WO2003092343A1 - Structure d'interconnexion de cartes a circuits imprimes - Google Patents

Structure d'interconnexion de cartes a circuits imprimes Download PDF

Info

Publication number
WO2003092343A1
WO2003092343A1 PCT/JP2003/003520 JP0303520W WO03092343A1 WO 2003092343 A1 WO2003092343 A1 WO 2003092343A1 JP 0303520 W JP0303520 W JP 0303520W WO 03092343 A1 WO03092343 A1 WO 03092343A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
board
circuit board
connection structure
printed
Prior art date
Application number
PCT/JP2003/003520
Other languages
English (en)
Japanese (ja)
Inventor
Hideki Sasaki
Yoshiyuki Hashimoto
Tomoo Murakami
Takahiro Kimura
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Publication of WO2003092343A1 publication Critical patent/WO2003092343A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes

Definitions

  • the present invention relates to a structure for connecting printed circuit boards such as a flexible printed circuit (FPC) board and a rigid printed circuit (RPC) board mounted on many electronic devices to each other.
  • printed circuit boards such as a flexible printed circuit (FPC) board and a rigid printed circuit (RPC) board mounted on many electronic devices to each other.
  • FPC flexible printed circuit
  • RPC rigid printed circuit
  • Small information terminals such as mobile phones and PDAs (Personal Digital Assistants), often require multiple printed circuit boards because many electronic components must be mounted in a limited space.
  • a connector having both an electrical connection function and a mechanical holding function, solder, ACF (Anisotropic Conductive Film), It is common to use an electrical connection material such as ACP (Anisotropic Conductive Paste).
  • Figures 26 and 27 show examples using connectors, and Figure 28 shows examples using connection materials.
  • Figure 26 shows an example where two RPC boards are overlaid via a connector.
  • a male connector 102a is mounted on one RPC board 100
  • a female connector 102b is mounted on the other RPC board 101, and the two boards are connected using both connectors.
  • a connection between the two boards is realized by mounting a connector 105 on the surface layer of the RPC board 103 and inserting a part of the FPC board 104 into the connector 105.
  • FIG. 28 shows an example in which an FPC board 104 is connected to an RPC board 103 using a connection material 106 such as solder. If solder is used as the connection material, apply solder paste to the terminals formed on the RPC board surface, and place the FPC board terminals on top of it and temporarily fix them, and apply heat and pressure to these terminals. The two substrates are connected by giving. When using ACF or ACP, sandwich the ACF or ACP between the terminals of the RPC board and the terminals of the FPC board, and connect the terminals of the two boards by applying heat and pressure to the terminals as with solder I do.
  • solder is used as the connection material
  • ACF or ACP sandwich the ACF or ACP between the terminals of the RPC board and the terminals of the FPC board, and connect the terminals of the two boards by applying heat and pressure to the terminals as with solder I do.
  • Information terminals such as mobile phones often use the latest expensive components, so if a component mounted on a board is defective, it must be replaced immediately with the smallest unit in which the component is mounted. Is required to be detachable.
  • the boards can be attached and detached, but the mounting space and mounting height on the board are larger than when connecting materials are used.
  • the mounting space and mounting height can be reduced compared to when a connector is used, but the boards cannot be attached or detached. Therefore, in the above two modes, the above two requests cannot be satisfied simultaneously.
  • Fig. 29 shows a cross-sectional view of the main part of this conventional technology. This is a structure in which a concave female connector 111 is provided on a multilayer printed circuit board 110, and a male connector 112 is inserted therein.
  • Multilayer printed circuit board 110 the outer layer printed circuit board 108, 109 male connector 112 to the c female connector 111 which is formed by integrally fixed overlapping the upper and lower surfaces of the inner insulating plate 107 is inserted, the male connector The terminal 112 contacts the terminal 113 of the female connector 111, and the connection between the two substrates is realized.
