WO2002074032A1 - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- WO2002074032A1 WO2002074032A1 PCT/JP2002/001597 JP0201597W WO02074032A1 WO 2002074032 A1 WO2002074032 A1 WO 2002074032A1 JP 0201597 W JP0201597 W JP 0201597W WO 02074032 A1 WO02074032 A1 WO 02074032A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cold plate
- electronic device
- integrated circuit
- brine
- case
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention uses a CPU or L S that requires measures against heat generation in a single case.
- It relates to an electronic device that houses a circuit board on which integrated circuit elements such as I are mounted.
- a server provided with a large number of electronic devices using integrated circuit elements is used. That is, in such a server, the operation of many integrated circuit elements As a result, a significant increase in temperature has occurred, so conventionally, the entire room in which the server is installed is cooled by a cooling device, and the cool air is taken into the electronic device to cool the integrated circuit element.
- cool air is taken in by a propeller fan (blower) provided on the back of the electronic device so that the flow of cool air generated in the electronic device hits the integrated circuit element. Only a part of the cooling water, and the cooling efficiency was not good. Therefore, part of the cool air taken into the case by the blower was discharged out of the electronic device without cooling the integrated circuit element.
- a propeller fan blower
- the present invention has been made in order to solve the problems of the related art, and provides an electronic device capable of efficiently cooling an integrated circuit element provided in a cold plate by heat exchange. With the goal. Disclosure of the invention
- the present invention is directed to an electronic device that accommodates a circuit board on which an integrated circuit element requiring heat generation countermeasures is mounted in a single case, and is attached to the integrated circuit element so that heat can be transferred from the integrated circuit element A cold plate, a pipeline heated by the cold plate circulates, and a heat exchanger that cools the pipeline and an air passage that connects the blower fan provided in the opening on one side of the case to the heat exchanger A cooling tank, a reserve tank for storing brine and a pump for circulating the brine, and a pump for circulating the brine, and at least one pair of cooling plates, which are provided in the flow of the brine from the heat exchanger to the cold plate. And a reciprocating straight-line plenum flow path.
- the present invention provides at least one of the blower fan and the pump so that the temperature of the cold plate becomes + 70 ° C or less when the temperature around the outer periphery of the case is + 35 ° C or more. It is characterized by including a control unit for controlling one of them.
- the present invention is characterized in that, in the above, a plurality of integrated circuit elements are mounted on a circuit board, and a cold plate is provided for each integrated circuit element.
- the present invention provides the above-described invention, in which a heat conductive material is provided between the integrated circuit element and the cold plate, and the integrated circuit element is formed using an elastic material, and the cold plate and a socket for holding the integrated circuit element are provided. It is characterized in that it is sandwiched between.
- the present invention is characterized in that, in the above, the blower fan is a cross flow fan, which is provided near the opening of the case, and supplies the air sucked from the opening in a line along the longitudinal direction of the heat exchanger. You.
- the present invention is characterized in that the fan casing is configured so that the opening faces downward and air is sucked from below. Further, in the above, the present invention is characterized in that the blower fan is a cross flow fan, which is provided near the opening of the case, and discharges the air heated by the heat exchanger from the opening.
- the present invention is characterized in that, in the above, the fan casing is configured to discharge air upward with the opening facing upward. Further, in the above, the present invention is characterized in that the angle at which the opening of the fan casing faces can be varied.
- the present invention provides the above-mentioned cold plate, wherein the cold plate is formed by fitting the irregularities formed on the two heat conductive members and bonding them together. It is characterized by holding a flowing pipe.
- the present invention is characterized in that a sheet material having thermal conductivity and elasticity is sandwiched between the heat conductive material and the pipe.
- the present invention is characterized in that a narrow portion is provided at a position on the upstream side with respect to the flow of brine inside the pipe sandwiched by the heat conductive material.
- the present invention as described above comprises a heat exchanger comprising a plurality of plates having heat conductivity, and a pipe penetrating through the plates so that heat can be transferred, and a pipe through which the inside flows.
- a part of the casing covering the exchanger is constituted by a fan casing or an extension of the fan casing, and the fan casing has a shape in which air is collected on a plate of the heat exchanger. .
- the present invention is characterized in that a plurality of ventilation holes are provided on a surface of the case surrounding the circuit board at a position facing the circuit board.
- the present invention is characterized in that the vent is formed by cutting and raising a part of the case.
- a pipe forming a circulation path of a pipeline circulating between the cold plate and the heat exchanger is arranged on one side in the case, and the bottom surface of this one side is connected to the heat exchanger. It is characterized by a low performance.
- the present invention is characterized in that a reserve tank and a pump are arranged on one side of the case.
- the present invention is characterized in that the bottom surface on one side of the case is inclined low toward a predetermined direction.
- the present invention provides, in the above, a brine detection sensor at the lowest portion of the bottom surface of the case or at or near the lowest portion.
- a detection unit that outputs an alarm in response to the output of the in-detection sensor.
- the present invention is characterized in that in the above, a plurality of heat radiation fins are provided on a side opposite to the integrated circuit element of the cold plate.
- the present invention is characterized in that in the above, a cooling plate blower is attached to the heat radiation fin.
- the present invention is characterized in that the blower for a cold plate has a centrifugal blower type fan.
- the present invention provides a heat exchanger comprising: a plurality of plates having heat conductivity; a pipe penetrating through the plate so that heat can be transmitted; and a pipe through which the inside flows.
- the outlet of the brine from the heat exchanger to the cold plate is set higher than the cold plate.
- FIG. 1 is a front view of a server rack on which a server as an embodiment of an electronic device to which the present invention is applied is loaded
- FIG. 2 is a perspective view of a server as an embodiment of the electronic device of the present invention.
- FIG. 3 is a perspective view of the server case of FIG. 2 with the top cover removed
- FIG. 4 is a plan sectional view of the server of FIG. 3
- FIG. 2 is a longitudinal side view of the front of the server in FIG. 2
- FIG. 6 is an enlarged view of a ventilation port on a side of a case of the server in FIG. 2
- FIG. 7 is a longitudinal rear view of the server in FIG.
- FIG. 8 is a longitudinal sectional side view of the server of FIG. 3, and FIG.
- FIG. 9 is a side view of an integrated circuit element and a cold plate mounted on a circuit board of the server of FIG. Yes, FIG. 10 is an exploded perspective view of the cold plate of FIG. 9, and FIG. 11 is a server of FIG.
- FIG. 12 is an electric circuit diagram of the brine cooling device.
- FIG. 12 is a flowchart for explaining the control operation of the microcomputer shown in FIG. 11, and
- FIG. 13 is a flowchart showing the control operation of the microcomputer shown in FIG.
- FIG. 14 is another flowchart for explaining the control operation of the computer.
