the generation of the trigger signal st.
- the Y-coordinate reading address counter 112 counts the pulse indicated by the Y pulse signal (Y-U ⁇ Pu1se), and stores the count value in a memo corresponding to the Y coordinate. Output as a reset dress signal (Y coordinate address signal). When a Y reset signal (Y — Reset) is input, the counter value corresponds to the reference position in the Y direction. It is compulsorily set to the address value corresponding to the specified Y coordinate.
- the X-coordinate read address counter 114 counts the panorace indicated by the X-panel signal (X-EncoderPu1se), and stores the count value in memory corresponding to the X-coordinate.
- the embedded data memo 1 1 selects one of the two types of address signals, the write address signal and the tm output address signal consisting of the Y coordinate address signal and the X coordinate address signal. The selected address signal is given to memory 118. When this and the write address signal are selected, the embedded data memo 1 1
- the write address is written to the address indicated by the write signal and the address signal: r
- the data is written o
- the address and the address data indicated by the output address signal are output from the memory 118 and output from the trigger signal generator 110 as the h trigger signal St. Be done
- the trigger signal generator 110 having the above-described configuration is provided with a semiconductor signal provided from outside of the RJC removing device 11.
- ⁇ ⁇ Array information Ia for the arrangement of the electrode pads 92, etc. (for example, coordinate information indicating the position of each electrode 92 in a predetermined coordinate system in the semiconductor chip 91) ),
- the coordinates corresponding to the center positions of all the electrodes 92 to be imaged included in the semiconductor chip 91 based on the sequence information Ia hereinafter referred to as “pad center coordinates J”).
- the calculated coordinates are converted into the corresponding memory and the corresponding memory, and the corresponding memory in memory 118 is represented by the center coordinates of the pad.
- Data indicating that there is something in this case, Factory 1 is written.
- the above memory address is input to the selector 116 as a write address (Write Address), and A certain write data (Write Data) is input to the S selector 116.
- the selector 116 writes "1" to the corresponding address of the memory 118.
- the above memory address is set so as to correspond to the above X coordinate. Therefore, a straight line connecting the center coordinates of each electrode 92 in the X direction is the imaging position 20 a 2 1 Since the a coincides with the straight line connecting the a in the X direction, the X coordinate of the imaging position 20a 21a is specified by specifying the memory ⁇ -less.
- FIG. 6 is a schematic diagram for explaining the relationship between such an imaging position 20a 21a and a memory address. Electrode 9 shown
- the square frame arranged along a straight line connecting the center coordinates of 2 in the X direction indicates the memory address, and the numbers in the frame indicate the data written in the memory address.
- ⁇ 1J is written in the memory corresponding to the center coordinates of the node and the node, and ⁇ ⁇ 1J in the node.
- the trigger signal generating section 110 outputs the trigger signal St when the imaging position 20a 21a matches the position corresponding to the address o.
- the data is sequentially output from the memo V-address from the S-address in S 16, and the trigger signal St is output immediately when 1 J is output. ⁇ The center coordinates of the pad and
- Electrode 92 is imaged when coincident with 20a o
- the time when the image is captured is the time when the flash signal Sf is output immediately after the output of the trigger signal st, but there is no actual difference since the two are almost the same time.
- the straight line connecting the center position id of each electrode 92 in the Y direction is assumed to be all parallel to the Y axis. That is, the X of each electrode 92 is The array pattern in the direction shall be repeated in the ⁇ direction.o
- the XY stage control section 120 has a separate body 90 XY stage 40
- a predetermined motor control signal 3 ⁇ 4 m for receiving the encoder signal se noting the position of the mouth and moving the mounting table to the predetermined position is given to the X ⁇ stage 40 .
- the imaging position 20a when an i-image is taken by the imaging mechanism (eg, CCD force camera) 20 is indicated by the arrow in the figure.
- the moving speed for performing the focus control for moving the mounting table of the imaging object 40 e.g., X-stage
- the speed is the same as or longer than the time required to acquire one image (hereinafter referred to as “shooting time j”) when acquiring images sequentially in succession with the CCD force camera 20.
- the imaging device 20a is moved from the center position of a certain electrode to the center position of an electrode adjacent to the electrode pad in the X direction for a longer time and longer. If it is moved within a shorter time than the shooting time determined to be moved, the force S will not be able to image all electrodes (the center position). Note that the above-mentioned shooting time is, for example, about 30 V V.
- the moving speed is not necessarily required to be constant. It is a good week because the imaging conditions at 0 a are constant.
- the image gm penetration section 130 is obtained by the ⁇ C C D force camera 20.
- the image collector S receives the image signal S i, and generates and outputs image data D i, which is a captured image in the vicinity of the electrode ⁇ ⁇ from the image signal si ⁇ . More RAM
- the image storage section 150 is stored in the temporary storage section 140. By performing a ringing process on the image data Di stored in the memory 100, a predetermined region outside the captured image near the electrode 92 is deleted, and the sampling is performed.
