Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67098—Apparatus for thermal treatment
  • H01L21/67109—Apparatus for thermal treatment mainly by convection
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
  • C25D11/02—Anodisation
  • C25D11/04—Anodisation of aluminium or alloys based thereon
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
  • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/04—Tubular or hollow articles
  • B23K2101/14—Heat exchangers

Definitions

• the present invention relates to a cooling plate used as a backing plate, a susceptor, a cooling plate for various temperature control, and the like in, for example, a sputtering device, a semiconductor manufacturing device, and an LCD manufacturing device.
• aluminum is used to include aluminum and its alloys.
• a backing plate for attaching a target is used in a sputtering apparatus for manufacturing semiconductors.
• This backing plate (101) has a target (100) attached to the surface as shown in FIG.
• a cooling medium flow passage (102) is formed in the inside to cool the cooling medium. That is, the backing plate (101) is composed of a laminated plate in which two aluminum plates (103) and (104) are overlapped and joined, and the backing plate (101) is formed on the overlapping surface of both aluminum plates (103) and (104).
• the cooling medium flow passage forming grooves (105) and (106) are respectively formed, and the aluminum plates (103) and (104) are joined and integrated so that the positions of these grooves correspond to each other, thereby forming the backing plate (101). Circuit inside A cooling medium flow path (102) is formed.
• the joining and integration of the two aluminum plates (103) (104) is performed in order to prevent the leakage of the cooling medium flowing through the cooling medium flow passage (102). This was generally done by brazing the mating surfaces.
• the surface of the groove (105) (106) is in a state where the aluminum base is exposed as it is, so that water or the like as a cooling medium is exposed to the groove (105). If (106) was allowed to flow for a certain period of time, there was a problem that these grooves would be corroded, and thus the life of the backing plate was short. At present, for example, they are replaced with new ones in one to two years due to such deterioration due to corrosion.
• the present invention has been made in view of such technical background, and an object of the present invention is to provide a cooling plate having a cooling medium circulation channel having excellent corrosion resistance and a long life, and having excellent cooling performance. .
• the above object is to provide a cooling plate having a cooling medium flow passage formed therein by superimposing and joining and integrating a plurality of metal plates each having a cooling medium flow passage forming groove formed on an overlapping surface.
• An anodic oxide film is formed on at least the groove for forming the cooling medium flow passage on the superposed surface of the metal plates, and the plurality of metal plates are integrally joined by friction stir welding. Achieved by boards.
• this cooling plate since the anodic oxide film is formed at least in the groove for forming the cooling medium flow passage, corrosion of the cooling medium flow passage is effectively prevented, and The durability is significantly improved.
• the metal plates are joined by friction stir welding, the welded portions do not adversely affect the anodic oxide film after production, such as deterioration, and therefore the excellent corrosion prevention effect is sufficiently maintained. And a long-life cooling plate with excellent durability can be obtained.
• the joining is performed by friction stir welding, the metal plates are joined to each other in an excellent state, whereby uniform cooling is performed as a cooling plate. ,
• the anodized film is formed on the entire surface of the superposed surfaces of the metal plates, thereby preventing not only corrosion of the cooling medium flow passage but also corrosion of the entire superposed surface of the metal plates.
• the durability as a plate is further improved.
• At least the peripheral portion near the cooling medium flow passage in the gap between the overlapping surfaces of the metal plates is sealed in a liquid-tight state by a sealing material. This can prevent the coolant such as water from leaking out of the cooling medium flow passage and staying there, so that the occurrence of crevice corrosion can be reliably prevented, and the durability of the cooling plate is improved. Further improve.
• a material made of a metal material or a material made of a water-resistant resin adhesive from the viewpoint of excellent joining (adhesion) durability.
• an adhesive composed of one or more resins selected from the group consisting of an epoxy resin, a phenol resin and a polyolefin resin has an advantage in terms of adhesion durability. It is preferable because it is particularly excellent.
• the method for manufacturing a cooling plate according to the present invention may further include: a first step of forming a cooling medium flow passage forming groove on each of the superposed surfaces of the plurality of metal plates; and anodizing treatment on the superposed surface of the metal plates.
• the cooling plate of the present invention having the above-mentioned features be manufactured with high productivity, but also before the friction stir welding is performed, since the anodizing treatment is performed first, the anode An oxide film can be formed, and therefore, the reliability of preventing corrosion of the superposed surfaces of the metal plates can be enhanced, and there is an advantage that a high-quality cooling plate can be manufactured. Furthermore, since the metal plates are joined by friction stir welding, the joining can be performed without deteriorating the previously formed anodic oxide film at the time of joining, and the excellent corrosion prevention effect can be sufficiently maintained. Thus, a long-lasting cooling plate with excellent durability can be manufactured. BRIEF DESCRIPTION OF THE FIGURES