- FIG. 14 is another flowchart for explaining the control operation of the microcomputer shown in FIG. 11, and
- FIG. FIG. 16 is a flowchart illustrating a control operation of another embodiment of the microcomputer computer shown in FIG. 11;
- FIG. 16 is a flowchart illustrating a control operation of another embodiment of the microcomputer shown in FIG. 15;
- FIG. 17 is a cross-sectional plan view of a server according to another embodiment of the electronic device of the present invention.
- FIG. 18 is a longitudinal sectional side view of the rear part of the server of FIG.
- the first nineteenth 20 is a perspective view of a cold plate and an integrated circuit element of a server according to another embodiment of the electronic device of the present invention.
- FIG. 20 is another perspective view of the cold plate of the integrated circuit element in the electronic device of the present invention.
- FIG. 21 is a diagram showing another mounting structure of the cold plate of the integrated circuit element in the electronic device of the present invention.
- FIG. 22 is a view showing still another mounting structure of the cold plate of the integrated circuit element in the electronic device of the present invention
- FIG. 23 is a diagram of the cold plate in the electronic device of the present invention
- FIG. 24 is a front view showing another embodiment, and FIG. 24 is a sectional view taken along line AA of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- a server (1U server) 1 of the embodiment is a center for providing various services to computers connected to a network, and has a caster 2A for moving on a bottom surface.
- Server Attached to the frame 2B of the work 2 a plurality of units are erected over a plurality of upper and lower stages.
- Each server 1 houses a circuit board 5 on which a plurality of semiconductor integrated circuit elements 6 such as LSIs and CPUs (or a single semiconductor integrated circuit element 6) may be mounted.
- a controller 52 is provided below the server rack 2 for managing tasks and operating status of each server 1.
- the server 1 includes, for example, a circuit board 5, a floppy disk drive 31, a CD-ROM drive 32, and a thin rectangular case 3 having a height of 45 mm, a width of 450 mm, and a depth of 53 mm.
- electronic components such as power supply circuit (POWER) 9, connector (I / O) 8, plate-fin type heat exchanger 11, cross-floor fan 14 as blower fan, pump for brine circulation 15, a reserve tank 26 for storing the brine, a cold plate 16 that is mounted so as to transfer heat from the integrated circuit element 6 and cools the integrated circuit element 6 It is configured to house the cooling device 10.
- the case 3 has a front surface 3A, a bottom surface 3B, a rear surface 3C, left and right side surfaces 3D, 3D, and is covered with a detachable upper surface cover 4 on the upper surface.
- the floppy disk drive 31 and the CD-ROM drive 32 face the right end toward the front 3A of the case 3, and an opening 30 is formed on the left side thereof.
- the heat exchanger 11 is disposed inside the case 3 so as to correspond to the inside of the opening 30.
- This heat exchanger 11 is composed of a plurality of plates 12 having good thermal conductivity, such as aluminum thin plates arranged at intervals of 1 mm to 5 mm, and is capable of transferring heat to these plates 12.
- It comprises a meandering aluminum pipe 13 which penetrates and through which a line flows as described later. If the distance between the plates 1 and 2 is small, the appropriate air Use a filter 34. If the interval is wide, use a safety structure such as a slit instead of the air filter 34.
- a fan casing 39 of the cross flow fan 14 is disposed on the side of the opening 30 of the heat exchanger 11 corresponding to the opening 30.
- the cross mouth opening fan 14 is provided near the opening 30.
- the fan casing 39 is for constructing an air passage from the opening 30 to the heat exchanger 11, and the opening 33 of the fan casing 39 is directed downward from the opening 30 of the case 3 to the outside.
- an air filter 34 for removing dust is attached to the opening 33.
- a curved opening angle adjusting plate 36 is attached to the upper edge of the opening 33 of the fan casing 39 in an eave shape.
- the opening angle adjusting plate 36 is detachably engageable with ribs 37A, which project from the locking plate 37 provided at the upper part in the opening 33 at predetermined intervals in front and rear.
- ribs 37A which project from the locking plate 37 provided at the upper part in the opening 33 at predetermined intervals in front and rear.
- a circulation path is formed in which cooling air is blown out from the floor side and is sucked in from the ceiling side.
- the server 1 is mounted on the sub-barracks 2 in multiple stages, but the downward angle of the opening 33 in the upper server 1 is made shallower (closer to the horizontal), and the opening 33 in the lower server 1 is reduced.
- the cooling air that rises from the floor surface can be cooled at each server.
- the cooling air (cool air) flows through the case 3 and is discharged from the back (rear) of the case 3.
- a rectifying flap plate 38 is attached to the fan casing 39 on the rear side of the cross flow fan 14, that is, on the side of the heat exchanger 11, and the air from the cross flow fan 14 is used for heat exchange. Prevents one-sided hits. Further, on both sides of the fan casing 39, an air passage member 41 extending to both sides and a lower side of the plurality of plates 12 of the rear heat exchanger 11 is formed in an extended manner. I have. Note that the air path member 41 may be formed of an extension member separate from the fan casing 39.
- the upper edge of the plate 12 of the heat exchanger 11 is in contact with the upper surface force bar 4 of the case 3, and the lower edge is the lower surface of the air path member 4 1 in contact with the bottom surface 3B of the case 3.
- the casing of the heat exchanger 11 is constituted by these.
- the air flow from the cross flow fan 14 is concentrated on the plates 12 ⁇ 'of the heat exchanger 11 by the air path member 41 of the fan casing 39.
- the air sucked into the case 3 is guided only between the plates 12 and 11 of the heat exchanger 11, so that the heat exchange efficiency is reduced when the air leaks to other places.
- the efficiency of heat exchange with the brine flow in the heat exchanger 11 described later is improved.
- the cross flow fan 14 corresponds to the longitudinal direction (left-right direction) of the air inlet side (front side) of the heat exchanger 11 and heats the air sucked from the opening 30 (opening 33). It is supplied in a line along the longitudinal direction of the exchanger 11. This allows the cross flow fan 14 The air sucked into the case 3 from the reopening 30 can be efficiently blown to the heat exchanger ⁇ 1.
- 14 M is a motor of the crossflow fan 14 (a DC motor whose rotation speed changes according to an applied voltage), which is attached to an outer surface of the fan casing 39.
- ventilation holes 4 2, 4 2 are formed on the left and right sides of the rear surface 3 C of the case 3, and ventilation fans 4 3 for exhaust air are respectively attached to the ventilation holes 4 2, 4 2.
- the circuit board 5 is mounted on the bottom surface 3 B of the case 3 between the heat exchanger 11 and the ventilation holes 42, 42. Further, the power supply circuit 9 is provided corresponding to the inside of the left vent hole 42.
- the left and right side surfaces 3D and 3D of the case 3 at the position surrounding the circuit board 5 are formed by cutting the side surfaces 3D and 3D corresponding to the circuit board 5 inward to form a plurality of ventilation holes 4 4. ⁇ Is formed (Fig. 6).
