WO2003034467A2 - Leistungshalbleitermodul - Google Patents
Leistungshalbleitermodul Download PDFInfo
- Publication number
- WO2003034467A2 WO2003034467A2 PCT/EP2002/011179 EP0211179W WO03034467A2 WO 2003034467 A2 WO2003034467 A2 WO 2003034467A2 EP 0211179 W EP0211179 W EP 0211179W WO 03034467 A2 WO03034467 A2 WO 03034467A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- housing
- power semiconductor
- semiconductor module
- pressing device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Definitions
- the power semiconductor module includes
- the invention relates to a power semiconductor module for mounting on a cooling element with at least one substrate on which one or more semiconductor components are located, and with a pressing device acting on the substrate in order to press the substrate in the mounted state onto the cooling element.
- a plurality of power semiconductors are arranged in a row on the top of an insulating and thermally conductive carrier (substrate) and connected to conductor tracks running on the top of the substrate.
- the underside of the substrate is pressed onto a heat sink by a pressing device.
- Power losses in the form of heat are dissipated via the heat sink during operation of the power semiconductor module.
- the heat sink For effective heat dissipation or a low heat transfer resistance and thus reliable operation of the power semiconductor module, the heat sink must lie flat and without gaps on the underside of the substrate.
- the present invention has for its object to provide a power semiconductor module which can be produced cost-effectively and which ensures good thermal contact with a cooling element or heat sink without additional separate components.
- This object is achieved according to the invention in a power semiconductor module of the type mentioned at the outset in that the pressing device is formed by a module housing with one or more resilient regions.
- An essential aspect of the present invention is the multi-functional use of a module housing. This means that there is no need to separately manufacture, handle and assemble individual parts for pressing the substrate onto the cooling element or onto the cooling body.
- the housing allows both the fixing of the power semiconductor module on the heat sink and the establishment of a good thermal contact in a single assembly process.
- Another essential aspect of the present invention is that the resilient elements or areas of the housing compensate for dimensional tolerances, in particular of the housing.
- the resilient areas can be integral material components of the housing. These can advantageously obtain their resilient properties through recesses and / or cross-sectional tapering in the housing material. This is particularly the case when using plastic and e.g. Housing manufactured in plastic injection molding advantageous.
- a one-piece design of the module housing or housing part on the one hand and the spring element (in particular with a pressure stamp) on the other hand makes the module housing or housing part easier to manufacture and simpler
- the power semiconductor module according to the invention has the additional advantage that a very homogeneous pressure force distribution can be achieved instead of a high point pressure.
- the pressing device acts on the substrate at a number of locations which are uniformly distributed over the substrate.
- the pressing device can advantageously have pressure stamps which are connected to the resilient areas.
- a further increase in the reliability and the homogeneity of the mechanical contact between the substrate and the heat sink can be achieved according to a preferred embodiment of the invention in that the pressing device acts all around on the edge region of the substrate.
- the module housing comprises a first housing part and a second housing part which acts on the first housing part with a spring force.
- the resilient areas can be formed by areas with recesses and / or cross-sectional tapering in the module housing and / or by spring elements (such as spring bands, spring edges, spring angle, etc.) formed integrally on the module housing.
- spring elements such as spring bands, spring edges, spring angle, etc.
- FIG. 1 components of a first exemplary embodiment of the power semiconductor module according to the invention in cross section before assembly
- FIG. 2 the exemplary embodiment according to FIG. 1 in the assembled state
- FIG. 3 the pressure force distribution in a pressing device of the first exemplary embodiment
- FIG. 4 a module housing part
- FIG. 5 greatly enlarged a resilient area of the module housing according to FIG. 4 in detail
- Figure 6 greatly enlarged a further resilient area of the module housing according to Figure 4 in detail and Figure 7 variants of resilient areas in greatly enlarged representations.
- the power semiconductor module 1 shown in FIG. 1 comprises, in a separate illustration, a ceramic substrate (carrier element) 2 on which a plurality of semiconductor components 6, 7 and 8 are arranged and electrically contacted.
- the semiconductor components are connected via indicated bonding wires to conductor tracks, not shown, which are formed on the surface of the substrate 2.
- the conductor tracks lead e.g. to contact pins (connection pins) for external connection of the power semiconductor module.
- the semiconductor components 6, 7 and 8 can be power semiconductors which develop high power losses converted into heat and therefore require effective heat dissipation.
- the semiconductor module further comprises a module housing 10, which in the exemplary embodiment is composed of two sub-housings 12 and 14.
- the module housing 10 is manufactured in a plastic injection molding process. When assembled (see FIG. 2), the partial housing 12 overlaps the partial housing 14, which is provided with a circumferential collar 15.
