WO2004006389A1 - コネクタ、このコネクタの製造方法、およびこのコネクタを用いた配線板構造 - Google Patents
コネクタ、このコネクタの製造方法、およびこのコネクタを用いた配線板構造 Download PDFInfo
- Publication number
- WO2004006389A1 WO2004006389A1 PCT/JP2003/008541 JP0308541W WO2004006389A1 WO 2004006389 A1 WO2004006389 A1 WO 2004006389A1 JP 0308541 W JP0308541 W JP 0308541W WO 2004006389 A1 WO2004006389 A1 WO 2004006389A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- connector
- wiring
- base material
- pressing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 123
- 239000000463 material Substances 0.000 claims abstract description 89
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 7
- 239000000806 elastomer Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000233855 Orchidaceae Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Definitions
- the present invention relates to a connector for connecting a plurality of wiring boards, a connector manufacturing method, and a wiring board structure using the connector.
- a plurality of wiring bases are housed inside an electronic device, and a connector is known as a means for connecting the plurality of wiring bases.
- the connector includes a base material, an adhesive layer provided over the entire surface of the base material, and wiring protruding from the surface of the adhesive layer.
- the wiring of the connector has a plurality of straight lines parallel to each other.
- the wiring substrate includes a substrate in which a plurality of grooves parallel to each other are formed, and a wiring provided on the bottom surface of the groove in the substrate. Therefore, the wiring of the portion of the wiring base connected to the connector (hereinafter referred to as the connector connection portion) is also formed of a plurality of straight lines parallel to each other.
- the two wiring bases are arranged side by side, and the connector is attached so as to straddle the connector connecting portions of the two wiring bases. That is, the protruding wiring of the connector is fitted into the groove of the wiring board. This allows the wiring of the connector to be connected to the wiring of each wiring board, and the adhesive layer of the connector to be used as the base of the wiring base.
- Adhesion to the material prevents relative displacement.
- the wiring of the connector connecting portion and the wiring of the connector have to be a plurality of straight lines parallel to each other. Therefore, the degree of freedom in designing the wiring pattern of the wiring board has been reduced. Disclosure of the invention
- an object of the present invention is to provide a connector, a connector manufacturing method, and a wiring board structure using the connector, which can ensure the degree of freedom in designing a wiring pattern on the wiring board.
- the wiring pattern of the connector and the wiring board since the wiring pattern of the connector and the wiring board must be formed in a plurality of straight lines parallel to each other, the degree of freedom in designing the wiring pattern of the wiring board is limited. Accordingly, the applicant has proposed that the wiring of the connector be provided with a pressing portion higher than the surface of the base material and the wiring of the wiring board be formed at substantially the same height as the surface of the base material. Was found to be improved.
- the adhesive layer of the connector does not contact the surface of the wiring board, and thus it is difficult to attach the connector to the wiring board.
- the applicant has focused on a portion of the base material surface of the connector except for the wiring, and has conceived of using a space between this portion and the wiring board. . That is, the holding portion is provided in a portion of the base material surface of the connector other than the wiring.
- the present invention provides the following.
- a connector connectable to a wiring board comprising: a non-conductive base material; and a conductive wiring provided on a surface of the base material, wherein the connector is provided to protrude from the wiring.
- a holding portion having a mounting surface protruding from a portion other than the pressing portion and having a mounting surface attachable to the wiring board.
- the conductive wiring and the pressing portion are made of a conductive material having high electric conductivity (low electric low efficiency).
- the conductive material include metal materials such as copper, silver, and aluminum, conductive polymers, organic materials such as carbon, inorganic materials such as ceramics including oxides, and combinations thereof. .
- a metal material having a high electric conductivity and an organic material having a relatively low elastic modulus are particularly preferable.
- a non-conductive substrate is formed of a non-conductive material having low electric conductivity (high electric resistivity).
- the non-conductive material includes, for example, organic materials such as bakelite and inorganic materials such as glass.
- the wiring board includes, for example, a plate-shaped base material and wiring formed on at least one surface of the base material.
- the pressing portion may be partially non-conductive as long as it has conductivity as a whole.
- the pressing portion may be provided with a spring or the like inside.
- the holding portion may be provided on the entire surface of the substrate except for the pressing portion, or may be formed in a small rectangular or circular shape and scattered on the surface of the substrate. This holding portion may be attached to the surface of the base material of the connector by adhesion, adhesion, or the like.