- the cut-and-raised vents 4 4 are directed obliquely rearward.
- the air sucked into the case 3 from the opening 30 is blown to the heat exchanger 11, passes through the plates 1 2, and reaches the circuit board 5. .
- the cold plate 16 passes through the periphery of the power supply circuit 9 and is sucked into the blower fans 43 and 43, and is discharged to the outside through the vents 42 and 42.
- a series of ventilation passages from the opening 30 to the ventilation holes 42 and 42 are formed in the case 3.
- the outlet 13 A of the brine of the heat exchanger 11 1 is located at the upper end on the left front side toward the heat exchanger 11, and the pipe 46 connected to this outlet 13 A is It is connected to the inlet of the reserve tank 26.
- a pipe 47 connected from an outlet of the reserve tank 26 is connected to a suction port of the pump 15, and a discharge port of the pump 15 is connected to an aluminum pipe 23 of a cold plate 16 described later. Connected to the entrance.
- the outlet of the pipe 23 is connected to the plenum inlet 13 B of the pipe 13 of the heat exchanger 11 via the pipe 48 to form an annular brine circulation path of the brine cooling device 10. That is, the reserve tank 26 and the pump 15 are provided in order in the flow of brine from the outlet 13 A of the heat exchanger 11 to the cold plate 16. Then, brine is sealed in the annular brine circulation path.
- the brine may be ordinary water, pure water or HFE (Hide mouth Fluo mouth ether).
- the inlet 13 B of the pipe 13 of the heat exchanger 11 is located just below the outlet 13 A at the front left of the heat exchanger 11, and the inlet 13 B and the outlet 13 A (at least 13 A) is located higher than the cold plate 16.
- the bottom surface 3B of the case 3 at a position corresponding to the lower part of the heat exchanger 11 is set higher than the other parts (FIG. 7).
- On the left A lower part 49 lower than the lower end of the heat exchanger ⁇ 1 is formed.
- the outlet ⁇ 3 ⁇ and the inlet 13 ⁇ of the pipe 13 of the heat exchanger 11 1 1, the pipes 46 and 48, the reserve tank 26, the pump 15 and the pipe 4 7 (these pipes are And so on, which are all located on or above this lower part 49.
- the circuit board 5 is mounted with a spacer at a position higher than the upper surface of the lower portion 49.
- the reserve tank 26 and the pump 15 are arranged in the front part on the lower part 49.
- the upper surface of the lower portion 49 is inclined forward and downward as a whole (FIG. 8), and the lowest front end is provided with a detection sensor 5 ⁇ for detecting the brine when the brine is accumulated. I have.
- the pump 15 5 since the outlet 13 3 of the heat exchanger 11 is located higher than the cold plate 16, even if connection failure with the piping 48 occurs at the outlet 13 ⁇ , the pump 15 5 will be described later. It is possible to minimize the amount of plume leaking out of the heat exchanger 11 before the operation is stopped. The brine leaked to the lower part 49 is detected by the detection sensor 51, and the pump 15 is stopped and an alarm is output as described later. Also, the lower part 49 and heat exchange A rib 50 is provided upright from the bottom surface 3B of the case 3 between the container 11 and the circuit board 5 to prevent the pline from flowing toward the circuit board 5 in the event of a leak. .
- a plurality of (three in this embodiment, but may be a single) semiconductor integrated circuit elements 6 are attached to the circuit board 5, and each of the integrated circuit elements 6 is arranged at a predetermined interval.
- each of the integrated circuit elements 6- is attached to the circuit board 5 via a socket 7 (FIG. 9).
- a cold plate 16 is attached to each of the integrated circuit elements 6 and 6 in a heat-exchange manner, and a grease 2 having a high thermal conductivity is provided between the cold plate 16 and the integrated circuit element 6. 4 is applied.
- the grease 24 brings the integrated circuit element 6 and the cold plate 16 into close contact with each other without any gap, and thereby efficiently transfers the heat of the integrated circuit element 6 to the cold plate 16.
- an elastic sheet material having good heat conductivity as described later may be used instead of the grease 24.
- the cold plate 16 is formed, for example, by laminating two aluminum plates (heat conductive materials) having high thermal conductivity (thermal conductivity) with force. That is, the cold plate 16 is a plate-like base member 17 located on the side of the integrated circuit element 6 as the heat conductive material, and the plate-shaped heat conductive material adhered to the base member 17 in close contact. The above-described pipe 23 is sandwiched between the base member 17 and the cover member 18 (FIG. 9).
- a plurality of pipe grooves 21 are formed in the base member 17 from the front end to the rear end, and the pipe grooves 21 are formed in parallel at predetermined intervals.
- the pipe grooves 21 and 21 have a semicircular shape equivalent to the outer peripheral shape of the pipe 23 and the base member. 7, and both pipe grooves 21, 21 are formed inside from both sides of the base member 17 at a predetermined interval.
- An engagement groove (recess) 19 having a predetermined depth and a predetermined width is provided between one pipe groove 21 and one side of the base member 17 from the front end to the rear end of the base member 17. Is formed across.
- the engagement groove 19 has a substantially U-shaped cross section, and is formed in the base member 17 substantially parallel to the pipe groove 21.
- An engagement groove 19A is formed between the two pipe grooves 21 from the front end to the rear end of the base member 17 in parallel with the pipe groove 21. A is formed similarly to the engagement groove 19.
- the base member 7 is formed with an engagement projection (projection) 20B having a predetermined height and a predetermined width from the front end to the rear end.
- the engaging projection 20B is formed so as to protrude from the base member 17 and is located between one of the pipe grooves 21 and the engagement groove 19A so as to be parallel to the pipe groove 21. It is formed.
- the base member 17 has an engagement protrusion 20C formed from the front end to the rear end thereof, and the engagement protrusion 20C has the same shape as the engagement protrusion 20B. It is located on the opposite side of the engagement groove 19 A with respect to the other pipe groove 21.
- the engagement groove 19, the pipe groove 21, the engagement protrusion 20 B, the engagement groove 19 A, the pipe groove 21, and the engagement protrusion 20 C are sequentially formed from one side of the base member 17. These are formed at predetermined intervals, and all of them are formed on one surface side of the base member 17.
- a plurality of (two) pipe grooves 21 are also formed in the lid member 18, and these pipe grooves 21 are formed in the same shape as the pipe grooves 21 formed in the base member 17.
- the two pipe grooves 21 formed in the lid member 18 are formed at positions facing the two pipe grooves 21 formed in the base member 17 when the lid member 18 is superimposed on the base member 17. Sa
- the pipes 23, 23 are sandwiched between the pipe grooves 21 formed in the base member 17 and the lid member 18, respectively.