• FIG. 1 is a perspective view showing a cooling plate according to one embodiment of the present invention.
• FIG. 2 is a plan view of the cooling plate.
• FIG. 3A is a sectional view taken along line AA in FIG.
• FIG. 3B is an enlarged sectional view showing the cooling medium flow passage and its vicinity in FIG. 3A.
• FIG. 4 is a perspective view showing the cooling plate in a separated state before joining.
• FIG. 5 is a sectional view showing a cooling plate according to another embodiment.
• FIG. 6 is a sectional view showing a conventional cooling plate. BEST MODE FOR CARRYING OUT THE INVENTION
• FIGS. 1 to 3 show a cooling system according to an embodiment of the present invention.
• the cooling plate (1) is used as a backing plate of a sputtering apparatus, and is composed of a laminated plate in which two metal plates (2) and (3) are overlapped and joined together.
• an aluminum plate is used as the metal plate (2) (3).
• Each of the superposed surfaces of the two metal plates (2) and (3) has a semicircular cross section.
• the grooves (2a) and (3a) for forming the cooling medium flow passage are formed. That is, as shown in FIG. 4, in the superposed surface of the lower metal plate (3), after one groove formed from one end in the longitudinal direction is branched in three directions, these three The grooves extend parallel to the other end along the length direction, and the three grooves join at the other end to form a single groove for forming the cooling medium flow passage (3). a) is formed. In the upper metal plate (2), the cooling medium passage forming groove (2a) in exactly the same manner is formed. Then, as shown in FIG.
• an anodized film (10) (10) is formed on the superposed surface of the two metal plates (2) and (3). That is, the anodic oxide films (10) and (10) are formed in the grooves (2a) and (3a) for forming the cooling medium flow passages, and the entire remaining surface of the superposed surface of the metal plates (2) and (3) is formed. Similarly, anodized films (10) and (10) are formed. Since the anodic oxide film is formed on the grooves (2a) and (3a) for forming the cooling medium flow passages, the corrosion of the cooling medium flow passages (4) can be effectively prevented. The durability of the cooling plate (1) can be significantly improved.
• the cooling medium flow paths are formed.
• the corrosion prevention of (4) it is possible to prevent the corrosion of the entire overlapping surface, and it is possible to further improve the durability of the cooling plate (1).
• the periphery of the cooling medium flow path (4) in the gap between the overlapping surfaces of the metal plates (2) and (3) is sealed in a liquid-tight state by the sealing material (11). I have.
• a gap is formed between the superposed surfaces of the metal plates, crevice corrosion easily occurs due to a cooling medium such as water.
• cooling medium flow path (4) is sealed with a sealing material, so that refrigerant such as water leaks out of the cooling medium flow path (4) and stays there. As a result, the occurrence of crevice corrosion can be reliably prevented, and the durability of the cooling plate (1) is further improved. Note that the entire gap 5 between the overlapping surfaces of the metal plates may be sealed with a sealing material.
• the joining and integration of the two metal plates (2) and (3) are performed by friction stir welding.
• This friction stir welding is performed, for example, by inserting a rotating pin-shaped probe into a welding target portion, softening the contact portion with the probe with frictional heat, and stirring the probe while inserting the probe along the welding target portion.
• This is a joining method of welding by moving. It is a kind of solid-state joining method, so that dissimilar metals can be joined together.
• the metal plate (2) is friction stir welded from the upper surface side, and the position of the welded portion (20) is (2) A central portion sandwiched between the peripheral portion of (3) and the three grooves (2a), (2a), and (2a) arranged in parallel as described above.
• any material can be used as long as it can seal the gap between the superposed surfaces of the metal plates (2) and (3) in a liquid-tight state.
• a sealing material made of a metal material (metal fitting) or a sealing material made of a five-water-resistant resin adhesive since the bonding (adhesion) durability can be improved.
• the metal material constituting the sealing material (11) is not particularly limited, and examples thereof include aluminum and the like.
• the water-resistant resin adhesive constituting the sealing material (11) is not particularly limited, but is a group consisting of an epoxy-based resin, a phenol-based resin, and a polyolefin-based resin because of its particularly excellent adhesion durability. It is preferable to use an adhesive composed of one or more resins selected from among them.
• the cooling plate (1) of the present invention is manufactured, for example, as follows. First, the overlapping surfaces of the two metal plates (2) and (3) are pressed by a molding die having a molding convex portion corresponding to the shape of the grooves (2a) and (3a). The grooves (2a) and (3a) for forming the coolant flow passage are formed on the surface (first step).
• an anodizing treatment is performed on the superposed surfaces of the metal plates (2) and (3) to form an anodized film (second step).
• the superposed surfaces of the metal plates (2) and (3) are overlapped so that the positions of the cooling medium flow passage forming grooves (2a) and (3a) coincide with each other, and friction stir welding is performed in this state.
• the metal plates (2) and (3) are joined and integrated (third step).
• the anodic oxide film (10) is formed on the superposed surface of the metal plates (2) and (3). (Rear surface).
• this two metal plates (2) and (3) are overlapped and joined.
• this two-piece joint integrated structure is a basic structure, and one or more sheets are added to this structure.