  • the structure described in the above publication makes it possible to reduce the mounting space and mounting height of the board and to attach and detach the board, which are required in mobile terminals and the like.
  • the connection reliability of the connector is reduced.
  • the miniaturization of the terminal pitch makes it easier for one connector terminal to be connected across two terminals or to be connected to the next terminal.
  • An object of the present invention is to solve the above-mentioned problems of the prior art.
  • the purpose of the present invention is to ensure that the terminal of one substrate contacts the terminal of the other substrate without erroneous connection or short circuit. That is to do.
  • a first printed board having irregularities on a side surface and a second printed board having irregularities that mesh with the irregularities of the first printed board have respective irregularities. are arranged so that they engage with each other.
  • a connection structure between printed circuit boards, wherein terminals are provided.
  • a concave substrate entrance is provided on a side surface of the first printed circuit board, and a convex substrate entrance inserted into the substrate insertion opening is provided on the second printed circuit board.
  • a concave substrate entrance is provided on a side surface of the first printed circuit board, and a convex substrate entrance inserted into the substrate insertion opening is provided on the second printed circuit board.
  • either an insulating substrate or a third printed circuit board is bonded to the upper and lower surfaces of the first printed circuit board, respectively.
  • FIGS. 1A and 1B are a perspective view showing a board connection structure according to one embodiment of the present invention and an exploded perspective view of a female print board.
  • FIG. 2 is a perspective view showing a substrate connection structure according to another embodiment of the present invention.
  • 3A, 3B, and 3C are cross-sectional views of the female printed circuit board used in the present invention.
  • FIG. 4 is an exploded perspective view of a female printed circuit board used in the present invention (part thereof).
  • FIG. 5 is an exploded perspective view of the female printed circuit board used in the present invention (part thereof).
  • 6A and 6B are exploded perspective views (part 3) of the female printed circuit board used in the present invention.
  • 7A, 7B, 7C, and 7D are cross-sectional views of the male printed circuit board used in the present invention.
  • FIG. 8 is a plan view showing a terminal structure (No. 1) used in the present invention.
  • 9A, 9B, 9C, 9D, 9E, 9F, and 9G are plan views for explaining a method of manufacturing a terminal structure (part 1) used in the present invention. is there.
  • FIG. 10 is a plan view showing a terminal structure (part 2) used in the present invention.
  • FIG. 11A, FIG. 11B, FIG. 11C, FIG. 11D, FIG. 11E, and FIG. 11F illustrate a method of manufacturing the female side of the terminal structure (part 2) used in the present invention.
  • FIG. 6 is a plan view showing the order of steps for performing the steps.
  • 12A and 12B are plan views in the order of steps for explaining the method of manufacturing the male side of the terminal structure (No. 2) used in the present invention.
  • FIG. 13 is a plan view showing a terminal structure (part 3) used in the present invention.
  • FIG. 14 is a plan view showing a terminal structure (part 4) used in the present invention.
  • FIG. 15 is a plan view showing a terminal structure (part 5) used in the present invention.
  • FIG. 16 is a plan view showing a structure for preventing the female printed circuit board from peeling off.
  • FIG. 17 is a cross-sectional view (part 1) illustrating a structure for preventing the female printed circuit board from peeling off.
  • FIG. 18 is a sectional view (part 2) showing a structure for preventing the female printed circuit board from peeling off.
  • FIG. 19 is a perspective view showing a structure for holding contact between terminals (part 1).
  • FIG. 20 is a plan view showing a structure (part 2) for maintaining contact between terminals.
  • FIG. 21 is a plan view showing a structure (part 3) for maintaining contact between terminals.
  • FIG. 22 is a plan view showing a structure (part 4) for maintaining contact between terminals.
  • FIG. 23 is a plan view showing a terminal structure with a hook action (No. 1).
  • FIG. 24 is a plan view showing a terminal structure with hook action (No. 2).
  • FIG. 25 is a plan view showing a terminal structure with hook action (No. 3).