- a heat conductive and elastic sheet material 53 made of a thin graphite sheet having a thickness of 50 or the like is interposed between the pipe 23 and the lid member 18, and a base member is provided. 17 between the pipe 23 and the lid 18.
- the sheet material may be on the base member 17 side of the pipe 23. Further, it may be provided between the integrated circuit element 6 and the cold plate 16 as described above, or may be attached to the upper surface of the cold plate 16. Further, as a material of the sheet material 53, a copper foil or the like can be considered.
- the sheet material 53 has a high thermal conductivity in the plane direction, which allows the heat transfer between the pipe 23 and the base member 17 and the lid member 18 to be performed well in a wide range, The conduction efficiency can be improved. By such an operation, heat transfer from the integrated circuit element 6 to the pipeline flowing in the pipe 23 of the cold plate 16 is performed extremely smoothly. Note that grease similar to that described above may be applied to a surface on which the sheet material 53 is not provided (for example, the upper surface of the base member 17 in FIG. 10).
- the cover member 18 is formed with engagement protrusions 20 and 2OA similar to the engagement protrusions 2OB and 20C from the front end to the rear end.
- the engagement projections 20 and 20 A are formed at positions facing the engagement grooves 19 and 19 A formed in the base member 17, and both engagement projections 20 and 20 A are formed. 0 A is press-fitted into the engagement grooves 19 and 19 A when the cover member 18 is overlapped with the base member 17.
- Engagement grooves 19B and 19C similar to the engagement grooves 19 and 19A are formed in the cover member 18 from the front end to the rear end.
- the engagement grooves 19B and 19C are formed at positions facing the engagement protrusions 20B and 20C formed on the base member 17, and the cover member 18 is connected to the base member 17 When polymerizing to The engaging projections 20B and 20C are press-fitted into the mating grooves 19B and 9C, respectively.
- the cold plate 6 is polymerized in a state where the pipes 23 and 23 and the above-mentioned sheet material 53 are sandwiched between the base member 17 and the cover member 18 (pipe grooves 21 and 21). Then, press-fit the engagement protrusions 20 and 20 A into the engagement grooves ⁇ 9 and 19 A, and press the engagement protrusions 20 B and 20 C into the engagement grooves 19 B and 19 C. Then, the base member 17 and the lid member 18 are tightly fixed to each other by force crimping. At this time, the outer circumferences of the pipes 23, 23 are tightly fixed to the base member 17 and the lid member 18 (via the sheet material 53). The two pipes 23 and 23 are located outside the front and rear ends of the base member 17 and the cover member 18.
- three cold plates No. 6 configured as described above are prepared, and the ends of the pipes 23 of each cold plate 16 are connected by a connector 23A. At this time, the cold plates 16 are connected to the three integrated circuit elements 6 mounted on the circuit board 5 at the respective dimensions, and the ends of the cold plate 16 on one side are connected.
- Pipe 23 is connected by a bend pipe (arc-shaped pipe) 23 B.
- each cold plate 16 is fixed on each integrated circuit element 6 via the grease 24 having high thermal conductivity as described above (FIG. 9).
- the cold plate 16 located on the opposite side of the bend pipe 23B is arranged.
- the left end of the pipe 23 is connected to the outlet from the pump 15 and the pipe 48 to the heat exchanger 11 above the lower part 49 as described above.
- FIG. 11 shows an electric circuit diagram of the plenum cooling device 10 of the server 1.
- reference numeral 54 denotes a general-purpose microcomputer constituting a control unit and a detection unit.
- the input port of the microcomputer 54 is attached to each of the cold plates 16...
- the heat exchangers TH1, TH2, TH3, and the heat exchanger are used.
- the input port of the microcomputer 54 is connected to a resistor (volume or the like) 56 for setting the maximum value T max (for example, + 80 ° C.) of the return temperature of the brine.
- the mode switch 57 is also connected.
- a voltage that changes based on the temperature detection of the detection sensor 51 is applied to the D (analog-Z digital conversion) input port, and the power is turned on (the power is supplied to the RESET input port of the microcomputer 54). Reset signal is input. Further, the micro-computer 54 exchanges data with the controller 52. The signal output from the output port of the microcomputer 54 is supplied to the switching power supply circuits SW1 and SW2 via a buffer, and the output voltage of the switching power supply circuits SW1 and SW2 is +6 V in this embodiment. It is controlled within the range of +12 V. Also, a transistor 59 for controlling the energization of the relay 58 (relay coil) is connected via a buffer. ON / OFF is controlled by the microcomputer 54. An LED display 61 is also connected to the output of the microcomputer 54.
- the switching power supply circuits SW 1 and SW 2 are supplied with DC +12 V output from the power supply circuit 9, and the output of the switching power supply circuit SW 1 has a resistor 62 and a normally open contact of a relay 58. It is supplied to the motor 15M of the pump 15 via 58A. The output of the switching power supply circuit SW 2 is supplied to the motor 14 M of the cross flow fan 14 via the resistor 63 and the normally open contact 58 B of the relay 58.
- a series circuit of the resistor 64 and the light emitting diode of the photopower PH1 is connected to the output side of the switching power supply circuit SW1 in parallel with the resistor 62.
- the output of the photo transistor is connected to the input port of the microcomputer 54.
- a series circuit of the resistor 66 and the light emitting diode of the photopower PH2 is connected in parallel with the resistor 63 on the output side of the switching power supply circuit SW2.
- the output of the photo transistor is connected to the input port of the microcomputer 54.
- a power ON reset signal is input to the microphone computer 54 in step S1 of FIG.
- the microcomputer 54 uses a relay 58, and an edge trigger using DC + 5V which is a power supply for the photopower brackets PH1 and PH2.
- the microcomputer 54 determines the maximum value T max of the brine return temperature set by the resistor 56 in step S2, and (Memory). In the embodiment, it is assumed that + 80 ° C is set as Tmax.
- the microcomputer 54 starts counting of a timer (for example, a 5-minute timer) having its function in step S3. Then, in step S4, it is determined whether the count of the timer has elapsed for 5 minutes, and if not, the process proceeds to step S5 to output DC + 12 V to the switching power supply circuits SW1 and SW2. Output voltage signals, and turn on transistor 59 to energize relay 58. When the relay 58 is energized, the contacts 58 A 58 B are closed.
- the DC 15 V is supplied to the motor 15 M of the pump 15 and the motor 14 M of the cross-opening fan 14, and both are operated at the maximum capacity.
- the cross flow fan 14 is operated, as described above, air is sucked in from the opening 30 of the case 3 and is blown in a line along the longitudinal direction of the heat exchanger 11.
- the air after cooling the plates 12 'and the piping 13 of the heat exchanger 11 and the piping 13 was cooled through the cold plate 16' of the circuit board 5 and the periphery of the power supply circuit 9. After that, the air is exhausted to the outside through the ventilation holes 42, 42 by the ventilation fans 43, 43.