- the material and height of the pressing portion and the holding portion may be determined as appropriate.
- the connector includes the base material, the wiring, the pressing portion, and the holding portion. Further, for example, a wiring board is configured to include a base material and wiring. Then, the connector is stacked facing the wiring board. As a result, The pressing portion of the connector contacts the wiring of the wiring board, and the wiring of the connector and the wiring of the wiring board are electrically connected via the pressing portion. At this time, since the holding portion is provided in a portion other than the pressing portion, the pressing portion can surely contact the wiring board. Therefore, since the wiring provided on the surface of the wiring board can be made flat, the degree of freedom in designing the wiring pattern of the wiring board can be secured.
- the connector holding portion is attached to the wiring board, the relative displacement between the connector and the wiring board can be prevented, and the connector and the wiring board can be securely connected.
- the connector is connected to the wiring board in the following procedure.
- the pressing portion of the connector is elastically deformed, and the distance between the connector and the wiring board is shortened, so that the holding portion of the connector comes into contact with the base material of the wiring board.
- the pressing portion of the connector presses the wiring board away from the connector by an elastic restoring force.
- the holding portion of the connector is pulled and extended toward the wiring board by the pressed and moved wiring board.
- the holding member generates an elastic restoring force that pulls the wiring board toward the connector.
- the base material of the connector or the wiring board is lower than the rigidity of the pressing portion or the holding portion.
- the base material of the connector / the base material of the wiring board is deformed.
- the connector is deformed.
- the rigidity of the wiring board base material is lower than the rigidity of the connector base material, the wiring board is deformed.
- the rigidity of the base material of the connector is equal to the rigidity of the base material of the wiring board, both the connector and the wiring board are deformed.
- the pressing portion or the holding portion is deformed.
- the holding portion can be attracted to the wiring board like a suction cup. Therefore, the connector can be securely held by the wiring board.
- a silicone-based or acrylic-based adhesive is applied to the mounting surface.
- the adhesive specifically, an adhesive containing at least one of YR3286 and YR3340 (trade name) manufactured by GE Toshiba Silicone Co., Ltd. is preferable.
- removable means that it can be detached at least twice.
- the attachment surface may be made removable by applying a predetermined glue component.
- the glue component include those that respond to a chemical stimulus and those that respond to a temperature change such as hot melt.
- the structure in which the height of the pressing part and the holding part changes in response to chemical stimuli and temperature changes It may be.
- the engagement includes, for example, a mechanical connection such as a hook and a loop such as a Velcro (registered trademark).
- a wiring board structure comprising: a wiring board; and a connector connected to the wiring board, wherein the connector has a non-conductive base material, and a conductive material provided on a surface of the base material.
- a conductive pressing portion protrudingly provided on the wiring; and a mounting surface protruding from a portion of the surface of the base material other than the pressing portion and capable of being mounted on the wiring board.
- the wiring board comprises: a non-conductive base; and a conductive wiring provided on the surface of the base
- the connector comprises: A wiring board structure, wherein the pressing portion of the connector comes into contact with the wiring of the wiring board and the holding portion is attached to the wiring board by being overlapped with the wiring board.
- the wiring board is electrically connected to the connector described above.
- the wiring of the wiring board may be formed on the base material in a planar manner by printing or the like, or may be formed three-dimensionally.
- the contact pressure between the pressing portion and the wiring board is determined by the pressing force of the pressing portion against the wiring board, the pulling force of the holding portion pulling the wiring board, and the physical properties of the pressing portion and the wiring board.
- a base material is formed, wiring is formed on the base material in a predetermined pattern using a conductive material, a mask layer is formed on the wiring, and a mask mold having an opening at a predetermined position is arranged on the mask layer.
- a pressing portion having conductivity is formed so as to protrude from the wiring, and is formed on the base material.
- An adhesive layer is formed over the entire surface, and a mask mold for covering a portion other than the pressed portion of the adhesive layer is arranged.
- the mask mold is irradiated with light for removing the mask layer from above the mask mold. Is removed by etching Method for producing a connector for a holding portion having a mounting surface for attachment to the circuit board, formed to protrude in a portion other than the pressing portion of the surface of the substrate.
- FIG. 1 is a sectional view showing a wiring board structure according to a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view of the wiring board structure according to the embodiment in a state where the pressing portion is in contact with the wiring board.
