WO2002084720A3 - Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif - Google Patents

Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif Download PDF

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Publication number
WO2002084720A3
WO2002084720A3 PCT/JP2002/003318 JP0203318W WO02084720A3 WO 2002084720 A3 WO2002084720 A3 WO 2002084720A3 JP 0203318 W JP0203318 W JP 0203318W WO 02084720 A3 WO02084720 A3 WO 02084720A3
Authority
WO
WIPO (PCT)
Prior art keywords
main body
supported
unit
body unit
points
Prior art date
Application number
PCT/JP2002/003318
Other languages
English (en)
French (fr)
Other versions
WO2002084720A2 (fr
Inventor
Kenji Nishi
Original Assignee
Nippon Kogaku Kk
Kenji Nishi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku Kk, Kenji Nishi filed Critical Nippon Kogaku Kk
Priority to AU2002246319A priority Critical patent/AU2002246319A1/en
Publication of WO2002084720A2 publication Critical patent/WO2002084720A2/ja
Priority to US10/310,036 priority patent/US6853443B2/en
Publication of WO2002084720A3 publication Critical patent/WO2002084720A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
PCT/JP2002/003318 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif WO2002084720A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002246319A AU2002246319A1 (en) 2001-04-06 2002-04-03 Exposure device and substrate processing system and device producing method
US10/310,036 US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001108334A JP2002305140A (ja) 2001-04-06 2001-04-06 露光装置及び基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/310,036 Continuation US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Publications (2)

Publication Number Publication Date
WO2002084720A2 WO2002084720A2 (fr) 2002-10-24
WO2002084720A3 true WO2002084720A3 (fr) 2007-10-25

Family

ID=18960494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/003318 WO2002084720A2 (fr) 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif

Country Status (6)

