WO2003001253A3 - Optoelektronisches bauelement und verfahren zu seiner herstellung - Google Patents
Optoelektronisches bauelement und verfahren zu seiner herstellung Download PDFInfo
- Publication number
- WO2003001253A3 WO2003001253A3 PCT/DE2002/002232 DE0202232W WO03001253A3 WO 2003001253 A3 WO2003001253 A3 WO 2003001253A3 DE 0202232 W DE0202232 W DE 0202232W WO 03001253 A3 WO03001253 A3 WO 03001253A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- filling material
- transmitter
- receiver
- optoelectronic component
- production
- Prior art date
Links
- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/481,528 US7256428B2 (en) | 2001-06-20 | 2002-06-19 | Optoelectronic component and method for the production thereof |
JP2003507594A JP2004532533A (ja) | 2001-06-20 | 2002-06-19 | オプトエレクトロニクス素子およびオプトエレクトロニクス素子の製造法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10129785A DE10129785B4 (de) | 2001-06-20 | 2001-06-20 | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
DE10129785.8 | 2001-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003001253A2 WO2003001253A2 (de) | 2003-01-03 |
WO2003001253A3 true WO2003001253A3 (de) | 2003-03-13 |
Family
ID=7688865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/002232 WO2003001253A2 (de) | 2001-06-20 | 2002-06-19 | Optoelektronisches bauelement und verfahren zu seiner herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US7256428B2 (de) |
JP (1) | JP2004532533A (de) |
DE (1) | DE10129785B4 (de) |
WO (1) | WO2003001253A2 (de) |
Families Citing this family (35)
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---|---|---|---|---|
DE102004001312B4 (de) * | 2003-07-25 | 2010-09-30 | Seoul Semiconductor Co., Ltd. | Chip-Leuchtdiode und Verfahren zu ihrer Herstellung |
DE10353604B4 (de) * | 2003-08-27 | 2012-06-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE10361650A1 (de) * | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul und Verfahren zu dessen Herstellung |
DE202004021711U1 (de) * | 2004-03-24 | 2010-07-15 | Odelo Led Gmbh | Optoelektronisches Bauelement mit einer auf seine Abbildung abgestimmten Abstrahlcharakteristik |
US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
JP4615981B2 (ja) * | 2004-12-08 | 2011-01-19 | スタンレー電気株式会社 | 発光ダイオード及びその製造方法 |
US20060189013A1 (en) * | 2005-02-24 | 2006-08-24 | 3M Innovative Properties Company | Method of making LED encapsulant with undulating surface |
US7595515B2 (en) | 2005-10-24 | 2009-09-29 | 3M Innovative Properties Company | Method of making light emitting device having a molded encapsulant |
US20070092636A1 (en) * | 2005-10-24 | 2007-04-26 | 3M Innovative Properties Company | Method of making light emitting device having a molded encapsulant |
EP1974389A4 (de) | 2006-01-05 | 2010-12-29 | Illumitex Inc | Separate optische vorrichtung zur lichtorientierung von einer led |
KR100764148B1 (ko) * | 2006-01-17 | 2007-10-05 | 루시미아 주식회사 | 시트상 형광체와 그 제조방법 및 이를 이용한 발광장치 |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
KR100703217B1 (ko) * | 2006-02-22 | 2007-04-09 | 삼성전기주식회사 | 발광다이오드 패키지 제조방법 |
US8044585B2 (en) * | 2006-05-02 | 2011-10-25 | Chain Technology Consultant Inc. | Light emitting diode with bumps |
KR20090064474A (ko) | 2006-10-02 | 2009-06-18 | 일루미텍스, 인크. | Led 시스템 및 방법 |
KR100770424B1 (ko) * | 2006-12-13 | 2007-10-26 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
US9944031B2 (en) * | 2007-02-13 | 2018-04-17 | 3M Innovative Properties Company | Molded optical articles and methods of making same |
US8330176B2 (en) | 2007-02-13 | 2012-12-11 | 3M Innovative Properties Company | LED devices having lenses and methods of making same |
WO2009100358A1 (en) | 2008-02-08 | 2009-08-13 | Illumitex, Inc. | System and method for emitter layer shaping |
JP2010050294A (ja) * | 2008-08-22 | 2010-03-04 | Glory Science Co Ltd | レンズを有する発光ユニットの製造方法 |
KR100993317B1 (ko) * | 2008-08-26 | 2010-11-09 | 삼성전기주식회사 | 발광 다이오드 패키지의 렌즈 제조방법 |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
JP5428358B2 (ja) * | 2009-01-30 | 2014-02-26 | ソニー株式会社 | 光学素子パッケージの製造方法 |
US7892869B2 (en) * | 2009-07-23 | 2011-02-22 | Edison Opto Corporation | Method for manufacturing light emitting diode assembly |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
TWM382505U (en) * | 2010-01-15 | 2010-06-11 | Cheng Uei Prec Ind Co Ltd | Video device |
DE102010024545B4 (de) | 2010-06-22 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
DE102010024864B4 (de) * | 2010-06-24 | 2021-01-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
JP2012069589A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | 発光装置 |
TWI517452B (zh) * | 2011-03-02 | 2016-01-11 | 建準電機工業股份有限公司 | 發光晶體之多晶封裝結構 |
KR20130096094A (ko) * | 2012-02-21 | 2013-08-29 | 엘지이노텍 주식회사 | 발광소자 패키지, 발광 소자 패키지 제조방법 및 이를 구비한 조명 시스템 |
EP3167494B1 (de) * | 2014-07-10 | 2019-10-02 | "Octa Light Bulgaria" AD | Verfahren und installation zur herstellung von lichtemittierenden dioden |
US9752925B2 (en) * | 2015-02-13 | 2017-09-05 | Taiwan Biophotonic Corporation | Optical sensor |
US9793450B2 (en) | 2015-11-24 | 2017-10-17 | Samsung Electronics Co., Ltd. | Light emitting apparatus having one or more ridge structures defining at least one circle around a common center |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62196878A (ja) * | 1986-02-25 | 1987-08-31 | Koito Mfg Co Ltd | 照明装置 |
JPH05145121A (ja) * | 1991-11-18 | 1993-06-11 | Matsushita Electric Works Ltd | 発光ダイオードの実装構造 |
US5513289A (en) * | 1988-10-27 | 1996-04-30 | Omron Tateisi Electronics | Optical integrated lens/grating coupling device |
WO2000024062A1 (en) * | 1998-10-21 | 2000-04-27 | Koninklijke Philips Electronics N.V. | Led module and luminaire |
JP2001028456A (ja) * | 1999-07-14 | 2001-01-30 | Victor Co Of Japan Ltd | 半導体発光素子 |
Family Cites Families (15)
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FR2592221B1 (fr) | 1985-12-20 | 1988-02-12 | Radiotechnique Compelec | Procede d'encapsulation d'un composant electronique au moyen d'une resine synthetique |
DE3719338A1 (de) * | 1987-06-10 | 1988-12-29 | Yue Wen Cheng | Leuchtdioden-anzeigevorrichtung |
US4843280A (en) * | 1988-01-15 | 1989-06-27 | Siemens Corporate Research & Support, Inc. | A modular surface mount component for an electrical device or led's |
US5130531A (en) * | 1989-06-09 | 1992-07-14 | Omron Corporation | Reflective photosensor and semiconductor light emitting apparatus each using micro Fresnel lens |
JPH06334220A (ja) * | 1993-05-24 | 1994-12-02 | Iwasaki Electric Co Ltd | 発光ダイオード |
DE19638630B4 (de) * | 1996-09-20 | 2004-11-18 | Siemens Ag | UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen |
DE19746893B4 (de) * | 1997-10-23 | 2005-09-01 | Siemens Ag | Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung |
JPH11163419A (ja) * | 1997-11-26 | 1999-06-18 | Rohm Co Ltd | 発光装置 |
DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
JP2000216443A (ja) * | 1999-01-25 | 2000-08-04 | Citizen Electronics Co Ltd | 表面実装型発光ダイオ―ド及びその製造方法 |
DE19918370B4 (de) * | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
DE10023353A1 (de) | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
JP2002216443A (ja) | 2000-11-17 | 2002-08-02 | Hitachi Ltd | 磁気ディスク装置及びその制御方法 |
US6987613B2 (en) * | 2001-03-30 | 2006-01-17 | Lumileds Lighting U.S., Llc | Forming an optical element on the surface of a light emitting device for improved light extraction |
JP3977774B2 (ja) * | 2003-06-03 | 2007-09-19 | ローム株式会社 | 光半導体装置 |
-
2001
- 2001-06-20 DE DE10129785A patent/DE10129785B4/de not_active Expired - Fee Related
-
2002
- 2002-06-19 WO PCT/DE2002/002232 patent/WO2003001253A2/de active Application Filing
- 2002-06-19 JP JP2003507594A patent/JP2004532533A/ja active Pending
- 2002-06-19 US US10/481,528 patent/US7256428B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62196878A (ja) * | 1986-02-25 | 1987-08-31 | Koito Mfg Co Ltd | 照明装置 |
US5513289A (en) * | 1988-10-27 | 1996-04-30 | Omron Tateisi Electronics | Optical integrated lens/grating coupling device |
JPH05145121A (ja) * | 1991-11-18 | 1993-06-11 | Matsushita Electric Works Ltd | 発光ダイオードの実装構造 |
WO2000024062A1 (en) * | 1998-10-21 | 2000-04-27 | Koninklijke Philips Electronics N.V. | Led module and luminaire |
JP2001028456A (ja) * | 1999-07-14 | 2001-01-30 | Victor Co Of Japan Ltd | 半導体発光素子 |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 012, no. 049 (E - 582) 13 February 1988 (1988-02-13) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 528 (E - 1437) 22 September 1993 (1993-09-22) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 16 8 May 2001 (2001-05-08) * |
Also Published As
Publication number | Publication date |
---|---|
JP2004532533A (ja) | 2004-10-21 |
US7256428B2 (en) | 2007-08-14 |
DE10129785A1 (de) | 2003-01-09 |
DE10129785B4 (de) | 2010-03-18 |
US20050001228A1 (en) | 2005-01-06 |
WO2003001253A2 (de) | 2003-01-03 |
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