- FIG. 3 is a cross-sectional view showing a state where the connector and the wiring board are connected in the wiring board structure according to the embodiment.
- FIG. 4A is a cross-sectional view of the wiring board structure according to the embodiment in a state where the base material of the connector is formed.
- FIG. 4B is a cross-sectional view showing a state in which wiring is formed on the surface of the substrate in the wiring board structure according to the embodiment.
- FIG. 4C is a cross-sectional view showing a state where a mask layer is formed on the wiring in the wiring board structure according to the embodiment.
- FIG. 4D is a sectional view showing a state where the mask layer is irradiated with ultraviolet rays in the wiring board structure according to the embodiment.
- FIG. 4E is a cross-sectional view showing a state where a part of the mask layer is disassembled in the wiring board structure according to the embodiment.
- FIG. 4F is a cross-sectional view of the wiring board structure according to the embodiment, in which a part of the mask layer has been removed.
- FIG. 4G is a cross-sectional view of the wiring board structure according to the embodiment in a state where the mask mold is removed.
- FIG. 4H is a cross-sectional view of the wiring board structure according to the embodiment, in which a pressing portion is formed.
- FIG. 41 is a cross-sectional view of the wiring board structure according to the embodiment in a state where the mask layer has been removed.
- FIG. 5A is a cross-sectional view showing a state in which an adhesive layer is formed in the wiring board structure according to the embodiment.
- FIG. 5B shows the wiring board structure according to the embodiment, which is arranged on the adhesive layer.
- FIG. 6 is a cross-sectional view of a state where ultraviolet light has been irradiated on the mask mold.
- FIG. 5C is a cross-sectional view showing a state where a part of the adhesive layer is disassembled in the wiring board structure according to the embodiment.
- FIG. 5D is a cross-sectional view of the wiring board structure according to the embodiment in a state where a pressing portion is exposed.
- FIG. 5E is a cross-sectional view of the wiring board structure according to the embodiment in a state where the mask mold is removed.
- FIG. 5F is a cross-sectional view showing a state where the connector is completed in the wiring board structure according to the embodiment.
- FIG. 6 is a sectional view showing a wiring board structure according to the second embodiment of the present invention.
- FIG. 7 is a sectional view showing a wiring board structure according to a third embodiment of the present invention.
- FIG. 8 is a sectional view showing a connector according to a fourth embodiment of the present invention.
- FIG. 9 is an enlarged cross-sectional view illustrating a wiring board structure according to a fifth embodiment of the present invention.
- FIG. 10 is a perspective view showing a state in which a pressing portion is formed in the connector according to the sixth embodiment of the present invention.
- FIG. 11 is a perspective view of the connector according to the embodiment in a state where the pressing portion is hidden.
- FIG. 12 is a perspective view of the connector according to the embodiment in a state where a pressing portion is exposed.
- FIG. 13 is a perspective view showing a connector according to a seventh embodiment of the present invention.
- FIG. 14A is a plan view showing a connector according to an eighth embodiment of the present invention. 2003/008541
- FIG. 14B is a sectional view of the connector according to the embodiment.
- FIG. 15A is a plan view of the connector according to the embodiment, in which a holding portion is not formed.
- FIG. 15B is a cross-sectional view of the connector according to the embodiment in a state where no holding portion is formed.
- FIG. 15C is a longitudinal sectional view of the connector according to the embodiment, in which a holding portion is not formed.
- FIG. 16A is a plan view of a modified example of the connector according to the embodiment.
- FIG. 16B is a sectional view of a modification of the connector according to the embodiment.
- FIG. 17A is a plan view showing a connector according to a ninth embodiment of the present invention.
- FIG. 17B is a cross-sectional view taken along the line XX ′ of FIG. 17A.
- FIG. 18 is a plan view showing the connector according to the tenth embodiment of the present invention.
- FIG. 18B is a sectional view taken along line YY ′ of FIG. 17A.
- FIG. 1 shows a schematic cross-sectional view of a wiring board structure 10 according to the first embodiment of the present invention.
- the wiring board structure 10 has a wiring board 14 and a connector 11 connected to the wiring board 14.
- the connector 11 includes a non-conductive base material 12 and a conductive wiring 13 provided on the surface of the base material 12. Further, the connector 11 is provided with a plurality of pressing portions 16 protrudingly provided on the surface of the base material 12 and protrudingly provided on a portion of the surface of the base material 12 excluding the pressing portion 16. And a holding portion 18.