  • FIG. 26 is a side view showing the conventional technology (No. 1).
  • FIG. 27 is a side view showing a conventional technique (part 2).
  • FIG. 28 is a side view showing a conventional technique (part 3).
  • FIG. 29 is a cross-sectional view showing a conventional technique (part 4).
  • FIG. 1A is a perspective view showing one embodiment of the present invention
  • FIG. 1B is an exploded perspective view of the female printed circuit board 1.
  • a concave opening 5 is provided on the side surface of the female printed circuit board 1, and the convex portion 6 of the male printed circuit board 2 is inserted into the opening 5.
  • the terminal of each board is formed on the side surface 3 inside the opening 5 on the female printed board 1 and on the side of the front end of the convex portion 6 inserted on the male printed board 2. 4 is provided.
  • the female printed circuit board 1 is manufactured by bonding the outer insulating plates 1a and 1c to the inner printed board 1b provided with the recess 5 on the side surface using, for example, an epoxy-based adhesive. Is done.
  • FIG. 2 is an exploded perspective view showing another embodiment of the present invention.
  • a concave portion 7 is provided on the side surface of the female printed circuit board 1, and the convex portion 6 of the male printed circuit board 2 is inserted into the concave portion 7, and the side surface of the female printed circuit board 1 is inserted.
  • the terminals provided on the side 3 of the male print substrate 2 are brought into contact with the terminals provided on the substrate 3, and then adhesive tape 8 is adhered to the connection portions of the substrates from the upper and lower surfaces to establish connection between the two substrates.
  • the adhesive tape 8 may be adhered to only one side.
  • FIG. 3 shows a configuration example of the female printed circuit board 1.
  • the female printed circuit board 1 has a terminal 9 formed on the side surface and a wiring pattern 10 formed on the surface.
  • 1c may be bonded.
  • outer insulating plates 1a and 1c may be bonded to both surfaces of an inner printed circuit board 1b having wiring patterns 10 on both surfaces.
  • an outer printed circuit board 1d and le having a wiring pattern 10 are arranged on both sides of an inner printed circuit board 1b having a wiring pattern 10, and a through space between the wiring patterns 10 is provided. It may be a multilayer printed circuit board connected at hole 11.
  • FIGS. 3A to 3C show the case where only one inner layer printed board 1 b having a concave portion (opening 5) is formed.
  • the inner printed board 1b may be laminated. That is, as shown in Fig. 4, two or more inner-layer printed boards 1b are stacked with the inner-layer insulating board 1f interposed therebetween, and the outer-layer insulating boards 1a and 1c are arranged on the upper and lower surfaces of the laminate. You may.
  • the female printed circuit board 1 may be configured by using a printed board instead of the insulating boards la, lc, and 1f.
  • two or more inner printed circuit boards 1b are bonded and laminated without interposing an inner insulating plate, and outer insulating plates la and 1c are arranged on the upper and lower surfaces of the laminate.
  • the female printed circuit board 1 can be configured by using a printed board instead of the outer insulating boards la and 1c.
  • a plurality of recesses (openings 5) may be provided in one inner layer printed board so that connection to another printed board can be made at a plurality of locations. That is, as shown in FIGS.6A and 6B, the concave portion 7 is formed on one side of the inner printed circuit board 1b (in the case shown in FIG.6A) or on a different side (in the case shown in FIG.6B).
  • the outer insulating plates la and 1c may be arranged on the upper and lower surfaces.
  • a printed board may be arranged instead of the outer insulating boards la and 1c.
  • FIG. 7 is a cross-sectional view illustrating a configuration example of the male-side printed board 2.
  • the male-side printed circuit board 2 is a single-sided printed circuit board having terminals 12 formed on the side surface and a wiring pattern 13 formed on the surface
  • a double-sided printed circuit board in which wiring patterns 13 are formed on both sides and the wiring patterns on the front and back surfaces of the board are connected via through holes 14 may be used.
  • the outer printed circuit boards 2a and 2c are arranged on the upper and lower surfaces of the inner printed circuit board 2b, respectively, and the wiring patterns 13 of each layer are connected through through holes 15 to form a multilayer printed circuit board.