- the partial housing 12 has a plurality of resilient areas 16, 17, 18, 19 which are integrally formed from the module housing material.
- the elastic properties can be created that material recesses are provided in the area of the resilient areas. However, local thinning of the material can also be provided (for example at regions 17 and 18), which forms resilient elastic bands (for example 20, 21). These bands form the pivot point or connection point for a stamp 25, which is designed in the form of a web.
- the stamp acts with its free end (base point) 26 on the upper side of the substrate 2.
- the resilient regions 16 and 19 act circumferentially indirectly on the edge region 28 of the substrate 2 via the collar 15.
- the module housing is screwed to a heat sink 30, which is only indicated, by means of fastening screws (not shown) which extend through bores 29.
- the spring forces are transmitted to the substrate via the collar 15 (forces F2) or the punches 25 (forces F3) and ensure that the substrate is pressed onto the heat sink 30 in a manner that is gentle on the substrate.
- the module housing thus not only functions as a dual function Housing for receiving and protecting or terminating the semiconductor components 6, 7, 8, but also with its spring-elastic regions 16, 17, 18, 19 as a pressing device 40.
- FIG. 4 shows a module housing part 50 with eight evenly distributed resilient areas 51, 52, 53, 54, 55, 56, 57, 58.
- the resilient areas 56 are an example and 58 shown greatly enlarged.
- the area 56 is trough-shaped as a material cut or extension of the module housing part 50.
- one end 62 of a pressure stamp 64 is formed.
- the area 58 between a side wall 66 of the module housing part 50 and a holding web 68 is likewise designed as a trough-shaped spring element by a corresponding material reduction as a spring band 69.
- FIG. 7 shows further variants of resilient areas in a greatly enlarged illustration.
- the actual resilient elements 70 can have an arcuate shape and can only be formed on a wall or a retaining web 71 of the housing or of a housing part. They can also be designed as a spring bracket 73 and can be formed only on a wall or a retaining web 74 of the housing or of a housing part.
- the resilient element 76 can also be designed as a rolled-up band and molded onto a wall or a retaining web 77 of the housing or of a housing part.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003537100A JP4279144B2 (ja) | 2001-10-10 | 2002-10-04 | 電力半導体モジュール |
DE10294771T DE10294771B4 (de) | 2001-10-10 | 2002-10-04 | Leistungshalbleitermodul |
US10/821,728 US7034395B2 (en) | 2001-10-10 | 2004-04-09 | Power semiconductor module with cooling element and pressing apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10149886.1 | 2001-10-10 | ||
DE10149886A DE10149886A1 (de) | 2001-10-10 | 2001-10-10 | Leistunghalbleitermodul |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/821,728 Continuation US7034395B2 (en) | 2001-10-10 | 2004-04-09 | Power semiconductor module with cooling element and pressing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003034467A2 true WO2003034467A2 (de) | 2003-04-24 |
WO2003034467A3 WO2003034467A3 (de) | 2004-01-29 |
Family
ID=7701988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2002/011179 WO2003034467A2 (de) | 2001-10-10 | 2002-10-04 | Leistungshalbleitermodul |
Country Status (4)
Country | Link |
---|---|
US (1) | US7034395B2 (de) |
JP (1) | JP4279144B2 (de) |
DE (2) | DE10149886A1 (de) |
WO (1) | WO2003034467A2 (de) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1953820A1 (de) | 2007-02-05 | 2008-08-06 | Siemens Aktiengesellschaft | Leistungshalbleitermodul |
CN101635287A (zh) * | 2008-07-22 | 2010-01-27 | 赛米控电子股份有限公司 | 功率半导体模块 |
EP2328390A3 (de) * | 2009-11-19 | 2011-09-07 | STILL GmbH | Umrichter mit einem Kühlkörper |
EP2328391A3 (de) * | 2009-11-19 | 2011-11-30 | STILL GmbH | Umrichter |
EP2328392A3 (de) * | 2009-11-19 | 2011-11-30 | STILL GmbH | Umrichter, insbesondere mehrphasiger Drehstromumrichter |
