WO2003004262A1 - Stratifie et son procede de production - Google Patents

Stratifie et son procede de production Download PDF

Info

Publication number
WO2003004262A1
WO2003004262A1 PCT/JP2002/006777 JP0206777W WO03004262A1 WO 2003004262 A1 WO2003004262 A1 WO 2003004262A1 JP 0206777 W JP0206777 W JP 0206777W WO 03004262 A1 WO03004262 A1 WO 03004262A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
laminate
layer
produced
printed wiring
Prior art date
Application number
PCT/JP2002/006777
Other languages
English (en)
French (fr)
Inventor
Masaru Nishinaka
Kanji Shimo-Ohsako
Takashi Itoh
Mutsuaki Murakami
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to JP2003510253A priority Critical patent/JPWO2003004262A1/ja
Priority to US10/482,855 priority patent/US20040231141A1/en
Priority to KR1020037003320A priority patent/KR100757612B1/ko
Publication of WO2003004262A1 publication Critical patent/WO2003004262A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2002/006777 2001-07-06 2002-07-04 Stratifie et son procede de production WO2003004262A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003510253A JPWO2003004262A1 (ja) 2001-07-06 2002-07-04 積層体およびその製造方法
US10/482,855 US20040231141A1 (en) 2001-07-06 2002-07-04 Laminate and its producing method
KR1020037003320A KR100757612B1 (ko) 2001-07-06 2002-07-04 적층체 및 그의 제조 방법

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2001206862 2001-07-06
JP2001-206862 2001-07-06
JP2001237058 2001-08-03
JP2001-237058 2001-08-03
JP2001348302 2001-11-14
JP2001348300 2001-11-14
JP2001-348300 2001-11-14
JP2001-348302 2001-11-14
JP2001-348301 2001-11-14
JP2001348288 2001-11-14
JP2001348301 2001-11-14
JP2001-348288 2001-11-14

Publications (1)

Publication Number Publication Date
WO2003004262A1 true WO2003004262A1 (fr) 2003-01-16

Family

ID=27554965

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/006777 WO2003004262A1 (fr) 2001-07-06 2002-07-04 Stratifie et son procede de production

Country Status (3)

Country Link
JP (1) JPWO2003004262A1 (ja)
KR (1) KR100757612B1 (ja)
WO (1) WO2003004262A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006054357A (ja) * 2004-08-13 2006-02-23 Nippon Steel Chem Co Ltd フレキシブルプリント配線板用積層体及びその製造方法
WO2006082828A1 (ja) * 2005-02-04 2006-08-10 Kaneka Corporation 等方性接着フィルム及びフレキシブル金属張積層体
JP2006327200A (ja) * 2005-05-27 2006-12-07 Ls Cable Ltd 微細パターン用軟性金属積層板
JP2007242975A (ja) * 2006-03-10 2007-09-20 Mitsubishi Gas Chem Co Inc プリント配線板及びその製造方法
JP2008201117A (ja) * 2007-01-24 2008-09-04 Hitachi Chem Co Ltd 樹脂付き金属薄膜、印刷回路板及びその製造方法、並びに、多層配線板及びその製造方法
JP2015111579A (ja) * 2008-03-25 2015-06-18 味の素株式会社 絶縁樹脂シート及び該絶縁樹脂シートを用いた多層プリント配線板の製造方法
JP2015133167A (ja) * 2015-04-22 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
US9549462B2 (en) 2013-03-26 2017-01-17 Kaneka Corporation Conductive film substrate, transparent conductive film, and method for producing transparent conductive film
CN111836484A (zh) * 2020-07-29 2020-10-27 欣强电子（清远）有限公司 一种pcb板背靠背设计的加工方法
CN114980575A (zh) * 2022-05-26 2022-08-30 珠海杰赛科技有限公司 半侧金属化半侧非金属化盲槽的加工方法和印刷电路板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5457374B2 (ja) * 2009-01-29 2014-04-02 Ｊｘ日鉱日石金属株式会社 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法
JP6251568B2 (ja) * 2010-07-06 2017-12-20 アトテック ドイチェランド ゲーエムベーハー 金属表面を処理する方法と、この方法によって形成された装置
JP5870148B2 (ja) 2013-11-27 2016-02-24 Ｊｘ金属株式会社 キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法
KR101991922B1 (ko) * 2017-04-28 2019-06-21 주식회사 진영알앤에스 금 적층 구리 필름 및 그 제조 방법
US11877404B2 (en) * 2020-02-13 2024-01-16 Averatek Corporation Catalyzed metal foil and uses thereof
WO2021163440A1 (en) * 2020-02-13 2021-08-19 Averatek Corporation Catalyzed metal foil and uses thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181402A (ja) * 1994-12-22 1996-07-12 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板の製造方法
JPH10193505A (ja) * 1997-01-09 1998-07-28 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板の製造方法
JP2000349412A (ja) * 1999-06-08 2000-12-15 Nippon Mektron Ltd 可撓性回路基板のビアホ−ル形成法
JP2001140084A (ja) * 1999-08-27 2001-05-22 Mec Kk ニッケルまたはニッケル合金のエッチング液

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08184202A (ja) * 1994-12-27 1996-07-16 Takenaka Komuten Co Ltd 集合住宅

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181402A (ja) * 1994-12-22 1996-07-12 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板の製造方法
JPH10193505A (ja) * 1997-01-09 1998-07-28 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板の製造方法
JP2000349412A (ja) * 1999-06-08 2000-12-15 Nippon Mektron Ltd 可撓性回路基板のビアホ−ル形成法
JP2001140084A (ja) * 1999-08-27 2001-05-22 Mec Kk ニッケルまたはニッケル合金のエッチング液

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006054357A (ja) * 2004-08-13 2006-02-23 Nippon Steel Chem Co Ltd フレキシブルプリント配線板用積層体及びその製造方法
JP4647954B2 (ja) * 2004-08-13 2011-03-09 新日鐵化学株式会社 フレキシブルプリント配線板用積層体の製造方法
WO2006082828A1 (ja) * 2005-02-04 2006-08-10 Kaneka Corporation 等方性接着フィルム及びフレキシブル金属張積層体
JP2006327200A (ja) * 2005-05-27 2006-12-07 Ls Cable Ltd 微細パターン用軟性金属積層板
JP4566157B2 (ja) * 2005-05-27 2010-10-20 エルエス ケーブル リミテッド 微細パターン用軟性金属積層板
JP2007242975A (ja) * 2006-03-10 2007-09-20 Mitsubishi Gas Chem Co Inc プリント配線板及びその製造方法
JP2008201117A (ja) * 2007-01-24 2008-09-04 Hitachi Chem Co Ltd 樹脂付き金属薄膜、印刷回路板及びその製造方法、並びに、多層配線板及びその製造方法
JP2015111579A (ja) * 2008-03-25 2015-06-18 味の素株式会社 絶縁樹脂シート及び該絶縁樹脂シートを用いた多層プリント配線板の製造方法
US9549462B2 (en) 2013-03-26 2017-01-17 Kaneka Corporation Conductive film substrate, transparent conductive film, and method for producing transparent conductive film
JP2015133167A (ja) * 2015-04-22 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
CN111836484A (zh) * 2020-07-29 2020-10-27 欣强电子（清远）有限公司 一种pcb板背靠背设计的加工方法
CN114980575A (zh) * 2022-05-26 2022-08-30 珠海杰赛科技有限公司 半侧金属化半侧非金属化盲槽的加工方法和印刷电路板

Also Published As

Publication number Publication date
JPWO2003004262A1 (ja) 2004-10-21
KR100757612B1 (ko) 2007-09-10
KR20030027117A (ko) 2003-04-03

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