- the wiring board includes a non-conductive base material 20, and a conductive wiring 21 provided on the surface of the base material 20.
- the rigidity of the base material 12 of the connector 11 is lower than the rigidity of the pressing part 16, the holding part 18, and the base material 20 of the wiring board 14.
- the pressing part 16 includes a conductive pressing part 16A formed of metal and disposed on the wiring 13 and a pressing part 16B not disposed on the wiring 13.
- the pressing portions 16A and 16B have a substantially conical shape, and are attached to the base material 12 at the bottom using an adhesive.
- the pressing portions 16A and 16B have a substantially conical shape, a large contact area between the bottom surface of these pressing portions 16A and 16B and the base material 12 can be secured.
- 16 A and 16 B can be securely joined to the substrate 12.
- the pressing portions 16A and 16B are not limited to a substantially conical shape, and may have a band shape with a conical cross section.
- the holding portion 18 is attached to the base material 12 with an adhesive.
- the holding portion 18 has a substantially columnar shape, and the portion on the bottom surface side and the upper surface side is wider than the middle portion.
- the upper surface of the holding portion is a mounting surface 19 that can be mounted on the wiring board 14. Further, the height of the holding portion 18 is slightly lower than the height of the pressing portions 16A and 16B.
- the bottom portion of the holding portion 18 is wider than the middle portion, a large contact area between the bottom surface and the base material 12 can be secured, similarly to the pressing portions 16A and 16B.
- the part 18 can be securely joined to the base material 12. Also, since the mounting surface 19 of the holding portion 18 is flat, it can be uniformly contacted with a wiring board 14 described later. You.
- the connector is placed facing the wiring board, and a pressing force is applied to the connector, so that the pressing portions 16 A and 16 B of the connector 11 are connected to the wiring of the wiring board 14 as shown in FIG. 2 Make contact with 1.
- the pressing portions 16 A and 16 B of the connector are pressed by the wiring 21 of the wiring board 14 and are elastically deformed and adhere to the wiring 21 of the wiring board 14.
- the wiring 13 of the connector 11 and the wiring 21 of the wiring board 14 are electrically connected via the pressing portions 16A and 16B.
- the pressing portions 16 A and 16 B of the connector 11 deform elastically, thereby reducing the distance between the connector 11 and the wiring board 14.
- the holding portion 18 contacts the substrate 20 of the wiring board 14.
- the pressing portions 16 A and 16 B of the connector 11 press the wiring board 14 in a direction away from the connector 11 by an elastic restoring force. I do.
- the holding portion 18 of the connector 11 is pulled and extended toward the wiring board 14 by the moved wiring board 14.
- the holding portion 18 has a natural restoring force that pulls the wiring board 14 in a direction approaching the connector 11 side.
- the rigidity of the base material 12 of the connector 11 is 3008541
- the base material 12 of the connector 11 is greatly deformed.
- the elastomer 54 is provided on the base film 52. ( Figure 4A). This elastomer 54 becomes the base material 12 of the connector 11.
- an adhesive layer 55 is provided on the elastomer 54, and a copper foil 56 as a conductive material is bonded in a predetermined pattern (FIG. 4B). The copper foil 56 becomes the wiring 13.
- a mask layer 58 is formed on the copper foil 56 (FIG. 4C).
- a mask mold 60 is arranged on the mask layer 58 and irradiated with ultraviolet rays (UV) 64 (FIG. 4D).
- UV ultraviolet rays
- FIG. 4E the mask layer 58 not covered by the mask mold 60 is decomposed by ultraviolet rays 64
- FIG. 4F a part of the mask layer 58 is removed
- the mask mold 60 is removed by etching (FIG. 4G). Further, by performing pattern etching on a portion where the mask layer 58 is removed and the copper foil 56 is exposed, an electrode 66 is formed (FIG. 4H). This electrode 66 is usually called a bump and serves as a pressing portion 16. Finally, the mask layer 58 is removed by etching (FIG. 41). Next, a procedure for forming the holding portion 18 will be described with reference to FIGS. 5A to 5F. That is, an adhesive layer 73 made of an adhesive is formed over the entire surface of the copper foil 56 and the electrode 66 (FIG. 5A).
