WO2003014755A1 - Dispositif d'evaluation des caracteristiques de cartes a sondes et procede d'exploration - Google Patents

Dispositif d'evaluation des caracteristiques de cartes a sondes et procede d'exploration Download PDF

Info

Publication number
WO2003014755A1
WO2003014755A1 PCT/JP2002/007205 JP0207205W WO03014755A1 WO 2003014755 A1 WO2003014755 A1 WO 2003014755A1 JP 0207205 W JP0207205 W JP 0207205W WO 03014755 A1 WO03014755 A1 WO 03014755A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe cards
measuring characteristics
probing method
measuring
detecting
Prior art date
Application number
PCT/JP2002/007205
Other languages
English (en)
French (fr)
Inventor
Masaru Suzuki
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to KR20037004756A priority Critical patent/KR100724174B1/ko
Publication of WO2003014755A1 publication Critical patent/WO2003014755A1/ja
Priority to US10/406,192 priority patent/US6809536B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/JP2002/007205 2001-08-06 2002-07-16 Dispositif d'evaluation des caracteristiques de cartes a sondes et procede d'exploration WO2003014755A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR20037004756A KR100724174B1 (ko) 2001-08-06 2002-07-16 프로브 카드의 특성을 측정하는 장치 및 방법
US10/406,192 US6809536B2 (en) 2001-08-06 2003-04-04 Apparatus for measuring properties of probe card and probing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-237642 2001-08-06
JP2001237642A JP4782953B2 (ja) 2001-08-06 2001-08-06 プローブカード特性測定装置、プローブ装置及びプローブ方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/406,192 Continuation-In-Part US6809536B2 (en) 2001-08-06 2003-04-04 Apparatus for measuring properties of probe card and probing method

Publications (1)

Publication Number Publication Date
WO2003014755A1 true WO2003014755A1 (fr) 2003-02-20

Family

ID=19068689

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007205 WO2003014755A1 (fr) 2001-08-06 2002-07-16 Dispositif d'evaluation des caracteristiques de cartes a sondes et procede d'exploration

Country Status (5)

Country Link
US (1) US6809536B2 (ja)
JP (1) JP4782953B2 (ja)
KR (1) KR100724174B1 (ja)
TW (1) TW552620B (ja)
WO (1) WO2003014755A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US7071714B2 (en) 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
JP4357813B2 (ja) * 2002-08-23 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブ方法
US8466703B2 (en) * 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
JP5089166B2 (ja) * 2003-03-14 2012-12-05 ルドルフテクノロジーズ インコーポレイテッド プローブカードアナライザにおける部品のたわみの影響を軽減する方法
JP4809594B2 (ja) 2004-08-02 2011-11-09 東京エレクトロン株式会社 検査装置
US20070009034A1 (en) * 2005-07-05 2007-01-11 Jarno Tulkki Apparatuses, computer program product, and method for digital image processing
KR100790817B1 (ko) * 2006-12-06 2008-01-03 삼성전자주식회사 반도체 제조관리 시스템
WO2008079307A1 (en) * 2006-12-19 2008-07-03 Rudolph Technologies, Inc. Probe card analysis system and method
JP2009276215A (ja) 2008-05-15 2009-11-26 Tokyo Electron Ltd プローブ装置及びコンタクト位置の補正方法
JP5222038B2 (ja) 2008-06-20 2013-06-26 東京エレクトロン株式会社 プローブ装置
JP5358138B2 (ja) * 2008-07-31 2013-12-04 東京エレクトロン株式会社 検査装置
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
US8534302B2 (en) * 2008-12-09 2013-09-17 Microchip Technology Incorporated Prober cleaning block assembly
KR101052506B1 (ko) * 2010-06-16 2011-07-29 주식회사 이노비즈 엘이디 검사장치 및 이를 이용한 엘이디 검사방법
JP2012204695A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
JP5952645B2 (ja) * 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
US9417308B2 (en) 2013-07-03 2016-08-16 Stichting Continuiteit Beijert Engineering Apparatus and method for inspecting pins on a probe card
CN103412280B (zh) * 2013-07-30 2015-12-02 杭州厚达自动化系统有限公司 一种旧电能表检测装置
CN105651228B (zh) * 2015-12-31 2018-05-18 深圳安博电子有限公司 一种在探针台上对基板测试参数进行设置的方法及装置
CN106646323B (zh) * 2016-12-14 2019-03-22 北京无线电计量测试研究所 一种共面波导探针传输特性测量装置和方法
CN109918973B (zh) 2017-12-13 2021-07-02 上海耕岩智能科技有限公司 一种生理特征侦测识别方法和光侦测装置
TWI667484B (zh) * 2018-08-03 2019-08-01 矽品精密工業股份有限公司 檢測裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05157790A (ja) * 1991-12-04 1993-06-25 Tokyo Kasoode Kenkyusho:Kk プローブカード検査装置
JPH05264590A (ja) * 1992-03-16 1993-10-12 Hitachi Electron Eng Co Ltd プローブカードの反り補正機構

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621166A (ja) 1992-06-30 1994-01-28 Mitsubishi Electric Corp ウエハプローバ
JP3163221B2 (ja) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
JPH11211732A (ja) * 1998-01-27 1999-08-06 Hitachi Constr Mach Co Ltd 走査型プローブ顕微鏡
JPH11251379A (ja) 1998-02-27 1999-09-17 Toshiba Microelectronics Corp ウエハプロービング装置
JP3905254B2 (ja) * 1998-06-22 2007-04-18 エスアイアイ・ナノテクノロジー株式会社 走査型プローブ顕微鏡
JP2001110857A (ja) * 1999-10-06 2001-04-20 Tokyo Electron Ltd プローブ方法及びプローブ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05157790A (ja) * 1991-12-04 1993-06-25 Tokyo Kasoode Kenkyusho:Kk プローブカード検査装置
JPH05264590A (ja) * 1992-03-16 1993-10-12 Hitachi Electron Eng Co Ltd プローブカードの反り補正機構

Also Published As

Publication number Publication date
TW552620B (en) 2003-09-11
JP2003050271A (ja) 2003-02-21
KR100724174B1 (ko) 2007-05-31
US6809536B2 (en) 2004-10-26
KR20040028645A (ko) 2004-04-03
US20030173951A1 (en) 2003-09-18
JP4782953B2 (ja) 2011-09-28

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