- the plume coming out of the outlet 13 A of the pipe 13 of the heat exchanger 11 reaches the reserve tank 26 through the pipe 46, and passes through the reservoir 26 to the suction port of the pump 15 again.
- the circulation sucked from is repeated.
- the cooled plates 16 ⁇ ′ are cooled by the air cooled in the heat exchanger 11, and the respective integrated circuit elements 6 ⁇ ⁇ are cooled by the cold plates 16 ⁇ ′.
- step S6 determines in step S6 whether the phototransistors of the photobras PH1 and PH2 are at 0 N.
- the phototransistors of the photocouplers PH1 and PH2 are ON, the microphone computer 54 determines that an output is generated from each switching power supply circuit SW1 and SW2, and proceeds to the step.
- step S4 if the phototransistors of the photocouplers PH1 and PH2 are OFF, it is possible that the pump 15 and the cross flow fan 14 are abnormal. Then, the process proceeds to step S7 to output an alarm by displaying an abnormality on the LED display 61.
- the microcomputer 54 After turning on the power, the microcomputer 54 continues to operate the cross-flow fan 14 and the pump 15 with the maximum capacity until the timer counts up, thereby responding to the heat generated when the server 1 starts up. At the same time, the cooling capacity of the brine cooling device 10 is stabilized.
- the exit computer 54 proceeds from step S4 to step S8, and determines whether the return temperature of the brine detected by the thermistor TH4 is equal to or higher than the maximum value Tmax.
- step S 12 If the temperature of the brine returned after heat exchange with each cold plate 1 6 ⁇ 'has risen to a temperature equal to or higher than T max, the microcomputer proceeds to step S 12 and proceeds as described above.
- the operation of the cross flow fan 14 and the pump 15 at the maximum capacity is continued, an error is displayed on the LED display 61 in step S13, and the process returns to step S8. As a result, a warning may be issued because the cold plate 16 may not be cooling the integrated circuit element 6 effectively.
- step S8 the process proceeds to step S9, where the temperature of each cold plate 16 ′ detected by each of the thermistors TH1, TH2, and TH3 is reduced. Take in the respective temperatures. Then, the highest temperature is selected from the thermistors T H1 to H 3 and set as T O.
- step S10 it is determined whether or not TO is equal to or greater than Tmax-5 (that is, + 75 ° C). If so, the process proceeds to step S14, where the cross flow fan 14 and the crossflow fan 14 are connected as described above. Run pump 15 at full capacity. Then, the process returns to step S8.
- step S 10 If T 0 is lower than T ma X — 5 in step S 10, the process proceeds to step S 11 to determine whether T 0 is equal to or larger than T ma X _ 40 (that is, + 40 ° C.). Judge. If TO is greater than or equal to T max — 40 and less than T max — less than 5 (ie, greater than or equal to + 40 ° C. and less than + 75 ° C.), the microphone-computer computer 54 will perform step S 2 in FIG. Go to 0.
- step S 20 the microphone mouth combination is calculated in advance by PID (proportional differential integration) or fuzzy calculation based on the current T 0 and ⁇ ⁇ obtained from the deviation (change) between the previous TO and this TO.
- Day Obtain the increase / decrease value AV of the output voltage of the switching power supply circuits SW 1 and SW 2 from the evening table.
- the routine cycle in this case is, for example, 0.5 seconds.
- the temperature of cold plate 16 becomes + Increase the capacity of the pump 15 and the cross flow fan 14 as the temperature of the brine rises, and decrease the capacity as the temperature falls so that the set value is 50 ° C to +70 ° C.
- a direction calculation is performed.
- the set value may be controlled by the controller 52 according to the operation rate of the server 1, or may be configured to be arbitrarily set manually.
- the microcomputer 54 sets the voltage signal V new to be output to each switching power supply circuit SW 1 and SW 2 in step S 21 to the current voltage signal + ⁇ V, and in step S 22, the voltage signal V new Correct the voltage signal so that new does not exceed the lower limit of DC +8 V and the upper limit of +12 V, and energize relay 58.
- the pump 15 and the cross flow fan 14 are operated with the adjusted capacity.
- the microcomputer 54 determines in step S24 whether the phototransistors of the photocouplers PH1 and PH2 are ON as described above, and outputs from the switching power supply circuits SW1 and SW2. If no light emission has occurred and the light emitting diodes of the photobras PH1 and PH2 do not emit light and each phototransistor is set to 0 FF, the LED display is performed as described above in step S25. Outputs an alarm by displaying an error on unit 61. If the switching power supply circuits SW1 and SW2 are normal, the process returns to step S8.
- step S 11 the microcomputer 54 proceeds to step S in FIG. Proceed to 15 to determine whether the mode switch 57 is set to 0 N or not. Now, assuming that the mode switch 57 is ON, the microcomputer 54 proceeds from step S15 to step S17, and outputs a DC +8 V voltage signal to the switching power supply circuit SW1. A voltage signal of 0 V is output to the switching power supply circuit SW 2 to energize the relay 58.
- step S18 it is also determined whether or not the output of the switching power supply circuit SW1 is generated by the phototransistor of the photobra PH1 in the same manner. Then, display an error on the LED display 61. Then, in any case, the process returns to step S8.
- step S15 when the mode switch 57 is OFF, the microcomputer 54 proceeds from step S15 to step S16, and outputs a 0 V voltage signal to the switching power supply circuits SW1 and SW2.
- the relay 58 is de-energized, and the process returns to step S8.
- the microcomputer 54 stops the cooling of the integrated circuit element 6 by the pipeline cooling device 10. .
- FIGS. 15 and 16 show another embodiment of control by the microcomputer 54.
- the controller 52 installed in the server rack 2 communicates with each server 1
- the operation rates of the integrated circuit elements 6 ⁇ ⁇ provided for each are calculated. Although the temperature rise of the integrated circuit element 6 can be grasped from this operation rate, each operation rate is transmitted to the microcomputer 54.
- the flowchart in this case performs control using this operation rate.
- step S32 the microcomputer 54 determines the maximum value Tmax of the return temperature of the pipeline set by the resistor 56 and stores it in the storage unit (memory). Also in this case, it is assumed that + 80 ° C. is set as T max.
- step S33 the microcomputer 54 starts counting of a timer (the 5-minute timer described above) having its function. Then, in step S34, it is determined whether or not the timer count has elapsed for 5 minutes. If not, the process proceeds to step S35, and DC + 1 2 V is applied to switching power supply circuits SW1 and SW2. Output voltage signals, and turn on transistor 59 to energize relay 58. When the relay 58 is energized, the contacts 58 A and 58 B are closed.