- a mask mold 61 covering a portion other than the electrodes 66 is arranged and irradiated with ultraviolet rays 64 (FIG. 5B).
- the adhesive layer 73 on the electrode 66 is decomposed and removed with ultraviolet light 64 (FIG. 5C), and the electrode 66 is exposed (FIG. 5D).
- the mask mold 61 is removed by etching, and the whole is cleaned (FIG. 5E).
- the base film 52 is removed (FIG. 5F). Thereby, the connector 11 is completed.
- FIG. 6 shows a cross-sectional view of a wiring structure 1OA according to the second embodiment of the present invention.
- the rigidity of the base material 20 of the wiring board 14 is less than the rigidity of the pressing parts 16A and 16B, the holding part 18 and the base material 12 of the connector 11. It is different from the first embodiment in that it is lower. Therefore, in the present embodiment, the base material 20 of the wiring board 14 is greatly deformed by being pressed by the pressing portions 16A and 16B.
- FIG. 7 shows a cross-sectional view of a wiring structure 10B according to the third embodiment of the present invention.
- the rigidity of the pressing portions 16 A and 16 B is smaller than the rigidity of the holding portion 18, the base material 20 of the wiring board 14, and the base material 12 of the connector 11. This is different from the first embodiment in that it is lower. Therefore, in the present embodiment, the pressing portions 16A and 16B are greatly deformed by being compressed by the base material 20 of the wiring board 14 and the base material 12 of the connector 11.
- the pressing portion 16 is formed of a conductive elastomer.
- the present invention is not limited to this, and a spring mechanism may be incorporated in the pressing portion.
- the edge of the mounting surface 19 of the holding portion 18 is in close contact with the wiring board 14. I have. Therefore, according to the present embodiment, a large contact area between the mounting surface 19 and the wiring board 14 can be ensured.
- FIG. 8 shows a sectional view of a connector 11C according to a fourth embodiment of the present invention.
- the shape of the holding portion 18C in the connector 11C is different from that of the first embodiment. That is, the holding portion 18C is higher than the pressing portion 16 and the mounting surface 19C is concave.
- the holding portion 18C can be attracted to the wiring board like a suction cup, the connector 11C can be more reliably held on the wiring board 14.
- FIG. 9 shows an enlarged cross section of a wiring structure 1 OD according to a fifth embodiment of the present invention.
- the structure of the holding portion 18D of the connector 1ID and the structure of the substrate 2OD of the wiring board 14D are different from those of the first embodiment.
- a plurality of hooks 3 21 and a plurality of loops 301 are provided on the mounting surface 19 D of the holding portion 18 D.
- a portion of the base material 2 OD of the wiring board 14 D to which the mounting surface 19 D of the holding portion 18 D is attached is provided with a plurality of hooks 3 21 on which the holding portion 18 D is engaged. Hooks 322 that engage the loop 302 and the loop 301 of the holding portion 18D are provided. Therefore, according to the present embodiment, the holding portion 18D can be securely attached to the wiring board 14D.
- FIGS. 10 to 12 show a manufacturing procedure of the connector 11E according to the sixth embodiment of the present invention.
- a wiring 86 is formed of a conductive material on a base material 84 formed of an elastomer, and a pressing portion 88 is formed on a part of the wiring 86.
- the adhesive layer 92 is formed by applying an adhesive. Thereby, the adhesive layer 92 is also formed on the pressing portion 88, and the convex portion 94 is formed.
- the adhesive layer 92 may be formed by covering an adhesive sheet.
- the adhesive layer 92 that forms the convex portion 94 is removed by ultraviolet irradiation or the like, and a rectangular opening 96 is formed to expose the pressing portion 88, as shown in FIG.
- the method of removing the adhesive layer 92 is not limited to ultraviolet irradiation, and may be cut out with a cutter knife or the like.
- FIG. 13 shows a connector 11F according to a seventh embodiment of the present invention.
- the present embodiment is different from the sixth embodiment in that a rectangular opening 96 is made continuous to form a band-shaped opening 98.
- FIGS. 14A and 14B show a connector 11G according to an eighth embodiment of the present invention.
- a base material 102 is formed of an elastomer, and a conductive material is formed on the base material 102.
- a wiring 108 having a property is formed, and a columnar pressing portion 110 is formed on a part of the wiring 108.
