WO2003084296A1 - Procede de correction des caracteristiques de transmission en circuit, sa structure de correction, et support de cone utilise pour la structure de correction - Google Patents

Procede de correction des caracteristiques de transmission en circuit, sa structure de correction, et support de cone utilise pour la structure de correction Download PDF

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Publication number
WO2003084296A1
WO2003084296A1 PCT/JP2002/003126 JP0203126W WO03084296A1 WO 2003084296 A1 WO2003084296 A1 WO 2003084296A1 JP 0203126 W JP0203126 W JP 0203126W WO 03084296 A1 WO03084296 A1 WO 03084296A1
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WO
WIPO (PCT)
Prior art keywords
circuit
holder
circuit pattern
pattern
transmission characteristic
Prior art date
Application number
PCT/JP2002/003126
Other languages
English (en)
Japanese (ja)
Inventor
Kouichirou Asou
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2002/003126 priority Critical patent/WO2003084296A1/fr
Priority to JP2003581557A priority patent/JPWO2003084296A1/ja
Publication of WO2003084296A1 publication Critical patent/WO2003084296A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method for correcting a transmission characteristic of a circuit, a correction structure, and a holder used for the correction structure, and more particularly to correcting a transmission characteristic of a circuit pattern connecting electronic components mounted on a printed circuit board.
  • the present invention relates to a method, a compensation structure, and a holder used for the compensation structure.
  • the conventional method of correcting the transmission characteristics of a circuit pattern by inserting a dubbing resistor is to print a solder cream on each of the opposing circuit pattern parts (pads for component mounting) with a gap in between, and then use chip resistance. After placing both ends of chip components such as chip capacitor, chip inductor, etc. on the solder cream of the circuit pattern, heat is applied to the solder cream. Was added and melted, and the chip component was soldered between circuit patterns.
  • Japanese Patent Application Laid-Open No. 62-089394 discloses that in a hybrid integrated circuit in which a chip component is mounted on a circuit board, a component holder is provided in a mounting portion of the chip component. It has been proposed. This component holder is provided with electrodes with spring properties at both ends of a flat insulating part. The bottom plate of the electrode part is soldered on the circuit pattern, and the side plates provided on both sides of the bottom plate This is to hold the chip component while electrically connecting it with one end of the chip component in between.
  • Japanese Patent Application Laid-Open No. 62-089394 a jumper connector capable of easily changing the resistance value of the circuit pattern is disclosed in Japanese Patent Application Laid-Open No. 9-923.
  • Japanese Patent Publication No. 64 discloses three types of jumper connectors.
  • the first jumper connector disclosed in Japanese Patent Application Laid-Open No. 9-923364 discloses a first jumper connector between two posts among a plurality of posts penetrating on an insulating plate.
  • the connector body is made of a conductive elastomer and is covered with an insulating cover, and the connector body is provided with a fitting hole for inserting a post.
  • the second jumper connector has a connector body in which a conductive elastomer is laminated on the inner surface of a U-shaped insulating cover in a side view, and is mounted on an edge of a printed circuit board to be printed. It connects the circuit patterns formed on the upper and lower surfaces of the substrate.
  • the third jumper connector has a similar U-shape in side view It has a connector body with a conductive insulator laminated on one of the opposing inner surfaces. It is attached to the edge of the printed circuit board and attached to one side of the printed circuit board. It connects the formed parallel circuit patterns.
  • an object of the present invention is to reduce the labor and time wasted when replacing the conventional chip component, and to easily correct the transmission characteristics of a circuit pattern requiring correction.
  • An object of the present invention is to provide a correction method, a correction structure, and a holder used for the correction structure.
  • a method for correcting the transmission characteristics of a circuit according to the present invention is a method for correcting the transmission characteristics of a circuit connecting electronic components mounted on a printed circuit board.
  • a pair of holding parts that can hold at least one circuit component in two holes so that they can be inserted and removed If the transmission characteristics are insufficiently corrected by attaching a mounting device, another circuit component is added to the holder, so that the circuit transmission characteristics are corrected to be optimal.