  • the projections 6 may be provided on a single printed board, for example, an outer printed board 2c.
  • a plurality of protrusions 6 are provided on one printed board, and are connected to a plurality of female printed boards or a female printed board having an inner printed board having a plurality of recesses (see FIG. 6A). You may do so.
  • the outer printed circuit boards 2a and 2c each having the convex portion 6 may be laminated via the inner insulating plate 2d to form the male printed circuit board 2.
  • An inner printed board may be used instead of the inner insulating board 2d.
  • Two female printed circuit boards can be connected to the male printed circuit board 2 configured as described above. Alternatively, it can be connected to a female print substrate (see Fig. 4) that has openings (connections) in two stages.
  • Fig. 8 shows the detailed structure of the terminals formed on the female printed board and the male printed board 2.
  • the contact portions of both substrates are cut into a mountain shape.
  • the inside of the recess 7 of the inner printed board 1b which is the inner layer of the female printed circuit board, is cut out in the shape of a mountain, terminals 9 are provided on one side of the mountain, and the wiring pattern 10 connected to it is printed on the inner printed board 1b. Is provided on at least one of the front and back surfaces.
  • the male printed circuit board 2 is also cut out at the tip of the convex portion 6 in a mountain shape, and a terminal 12 is provided on one side of the mountain shape, and wiring connected to the terminal is provided.
  • the pattern 13 is provided on at least one of the front and back surfaces of the male printed circuit board 2.
  • the terminals are automatically aligned with each other at the time of connection between the boards, and the terminals do not shift sideways, so that the connection of the terminal portions is not visible. Even within the substrate, the terminals can be brought into accurate contact with each other. Also, unlike the conventional technology, when the terminals are formed on the side surface of the substrate, the contact area of the terminals is likely to be reduced. However, the contact area is increased by making the terminal portions uneven.
  • FIG. 8 Next, an example of a method for manufacturing the terminal portion shown in FIG. 8 will be described with reference to FIGS. 9A to 9G.
  • the inner printed board 1b of the female printed board 1 shown in FIG. 1 will be described, but the same applies to the female printed board 1 shown in FIG.
  • a wiring pattern 10 is formed on at least one surface of the inner printed board 1b in advance (FIG. 9A).
  • the cutting line is indicated by a dotted line.
  • a resist film 16 for electroless plating is formed on the entire surface of the inner printed board 1b (FIG. 9B).
  • a recess 7 serving as a substrate insertion portion is formed by a router process or a die punching process so that the terminal portion has a mountain shape (FIG. 9C).
  • An activation treatment is performed to form a catalyst layer 17 for electroless plating, the catalyst layer on the surface is removed by brushing or the like, and the catalyst layer 17 is left only on the side surfaces (FIG. 9D).
  • a glass epoxy resin laminated board such as FR_4 can be used for the substrate material of the inner layer printed board 1b which is an inner layer of the female printed board 1, and a flexible polyimide film can be used for the board material of the male printed board 2.
  • both substrate materials may be rigid plates or flexible plates.
  • connection structure configured as described above, even if the terminal at the contact portion cannot be visually checked, the two substrates are automatically brought into contact with each other along the uneven terminal structure cut into a mountain shape. And the terminals can be connected accurately. Also, by providing the terminals on the end face of the board, the contact area of the terminals is reduced, but the terminal structure is By forming the mold, the contact area can be increased and the increase in contact resistance can be suppressed.
  • FIG. 10 is a plan view showing the structure of the terminals of the inner printed board 1 b of the female printed board 1 and the terminals of the male printed board 2.