- a hollow cylindrical holding portion 122 is formed around the cylindrical pressing portion 110 with an adhesive.
- the pressing portion 110 is slightly higher than the holding portion 122.
- the band-shaped holding portion 132 may be formed so as to surround the plurality of pressing portions 110. Specifically, the holding section 132 surrounds three pressing sections 110 arranged obliquely to the length direction of the wiring 108.
- FIGS. 17A and 17B show a connector 11H according to a ninth embodiment of the present invention.
- the structure of the holding portion 142 is different from that of the eighth embodiment. That is, the holding portion 142 is formed over the entire surface except for the portion where the pressing portion 110 is provided. Therefore, the center of the circular opening 144 formed in the holding portion 144 and the center of the pressing portion 110 substantially coincide with each other. Further, the holding portion 144 is higher than the pressing portion 110 by the dimension t.
- FIGS. 18A and 18B show a connector 11I according to the tenth embodiment of the present invention.
- the structure of the holding section 152 is different from that of the eighth embodiment. That is, the holding portion 152 is formed over the entire surface except for the portion where the pressing portion 110 is provided. Therefore, a strip-shaped opening 154 is formed in the holding portion 152, and the opening 154 is formed by three pressing portions 111 obliquely arranged with respect to the length direction of the wiring 108. Surrounds 0. Further, the holding portion 152 is higher than the pressing portion 110 by the dimension t. It should be noted that the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within a range that can achieve the object of the present invention are included in the present invention.
- the connector of the present invention the method of manufacturing the connector, and the wiring board structure using the connector, the following effects can be obtained.
- the pressing portion of the connector contacts the wiring of the wiring board, and the wiring of the connector and the wiring of the wiring board are electrically connected via the pressing portion.
- the holding portion is provided in a portion other than the pressing portion, the pressing portion can surely contact the wiring board. Therefore, since the wiring provided on the surface of the wiring board can be made flat, the degree of freedom in designing the wiring pattern of the wiring board can be secured. Also, since the connector holding portion is attached to the wiring board, the relative displacement between the connector and the wiring board can be prevented, and the connector and the wiring board can be securely connected.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03762886A EP1536520A4 (en) | 2002-07-05 | 2003-07-04 | CONNECTORS, MANUFACTURING METHOD THEREFOR AND PCB STRUCTURE THEREWITH |
JP2004519272A JPWO2004006389A1 (ja) | 2002-07-05 | 2003-07-04 | コネクタ、このコネクタの製造方法、およびこのコネクタを用いた配線板構造 |
KR1020057000105A KR100975185B1 (ko) | 2002-07-05 | 2003-07-04 | 커넥터, 이 커넥터의 제조 방법 및 이 커넥터를 이용한배선판 구조 |
US10/520,162 US7303402B2 (en) | 2002-07-05 | 2003-07-04 | Connector, method for manufacturing the same, and wiring board structure employing it |
AU2003244213A AU2003244213A1 (en) | 2002-07-05 | 2003-07-04 | Connector, method for manufacturing the same, and wiring board structure employing it |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-197020 | 2002-07-05 | ||
JP2002197020 | 2002-07-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004006389A1 true WO2004006389A1 (ja) | 2004-01-15 |
Family
ID=30112385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/008541 WO2004006389A1 (ja) | 2002-07-05 | 2003-07-04 | コネクタ、このコネクタの製造方法、およびこのコネクタを用いた配線板構造 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7303402B2 (ja) |