Country Link
US (1) US6853443B2 (ja)
JP (1) JP2002305140A (ja)
KR (1) KR20030011296A (ja)
CN (1) CN1636268A (ja)
AU (1) AU2002246319A1 (ja)
WO (1) WO2002084720A2 (ja)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004286099A (ja) * 2003-03-20 2004-10-14 Yaskawa Electric Corp 制振装置
AU2003219097A1 (en) 2003-03-26 2004-10-18 Carl Zeiss Smt Ag Device for the low-deformation replaceable mounting of an optical element
KR101484435B1 (ko) 2003-04-09 2015-01-19 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
EP2613193B1 (en) 2003-04-11 2016-01-13 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
KR20060009957A (ko) 2003-05-27 2006-02-01 가부시키가이샤 니콘 노광 장치 및 디바이스의 제조 방법
KR101281357B1 (ko) * 2003-06-06 2013-07-02 가부시키가이샤 니콘 광학 소자 유지 장치, 경통, 노광 장치, 및 디바이스의제조방법
TWI536430B (zh) * 2003-06-19 2016-06-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
WO2005006416A1 (ja) * 2003-07-09 2005-01-20 Nikon Corporation 結合装置、露光装置、及びデバイス製造方法
CN102854755A (zh) 2003-07-09 2013-01-02 株式会社尼康 曝光装置
CN102323724B (zh) * 2003-07-28 2014-08-13 株式会社尼康 液浸曝光装置及其制造方法、曝光装置、器件制造方法
TWI569308B (zh) 2003-10-28 2017-02-01 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造 方法
TWI612338B (zh) 2003-11-20 2018-01-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
JP4747263B2 (ja) * 2003-11-24 2011-08-17 カール・ツァイス・エスエムティー・ゲーエムベーハー オブジェクティブにおける光学素子のための保持装置
JP4654915B2 (ja) * 2003-12-25 2011-03-23 株式会社ニコン 光学素子の保持装置、鏡筒、露光装置、及びデバイスの製造方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
TWI360837B (en) 2004-02-06 2012-03-21 Nikon Corp Polarization changing device, optical illumination
JP4710308B2 (ja) * 2004-10-29 2011-06-29 株式会社ニコン レチクル搬送装置、露光装置、及びレチクルの搬送方法
US7869000B2 (en) * 2004-11-02 2011-01-11 Nikon Corporation Stage assembly with lightweight fine stage and low transmissibility
US7417714B2 (en) * 2004-11-02 2008-08-26 Nikon Corporation Stage assembly with measurement system initialization, vibration compensation, low transmissibility, and lightweight fine stage
KR20070085764A (ko) * 2004-11-04 2007-08-27 가부시키가이샤 니콘 미동 스테이지 ｚ 지지 장치
US20090262316A1 (en) * 2005-01-31 2009-10-22 Nikon Corporation Exposure apparatus and method for producing device
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
KR101544336B1 (ko) 2005-05-12 2015-08-12 가부시키가이샤 니콘 투영 광학계, 노광 장치 및 노광 방법
WO2006133800A1 (en) 2005-06-14 2006-12-21 Carl Zeiss Smt Ag Lithography projection objective, and a method for correcting image defects of the same
US20070030462A1 (en) * 2005-08-03 2007-02-08 Nikon Corporation Low spring constant, pneumatic suspension with vacuum chamber, air bearing, active force compensation, and sectioned vacuum chambers
US8953148B2 (en) * 2005-12-28 2015-02-10 Nikon Corporation Exposure apparatus and making method thereof
JP2007294594A (ja) * 2006-04-24 2007-11-08 Nsk Ltd 露光装置及び露光方法
US7936443B2 (en) * 2006-05-09 2011-05-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080073596A1 (en) * 2006-08-24 2008-03-27 Asml Netherlands B.V. Lithographic apparatus and method
TWI653511B (zh) * 2006-08-31 2019-03-11 日商尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
US8908144B2 (en) * 2006-09-27 2014-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100779372B1 (ko) * 2006-12-06 2007-11-23 동부일렉트로닉스 주식회사 진동측정수단이 구비된 노광장치 및 진동저감방법
KR20090106555A (ko) * 2006-12-27 2009-10-09 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 디바이스의 제조 방법
JP5013906B2 (ja) * 2007-03-05 2012-08-29 キヤノン株式会社 光学素子保持装置
KR100866447B1 (ko) * 2007-06-19 2008-10-31 주식회사 동부하이텍 반도체 장치 제조용 노광 장치
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5188135B2 (ja) * 2007-10-05 2013-04-24 キヤノン株式会社 露光装置及びデバイス製造方法
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
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NL1036167A1 (nl) 2007-11-20 2009-05-25 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US9176393B2 (en) 2008-05-28 2015-11-03 Asml Netherlands B.V. Lithographic apparatus and a method of operating the apparatus
WO2009145048A1 (ja) 2008-05-28 2009-12-03 株式会社ニコン 空間光変調器の検査装置および検査方法、照明光学系、照明光学系の調整方法、露光装置、およびデバイス製造方法
NL1036957A1 (nl) * 2008-06-13 2009-12-15 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5126076B2 (ja) * 2009-01-08 2013-01-23 富士通株式会社 位置測定装置、成膜方法並びに成膜プログラム及び成膜装置
JP5534910B2 (ja) * 2009-04-23 2014-07-02 ギガフォトン株式会社 極端紫外光源装置
DE102009026187A1 (de) * 2009-07-16 2011-01-27 Hseb Dresden Gmbh Inspektionssystem
WO2011006245A1 (en) * 2009-07-17 2011-01-20 Diversitech Equipment And Sales (1984) Ltd. Fume extraction system with automatic fume hood positioning
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US9242313B2 (en) * 2012-07-30 2016-01-26 General Electric Company Welding furnace and viewport assembly
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US9368378B2 (en) * 2013-12-31 2016-06-14 Sophia Wen Semiconductor wafer cleaning system
US9176070B2 (en) * 2014-04-07 2015-11-03 Hseb Dresden Gmbh Inspection assembly
US10409174B2 (en) 2014-06-16 2019-09-10 Asml Netherlands B.V. Lithographic apparatus, method of transferring a substrate and device manufacturing method
WO2016139012A1 (en) * 2015-03-03 2016-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JPWO2016167339A1 (ja) * 2015-04-17 2018-03-08 株式会社ニコン 露光システム
JP7360308B2 (ja) * 2019-11-25 2023-10-12 キヤノン株式会社 露光装置、露光方法、および物品製造方法
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09297018A (ja) * 1996-05-07 1997-11-18 Nikon Corp 位置検出装置
WO2000014779A1 (fr) * 1998-09-03 2000-03-16 Nikon Corporation Appareil et procede d'exposition, dispositif et procede de production dudit appareil
JP2000206279A (ja) * 1999-01-11 2000-07-28 Canon Inc 位置決め装置、露光装置およびデバイス製造方法
JP2001023885A (ja) * 1999-07-08 2001-01-26 Nikon Corp 露光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW318255B (ja) 1995-05-30 1997-10-21 Philips Electronics Nv
JP3575615B2 (ja) * 1995-05-30 2004-10-13 アーエスエム リソグラフィ ベスローテン フェンノートシャップ 三次元的に位置決め可能なマスクホルダを有するリソグラフ装置
WO1998024115A1 (fr) 1996-11-28 1998-06-04 Nikon Corporation Dispositif d'alignement et procede d'exposition
JPH11315883A (ja) * 1998-04-30 1999-11-16 Canon Inc 除振装置、露光装置およびデバイス製造方法
US6529260B2 (en) * 2001-05-03 2003-03-04 Nikon Corporation Lifting support assembly for an exposure apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09297018A (ja) * 1996-05-07 1997-11-18 Nikon Corp 位置検出装置
WO2000014779A1 (fr) * 1998-09-03 2000-03-16 Nikon Corporation Appareil et procede d'exposition, dispositif et procede de production dudit appareil
JP2000206279A (ja) * 1999-01-11 2000-07-28 Canon Inc 位置決め装置、露光装置およびデバイス製造方法
JP2001023885A (ja) * 1999-07-08 2001-01-26 Nikon Corp 露光装置

Also Published As

Publication number Publication date
US20030117596A1 (en) 2003-06-26
WO2002084720A2 (fr) 2002-10-24
AU2002246319A1 (en) 2002-10-28
KR20030011296A (ko) 2003-02-07
US6853443B2 (en) 2005-02-08
CN1636268A (zh) 2005-07-06
AU2002246319A8 (en) 2008-01-03
JP2002305140A (ja) 2002-10-18

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