  • a terminal 9 is formed at a protruding point ⁇ formed in the inner part of the concave portion 7 of the inner printed board 1b, and a wiring pattern 10 connected to the terminal 9 is formed on at least one of the front and back surfaces of the inner printed board 1b.
  • the male printed circuit board 2 has a semicircular terminal 12 formed at the tip of the convex portion 6, and a wiring pattern 13 connected to the semicircular terminal 12 is formed on at least one of the front and back surfaces of the male printed circuit board 2. Is formed.
  • the terminals do not shift laterally, so that the connection of the terminal portions is not visible in the substrate.
  • the terminals can be brought into accurate contact with each other.
  • the contact area of the terminals tends to be small, but the contacts are ensured by forming the terminals of the male printed circuit board 2 in a semicircular shape .
  • a wiring pattern 10 is formed on at least one of the front and back surfaces of the inner insulating board [FIG. 11A].
  • a resist film 16 for preventing electroless plating is formed on the entire surface of the inner printed board 1b (FIG. 11B).
  • a recess 7 serving as a substrate insertion portion is formed by a router process or a die punching process [FIG. 11C].
  • the catalyst layer 17 is formed by performing an activation treatment against electroless plating, and the catalyst layer on the substrate surface is removed by brushing or the like, leaving only the catalyst layer 17 on the side surface (FIG. 11D).
  • Use a router, carbon dioxide laser, or jagged laser to remove the catalyst other than the terminals (Fig. 11E).
  • the terminal portion is cut out in a circular shape using a carbon dioxide gas laser or a yag laser used for forming a small-diameter via hole.
  • nickel plating and gold plating are performed to form the terminal 9 [Fig. 11F]. Then, if necessary, remove resist film 16 I do.
  • the terminals 12 of the male printed circuit board 2 are manufactured as follows. As shown in Fig. 12A, a wiring pattern 13 is formed, a through hole is opened on the wiring pattern 13 so as to straddle the cutting line indicated by the dotted line, and the inner diameter is plated by a conventional method. Sul — forms hole 18 Finally, as shown in FIG. 12B, the center of the through hole 18 is cut by router processing or die punching to obtain a male printed circuit board 2 having semicircular terminals 12.
  • FIGS. 13 to 15 further show other structural examples of the connection portion.
  • the crests formed at the inner part of the recessed part 7 of the inner printed board 1b and at the tip of the protruded part 6 of the male printed board 2 are not continuous, and the crests It is formed intermittently across the parallel part.
  • the terminals of the inner printed board 1b and the male printed board 2 are formed on the top and bottom of the mountain, respectively, and are connected to the wiring patterns 10 and 13 formed on the board, respectively.
  • the concave and convex portions formed on the inner portion of the concave portion 7 of the inner layer printed board 1 b and the tip portion of the convex portion 6 of the male printed circuit board 2 have a shape in which a part of a mountain shape is removed, Then, it has a trapezoidal shape.
  • the inner printed board 1b and the terminals 9 and 12 of the male printed board 2 are formed on the shorter sides of two parallel sides of the trapezoid, respectively, and the wiring patterns 10 and 13 formed on the board, respectively. Is connected to
  • the trapezoidal shape is intermittently formed with the portion parallel to the side of the substrate being different from the trapezoidal shape shown in FIG.
  • the example is different from the example in Fig. 14 but otherwise the same.
  • FIG. 16 is a plan view of the female printed circuit board 1.
  • Through holes 20 are formed one by one near the edge of the substrate around the opening 5.
  • lands 21 are provided around the through holes 20 on the upper and lower surfaces of the female printed circuit board 1. Be killed. If it is desired to further increase the strength, lands 23 may be provided also in the inner layer as shown in FIG. Furthermore, if this 20 is connected to the inner ground plane layer, it will be more robust. At the same time, increasing the number of through holes is also an effective way to avoid substrate peeling.
  • the male printed circuit board 2 comes off the female printed circuit board 1 due to an external force, and the contact of the terminals is released.
  • the roughness of the inner surfaces of the outer insulating plates l a and l c and the roughness of the front and back surfaces of the male printed circuit board 2 make it possible to hold both boards to some extent, but there is a possibility that the contact parts may come off due to external force.