EP (1) | EP1536520A4 (ja) |
JP (1) | JPWO2004006389A1 (ja) |
KR (1) | KR100975185B1 (ja) |
CN (1) | CN1333494C (ja) |
AU (1) | AU2003244213A1 (ja) |
TW (1) | TWI228959B (ja) |
WO (1) | WO2004006389A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006066729A (ja) * | 2004-08-27 | 2006-03-09 | Toshiba Corp | 回路基板モジュールとその製造方法 |
US20140331275A1 (en) * | 2013-05-01 | 2014-11-06 | International Business Machines Corporation | Context-aware permission control of hybrid mobile applications |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9692147B1 (en) * | 2015-12-22 | 2017-06-27 | Intel Corporation | Small form factor sockets and connectors |
Citations (5)
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JPS6116884U (ja) * | 1984-07-02 | 1986-01-31 | パイオニア株式会社 | コネクタ構造 |
JPS6361704U (ja) * | 1986-10-14 | 1988-04-23 | ||
JPH04116374U (ja) * | 1991-03-28 | 1992-10-16 | 信越ポリマー株式会社 | 弾性コネクター |
JPH07282878A (ja) * | 1994-04-01 | 1995-10-27 | Whitaker Corp:The | 異方導電性接続部材及びその製造方法 |
JP2001210933A (ja) * | 1999-11-18 | 2001-08-03 | Japan Aviation Electronics Industry Ltd | 導体パターンの形成方法及びその形成方法を用いて製造される配線部材、コネクタ、フレキシブルプリント配線板、異方導電性部材 |
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US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
KR970005934B1 (ko) * | 1994-08-17 | 1997-04-22 | 대우전자 주식회사 | 모니터의 테스팅 회로 |
SE516748C2 (sv) * | 1996-12-19 | 2002-02-26 | Ericsson Telefon Ab L M | Sammansättningsstruktur innefattande minst ett flip-chip och ett substrat |
CN1242108A (zh) * | 1996-12-23 | 2000-01-19 | Scb技术公司 | 可表面连接的半导体桥接元件、器件和方法 |
JP4042182B2 (ja) | 1997-07-03 | 2008-02-06 | セイコーエプソン株式会社 | Icカードの製造方法及び薄膜集積回路装置の製造方法 |
JP2000207943A (ja) * | 1999-01-11 | 2000-07-28 | Sony Corp | 異方性導電膜及び異方性導電膜を用いた電気的接続装置 |
US6213784B1 (en) * | 2000-05-15 | 2001-04-10 | National Starch And Chemical Investment Holding Corporation | Electrical connector |
-
2003
- 2003-07-04 CN CNB038159848A patent/CN1333494C/zh not_active Expired - Fee Related
- 2003-07-04 TW TW092118352A patent/TWI228959B/zh not_active IP Right Cessation
- 2003-07-04 EP EP03762886A patent/EP1536520A4/en not_active Withdrawn
- 2003-07-04 US US10/520,162 patent/US7303402B2/en not_active Expired - Fee Related
- 2003-07-04 KR KR1020057000105A patent/KR100975185B1/ko not_active IP Right Cessation
- 2003-07-04 JP JP2004519272A patent/JPWO2004006389A1/ja not_active Withdrawn
- 2003-07-04 AU AU2003244213A patent/AU2003244213A1/en not_active Abandoned
- 2003-07-04 WO PCT/JP2003/008541 patent/WO2004006389A1/ja not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6116884U (ja) * | 1984-07-02 | 1986-01-31 | パイオニア株式会社 | コネクタ構造 |
JPS6361704U (ja) * | 1986-10-14 | 1988-04-23 | ||
JPH04116374U (ja) * | 1991-03-28 | 1992-10-16 | 信越ポリマー株式会社 | 弾性コネクター |
JPH07282878A (ja) * | 1994-04-01 | 1995-10-27 | Whitaker Corp:The | 異方導電性接続部材及びその製造方法 |
JP2001210933A (ja) * | 1999-11-18 | 2001-08-03 | Japan Aviation Electronics Industry Ltd | 導体パターンの形成方法及びその形成方法を用いて製造される配線部材、コネクタ、フレキシブルプリント配線板、異方導電性部材 |
Non-Patent Citations (1)
Title |
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See also references of EP1536520A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006066729A (ja) * | 2004-08-27 | 2006-03-09 | Toshiba Corp | 回路基板モジュールとその製造方法 |
US20140331275A1 (en) * | 2013-05-01 | 2014-11-06 | International Business Machines Corporation | Context-aware permission control of hybrid mobile applications |
Also Published As
Publication number | Publication date |
---|---|
TWI228959B (en) | 2005-03-01 |
CN1666384A (zh) | 2005-09-07 |
JPWO2004006389A1 (ja) | 2005-11-10 |
KR20050016957A (ko) | 2005-02-21 |
EP1536520A1 (en) | 2005-06-01 |
EP1536520A4 (en) | 2007-04-04 |
AU2003244213A1 (en) | 2004-01-23 |
US20060105587A1 (en) | 2006-05-18 |
CN1333494C (zh) | 2007-08-22 |
KR100975185B1 (ko) | 2010-08-10 |
US7303402B2 (en) | 2007-12-04 |
TW200410616A (en) | 2004-06-16 |
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