- step S36 determines in step S36 whether or not the photovoltaic transistors PH1 and PH2 are ON, and outputs from the switching power supply circuits SW1 and SW2. If the phototransistors of the photocouplers PH1 and PH2 are ON, it is determined that an output is generated from each switching power supply circuit SW1 and SW2, and the process proceeds to step S34. Back, the phototransistors of the photobras PH1 and PH2 If it is OFF, the process proceeds from step S36 to step S37, and an alarm is output by displaying an error on the ED display 61.
- the microcomputer 54 After turning on the power, the microcomputer 54 continues the operation of the cross flow fan 14 and the pump 15 at the maximum capacity until the timer counts up, so that the cooling capacity of the pipeline cooling device 10 is stabilized. Let it. When the timer counts up 5 minutes after the power is turned on, the microcomputer 54 proceeds from step S34 to step S38, and the return temperature of the line detected by the thermistor TH4 becomes the highest. It is determined whether the value is equal to or greater than the value Tmax.
- step S42 If the temperature of the brine returned by heat exchange with each cold plate 1 66 ⁇ rises to a temperature equal to or higher than Tmax, the microcomputer 54 proceeds to step S42 and proceeds to step S42 in the same manner as described above.
- the operation of the maximum capacity of the mouth fan 14 and the pump 15 is continued, an abnormality is displayed on the LED display 61 in step S43, and the process returns to step S38. With this, an alarm is given that the integrated circuit element 6 ⁇ has an abnormally high temperature.
- step S38 determines whether or not F0 is, for example, 80% or more, and if it is, the process proceeds to step S44, and the cross flow fan 14 and the pump 15 are operated at the maximum capacity as described above. drive. Then, the process returns to step S38.
- step S40 If F0 is lower than 80% in step S40, the process proceeds to step S41, and it is determined whether F0 is, for example, 40% or more. And If F0 is not less than 40% and less than 80%, the microcomputer 5 proceeds to step S50 in FIG.
- step S50 the microcomputer determines the switching power supply circuit SW from the data table previously calculated by PID (proportional differential integration) or fuzzy calculation based on the deviation (change) between the previous F0 and the current F0. 1.
- An increase / decrease value ⁇ V of the output voltage of SW2 is obtained.
- the routine cycle in this case is, for example, 0.5 seconds.
- the temperature outside case 3 is + 35 ° C
- the temperature of the cold shake 16 is + The calculation is performed in such a manner that the capacity of the pump 15 and the cross flow fan 14 is increased in accordance with the rise in the temperature of the pipeline, and the capacity is decreased in accordance with the decrease in the temperature, so as to be 70 ° C. or less.
- the microcomputer 54 sets the voltage signal V new to be output to each switching power supply circuit SW 1 and SW 2 in step S 51 to the current voltage signal + the above ⁇ V, and in step S 52, the voltage signal V new Correct the voltage signal so that new does not exceed the lower limit of DC +8 V and the upper limit of +12 V, and energize relay 58.
- the pump 15 and the cross flow fan 14 are operated with the adjusted capacity. With such control, the cooling capacity can be rapidly increased even for rapid heat generation of the integrated circuit element 6, and damage to the element can be avoided.
- the microcomputer 54 determines in step S54 whether the phototransistors of the photocouplers PH1 and PH2 are ON as described above, and outputs from the switching power supply circuits SW1 and SW2. If it has not been generated, the light emitting diodes of the PH1 and PH2 light emitting diodes do not emit light, and if each phototransistor is turned off, the LED display is turned on as described above in step S55. 6 An alarm is displayed by displaying an error on Is output. If the switching power supply circuits SW ⁇ and SW2 are normal, the process returns to step S38. . On the other hand, if F0 is 40% lower in step S41, the microcomputer 54 proceeds to step S15 in FIG. 14 and executes the same control thereafter. Note that the control in FIG. 14 is the same as that described above, and a description thereof will be omitted. As described above, the brine cooling device 10 can be controlled also by the operation rates of the integrated circuit elements 6.
- the microcomputer 54 responds to this by displaying an abnormality on the LED display 61 and outputting an alarm.
- a 0 V voltage signal is output to the switching power supply circuit SW 1 to stop the pump 15. This will minimize the amount of ply leakage.
- a voltage signal of the maximum +12 V is output to the switching power supply circuit SW2 and is blown into the case 3 with the maximum capacity to secure the cooling in the case 3.
- the detection sensor 51 detects the leakage of the brine, the operation of all the electric components including the integrated circuit element 6 may be stopped.
- connection parts such as the inlet and outlet ports 13 and 13 B of the pipes 13 of the heat exchanger 11 and the respective pipes 46, 47, 48, 23, the reserve reservoir 26, and the pump 15
- the leaked brine accumulates in the front part of the lower part 49 of the bottom surface 3B of the case 3 and is detected by the detection sensor 51 when the leaked brine is detected by the detection sensor 51. Therefore, the user can quickly perform maintenance for the leakage failure of the pipeline.
- pump 15 is shut down, stopping forced leakage of brine.
- the outlet 13A of the heat exchanger 11 is located higher than the cold plate 16, so if leakage occurs at the outlet 13A, the pump 15 is stopped to exchange heat. Unit 1 1
- the line will stay inside. Therefore, the amount of brine leaked from the heat exchanger 11 is minimized.
- FIGS. 17 and 18 show the structure of another embodiment of the server 1 relating to the arrangement of the crossflow fan # 4.
- the same reference numerals as those in FIGS. 4 and 5 have the same or similar functions.
- an opening 67 is formed in the rear surface 3C of the case 3, and a fan casing 39 of the cross opening opening fan 14 is arranged inside the opening 67.
- the cross flow fan 14 is provided near the opening 67.
- the fan casing 3 9 is for forming an air passage from the cross flow fan 14 to the front heat exchanger 11 1, and the opening 3 3 of the fan casing 3 9 is the opening 6 7 of the case 3.
- the filter 33 faces the outside while pointing upward, and a similar filter 34 for removing dust is attached to the opening 33.
- a curved opening angle adjusting plate 36 is attached to the lower edge of the opening 33 of the fan casing 39.
- the opening angle adjusting plate 36 is detachably engageable with ribs 37 A 1 ⁇ protruding from the locking plate 37 provided at the lower portion of the opening 33 at predetermined intervals in the front and rear directions.
- the opening 3 The amount projecting from the lower edge of 3 can be changed in three stages.
- the upward angle of the opening 33 can be changed in three stages, for example, 15 °, 30 °, and 45 ° from the horizontal.
- the server rack 2 of this type As described above, in the office where the server rack 2 of this type is installed, air for air conditioning is blown out from the floor.
- the server 1 As described above, the server 1 is mounted on the server rack 2 in multiple stages, but the upward angle of the opening 3 in the upper server 1 is made shallow (closer to the horizontal), and the opening 3 in the lower server 1 is reduced. 3 Increase the upward angle (turn upward). As a result, the air in the case 3 can be easily discharged to the outside, and the cooling efficiency of the integrated circuit element 6 can be further improved.
- the air conditioning method of the place where the server rack 2 is installed is not limited to the blowing method from the floor surface, but may be performed by a floor-mounted air conditioner or a ceiling-mounted air conditioner, or through a duct. Also includes those that are air-conditioned.
- FIG. 19 shows an example in which heat radiating fins 68 are attached to the cold plate 16.
- the same symbols as those in FIGS. 9 and 10 are the same.
- the cold plate 16 is detachably fixed to the socket 7 by an elastic metal plate spring 69 serving as an elastic material with the integrated circuit element 6 sandwiched between the cold plate 16 and the socket 7. I have.
- a plurality of aluminum radiating fins 68 are provided on the upper surface of the lid member 18 of the cold plate 16, that is, the surface opposite to the lower surface with which the integrated circuit element 6 contacts. Installed. At this time, a notch 68 A into which the leaf spring 69 can be inserted is formed in the radiation fin 68. Further, an air blower 71 for the cold plate 16 is mounted on the upper surface of the heat radiating fins 68 ′ ′ ′. This blower The device 71 is composed of a centrifugal blow-type turbo fan with a small thickness, sucks air from the lower radiating fins 6 8, and discharges it from the side discharge port 72.
- the cold plate 16 is cooled strongly by the heat dissipation from the heat radiating fins 68 and the forced ventilation by the blower 71, and the integrated circuit element 6 is cooled. Cooling can be quickly and accurately achieved. Further, since the blower 71 is a centrifugal fan, it is possible to reduce the size by minimizing the increase in height.
- FIG. 20 shows another example of the mounting structure of the cold plate 16 and the integrated circuit element 6.
- the cold plate 16 is the bottom surface 3B of the case 3 and the circuit board 5 is on top.
- mounting bases 17A and 17B are provided at the lower left and right ends of the base member 17 of the cold plate 16 and these mounting bases 17A and 17B are provided.
- the cold plate 16 is fixed to the bottom surface 3 B of the case 3 by screwing a screw 76 into the provided screw hole.
- a heat conductive sheet similar to that described above may be interposed between the cold plate 16 and the bottom surface 3B.
- the integrated circuit element 6 is disposed in contact with the upper surface of the lid member 18 of the cold plate 16 attached to the bottom surface 3B of the case 3 via a heat conductor (not shown) such as grease. Further, a socket 7 electrically connected to the integrated circuit element 6 and a circuit board 5 electrically connected to the socket 7 are provided on the integrated circuit element 6, and the circuit board 5 and the socket 7.
- the integrated circuit element 6 consists of a pair of elastic metal plate panels 73A and 73B as elastic materials, By mounting over the case 16, it is fixed integrally to the bottom surface 3 B of the case 3.
- Each of the leaf springs 7 3 A and 7 3 B has a pair of arms and a mountain-shaped connecting portion connecting the base ends of the arms as shown in the figure. ing.
- each of the pair of leaf springs 73A and 73B is fixed to both side walls of the base member 17 of the cold plate 16 with screws 74, and The other ends of the springs 73A and 73B are detachably engaged with engaging grooves 7A and 7B having inclined engaging surfaces formed on both side walls of the socket 7, respectively.
- the integrated circuit element 6 is attached to the bottom surface 3B of the case 3 via the cold plate 16 with the contraction force of the plate panels 73A and 73B.
- the integrated circuit element 6 can be easily attached to the case 3 while being sandwiched between the cold plate 16 and the socket 7, and in this case, the cold plate 1 Since the degree of adhesion of Case 6 to Case 3 is large, heat transfer is also high. Therefore, since the heat radiation effect is high, the cooling of the integrated circuit element 6, which is a heat-generating electronic component, can be effectively performed in combination with the cooling action of the pipeline.
- FIG. 21 shows still another example of the mounting structure of the cold plate 16 and the integrated circuit element 6.
- the same reference numerals as those in FIGS. 9 and 10 denote the same parts.
- the circuit board 5 is fixed to the bottom surface 3B of the case 3 in a raised state, and the socket 7 electrically connected to the circuit board 5 is mounted on the upper surface of the circuit board 5. Have been killed.
- the integrated circuit element 6 is electrically connected to the upper side of the socket 7.
- the cold plate 16 is disposed on the upper surface of the integrated circuit element 6 via the grease 24.
- the lid member of the cold plate 16 A screw hole 77 is formed in the center of the upper surface of the.
- Reference numeral 78 denotes an elastic metal leaf spring as an elastic material, which has a substantially M-shaped side surface.
- a flat portion 78 A is formed at the center of the leaf spring 78, and the flat portion 78 A is covered with a screw 81 screwed into a screw hole 77, and a lid member of the recall bracket 16. 18 It is fixed to the upper surface of 8.
- the leaf springs 78 are detachably engaged with both end portions 78 B, 78 B of the socket 7 in engagement groove portions 7 A, 7 B formed on both side walls of the socket 7, respectively.
- the cold plate 16 is pressed down integrally with the integrated circuit element 6 with the shrinking force of 7 8, the integrated circuit element 6 is sandwiched between the cold plate 16 and the socket 7, and attached to the circuit board 5. It is.
- FIG. 22 shows still another example of the mounting structure of the cold plate 16 and the integrated circuit element 6. Also in this case, the circuit board 5 is raised and fixed to the bottom surface 3 B of the case 3, and the socket 7 electrically connected to the circuit board 5 is provided on the upper surface of the circuit board 5. The integrated circuit element 6 is electrically mounted and connected to the upper side of the socket 7.
- the cold plate 16 is disposed on the upper surface of the integrated circuit element 6 via the grease 24.
- the elastic metal plate panel 81 also has a substantially M-shaped side surface, and the center of the panel 81 is in contact with the center of the upper surface of the lid member 17 of the cold plate 16. Then, both sides of the leaf spring 81 are inserted between the two pipes 23 and 23 to be engaged therebetween, and both ends 81 A and 81 A are connected to the socket 7.
- the cold plate 16 is integrated with the integrated circuit element 6 by the contraction force of the panel panel 81 by detachably engaging with the engaging grooves 7 A and 7 B formed on both side walls.
- the integrated circuit element 6 is held between the cold plate 16 and the socket 7 and attached to the circuit board 5. in this case, Since the panel panel 81 is engaged between the pipes 23, 23, there is no displacement even if it is not fixed with screws.
- the integrated circuit element 6 can be easily attached to the circuit board 5 while being sandwiched between the cold plate 16 and the socket 7.
- screws for fixing the panel are also unnecessary.