  • a non-slip rubber 25 is bonded to the bottom surface of the male printed circuit board 2.
  • holes 26 and 27 are formed to penetrate both in the thickness direction of the board, and penetrate them.
  • Insert pin 28 as shown.
  • recesses 29 are provided on both sides of the concave portion 7 formed on the inner printed circuit board of the female printed circuit board 1, and both sides of the convex portion 6 of the male printed circuit board 2, Protrusions 30 corresponding to the depressions 29 are provided.
  • the inner printed circuit board of the female printed circuit board 1 is provided with a depression 29 as shown in FIG. 21 and a hook as shown in FIG. Attach plate 31.
  • the hook plate 31 has a structure in which the projections 32 correspond to the depressions 29 in FIG. 21, and the projections 32 are depressed inward by pushing the projection means 33 inward.
  • the outer insulation board or the outer printed board
  • the locations where the depressions and the projections are formed can be reversed.
  • an ⁇ -shaped terminal recess 34 is formed at the back of the recess 7 of the inner printed board 1 b of the female printed board, and the protrusion 6 of the male printed board 2 is formed.
  • An ⁇ -shaped terminal protrusion 35 is formed at the tip, and when the protrusion 6 of the male printed circuit board 2 is inserted into the recess 7 of the inner layer printed board 1b, the terminal protrusion 35 is formed. It is designed to be inserted into the terminal recess 34.
  • the dimension a of the base of the projection 35 is set smaller than its maximum width b
  • the dimension A of the entrance of the terminal recess 34 is set smaller than its maximum width B. 5 is set smaller than the maximum width b.
  • an ⁇ -shaped terminal recess 34 is formed in the inner portion of the recessed portion 7 of the printed board 1 b
  • an ⁇ -shaped terminal recessed portion 4 is formed in the male printed substrate 2.
  • a terminal protrusion 35 formed by punching in a letter shape is provided. In the example shown in Fig.
  • a trapezoidal terminal recess 34 is formed at the back of the recess 7 of the inner layer printed board lb, and a trapezoid is formed at the tip of the protrusion 6 of the male printed circuit board 2.
  • the terminal protrusion 35 is provided.
  • the entrance of the terminal recess 34 and the tip of the terminal projection 35 are chamfered. The chamfer may be on only one of the substrates.
  • connection structure between printed circuit boards according to the present invention is configured such that the irregularities formed in the terminals are engaged with each other.
  • no lateral displacement occurs when the terminals are connected, short-circuiting or incorrect connection does not occur even if the terminal pitch is reduced, improving the connection reliability between printed circuit boards. It can be done.
  • space saving and low mounting height can be realized while securing the detachability between the substrates.
  • connection structure between printed boards according to the present invention can be applied to printed circuit boards, such as a flexible printed circuit (FPC) board and a rigid printed circuit (RPC) board, mounted on many electronic devices. Suitable for connecting to each other.
  • printed circuit boards such as a flexible printed circuit (FPC) board and a rigid printed circuit (RPC) board, mounted on many electronic devices. Suitable for connecting to each other.
  • FPC flexible printed circuit
  • RPC rigid printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne une structure d'interconnexion de cartes de circuits imprimé, qui comprend une première carte à circuits imprimés (1) présentant des protubérances et des évidements sur sa face latérale, une seconde carte à circuits imprimés (2) présentant des protubérances et des évidements qui viennent s'interconnecter avec ceux de la première carte à circuits imprimés, et des bornes (9) installées au niveau des sections de contact respectives des protubérances et des évidements lorsque la première et la seconde carte à circuits imprimés sont positionnées de telle manière que leurs protubérances et leurs évidements sont interconnectés.
PCT/JP2003/003520 2002-04-25 2003-03-24 Structure d'interconnexion de cartes a circuits imprimes WO2003092343A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002123355A JP2003317830A (ja) 2002-04-25 2002-04-25 プリント基板間の接続構造
JP2002-123355 2002-04-25