• a configuration in which three or more metal plates are joined in a configuration having the same gist as that of the above-described embodiment may be adopted, and the invention described in the claims of the present application is as described above. It also includes various configurations.
• the cross-sectional shape of the cooling medium flow path (4) is circular, but is not particularly limited to this.
• the circuit configuration of the cooling medium flow passage (4) is not limited to the branching or merging configuration as in the above embodiment, but may be, for example, a meandering circuit.
• the friction stir welding is performed from the upper surface side of the metal plate (2). However, for example, as shown in FIG. 5, the friction stir welding is performed from the side surface side of the metal plate (2) (3). It may be.
• the cooling plate (1) of the present invention has been described as being used as a backing plate of a sputtering apparatus.
• the use of the cooling plate (1) of the present invention is not particularly limited. It can be used as a packing plate, a susceptor, or a cooling plate for various temperature control in an apparatus or an LCD manufacturing apparatus.
• the groove forming surfaces of the aluminum plates were overlapped with each other in such a manner as to match the positions of the grooves, and in this state, friction stir welding was performed to join and integrate the aluminum plates to obtain a cooling plate.
• a cooling plate was obtained in the same manner as in Example 1 except that the vicinity of the cooling medium flow passage was sealed in a liquid-tight state with a sealing material made of aluminum.
• Example 1 except that the peripheral portion near the cooling medium flow path in the gap between the overlapping surfaces of the aluminum plates (anodic oxide films) was sealed in a liquid-tight state with a sealing material made of an epoxy resin adhesive.
• a cooling plate was obtained in the same manner as in 1.
• Example 1 except that the peripheral portion near the cooling medium flow passage in the gap between the overlapping surfaces of the aluminum plates (anodized films) was sealed in a liquid-tight state with a sealing material made of an acryl resin adhesive.
• a cooling plate was obtained in the same manner as in 1.
• a cooling plate was obtained in the same manner as in Example 1, except that the anodic oxide film was not formed.
• a cooling plate was obtained in the same manner as in Comparative Example 1, except that TIG welding was used instead of friction stir welding.
• Corrosion test solution NaC 1: 234mgZL, Na 2 S0 4: 89mgZL, C uC 12 ⁇ 2 H2O: 2. 7mg / L, F e C 12 ⁇ 6H 2 0: 145mg / L
• the cooling plates of Examples 1 to 6 of the present invention were excellent in corrosion resistance in both the cooling medium flow paths and the gaps between the overlapping surfaces.
• the cooling plates of Comparative Examples 1 and 2 were inferior in corrosion resistance.
• the cathodic oxide film is formed at least in the groove for forming the cooling medium flow passage, corrosion of the cooling medium flow passage can be effectively prevented, and the durability of the cooling plate can be improved.
• the welds may have a negative effect on the anodic oxide coating over time after production, such as deterioration. Therefore, it is possible to maintain the initially excellent corrosion prevention effect over a long period of time, and a synergistic action of these can provide a durable and long-lasting cooling plate.
• the metal plates are joined in a favorable state by friction stir welding, uniform cooling without variation at any position on the surface is possible.
• the durability of the cooling plate can be further improved.
• the sealing material is made of a metal material or a water-resistant resin adhesive
• the joining durability can be further improved, and the reliability of the sealing can be improved.
• the water-resistant resin adhesive is composed of one or more resins selected from the group consisting of epoxy resin, phenol resin and polyolefin resin, the adhesive durability is remarkable. Thus, the sealing can be reliably performed for a long time, and the durability of the cooling plate can be further improved.
• the method for manufacturing a cooling plate according to the present invention can produce the cooling plate with high productivity and, since the anodizing treatment is first performed before performing the friction stir welding, the details of the superposed surface of the metal plate can be obtained.
• the anodized film can be formed, and therefore, the reliability of preventing corrosion of the superposed surfaces of the metal plates can be enhanced, and a high-quality cooling plate can be manufactured.
• the friction stir welding is used, the anodized film formed earlier during the welding does not deteriorate, and therefore, in combination with the above-described effect of improving the reliability of the corrosion prevention, a high durability with high durability can be obtained.
• a long-lasting cooling plate can be manufactured.
• the cooling plate of the present invention enables uniform cooling, has excellent durability, and has a long life. Therefore, for example, a backing plate, a susceptor, a variety of types in a sputtering device, a semiconductor manufacturing device, an LCD manufacturing device, etc. It is suitable as a cooling plate for temperature control.

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• General Engineering & Computer Science (AREA)
• Pressure Welding/Diffusion-Bonding (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)

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Citations (4)

• 2002
  • 2002-06-20 WO PCT/JP2002/006143 patent/WO2003001136A1/ja active Application Filing
  • 2002-06-20 TW TW091113513A patent/TW530147B/zh not_active IP Right Cessation
  • 2002-06-20 KR KR10-2003-7016592A patent/KR20040012950A/ko not_active Application Discontinuation

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