CN106298689A (zh) * | 2015-05-28 | 2017-01-04 | 台达电子企业管理(上海)有限公司 | 封装结构 |
CN107924894A (zh) * | 2015-08-24 | 2018-04-17 | 罗伯特·博世有限公司 | 用于冷却电结构元件的装置 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10326176A1 (de) * | 2003-06-10 | 2005-01-05 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Leistungshalbleitermodul |
DE102004018476B4 (de) | 2004-04-16 | 2009-06-18 | Infineon Technologies Ag | Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung |
DE102004043019A1 (de) * | 2004-09-06 | 2006-03-23 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Baugruppe |
DE102006008807B4 (de) * | 2006-02-25 | 2010-10-14 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem Leistungshalbleitermodul und einem Kühlbauteil |
DE102007016222B3 (de) | 2007-04-04 | 2008-11-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul in Druckkontaktausführung sowie Verfahren zur Herstellung desselben |
EP1990830A1 (de) * | 2007-04-12 | 2008-11-12 | Siemens Aktiengesellschaft | Halbleitermodul |
US9373563B2 (en) * | 2007-07-20 | 2016-06-21 | Infineon Technologies Ag | Semiconductor assembly having a housing |
US7944033B2 (en) | 2007-10-18 | 2011-05-17 | Infineon Technologies Ag | Power semiconductor module |
US7763970B2 (en) | 2008-02-27 | 2010-07-27 | Infineon Technologies Ag | Power module |
US7808100B2 (en) | 2008-04-21 | 2010-10-05 | Infineon Technologies Ag | Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element |
DE102008033852B3 (de) | 2008-07-19 | 2009-09-10 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem Leistungshalbleitermodul und Verfahren zu deren Herstellung |
US8237260B2 (en) * | 2008-11-26 | 2012-08-07 | Infineon Technologies Ag | Power semiconductor module with segmented base plate |
DE102009002191B4 (de) | 2009-04-03 | 2012-07-12 | Infineon Technologies Ag | Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung |
DE102009043760A1 (de) * | 2009-09-30 | 2011-03-31 | Trilux Gmbh & Co. Kg | Befestigungselement für plattenförmige Bauteile aneinander, insbesondere für eine LED-Platine an einem Kühlkörper |
FR2981537B1 (fr) * | 2011-10-12 | 2017-03-24 | Valeo Thermal Systems Japan Corp | Systeme de maintien mecanique, ensemble comprenant un tel systeme et une carte electronique et procede d'assemblage sur une surface d'un tel systeme et d'une telle carte |
JP6037935B2 (ja) * | 2013-05-17 | 2016-12-07 | アスモ株式会社 | 電子装置 |
US20150001700A1 (en) * | 2013-06-28 | 2015-01-01 | Infineon Technologies Ag | Power Modules with Parylene Coating |
EP2940718B1 (de) * | 2014-04-30 | 2018-04-18 | Vincotech GmbH | Anordnung zur Kühlung eines Leistungsmoduls |
US9620877B2 (en) | 2014-06-17 | 2017-04-11 | Semiconductor Components Industries, Llc | Flexible press fit pins for semiconductor packages and related methods |
US10624214B2 (en) * | 2015-02-11 | 2020-04-14 | Apple Inc. | Low-profile space-efficient shielding for SIP module |
US9431311B1 (en) | 2015-02-19 | 2016-08-30 | Semiconductor Components Industries, Llc | Semiconductor package with elastic coupler and related methods |
DE102015114188B4 (de) * | 2015-08-26 | 2019-03-07 | Semikron Elektronik Gmbh & Co. Kg | Leistungselektronisches Submodul mit einem zweiteiligen Gehäuse |
DE102015115122B4 (de) * | 2015-09-09 | 2022-05-19 | Infineon Technologies Ag | Leistungshalbleitermodul mit zweiteiligem Gehäuse |
TWI553828B (zh) * | 2015-10-30 | 2016-10-11 | 財團法人工業技術研究院 | 整合型功率模組 |
JP6274196B2 (ja) * | 2015-12-16 | 2018-02-07 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
US10177057B2 (en) | 2016-12-15 | 2019-01-08 | Infineon Technologies Ag | Power semiconductor modules with protective coating |
CN109756076B (zh) * | 2017-11-01 | 2022-05-20 | 德昌电机(深圳)有限公司 | 电机 |
EP3913665A1 (de) | 2020-05-18 | 2021-11-24 | Infineon Technologies AG | Leistungshalbleitermodul und verfahren zur herstellung eines leistungshalbleitermoduls |
DE102021134001A1 (de) | 2021-12-21 | 2023-06-22 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Substrat, Leistungshalbleiterbauelementen und mit einem Druckkörper |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3911327A (en) * | 1973-07-19 | 1975-10-07 | Ates Componenti Elettron | Mounting assembly for integrated circuits heat sink and clamp means |
GB2167228A (en) * | 1984-10-11 | 1986-05-21 | Sinclair Res Ltd | Integrated circuit package |
EP0254692A1 (de) * | 1986-07-17 | 1988-01-27 | STMicroelectronics S.r.l. | Halbleitervorrichtung angebracht in einem hochflexiblen, segmentierten Gehäuse und mit einem Kühlkörper ausgerüstet |
DE4111247A1 (de) * | 1991-04-08 | 1992-10-22 | Export Contor Aussenhandel | Schaltungsanordnung |
DE19533298A1 (de) * | 1995-09-08 | 1997-03-13 | Siemens Ag | Elektronisches Modul mit Leistungsbauelementen |
WO2003021680A2 (de) * | 2001-09-01 | 2003-03-13 | Eupec Gmbh | Leistungshalbleitermodul |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8421499D0 (en) * | 1984-08-24 | 1984-09-26 | British Telecomm | Heat sink |
DE3508456A1 (de) | 1985-03-09 | 1986-09-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul |
DE4001554A1 (de) | 1990-01-20 | 1991-07-25 | Abb Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
DE19530264A1 (de) * | 1995-08-17 | 1997-02-20 | Abb Management Ag | Leistungshalbleitermodul |
DE19723270A1 (de) * | 1997-06-03 | 1998-12-10 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Kühlblechverbindungsklammer für Leistungshalbleiter |
JPH11330328A (ja) | 1998-05-14 | 1999-11-30 | Denso Corp | 半導体モジュール |
DE19942770A1 (de) * | 1999-09-08 | 2001-03-15 | Ixys Semiconductor Gmbh | Leistungshalbleiter-Modul |
DE19942915A1 (de) * | 1999-09-08 | 2001-03-15 | Still Gmbh | Leistungshalbleitermodul |
-
2001
- 2001-10-10 DE DE10149886A patent/DE10149886A1/de not_active Withdrawn
-
2002
- 2002-10-04 DE DE10294771T patent/DE10294771B4/de not_active Revoked
- 2002-10-04 WO PCT/EP2002/011179 patent/WO2003034467A2/de active Application Filing
- 2002-10-04 JP JP2003537100A patent/JP4279144B2/ja not_active Expired - Lifetime
-
2004
- 2004-04-09 US US10/821,728 patent/US7034395B2/en not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3911327A (en) * | 1973-07-19 | 1975-10-07 | Ates Componenti Elettron | Mounting assembly for integrated circuits heat sink and clamp means |
GB2167228A (en) * | 1984-10-11 | 1986-05-21 | Sinclair Res Ltd | Integrated circuit package |
EP0254692A1 (de) * | 1986-07-17 | 1988-01-27 | STMicroelectronics S.r.l. | Halbleitervorrichtung angebracht in einem hochflexiblen, segmentierten Gehäuse und mit einem Kühlkörper ausgerüstet |
DE4111247A1 (de) * | 1991-04-08 | 1992-10-22 | Export Contor Aussenhandel | Schaltungsanordnung |
DE19533298A1 (de) * | 1995-09-08 | 1997-03-13 | Siemens Ag | Elektronisches Modul mit Leistungsbauelementen |
WO2003021680A2 (de) * | 2001-09-01 | 2003-03-13 | Eupec Gmbh | Leistungshalbleitermodul |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1953820A1 (de) | 2007-02-05 | 2008-08-06 | Siemens Aktiengesellschaft | Leistungshalbleitermodul |
US7760505B2 (en) | 2007-02-05 | 2010-07-20 | Siemens Aktiengesellschaft | Power semiconductor module |
CN101241885B (zh) * | 2007-02-05 | 2012-02-08 | 西门子公司 | 功率半导体模块 |
CN101635287A (zh) * | 2008-07-22 | 2010-01-27 | 赛米控电子股份有限公司 | 功率半导体模块 |
EP2148368A1 (de) | 2008-07-22 | 2010-01-27 | Semikron Elektronik GmbH & Co. KG Patentabteilung | Leistungshalbleitermodul |
EP2328390A3 (de) * | 2009-11-19 | 2011-09-07 | STILL GmbH | Umrichter mit einem Kühlkörper |
EP2328391A3 (de) * | 2009-11-19 | 2011-11-30 | STILL GmbH | Umrichter |
EP2328392A3 (de) * | 2009-11-19 | 2011-11-30 | STILL GmbH | Umrichter, insbesondere mehrphasiger Drehstromumrichter |
CN106298689A (zh) * | 2015-05-28 | 2017-01-04 | 台达电子企业管理(上海)有限公司 | 封装结构 |
CN107924894A (zh) * | 2015-08-24 | 2018-04-17 | 罗伯特·博世有限公司 | 用于冷却电结构元件的装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4279144B2 (ja) | 2009-06-17 |
WO2003034467A3 (de) | 2004-01-29 |
US20040217465A1 (en) | 2004-11-04 |
DE10294771B4 (de) | 2007-12-27 |
DE10149886A1 (de) | 2003-04-30 |
DE10294771D2 (de) | 2004-08-05 |
US7034395B2 (en) | 2006-04-25 |
JP2005506698A (ja) | 2005-03-03 |
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