Publications (1)

Publication Number Publication Date
WO2003092343A1 true WO2003092343A1 (fr) 2003-11-06

Family

ID=29267482

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/003520 WO2003092343A1 (fr) 2002-04-25 2003-03-24 Structure d'interconnexion de cartes a circuits imprimes

Country Status (2)

Country Link
JP (1) JP2003317830A (fr)
WO (1) WO2003092343A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103120036A (zh) * 2010-09-20 2013-05-22 米尔Mk株式会社 拼接式印刷电路基板
WO2015121532A1 (fr) 2014-02-14 2015-08-20 Nokia Corporation Carte de circuit imprimé et appareil et procédés associés
CN107645832A (zh) * 2017-09-27 2018-01-30 王朝 一种高可靠性pcb续接结构

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006319050A (ja) 2005-05-11 2006-11-24 Toshiba Corp 配線板、コネクタ、および電子機器
KR100725483B1 (ko) 2005-11-18 2007-06-07 삼성전기주식회사 플랫 케이블용 커넥터
JP5438455B2 (ja) * 2009-10-02 2014-03-12 モレックス インコーポレイテド コネクタ
US9590344B2 (en) 2014-09-17 2017-03-07 Helion Concepts, Inc. Ultra low profile PCB embeddable electrical connector assemblies for power and signal transmission
JP2017004675A (ja) * 2015-06-08 2017-01-05 シャープ株式会社 平型ケーブルとコネクタとの接続構造
US11025193B2 (en) 2016-08-16 2021-06-01 Helion Concepts, Inc. Compact, low-profile, multiply configurable solar photovoltaic module with concealed connectors
US20180309003A1 (en) 2017-04-24 2018-10-25 Helion Concepts, Inc. Lightweight solar panels with solar cell structural protection
JP7382721B2 (ja) * 2018-02-09 2023-11-17 古河電気工業株式会社 平板状電線の接続構造及び該接続構造を備えるワイヤハーネス
CN110708869A (zh) * 2019-11-07 2020-01-17 江苏上达电子有限公司 一种线路板及其设计方法
CN111867255B (zh) * 2020-07-07 2021-07-09 胜宏科技（惠州）股份有限公司 一种显示屏用金属化侧壁水平分段的pcb制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210465U (fr) * 1985-07-03 1987-01-22
JPH0274784U (fr) * 1988-11-28 1990-06-07
JPH02177386A (ja) * 1988-12-27 1990-07-10 Nec Corp 電子デバイス
JPH06204639A (ja) * 1992-12-29 1994-07-22 Ibiden Co Ltd 長尺状樹脂製プリント基板の接続方法
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210465U (fr) * 1985-07-03 1987-01-22
JPH0274784U (fr) * 1988-11-28 1990-06-07
JPH02177386A (ja) * 1988-12-27 1990-07-10 Nec Corp 電子デバイス
JPH06204639A (ja) * 1992-12-29 1994-07-22 Ibiden Co Ltd 長尺状樹脂製プリント基板の接続方法
US5429510A (en) * 1993-12-01 1995-07-04 Aehr Test Systems, Inc. High-density interconnect technique

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103120036A (zh) * 2010-09-20 2013-05-22 米尔Mk株式会社 拼接式印刷电路基板
WO2015121532A1 (fr) 2014-02-14 2015-08-20 Nokia Corporation Carte de circuit imprimé et appareil et procédés associés
CN106465540A (zh) * 2014-02-14 2017-02-22 诺基亚技术有限公司 电路板及相关联的装置和方法
CN107645832A (zh) * 2017-09-27 2018-01-30 王朝 一种高可靠性pcb续接结构

Also Published As

Publication number Publication date
JP2003317830A (ja) 2003-11-07

Similar Documents

Publication Publication Date Title
US20050243528A1 (en) Board pieces and composite wiring boards using the board pieces
JP4276883B2 (ja) 多層プリント配線板の接続構造
WO2004098251A1 (fr) Structure de connexion de tableau de connexions imprime
TWI245469B (en) Connecting structure of printed wiring board
WO2004098249A1 (fr) Structure de connexion de carte imprimee
JP2001326441A (ja) 複合配線板及びその製造方法
WO2003092343A1 (fr) Structure d'interconnexion de cartes a circuits imprimes
KR20010087338A (ko) 프린트 배선 기판 및 프린트 배선 기판의 제조 방법
JP2009081342A (ja) 多層プリント配線板とその製造方法
TWI603659B (zh) Printed circuit board and connector to connect the circuit board
CN217721588U (zh) 层叠体
JP2007221077A (ja) プリント配線板の接続構造および接続方法
WO2002015652A1 (fr) Tableau de connexions souple pour connexion avant-arriere
WO2003028165A1 (fr) Tableau de connexions a bornier
CN113423172B (zh) 软硬结合电路板及其制作方法
US6972383B2 (en) Multilayered circuit board
JP2001102743A (ja) 一枚基板化構造
JP5579559B2 (ja) フレキシブルプリント配線板の接続構造
CN114391304B (zh) 板对板连接结构及其制作方法
JPS6011585Y2 (ja) コネクタ−
JP2579133B2 (ja) 多層プリント配線板の製造方法
CN220307461U (zh) 电路板和组合电路板
JPH1126906A (ja) プリント配線板の接続構造
JP2003060324A (ja) プリント配線板
CN116963394A (zh) 嵌埋连接器的电路板及其制作方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase