WO2003007340A2 - Wafer transport apparatus - Google Patents

Wafer transport apparatus Download PDF

Info

Publication number
WO2003007340A2
WO2003007340A2 PCT/US2002/023233 US0223233W WO03007340A2 WO 2003007340 A2 WO2003007340 A2 WO 2003007340A2 US 0223233 W US0223233 W US 0223233W WO 03007340 A2 WO03007340 A2 WO 03007340A2
Authority
WO
WIPO (PCT)
Prior art keywords
arm
link
chamber
robot arm
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/023233
Other languages
English (en)
French (fr)
Other versions
WO2003007340A3 (en
Inventor
David Kinnard
Daniel Richardson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Priority to AU2002354691A priority Critical patent/AU2002354691A1/en
Priority to EP02752504A priority patent/EP1407479A2/en
Priority to JP2003513012A priority patent/JP4352233B2/ja
Priority to KR1020047000473A priority patent/KR100940958B1/ko
Publication of WO2003007340A2 publication Critical patent/WO2003007340A2/en
Publication of WO2003007340A3 publication Critical patent/WO2003007340A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0093—Programme-controlled manipulators co-operating with conveyor means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Definitions

  • Figure 4 shows a cross sectional view of the loadlock chamber and the process chamber.
  • Figures 7-8 show a plan view and a perspective view of the upper robot arm
  • the end effector 134 of the lower arm 130 is moved by the mechanism described above from the centerline of the process chamber 104 to the center of the loadlock chamber 118, exactly over a cooling station, i.e., cold plate 142.
  • the wafer 194 is then placed upon the cooling station or cold plate 142 by the lower robot arm 130 immediately after retrieval.
  • the circular shape of the end effector 134 supporting the wafer circumscribes the perimeter of the liquid cooled disc 142 as the robot assembly is allowed to move down in the negative z- axis direction so as to place the wafer on the surface of the liquid cooled disc or cold plate assembly.
  • the venting of the loadlock chamber 118 is required to effect a change in a gas conduction heat transfer coefficient between the cooled plate surface and the wafer backside from 0.1 to 10.0 torr, and from 10 torr to atmospheric pressure to allow gas convention to cool the wafer.
  • the change or increase in the heat transfer coefficient or the vent to atmosphere time being desirable or in fact required to prevent mechanical stress in the wafer and the resulting deformation and possible damage.
  • pivots of articulated wafer transport arms are not centrally located within the loadlock chamber 118. Further, the wafer transfer path does not cause the central wafer axis to pass over, or even come approximately near, wafer transport arm primary pivot axis 140. Such an arrangement allows the entire transport mechanism to be more compact, thereby reducing the size of the chamber 118. Such an arrangement also allows the wafer transport arms to be housed in a separate sub-chamber for simplified setup and repair.
  • the path of the end effectors may be varied.
  • the cam profile can be "adjusted” after the device is assembled and installed such that effectively any reasonable motion, i.e. other than straight line, can be obtained within the confines or path described by the loadlock centerline to the process chamber centerline.
  • This allows independently selectable or adjustable motion of the translating arm relative to the link arm to be obtained without using a second servomotor or a motor controller and associated software.
  • the housing assembly would contain 3 concentric shafts as follows: a.
  • the lower arm assembly 130, 132, 134 extends into the process chamber 104 (and is now below the wafer pins 190, 192 and thermocouple 193). As shown in Figure 21, the arm assembly rises to position 1 to pick up the first wafer 290a from the wafer pins 190, 192 and thermocouple 193 (the lower arm end effector 134 is now above the wafer pins 190, 192 and thermocouple 193). As shown in Figure 22, the lower arm assembly 130, 132, 134 returns to the loadlock chamber 102 with the first wafer 290a.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/US2002/023233 2001-07-13 2002-07-12 Wafer transport apparatus Ceased WO2003007340A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2002354691A AU2002354691A1 (en) 2001-07-13 2002-07-12 Wafer transport apparatus
EP02752504A EP1407479A2 (en) 2001-07-13 2002-07-12 Wafer transport apparatus
JP2003513012A JP4352233B2 (ja) 2001-07-13 2002-07-12 ロードロック室アセンブリ及びウエハ移送装置
KR1020047000473A KR100940958B1 (ko) 2001-07-13 2002-07-12 웨이퍼 트랜스포트 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/905,031 US6663333B2 (en) 2001-07-13 2001-07-13 Wafer transport apparatus
US09/905,031 2001-07-13

Publications (2)

Publication Number Publication Date
WO2003007340A2 true WO2003007340A2 (en) 2003-01-23
WO2003007340A3 WO2003007340A3 (en) 2003-11-27

Family

ID=25420193

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/023233 Ceased WO2003007340A2 (en) 2001-07-13 2002-07-12 Wafer transport apparatus

Country Status (8)

Country Link
US (3) US6663333B2 (enExample)
EP (1) EP1407479A2 (enExample)
JP (1) JP4352233B2 (enExample)
KR (1) KR100940958B1 (enExample)
CN (1) CN1320595C (enExample)
AU (1) AU2002354691A1 (enExample)
TW (1) TW559863B (enExample)
WO (1) WO2003007340A2 (enExample)

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WO2004107414A3 (en) * 2003-05-22 2005-08-11 Axcelis Tech Inc Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith

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Also Published As

Publication number Publication date
CN1320595C (zh) 2007-06-06
KR100940958B1 (ko) 2010-02-05
KR20040015805A (ko) 2004-02-19
US20040076505A1 (en) 2004-04-22
US6969227B2 (en) 2005-11-29
US20030012624A1 (en) 2003-01-16
US6663333B2 (en) 2003-12-16
AU2002354691A1 (en) 2003-01-29
US6877946B2 (en) 2005-04-12
JP2004535674A (ja) 2004-11-25
JP4352233B2 (ja) 2009-10-28
TW559863B (en) 2003-11-01
CN1554112A (zh) 2004-12-08
EP1407479A2 (en) 2004-04-14
WO2003007340A3 (en) 2003-11-27
US20040052632A1 (en) 2004-03-18

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