  • the transmission characteristic correction structure of the circuit of the present invention that achieves the above object, An apparatus for correcting the transmission characteristics of a circuit connecting electronic components mounted on a printed circuit board, comprising two holes provided at a predetermined distance on a circuit pattern of the circuit, and A land formed by enlarging the circuit pattern around the hole, and inserted into the two holes and electrically connected to the circuit pattern by solder. At least one circuit component is exchangeably held. And a plurality of types of circuit members having a shape which can be exchangeably mounted between the pair of holders and having different functions depending on the built-in circuit elements. And features.
  • the holder is a rod made of a conductive metal, and the circuit member is provided with through holes at the same interval as the interval between the two holes, and these through holes are inserted through the rod. As a result, a configuration in which both ends of the circuit member are connected to the circuit pattern.
  • a head portion can be provided at one end of the rod.
  • a flange may be formed near one end of the rod, and the length from the flange to one end may be longer than the thickness of the circuit board on which the rod is mounted.
  • the retainer is composed of two bases projecting from the base made of insulating material at the same interval as the space between the two holes, and is provided on the bottom side of this base. Indicates that the base of the rod inserted into the hole is protruding.
  • a terminal having a panel property is provided in a portion adjacent to the through hole inside the circuit member, and the panel portion of the terminal protrudes into the through hole. And a circuit element is connected between these terminals.
  • the axis of the through hole of the circuit member is A terminal made of a panel material composed of a base portion and a side wall portion facing the base portion is provided on the upper portion, the axis passes through the base portion, and the front end portion of the side wall portion projects into the through hole.
  • circuit elements are connected between these terminals.
  • the holder is a flexible holder made of a conductive metal, and a concave portion for receiving a circuit member is formed at an opposite portion of the holder, and a mounting pin protrudes at one end.
  • the holder is inserted into the hole through the mounting pin, and the base is fixed in a state where it is electrically connected to the circuit pattern by soldering, and at least one circuit is formed in the recess provided on the free end side.
  • the circuit member is composed of a circuit element portion and two conductor portions located at both ends of the circuit element portion, and the free ends of these conductor portions are formed in the concave portions of the holder. A form that is formed in a shape that is held.
  • the resist is formed on the circuit pattern forming surface of the printed circuit board, and the land and the wiring pattern between the lands are cut with the resist.
  • the holder of the present invention that achieves the above-mentioned object removes and inserts and removes chip-shaped circuit components mounted on the circuit pattern.
  • a plurality of recesses for receiving one end of the circuit member are formed at opposing portions of the holder portion, and mounting pins protrude from the mounting base. The mounting pins are passed through holes in the circuit pattern, and the mounting base is electrically connected to the circuit pattern by soldering in a state where the concave portions are opposed to each other.
  • the transmission characteristic correction method and the correction structure of the circuit of the present invention configured as described above, and the holder used for the correction structure, it is possible to change the constant of the chip component such as the damping resistance without using solder.
  • multiple chip components can be arranged in one place.By changing the components that make up the module of chip components and combining them, capacitors and filters can be combined. This has the effect that various functions can be performed.
  • FIG. 1A is a diagram showing a circuit to which the method for correcting transmission characteristics of a circuit according to the present invention is applied.
  • FIG. 1B is a partially enlarged view of FIG. 1A, showing an example of a state of forming a resist.
  • FIG. 1C is a partially enlarged view of FIG. 1A, and is a view showing another example of a state of forming a resist.
  • FIG. 2A is a perspective view showing a first embodiment of the jumper pin used in the present invention.
  • FIG. 2B is a partially enlarged sectional view showing a method of fixing the jumper pins shown in FIG. 2A to a substrate.
  • FIG. 2C is a perspective view showing a second embodiment of the jumper pin used in the present invention.
  • Fig. 2D shows how the jumper pins shown in Fig. 2C are fixed to the board. It is a partial expanded sectional view.
  • FIG. 3A is a perspective view showing a third embodiment of the jumper pin used in the present invention.
  • FIG. 3B is a partially enlarged cross-sectional view showing a method of fixing the jumper pins shown in FIG. 3A to a substrate.
  • FIG. 4A is a perspective view showing a first embodiment of a first embodiment of a circuit component mounted on a jumper pin used in the present invention.
  • FIG. 4B is a perspective view showing a second embodiment of the first embodiment of the circuit component mounted on the jumper pin used in the present invention.
  • FIG. 4C is a perspective view showing a third embodiment of the first embodiment of the circuit component mounted on the jumper pin used in the present invention.
  • FIG. 4D is a sectional view of a circuit component attached to the jumper pin used in the present invention shown in FIG. 4A.
  • FIG. 5A is a partially enlarged view showing a state where a part of the circuit pattern of FIG. 1B is cut.
  • FIG. 5B is an assembly perspective view for explaining the first embodiment of the circuit transmission characteristic correcting method of the present invention.
  • FIG. 5C is an assembled perspective view for explaining a second embodiment of the method for correcting the transmission characteristics of a circuit according to the present invention.
  • FIG. 6A is a perspective view showing a first embodiment of the second embodiment of the circuit component mounted on the jumper pin used in the present invention.
  • FIG. 6B is a perspective view showing a second embodiment of the second embodiment of the circuit component mounted on the jumper pin used in the present invention.
  • FIG. 6C is a perspective view showing a third embodiment of the second embodiment of the circuit component mounted on the jumper pin used in the present invention.
  • FIG. 7A is a perspective view showing a first embodiment of the third embodiment of the circuit component used in the present invention.
  • FIG. 7B is a perspective view showing a second embodiment of the third embodiment of the circuit component used in the present invention.
  • FIG. 7C is a perspective view showing a third embodiment of the third embodiment of the circuit component used in the present invention.
  • FIG. 7D is a cross-sectional view of the circuit component shown in FIG. 7A.
  • FIG. 8A is a perspective view of a holder used in the present invention.
  • FIG. 8B is a perspective view showing a structure of a holder for mounting the circuit components shown in FIGS. 7A to 7C and a state where the holder is mounted on a circuit pattern.
  • FIG. 8C is a side view illustrating a state where the circuit components shown in FIGS. 7A to 7C are mounted on the holder of FIG. 8B.
  • FIG. 8D is a side view showing a state where a large-sized circuit component of the third embodiment is attached to the holder of FIG. 8B.
  • FIG. 9A is a waveform diagram showing a received signal on a signal receiving side on one circuit pattern when no damping resistor is added in the circuit of FIG. 1A.
  • FIG. 9B is a waveform diagram showing a received signal on the signal receiving side on one circuit pattern when a damping resistor is added in the circuit of FIG. 1A.
  • FIG. 1A is a diagram showing a circuit to which the method for correcting transmission characteristics of a circuit according to the present invention is applied.
  • a first integrated circuit (IC) 1 and a second integrated circuit (IC) 2 are mounted on a circuit board, and a plurality of circuit patterns 3 are provided between IC 1 and IC 2.
  • the connected state is shown.
  • two land sections 4 are provided at a predetermined distance from each other on the receiving side of each circuit pattern 3 in the vicinity of the IC (here, IC 2).
  • a through hole 5 is provided at the center of the land portion 4. This through hole 5 may be a through hole.
  • FIG. 1B is a partially enlarged view of the vicinity of the two land portions 4 of FIG. 1A.
  • a resist 6 as an insulating coating is applied on the entire surface of the circuit board, and a peeling portion of the resist 6 is provided at a place where the circuit components are soldered, such as the land 4. There are seven.
  • the circuit pattern 3 in the portion between the two land portions 4 needs to be cut when circuit components are attached to the land portion 4, so that the register 6 in this portion must be cut.
  • a resist stripping section 8 is provided so that the circuit pattern 3 can be easily cut.
  • the resist stripping portions 8 for the circuit pattern cut may be provided at two locations in a slit shape. In this way, if the resist stripping portion 8 for the circuit pattern cut is provided in the middle of the circuit pattern 3, the circuit pattern 3 can be easily cut, and since the resist 6 is not provided, the circuit pattern becomes strong. It is possible to surely confirm whether or not the printer has been shut down.
  • Figures 2A to 3B show the configuration of jumper pins used to attach circuit components to circuit pattern 3 described in Figures 1A to 1C. Things.
  • FIG. 2A shows a configuration of a jumper pin 10 used to attach a circuit component to a circuit pattern 3 in the first embodiment of the present invention.
  • the jumper pin 10 of the first embodiment includes a columnar rod made of a conductive metal, and a head portion 11 is provided at one end thereof.
  • the jumper pin 10 of the first embodiment is inserted into the hole 5 from the back side of the land portion 4 of the substrate 50 on which the circuit pattern 3 is provided, and the land 18 is soldered. Fixed to part 4.
  • FIG. 2C shows a configuration of a second embodiment of the jumper pins 10 used for attaching circuit components to the circuit pattern 3 in the present invention.
  • the jumper pin 10 of the second embodiment has a columnar rod made of a conductive metal, and a flange 12 is provided near one end thereof. The length L from the flange portion 12 to the end of the jumper pin 10 is longer than the thickness of the circuit board to which the jumper pin 10 is attached.
  • the jumper pin 10 of the second embodiment is provided with a circuit pattern 3 and is inserted into the hole 5 from the land 4 side of the substrate 50. For this reason, the hole 5 is a through hole, and a back surface land portion 9 is provided around the hole 5 on the back surface side of the substrate 50.
  • the jumper pin 10 of the second embodiment is inserted until the flange portion 12 comes into contact with the front surface land portion 4, and at this time, the end of the jumper pin 10 projecting from the rear surface land portion 9 is connected to the solder 18. Therefore, it is fixed to the back land part 9.
  • FIG. 3A shows a configuration of a third embodiment of a jumper pin 10 used for attaching a circuit component to a circuit pattern 3 in the present invention.
  • the jumper pin 10 of the third embodiment is formed by fixing two columnar rods made of a conductive metal to a rectangular thin-plate jumper base 13. From the back of the jumper base 13 The height H to the end of the jumper pin 10 protruding is larger than the thickness of the circuit board on which the jumper pin 10 is mounted.
  • the interval P between the two jumper pins 10 is the same as the interval between the two holes 5 on one circuit pattern 3 shown in FIGS. 1A to 1C. As shown in FIG.
  • the jumper pin 10 of the third embodiment is inserted into the hole 5 from the land portion 4 side of the substrate 50 provided with the circuit pattern 3, and the jumper base 13 is connected to the circuit. Installed on pattern 3. At this time, the circuit pattern 3 between the holes 5 is cut in advance.
  • the two holes 5 are through holes, and a rear surface land portion 9 is provided around the hole 5 on the rear surface side of the substrate 50.
  • the end of the jumper pin 10 of the third embodiment protrudes from the rear surface land portion 9 with the jumper base 13 mounted on the circuit pattern 3, so that it is connected to the rear surface land portion.
  • the two jumper pins 10 are fixed on the circuit pattern 3 by fixing them to the solder 9 using solder 18.
  • the jumper pins 10 of the first to third embodiments may be mounted in advance in all the holes 5 of the circuit pattern 3 shown in FIG. 1A, but the transmission characteristics of the circuit pattern 3 need to be corrected. It can be retrofitted only when necessary.
  • FIGS. 4A to 4C show a first embodiment of a circuit element module which is a circuit component attached to the jumper pin 10 used in the present invention described with reference to FIGS. 2A to 3B.
  • FIG. 4A shows a resistance module 20 according to the first embodiment of the first mode.
  • the resistance module 20 has a thin plate-like rectangular parallelepiped shape, and has two pin holes 21.
  • the distance Q between the two pin insertion holes 21 provided in the resistance module 20 is the same as the distance between the two holes 5 shown in FIGS. 1A to 1C.
  • a resistance component having a predetermined resistance value is connected between the two holes 5 of the resistance module 20.
  • FIG. 4B shows a capacitor module 30 according to a second embodiment of the first embodiment.
  • the external shape of the capacitor module 30 is the same as that of the resistance module 20, and the distance between the two pin insertion holes 31 is also the same as that of the resistance module 20.
  • the only difference from the resistance module 20 is that a capacitor having a predetermined capacitance is connected between the two through holes 31 of the capacitor module. Therefore, when the capacitor module 30 is attached to two pins through the two pin insertion holes 31, a state is established in which a capacitor is connected between the two jumper pins 10.
  • FIG. 4C shows a coil module 40 according to a third embodiment of the first mode.
  • the outer shape of the coil module 40 is the same as that of the resistance module 20, and the distance between the two pin insertion holes 41 is also the same as that of the resistance module 20.
  • the only difference from the resistance module 20 is that a coil having a predetermined inductance is connected between the two insertion holes 41 of the coil module 40. Therefore, when the coil module 40 is attached to the two pins through the two pin through holes 41, a coil is connected between the two jumper pins 10.
  • FIG. 4D specifically shows an example of the internal configuration of the resistance module 20 shown in FIG. 4A.
  • the resistance module 20 is entirely covered with an insulating bar 22.
  • the insulating cover 22 is provided with two pin insertion holes 21 on each of the front and rear surfaces.
  • a spacer 23 made of an insulating material is provided between the pin insertion hole 21 and both ends of the insulation cover 22.
  • This terminal 24 has panel characteristics, and one end of Project into the pin insertion hole 21. When a jumper pin is inserted into the pin insertion hole 21, the terminal 24 moves inward while electrically contacting the jumper pin.
  • a conductor 25 is provided on the back side of each of these two terminals 24, and a resistance element 26 is interposed between the conductors 25.
  • the capacitor module 30 and the coil module 40 have the same structure as the resistor module 20 shown in FIG. 4D. That is, the capacitor module 30 has a capacitor provided in the portion of the resistance element 26 in FIG. 4D, and the coil module 40 has a coil provided in the portion of the resistance element 26 in FIG. 4D. It is a thing.
  • FIG. 5B illustrates a first embodiment of a method for correcting transmission characteristics of a circuit according to the present invention.
  • the jumper pin 10 of the first or second embodiment is fixed to the hole 5 of the land portion 4 as described with reference to FIG. 2B or 2D. Attach 0.
  • the resistance module 20 can be easily installed by simply inserting the jumper pins 10 into the pin insertion holes 21 and a predetermined resistance is inserted between the lands 4 of the circuit pattern 3 as a damping resistance. become.
  • FIG. 5C illustrates a second embodiment of the method of correcting transmission characteristics of a circuit according to the present invention.
  • the jumper pin 10 of the third embodiment is fixed to the hole 5 of the land portion 4 together with the jumper base 13 as described with reference to FIG. Attach.
  • the resistance module 20 can be easily attached simply by inserting the jumper pin 10 into the pin insertion hole 21, and a predetermined resistance is inserted into the circuit pattern 3 as a damping resistance.
  • the filter circuit can be inserted into the circuit pattern 3.
  • the waveform measurement probe is brought into contact with the jumper pin 10 remaining above the resistance module. This makes it easier to check the waveform.
  • the circuit element module can be easily added or replaced while the waveform measurement probe is connected to the jumper pin 10, so that the transmission characteristics of the circuit can be easily corrected.
  • FIGS. 6A to 6C show a second embodiment of the circuit element module attached to the jumper pin 10 used in the above-described first embodiment of the method for correcting the transmission characteristics of the circuit of the present invention.
  • the circuit element module of the second embodiment is of a vertical type.
  • FIG. 6A shows a first embodiment of the second mode, in which the resistance module 20 3 shows the configuration of A.
  • a vertical type resistance module 2 OA insulation cover 22 A, two terminals 24 A having panel characteristics are provided.
  • the pin insertion hole 21A of the resistor module 2OA is rectangular, and passes through the portion of the terminal 24A having a panel property, and is provided vertically through the terminal 24A.
  • a conductor 25 A is provided inside each of the two terminals 24 A, and a resistance element 26 A is sandwiched between the conductors 25 A.
  • the capacitor module 3OA and the coil module 4OA also have the same structure as the resistor module 20A shown in FIG. 6A. That is, as shown in FIG. 6B, the capacitor module 30A is provided with a capacitor 32A in the resistance element 26A portion of the resistance module 2OA, and the coil module 4A is As shown in FIG. 6C, a coil 42 A is provided at a portion of the resistance element 26 A of the resistance module 2 OA.
  • FIGS. 7A to 7D show a third embodiment of a circuit component mounted on jumper pin 10 used in a second embodiment of the method for correcting the transmission characteristics of a circuit according to the present invention.
  • the circuit component according to the third embodiment has a thin plate shape like the circuit component according to the first embodiment.
  • FIG. 7A shows a first example of the third embodiment, and shows a configuration of the resistance module 20B.
  • the configuration of the thin plate-shaped resistance module 20B is simple, and the resistance element 26B is sandwiched between two conductors 25B as shown in the cross section in FIG. 7D.
  • the capacitor module 30B and the coil module 40B have the same structure as the resistance module 20B shown in FIG. 7A. That is, as shown in FIG. 7B, the capacitor module 30 B has a configuration in which a capacitor 32 B is provided in the resistance element 26 B of the resistance module 20 B, and the coil module 40 B Is shown in Figure 7C. A coil 42 B is provided at the resistance element 26 B of the resistance module 20 B.
  • the third configuration of the resistor module 20 B, capacitor module 30 B, and coil module 40 B configured as described above is used by being sandwiched between two holders 14 as shown in FIG. 8A. Is done.
  • the holder 14 is formed by providing a plurality of concave portions 15 for receiving circuit components in a vertically long main body having a paneling property. At its base portion, mounting pins 16 for mounting the holder 14 to the substrate are provided. Is protruding.
  • the holder 14 is used by fixing two to the substrate with the concave portions 15 facing each other.
  • the land part 4 and the land part 4 of the circuit pattern 3 for correcting the transmission characteristic are used.
  • the portion between them is cut to form a cut portion 19.
  • the mounting pin 16 of the holder 14 is inserted into the hole 5 of the land part 4, and the concave part 15 of the holder 14 is opposed to the land part 4 or the rear land part 9. Is fixed with solder.
  • FIG. 8C shows a state in which the resistance module 20B is mounted between the concave portions 15 of the holder 14 fixed to the substrate 50.
  • illustration of the circuit pattern on the substrate 50 is omitted.
  • the resistance module 20 B can be easily installed simply by inserting it between the recesses 15 of the holder 14, and a predetermined resistance is inserted between the lands 4 of the circuit pattern 3 as a damping resistance. Will be done.
  • FIG. 8C shows an example in which a plurality of resistor modules 20 B of the same size are mounted between holders 14.
  • FIG. 8D shows a state in which a large resistor module 27 is mounted between the uppermost concave portions 15 of the holder 14.
  • the holder 14 used in the present invention can mount a circuit component, which has conventionally been difficult to mount, on a circuit pattern in the form of a circuit element module. Replacement is also possible, and can hold a large variety of circuit components.
  • circuit components can be replaced without using solder, the transmission characteristics of a circuit pattern can be easily corrected.
  • FIG. 9A is a waveform diagram showing a received signal on the signal receiving side on one circuit pattern 3 when a damping resistor is not added in circuit pattern 3 of FIG. 1A.
  • the transmission circuit focuses on the signal waveform on the receiving side to detect the transmission characteristics. However, if there is no damping resistor on the circuit pattern 3, the ringing (waveform) as shown by the broken line in the figure Shaking) is occurring.
  • the method and structure for correcting the transmission characteristics of a circuit and the holder used in the structure according to the present invention it is possible to easily and efficiently change a circuit constant such as a damping resistance without using solder.
  • a circuit constant such as a damping resistance
  • solder By combining and changing the components that make up the module, it has the effect of fulfilling various functions as capacitors and filters.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

La présente invention a trait à un procédé de correction et une structure de correction permettant d'améliorer les caractéristiques de transmission entre des composants de circuit montés sur une carte de circuit lorsque celle-ci est défectueuse. On réalise une pièce de puce apte à la correction de résistance, de capacité et d'inductance, et on améliore les caractéristiques de transmission d'une configuration de circuit (3) par l'ajustement interchangeable de la pièce de puce entre deux broches de cavalier (20) disposés dans la configuration de circuit ou entre des supports de cône. On peut aisément et de manière efficace modifier la constante du circuit, et on peut ajouter diverses fonctions d'un condensateur ou un filtre à la configuration d'un circuit en changeant les composants constitutifs d'un module et en les combinant.
PCT/JP2002/003126 2002-03-28 2002-03-28 Procede de correction des caracteristiques de transmission en circuit, sa structure de correction, et support de cone utilise pour la structure de correction WO2003084296A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2002/003126 WO2003084296A1 (fr) 2002-03-28 2002-03-28 Procede de correction des caracteristiques de transmission en circuit, sa structure de correction, et support de cone utilise pour la structure de correction
JP2003581557A JPWO2003084296A1 (ja) 2002-03-28 2002-03-28 回路の伝送特性補正方法、補正構造、及びこの補正構造に使用される保持具

Applications Claiming Priority (1)

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PCT/JP2002/003126 WO2003084296A1 (fr) 2002-03-28 2002-03-28 Procede de correction des caracteristiques de transmission en circuit, sa structure de correction, et support de cone utilise pour la structure de correction

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161172A (ja) * 2009-01-07 2010-07-22 Tdk Corp 積層コンデンサ及び積層コンデンサの実装構造
JP2010177377A (ja) * 2009-01-28 2010-08-12 Denso Corp 実装基板、及び該実装基板のノイズ対策方法
JP2011103347A (ja) * 2009-11-10 2011-05-26 Renesas Electronics Corp 半導体パッケージ及びシステム
JP2014175119A (ja) * 2013-03-07 2014-09-22 Nec Engineering Ltd コネクタ
JP2019125414A (ja) * 2018-01-11 2019-07-25 株式会社Ｎｔｔファシリティーズ ケーブルおよび配線器具

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JPS5649068U (fr) * 1979-09-22 1981-05-01
JPS63138676A (ja) * 1986-11-28 1988-06-10 日本電子機器株式会社 調整抵抗用タ−ミナル
JPS63185308U (fr) * 1987-05-22 1988-11-29
JPH04132292A (ja) * 1990-09-21 1992-05-06 Nec Corp ポリイミド樹脂多層配線基板
JPH06104031A (ja) * 1992-09-17 1994-04-15 Fujitsu Ltd 調整部品用端子
JPH07235357A (ja) * 1994-02-23 1995-09-05 Fujitsu Ltd 調整部品の取付構造

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JPH0412665Y2 (fr) * 1985-12-13 1992-03-26
JPS62180973U (fr) * 1986-05-07 1987-11-17
JPH0341968U (fr) * 1989-08-31 1991-04-22

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649068U (fr) * 1979-09-22 1981-05-01
JPS63138676A (ja) * 1986-11-28 1988-06-10 日本電子機器株式会社 調整抵抗用タ−ミナル
JPS63185308U (fr) * 1987-05-22 1988-11-29
JPH04132292A (ja) * 1990-09-21 1992-05-06 Nec Corp ポリイミド樹脂多層配線基板
JPH06104031A (ja) * 1992-09-17 1994-04-15 Fujitsu Ltd 調整部品用端子
JPH07235357A (ja) * 1994-02-23 1995-09-05 Fujitsu Ltd 調整部品の取付構造

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161172A (ja) * 2009-01-07 2010-07-22 Tdk Corp 積層コンデンサ及び積層コンデンサの実装構造
JP2010177377A (ja) * 2009-01-28 2010-08-12 Denso Corp 実装基板、及び該実装基板のノイズ対策方法
JP2011103347A (ja) * 2009-11-10 2011-05-26 Renesas Electronics Corp 半導体パッケージ及びシステム
JP2014175119A (ja) * 2013-03-07 2014-09-22 Nec Engineering Ltd コネクタ
JP2019125414A (ja) * 2018-01-11 2019-07-25 株式会社Ｎｔｔファシリティーズ ケーブルおよび配線器具
JP7061879B2 (ja) 2018-01-11 2022-05-02 株式会社Ｎｔｔファシリティーズ ケーブルおよび配線器具

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