- FIG. 7 is a schematic diagram for explaining the automatic V mining process.
- the image 51 in the figure is centered on the image V data D1 and the center coordinates of the electrode 92 are aligned with the imaging position 20a.
- the triangular boundary line 52 indicated by a dotted line is set as a boundary 1 including a captured image of the electrode 92 and surrounding a slightly larger area than its surroundings.
- the center position of the area inside the sensing boundary 5 2 coincides with the center coordinates of the electrode 9 2.
- the trimming boundary line 52 for the image 51 is a / k
- the image captured by the electrode 92 is processed by a well-known image recognition processing method.
- the trimmed image data D i ′ that can generate the image data D 1 ′ can be discarded by the large-capacity storage unit 160.
- the image data D1 stored by the large storage unit 160 is stored in the hard disk 16 via the interface 15 later. This is the target of the beep inspection performed by the inspection unit 170.
- the processing procedure related to the imaging operation of the computer 10 corresponding to the above functions will be described below with reference to FIG.
- FIG. 8 is a flowchart showing a processing procedure related to the imaging operation of the computer 10. One of this computer 10 To
- the signal generator 110 is a function of the function described above.
- the semiconductor chips 9 included in the semiconductor gen are the semiconductor chips 9 included in the semiconductor gen.
- Step S10 receives the array information Ia regarding the arrangement of the electrodes 1 and the arrangement of the electrodes 92, etc. ⁇
- the center coordinates of the electrodes 92 included in the semiconductor chip 91 are calculated, and the calculated coordinates are respectively corresponded.
- Step S10 To perform the initial setting process that converts the memory address into a memory address and writes the memory address, pad, and center coordinates.
- Step S10 it is also possible to calculate the center coordinates of all the electricity 92 included in all the semiconductor chips and write the corresponding coordinates in the memory and the memory.
- the XY stage control unit 120 places the semiconductor nano 90 so that the predetermined starting point P 1 is adjusted to the imaging position 20 a of the CCD force camera 20.
- the trigger signal generating section 110 determines whether or not the center coordinates of the pixel coincide with the imaging position 20a based on the end signal Se (step S300). In the event that the judgment in step S30 is repeated, the trigger signal generator 110 outputs the trigger signal st (step 7). Step S40). Note that the flash signal Sf is output immediately after the trigger signal St1) is output, as described above.
- the image reading unit 130 receives the image signal S i obtained by the cCD force camera 20, and, based on the image signal S i of ⁇ , an image table which is a captured image of the electrode and its vicinity. Data D i is generated, and the temporary storage section 140 temporarily stores the image data D i.
- the XY stage control unit 120 causes the imaging position 20 a of the CCD camera 20 to exceed the center coordinate of the electrode 92 at the end farthest in the X direction. (1) judge whether or not to finish reading the image in the X direction.
- step S30 the process of sending a trigger signal at the trigger point is repeated until the image reading in the X direction is completed (S60 ⁇ S 3 0 ⁇ S 4
- the imaging position 20a is the end point P
- the XY stage control unit 1 20 moves the mounting table of the XY stage 40 on which the semiconductor wafer 90 is mounted, in order to align the imaging position 20a of the CCD camera 20 with the Y coordinate corresponding to the next electrode row. Then, a predetermined motor control signal Sm for causing the XY stage 40 to be generated is given to the XY stage 40 (step S80).
- the image trimming section 150 cuts a predetermined area other than the area including the captured image of the electrode 92 from the image data Di stored in the temporary storage section 140. By performing a trimming process to generate trimmed image data D i,
- Step S900 Note that the trimming process of>-is performed for all the image data Di (specifically, for all the electrodes 92 arranged in the X direction) stored in the temporary storage unit 140. This is performed on the captured image) at once.
- the image trimming section 150 is used for the probe mark inspection by the probe mark inspection section 170 with respect to the image data D i, which has been subjected to the trimming.
- Creates data with additional information including predetermined numbers and annotations (step S100), and the large-capacity storage unit 160 performs image trimming.
- the above-mentioned data to which the additional information is added by the unit 150 is stored (step S110). After that, as described in HU, the processing is step S
- steps S90 to S110 uses the movement time for moving the position of the XY stage 40 in the processing of step S800. Done. Note that the combination If the processing speed of the user 10 and the storage speed of the hard disk 16 are sufficiently fast, these processes may be performed immediately after the image capturing process of step S50. . Further, these processes may be performed in parallel with the process of step S80 (and the processes executed thereafter).
- step S60 If it is determined in step S60 that the imaging position 20a has reached the end point P2, the image reading operation for the semiconductor chip ends. If there is a semiconductor chip from which an image is to be read, the above process is started from the beginning after the probe mark inspection operation described below is completed.
- the probe mark inspection operation includes a picked-up image of an electrode including a probe mark serving as a model, and an electrical characteristic inspection (forming an probe mark to be subjected to the probe mark inspection operation).
- an image of the electrode 92 included in the semiconductor chip 91 is required. Therefore, the procedure of the entire process including the above-mentioned probe mark inspection operation will be described.
- FIG. 11 is a flowchart showing an overall processing procedure when performing a probe mark inspection in the present embodiment.
- step S1 an image for registering, as a model, probe marks in an ideal state formed on all electrodes included in a predetermined semiconductor chip (image processing for model registration) is performed. Specifically, it is completely different from the specified inspection probe to be inspected for probe marks. Includes when there is no time (for example, when it is new) ⁇ ⁇ In order to clarify the position of the newly formed bleeding mark, a new or new bleeding mark must be removed.
- a probe mark is formed on the chip using the above-described predetermined inspection probe.
- step S2 the imaging process for model registration (step S2).
- the image of the electrode including the probe traces as the model obtained by the above is deciphered to calculate and store the barycentric coordinates of the model-to-model traces.
- Model registration processing is performed.
- a well-known method is used to calculate the barycentric coordinates by such image analysis. For example, a pixel included in the image included in the image or a pixel constituting the boundary thereof is determined based on the luminance of the pixel. ⁇ -Based on the coordinates of these detected pixels, the barycentric coordinates of the map are calculated. Nine ⁇ The barycentric coordinates are set in advance for the semiconductor chip 91;
- the coordinates are in a predetermined coordinate system defined by the array, and array information Ia including information on the coordinate system is a wafer information record.
- the information is stored in the large-capacity storage unit 160 together with information such as a predetermined number used for the inspection of the trace of the probe by the probe 70.
- information such as a predetermined number used for the inspection of the trace of the probe by the probe 70.
- the following Various calculations are performed based on the center coordinates of the probe marks, but if the coordinates of feature points exhibiting properties that are commonly included in all probe marks (for example, the pixel coordinates of the minimum Y coordinate, etc.) Can be used instead of the center of gravity coordinate
- the information obtained by the processing of the step S 1 S 2 can be used repeatedly until the above-mentioned predetermined inspection probe becomes abnormal. It only needs to be performed once, for example, when using the outlet for the first time. In addition, even if there is a gap between a plurality of inspection devices, the predetermined inspection
- the above information may be configured to be shared by these multiple detection devices via a predetermined network etc.
- step S3 the imaging of the electrodes included in the semiconductor chip 91 before the test (imaging calculation processing for minute calculation) is performed.
- This imaging processing is performed for all the electrodes included in the predetermined semiconductor chip 91. This may be performed only on the four electrodes arranged near the corner of the semiconductor chip 91. In addition, all the electrodes of the semiconductor chip included in the semiconductor wafer 90 may be removed.
- step S4 a probe test is performed on all the semiconductor chips included in the predetermined semiconductor wafer, 90, by a predetermined probe test apparatus equipped with the predetermined inspection probe.
- probe marks to be subjected to probe mark inspection are formed on the electrodes.
- step S5 an image of the electrode including the probe mark formed by the probe test (image processing for probe mark inspection) is performed by the probe mark reading apparatus.
- This operation is the above-described imaging operation described with reference to FIG. Note that, unlike the case of the model registration imaging process (step S1), the probe image formed by the probe test is included in the electrode image acquired by the imaging here. In addition to traces, it is possible that one or more probe traces formed by different (eg, previous) probe tests are included
- step S6 a predetermined probe mark inspection process is performed based on the image of the electrode obtained by the probe mark inspection imaging process (step S5). The details of this processing will be described later.
- step S7 a further detailed inspection is performed based on the result obtained in step S6 (a probe mark inspection process). Professionals judged An image of the electrode containing the trace is extracted from the large storage section 160, and the shape and size of the trace are analyzed in detail. This detailed inspection is typically performed by visual inspection of an operator. The detailed inspection of-may be omitted if necessary.
- FIG. 12 is a flowchart showing a processing procedure for detecting a probe mark of the computer 10.
- the probe trace inspection unit 170 which is one of the functions realized by the computer 10, uses the model of the position of the probe trace formed by the above-mentioned mouthpiece as a model.
- An initial vector calculation process is performed to calculate a vector (hereinafter referred to as an “initial vector”) indicating how much the position has changed from the position of the registered plug-to-print mark.
- Step S210 the detailed processing (subroutine) of the initial vector calculation processing will be described with reference to FIG. Fig. 13 is a flowchart showing the procedure of this subroutine.
- the probe mark inspection section 170 is used to detect the corners of the semiconductor chip 91, that is, four corners of the electrode image obtained by the probe mark inspection imaging process (step S 5).
- the image data of the four electrodes (hereinafter referred to as “corner pads”) arranged near the corners are read out from the large-capacity storage unit 160 (step S211).
- the probe mark inspection unit 170 detects the probe mark formed by the probe test from the corner pad image obtained in step S211 (step S2). 2 1 2) In the case that the image of Conapad contains only one probe, it is extremely easy to detect the trace of the probe.However, as described in, ⁇ , Contains not only the mark formed by the above-mentioned test but also one or more mark formed by the different (more than one) test. The image processing for difference calculation is performed from the image of the node obtained in step S211 above.
- Step V Step S 3 The difference between the image of the current test and the image of ⁇ ⁇
- Fig. 1 Detects traces of pumps formed by a test.
- FIG. 4 is a diagram for explaining the difference calculation of. Image in figure
- A shows the image of the computer pad of the test
- image B shows the image of the napad after the test.
- the single-chip mark inspection unit 170 calculates the center-of-gravity coordinates of one single-point mark from the image of the single-point-and-one-point mark obtained in step S212. Calculate (Step S)
- step S 2 Is the same as described in the module registration process (step S 2), and the center of gravity coordinate of the semiconductor chip 91 is calculated with respect to the semiconductor chip 91. It must be described in advance that the coordinates are in the predetermined coordinate system It is
- the prop mark inspection unit 170 calculates the center position C i of these barycentric coordinates from the barycentric coordinates of the corner probe marks obtained in step S213 (step S211). 4) In addition, since the center of gravity of the contact mark does not always coincide with the center of the electrode, the center position C i is located near the center of the semiconductor chip 91, which is not the center of the semiconductor chip 91.
- the probe mark inspection section 170 performs the model registration processing.
- the coordinates of the center of gravity of the probe mark serving as the model stored in step S1 are shown in the vicinity of the four corners of the semiconductor chip.
- the coordinates of the center of gravity of the probe mark (hereinafter referred to as “modenole corner mark”), which is the location of the electrode electrode, are located in the large storage unit.
- the probe mark inspection unit 1700 calculates the center position Cm of these barycentric coordinates from the barycentric coordinate force of the Modenoleco-nap mark that was extracted in step S215. (Step V S 2
- this center position C m is the center position of the semiconductor chip 91 and its vicinity that does not coincide with the center position C i.
- the probe mark inspection unit 170 calculates the vector (from the center position C m calculated in step S 2 16) to the center position C i calculated in step S 2 14.
- the initial vector for calculating the “initial vector J” is obtained from the probe traces registered by the model using the probe traces formed by the above-mentioned project. It is used as a vector indicating the deviation in subsequent processing.
- the process ends, the process returns to the process shown in Fig. 12.
- the initial vector is calculated from the center position C i calculated based on the barycenter coordinates of the kona probe trace and the center position C m calculated based on the barycenter coordinates of the model probe probe mark.
- the reason will be described in detail with reference to FIG. Fig. 15 is a schematic diagram for explaining the initial vector calculation.
- the semiconductor chip 910 shown in the figure has six electrodes 921 to 926, and these electrodes are Includes 931 to 936, which are formed by probe testing.
- the probe traces 831 to 836 registered in the modules corresponding to these probe traces are indicated by dotted lines, and the center of gravity of the probe traces is indicated by crosses.
- the line connecting the position of the center of gravity of the corner probe 933 of the semiconductor chip 910 and the position of the center of gravity of 934, which is indicated by the center position of the circle, and the mark 931,9 of the corner probe The model / reco-nap ⁇ -bu traces 8 3 3 8 3 4 so that the intersection of the line with the center line of the center of gravity of 36 becomes' b 1AZ. 3 ⁇ 4C i in these probe traces.
- the intersection of the line connecting the centers of gravity and the line connecting the centers of gravity of the model naps 831 and 836 is the center position Cm of these probe marks.
- the initial vector Vi obtained by vectoring the center position C force to the center 1K position C i is the trace of the model probe.
- the vectors indicating the direction in which the inspection probe is shifted should be the same and equal to the initial vector, but the inspection must have been performed multiple times. Due to aging such as bending, chipping, and abrasion, the position of the semiconductor chip deviates from the ideal arrangement, and furthermore, the ideal position force when positioning the semiconductor chip 910 is determined. This is because deviation occurs. In particular, when the semiconductor chip 910 is placed on the XY stage 40, it may be displaced from the ideal position in the X and Y directions or in the rotation direction. There are many and. The amount of deviation in the rotational direction is such that a relatively large variation can be seen in the corner pad V of the semiconductor chip 910.
- the initial vector is calculated as described above, focusing on the nap-open mark. In order to completely average the deviations, it is preferable to calculate the vector from the probe trace as a model to the probe trace formed by the test for all the electrodes. On the other hand, on the other hand, the amount of calculation is large, so that the processing takes a lot of time, and it is not preferable to quickly detect a probe mark.
- the initial vector is calculated by focusing on the four napads.In particular, the amount of deviation in the rotational direction can be averaged sufficiently accurately. It is suitable because the initial vector can be calculated at high speed.
- the initial vector is calculated from the center 11Z. C i and the center C m, but the
- the vector to the average position of a part or all of the positions of the centers of gravity of 3, 934, 936 may be set as the initial vector. Further, the initial vector may be calculated based on a predetermined probe mark other than the modenole nap mouth mark and the corner mark.
- a value of 0 indicates a judgment range calculation process for judging pass / fail of the pop mark (step S220).
- the probe mark formed on the power node by the probe test is the initial probe mark from the model probe mark as long as there is no abnormality in the inspection probe.
- the range that indicates the limit for this neighborhood that is located in the vicinity of 1 AI that has moved by the direction and distance indicated by the knob is here called the judgment range.
- the displacement of the probe mark position formed by the probe mouth and the maximum displacement amount of all the probe mark positions formed by the inspection probes that are all the motors It is necessary to determine in consideration of the amount of deviation caused by aging due to multiple probe tests, and this will be described below with reference to FIGS. 16 and 17.
- FIG. 16 is a schematic diagram for explaining the amount of displacement caused by the first probe p1
- FIG. 17 shows the amount of displacement caused by the second probe P2.
- Ra indicates the displacement of the position of the probe mark formed by the first and second probes P 1 P 2 having different shapes
- the dotted line indicates Show the range of the deviation.
- This shift Ra is calculated from the bending and bending calculated based on the shapes of the first and second pubs P 1 and P 2, the rigidity of the metal as the material and the applied load. It can be obtained in advance by numerical calculation.
- RM is based on all the test probes used when the first and second probes 1 are used as a monitor probe.
- the displacement RM which indicates the maximum deviation of the position of the one-shot mark, can be easily obtained from the positions of the one-mark marks registered in all models. For example, the X coordinate of the center of gravity of
- the difference between the minimum value and the maximum value for the Y coordinate is calculated, and the value obtained by dividing the larger value of the difference by 2 and adding Ra to RM is considered as RM.
- the deviation amount RM is larger than the deviation amount Ra because the shape of each inspection port has a slight variation.-
- the mounting position is slightly different from the calculated position. It may be due to slight deviation.
- RT is the maximum deviation of the mark positions of all probe marks formed by all the inspection probes, taking into account the deviation caused by aging due to multiple testing. .
- the amount of deviation RT can be easily obtained from the positions of all the pump traces actually formed, but on the other hand, the amount of calculation is large, so that the processing takes a lot of time and the speed is high.
- a predetermined coefficient larger than 1 obtained by empirically examining the shadow of the aging is multiplied by the deviation-RM.
- the deviation RT is calculated from Put out. In addition, it is good to calculate taking into account the deviation of the four napbs.
- the ⁇ -p mark inspection unit 170 sets the inside of a circle having a radius equal to the deviation RT calculated as follows as the above-mentioned judgment m range.
- the probe mark inspection unit 170 extracts 57-degree image of the electrode to be subjected to the probe mark inspection from the large-capacity storage unit 160 (step S230).
- the probe mark inspection unit 1700 performs pass / fail judgment processing of the contact mark included in the extracted electrode image (step S240). Detailed processing (supple-chain) will be described.
- Figure 18 is a flowchart showing the procedure of the subroutine (1).
- the probe mark detection section 170 is the weight of the mub-registered probe mark that is centered on the electrode exposed in step S230.
- the probe mark detecting unit 1700 determines the step S230 from the center of gravity of the probe mark that is a mog that has been extruded in step S230. Calculate the coordinates of the point separated by the distance and the direction of the initial vector calculated in step (S2422). Ideally, this point (the above center coordinates) In order to determine the barycentric coordinates of the pi mark formed by the butt mouth in the vicinity, the determination area may be determined around this point.
- the probe mark inspection unit 170 sets the center of the center coordinate of the determination range calculated in step S242 as the center.
- BX is determined using a circle having a radius of the deviation RT calculated in S 220 as a determination range (step S 243).
- the judgment range is circular, but any shape such as a square may be used.
- the probe mark inspection unit 1700 detects a probe mark from a predetermined region of the polar image within the determination range transmitted by BX in step S243 (step S24).
- a known image processing method such as a detection method based on the luminance of a pixel is used for detecting a probe mark, as in the case of the present embodiment. Only probe traces are detected. ⁇ It is not necessary to scrutinize the entire electrode image.Therefore, probe traces can be detected.
- the tip trace inspection section 170 determines in step S243 whether a trace has been detected (step S243).
- Step S 2 4 In the case where a test mark is detected, the test mark is judged to be good, and the P half 'J Ab / TB result is recorded in memo y 10a. Make a temporary record and return to the processing of FIG. 12 (Step s2444). If no probe mark is detected, it is determined that the relevant probe mark is defective. At the same time, the relevant web page is temporarily stored in a memory V or the like, and the process returns to the processing of FIG. 12 (step S2445). If a part of the ⁇ -mark is detected, the entire mark is detected, and the mark is treated as if the ⁇ -mark was not detected.
- FIG. 19 shows the process for determining whether the prop mark is good or bad.
- FIG. 9 is a diagram showing an example of detection of a ⁇ -p mark on the electrode.
- O The image 927 of the electrode shown in the figure is the same as the ⁇ -p mark 937 formed by the current P-p test. Includes 957a9557b and 957C formed by the probe test formed by the previous probe test.
- the model registered probe trace 873 corresponding to the probe ⁇ trace 937 is indicated by a dotted line, and the center of gravity of the probe trace is indicated by the cross mark. Indicated by the center position o Referring to Fig. 19 ⁇ From the image within the circular judgment range due to the presence of the pup mark 937 in the circle of radius RT from the center coordinate of the judgment range A ⁇ -p mark is detected. This is a scar
- FIGS. 2A and 2B are diagrams showing another example of detection of a pi-p mark in the process of judging the quality of a probe mark.
- Each element of the figure o is shown in FIG. For O, the same elements are denoted by the same reference numerals and description thereof will be omitted.
- the examples shown in FIGS. 2A and B0 are different from the examples shown in FIGS. 19A and 19B in that there is a probe mark 937 force S outside the circle of radius RT from the center coordinate of the judgment range. Therefore, no mark on the mouth is detected from the image within the circular judgment range. Therefore, the hole 9 3 7 is determined to be defective.
- step S 240 when the pass / fail judgment processing (step S 240) as described above is completed, the ⁇ -p mark detection section 17 In the case of 0, based on the judgment of the above B determination process ⁇ £; pp ⁇ , if the opening mark is not good, the processing of step S260 is omitted and the step S270 is omitted. 0 is performed, and if the u-bu trace is good, the processing of step S260 is performed. 2 5 0)
- the probe mark inspection unit 1700 determines whether or not the probe mark position id is good with respect to the probe mark determined to be good. Perform position judgment processing (Step S 2 6
- a protection part (passivation part) is formed near the edge of the suspension pole, and the area occupied by probe marks is maintained. When overlapping with some areas, problems such as poor conduction in the test may occur. For this reason, it is necessary to judge that the probe marks and marks are not good at the mouth of the drum where the duplication occurs as described above.>-
- Fig. 2 A and B1 show the maximum and minimum values of the X and Y coordinates of the above-mentioned probe mark.
- Xma X indicates the maximum value of the X coordinate of the probe mark.
- X min indicates the minimum value of the X coordinate,
- Y max indicates the maximum value of the ⁇ coordinate, and
- Y mi 11 indicates the minimum value of the Y coordinate.
- step S7 the area occupied by the probe marks 937 and the degree of proximity of the protective part are also determined.
- FIG. 2 A and B2 are diagrams showing boundaries for checking the degree of closeness of ⁇ . Any one of Xma, XminYmaX and Ym1n is the boundary of whistle 1. Line 9
- the pit mark position is determined to be defective, and the When the coordinates correspond to the inside of the first boundary line 901 and the outside of the second offset line 902, the prop mark does not overlap with the protection part but is relatively small. Therefore, it can be said that the probe mark position is important, and the probe mark, which is the coordinate corresponding to the inside of the second boundary line 902, is separated from the protective part. Therefore, the judgment result (whether it is bad, key required, or good) such that the pump mark position is judged to be good is temporarily stored in the memory.
- step S 260 when the above-described probe mark position determination processing (step S 260) is completed.
- the probe mark inspecting section 170 stores the memory or the like. Based on the various judgment results temporarily stored in the storage area, a process for creating a soda is performed to a predetermined amount (step S
- the classification header of 270 0 includes, for example, the test date and time, test machine number ⁇ Pubmanore (model mark), ⁇ e ⁇ ⁇ , ⁇ mouth ⁇ name ⁇ ⁇ t t3 ⁇ chip number ⁇ chip number ⁇ Pin (electrode) number, probe port size ⁇ £ (probe mark good / bad judgment) result, probe position result location ⁇ £ probe mark detection parameter, etc.
- the result of the probe judgment (testing the quality of the probe mark) is the result obtained by the process of judging the quality of the probe mark (step s240).
- the position determination result including the deviation amount RT obtained by the determination range calculation processing (step S220) is sent to the probe mark position determination processing (step S260).
- Predetermined probe mark detection Includes data indicating that the result is "poor” ⁇ "Survey required J or factory good”.
- the parameters include the coordinates of the center of gravity of the probe mark, the values of X max, and X min Y ma Y min, and the area and aspect ratio of the probe mark obtained by a predetermined calculation. May be included.
- the soda is associated (linked) with the image file of the corresponding electrode and stored in the large-capacity storage unit 160 (a predetermined folder or the like).
- step S7 that is performed later by Kedah to such a classification, it is possible to efficiently specify and extract the image of the electrode to be inspected and the electrode to be inspected.
- the pump mark inspection unit 170 judges whether or not the images of all the electrodes included in the semiconductor chip 91 have been read and inspected (step S280). If all the images have not been read out, read out the image of the next electrode.
- step S210 to S270 The operation of the computer 10 including the above-described processing (steps S210 to S270) is performed after the imaging operation of the electrodes of the semiconductor chip is completed. If the processing speed of the computer 10 is fast enough, every time one electrode is imaged, even if a probe mark inspection operation is performed on that electrode, o these operations are performed in parallel. May be done.
- the semiconductor mounted on the mounting table is moved by the XY stage 40 at a constant speed in the X direction.
- the electrodes illuminated by the flash of the light source 30 are moved to the CCD camera 20. , The image is taken in order. With this configuration, the probe can obtain the image of the electrode in a short time without the need for the user to use all the labor and in a short time. Can be read o
- 1 is an electrode that is illuminated for a short time by the flash of light source 30.
- the configuration is such that the images are sequentially taken by the CCD camera 20.
- the mouthpiece reader 1 can prevent blurring of the captured image, and can be compared with control using a physical shutter device or the like. Easy image capture Can be obtained
- the present ⁇ -no-SJD capture device the present ⁇ -no-SJD capture device
- the trigger signal generator 110 included in 1 is
- the coordinates corresponding to the center of all the electrodes 92 to be imaged are calculated based on the array information Ia on the array of 92 and the like. Because of this, the arrangement of 11Z.
- the arrangement of 11Z which is not necessarily arranged at equal intervals, can be changed at a high speed. It can be read.
- the probe mark reading apparatus 1 performs a time-consuming image difference calculation only when calculating the initial vector.
- the quality of the probe mark is determined based on the initial vector value and a predetermined determination range (deviation amount RT).
- the quality of the probe mark formed by the last probe test even if the image of the electrode includes a plurality of probe marks, is good. It is possible to judge the quality of the position at high speed. For example, if 1 0
- the difference calculation is performed by subtracting the image of the probe m from the image of the electrode for pin 0.
- the time required for one difference calculation is about 200 seconds, and the time required for the last
- the time required to read one image of the mouth test ⁇ is about 30 jsec, so it takes about 230 seconds (approximately 4 minutes) for the inspection of all probes. But it's pretty.
- the probe mark inspection according to the present embodiment is performed on the image of the electrode for the 100-th pin, Since the time required to detect one probe mark is about 10 milliseconds, all probe mark inspections are completed in about 10 seconds. Therefore, it can be seen that the probe mark detection in the present embodiment is performed at a very high speed.
- probe mark inspection operation in the present embodiment, a relative Since accurate position detection is performed, probe mark inspection can be accurately performed without being affected by, for example, a change in the brightness of a pixel during image acquisition.
- the image 5 including the captured image of the electrode 9 2 (
- the number of electrodes 92 included in the image data Di is configured to be one.
- the number of 2 may be plural. For example, when the midpoint position of the straight line connecting the centers of the adjacent electrodes, that is, the middle position of the adjacent electrodes and the imaging ilL 20a coincide.
- the electrodes 92 included in the image data Di are 2 It is configured to be one.
- FIG. 9 is a diagram illustrating an example of an image 51 including captured images of two electrodes 92 a and 92 b according to this configuration.
- the center position of the area inside the mining boundary lines 52a and 52b is determined by the array information Ia of the electrodes 92a and 92b indicated by the wafer information storage section 105. It can be easily calculated from the force. Therefore, trimming ⁇ ru idp- ⁇ i-
- the boundary lines 52a and 52b can be easily formed. Therefore, when the picked-up image of the electrodes 92a 92b is recognized by a known image recognition process, it is not necessary to perform a trimming process, and the trimming J * field line 52 can be easily obtained. a, 5 2 b Internal electrode 9 2 a,
- FIG. 10 is a diagram exemplifying an image 51 including captured images of ⁇ four and a half electrodes 92 a to 92 e.
- the center position of 5 2 e can be easily calculated from the array information I a on the electrode array and the like indicated by the quenching information storage unit 105 as in “1 mouth” as in “1 port”.
- a plurality of trimmed image data D i which are composed of the captured images of the electrodes 92 a to 92 e inside 2 e.
- the pole 92 e is discarded because the whole is not imaged, but the entire image is generated by combining with the remaining part of the next image to be imaged. It may be.
- the XY stage 40 According to the configuration in which the images of two or more electrodes are acquired by the imaging operation of &&, two images are acquired in one imaging time by the CCD force camera 20. Since the images of the above electrodes can be acquired in order, the XY stage 40
- the prober 1 can acquire an image of the electrode in a further fee time and read a probe mark.
- a plurality of electrodes to be imaged are arranged adjacent to each other in the X direction as shown in FIG. 10, but a plurality of m-poles adjacent to each other in the ⁇ direction or adjacent to each other in the X and ⁇ directions.
- the configuration may be such that a plurality of electrodes are imaged at once. In this configuration, it is possible to increase the moving distance in the Y direction of the imaging position 20a after the scanning in the X direction is completed (for example, to move two or more lines). Acquires and removes traces of props
- the light source 30 emits a high-intensity flash for a period of time of about a few microseconds from the point in time when the flash signal Sf is given.
- 20 is configured to acquire a captured image without blur.However, if the configuration is to acquire a captured image without blur, the CCD from the light source 30 to the semiconductor sharpener through 90 is used.
- a new shutter device that normally shuts off the optical path and operates so as to open the optical path for a short time at a predetermined time is added.
- the configuration of the shutter may be realized electronically. According to these configurations, the light source 30 is not limited to a flash such as a xenon flux lamp.
- the configuration that controls the Y stage 40 may be used. However, in the configuration of the above, the average speed becomes slow because acceleration and deceleration are repeated. Therefore, the above embodiment in which the moving is performed at a constant high speed The configuration of the state is better V ⁇ ⁇ .
- the imaging position 20a is linked by moving the position of the semiconductor antenna 90 to be imaged by the XY stage 40 (the XY stage is moved.
- the imaging position 20a is moved in the X and Y directions by changing the position or imaging angle of the CCD force camera 20 instead of 40. It is possible to use a configuration in which a re-installation device is provided. Further, the XY stage 40 is omitted, and the reflecting mirror is arranged so that the image of the electrode 92 is given to the CCD force camera 20 via the reflecting mirror, and the angle of the reflecting mirror is changed. Accordingly, a configuration may be provided in which a reflection angle changing device that moves the imaging position 20a of the cCD camera 20 in the X direction and the Y direction is provided. Further, by combining these configurations as appropriate, the configuration may be such that the imaging position is continuously moved.
- the configuration is such that the electrodes 92 included in one semiconductor chip after the semiconductor wafer 90 are sequentially imaged.
- the configuration is such that the entire semiconductor nano 90 is sequentially imaged. It may be.
- the configuration may be such that when imaging 1 in the X direction, the electrodes 92 included in the plurality of semiconductor chips are sequentially imaged. Even when imaging is performed in this way, the information storage unit 10
- the force S which is a configuration in which the F-K back control is performed based on the encoder signal se from the XY stage 40. If the XY stage control unit 120 can accurately determine the position where the mounting table of the XY stage 40 should be, based on this position, without being based on the encoder signal S e, The control may be performed.
- a probe is provided for an image of an electrode obtained by continuously imaging the semiconductor wafer 90 on the (XY stage) that moves at a constant speed by the CCD camera 20.
- a mark inspection operation is performed, but in order to realize the probe mark inspection operation, it is sufficient that a captured image of the electrode pad exists. Therefore, as a premise of the probe mark detection operation, the imaging operation does not necessarily have to be performed.
- an image of an electrode may be acquired by a conventional imaging operation, which is different from the present apparatus.
- An image of the electrode captured by the device may be provided to the device, and the probe mark inspection operation may be performed based on the provided image.
- the description of the above embodiment can also be applied to a probe mark inspection device that performs only the probe mark inspection operation.
Abstract
Description
Claims
Priority Applications (2)
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EP03754153A EP1557876A4 (en) | 2002-10-28 | 2003-10-16 | PROBE MARK READER AND METHOD FOR READING A PROBE MARK |
AU2003273025A AU2003273025A1 (en) | 2002-10-28 | 2003-10-16 | Probe mark reader and probe mark reading method |
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EP (1) | EP1557876A4 (ja) |
KR (1) | KR100738693B1 (ja) |
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- 2003-10-16 EP EP03754153A patent/EP1557876A4/en not_active Withdrawn
- 2003-10-16 AU AU2003273025A patent/AU2003273025A1/en not_active Abandoned
- 2003-10-16 KR KR1020057007243A patent/KR100738693B1/ko active IP Right Grant
- 2003-10-16 WO PCT/JP2003/013256 patent/WO2004038786A1/ja active Application Filing
- 2003-10-24 TW TW092129625A patent/TW200423276A/zh not_active IP Right Cessation
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TWI498578B (zh) * | 2014-01-29 | 2015-09-01 | King Yuan Electronics Co Ltd | 半導體元件測試系統及其影像處理加速方法 |
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US7026832B2 (en) | 2006-04-11 |
KR100738693B1 (ko) | 2007-07-12 |
EP1557876A1 (en) | 2005-07-27 |
TWI318430B (ja) | 2009-12-11 |
US20060139628A1 (en) | 2006-06-29 |
KR20050055041A (ko) | 2005-06-10 |
US7224175B2 (en) | 2007-05-29 |
AU2003273025A1 (en) | 2004-05-13 |
EP1557876A4 (en) | 2009-06-24 |
US20040081349A1 (en) | 2004-04-29 |
TW200423276A (en) | 2004-11-01 |
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