- FIGS. 23 and 24 show the structure of another example of the cold plate 16. Also in this figure, the same reference numerals as those in FIGS. 9 and 10 are the same. In this case, one or more (two in this embodiment) projections 82 are formed in the base member 17 of the cold plate 16 and the pipe groove 21 of the lid member 18 against the flow of the brine. It is formed on the upstream side.
- the pipe 23 is crushed by the protrusions 82 when the base member 17 and the cover member 18 are caulked, and the narrow portion 83 equal to the number of the protrusions 82 flows in the pipeline. It will be formed at a position on the upstream side of
- a projection 82 is formed in advance on the base member 17 of the cold plate 16 and the groove 21 of the lid member 18 so that the two members 17 and 18 can be connected by force-staking. Since the narrow portion 83 is formed by being crushed by the pipe 23 and the protruding portion 82, the manufacturing process of the cold plate 16 is the same as the conventional process. Therefore, an increase in production cost can be suppressed.
- the microphone 15 and the cross-flow fan 1 are operated by the computer 54 based on the return temperature of the brine and the temperature of each cold plate 16 and the operating rate of each integrated circuit element 6.
- the operation of the pump 4 was controlled, but not limited to it.
- the pump 15 was always operated, and the capacity of only the cross flow fan 14 was controlled. A method of controlling the capacity of a vehicle may be used.
- heat can be transferred from the integrated circuit element.
- At least a blower fan or the like is provided so that when the temperature around the outer periphery of the case is + 35 ° C or more, the temperature of the cold plate becomes + 70 ° C or less. Since a control unit that controls one of the pumps is provided, the cooling capacity can be quickly increased even for rapid heat generation of the integrated circuit element, and damage to the integrated circuit element can be avoided before it occurs. It becomes.
- a plurality of integrated circuit elements are mounted on a circuit board and a cold plate is provided for each of the integrated circuit elements.
- Each element can be cooled effectively. In this case, it is possible to minimize the temperature difference between each cold plate on the upstream side and the downstream side of the brine flow. Can be uniformly cooled. In particular, since the flow path in the cold plate is straight, the piping configuration is simplified, the flow resistance of the brine is reduced, and the cooling of the integrated circuit element can be performed efficiently.
- a heat conductive material is provided between the integrated circuit element and the cold plate, and the integrated circuit element is held by using an elastic material, and the cold plate and the integrated circuit element are held.
- the mounting between the integrated circuit element and the cold plate can be carried out extremely easily because it is sandwiched between the socket and the socket.
- the blower fan is a cross flow fan, which is provided near the opening of the case and sucks the air from the opening. Since the air is supplied in a line along the length of the heat exchanger, the air sucked into the case from the opening by the cross flow fan can be efficiently blown over the entire length of the heat exchanger. As a result, the heat exchange efficiency of the heat exchanger can be improved.
- the efficiency of heat exchange between the brine flow and the ventilation air in the heat exchanger can be improved, and the cooling efficiency of the integrated circuit element by the brine can be improved, and the integrated circuit element can be quickly and efficiently cooled.
- the fan casing is configured to draw outside air (or cooled air) from under the opening of the case in which the opening is directed downward and air is sucked from below.
- air or cooled air
- the air can be easily taken into the case, and the cooling of the integrated circuit element can be achieved. The efficiency can be further improved.
- the blower fan is a cross-flow fan, which is provided near the opening of the case and discharges the air heated by the heat exchanger from the opening. Air heated to a heat exchanger can be efficiently discharged.
- the heat exchange in the heat exchanger and the cooling efficiency of the integrated circuit element can be improved, and the integrated circuit element can be cooled quickly and efficiently.
- the fan casing is configured to discharge air upward with the opening facing upward, the high-temperature air heated in the case is efficiently diffused to the outside. Can be become able to.
- the air in the case can be easily discharged to the outside, and the cooling efficiency of the integrated circuit element is further improved. Will be able to do it.
- the angle of the opening of the fan casing is configured to be variable, so that, for example, even when such electronic devices are stacked and installed in a plurality of stages vertically, By changing and adjusting the opening angle of the fan casing of the step, air can be smoothly circulated in the case of each electronic device.
- the cold plate is formed by fitting and bonding the irregularities formed on the two heat conductive members so as to sandwich the pipe through which the brine flows, so that the cold plate is This simplifies the plate structure and assembly workability, and improves productivity.
- a sheet material having thermal conductivity and elasticity is sandwiched between the heat conductive material and the pipe, so that the heat conductive material and the pipe are interposed.
- the heat transfer efficiency can be improved by the sheet material.
- the heat exchange efficiency between the brine flowing through the pipe and the heat conducting material having the integrated circuit element is improved, and the cooling efficiency of the layer and the integrated circuit element can be improved.
- a narrow portion is provided at a position on the upstream side of the flow of the brine inside the pipe sandwiched by the heat conductive material, so that the brine circulating in the pipe is narrow. Turbulence is generated when passing through the pipe, and as a result, the brine is agitated, and the temperature layer of the line between the periphery and the center of the pipe is eliminated, thereby improving the cooling efficiency when cooling the integrated circuit element Will be able to do it.
- the heat exchanger is composed of a plurality of plates having heat conductivity, and a pipe which penetrates these plates so as to be able to transfer heat and through which the brine flows.
- a part of the heat exchanger is covered with a fan casing or an extension of the fan casing, and the fan casing has a shape in which air is collected on a plate of the heat exchanger.
- the air sucked into the case by the cross flow fan can be guided only to the heat exchanger by the fan casing which forms a part of the casing covering the heat exchanger or its extension member.
- a plurality of ventilation holes are provided at a position facing the circuit board on a surface of the case surrounding the circuit board.
- air taken into the case from the opening by the blower fan is provided. After the air has been heated by exchanging heat with the heat exchanger, fresh air can be taken into the case through the vent, and the temperature inside the case is increased by the air exchanged with the heat exchanger. Inconvenience that rises significantly can be avoided beforehand.
- the vent in addition to the above, since the vent is formed by cutting and raising a part of the case, the vent can be easily formed, thereby improving the productivity. It becomes possible.
- a conduit forming a brine circulation path circulating between the cold plate and the heat exchanger is disposed on one side of the case, and the bottom surface of this one side is disposed. Since it was lower than the heat exchanger, in the pipeline that forms the pipeline circulation path, even if leakage occurred due to poor connection, cracks, damage, etc. It will accumulate in low places. As a result, it is possible to avoid a disadvantage that the leaked pipeline causes an adverse effect such as a short circuit of the integrated circuit element arranged in the case.
- the reserve tank and the pump are disposed on one side of the case, even if a failure occurs in the reserve tank and the pump, the reserve tank and the pump are still connected to the pump.
- the leaked plenum collects in a lower part on one side of the bottom surface, so that it is possible to avoid invading the entire case and adversely affecting integrated circuit elements and the like.
- the bottom surface of one side of the case is inclined low toward a predetermined direction, so that the brine leaked to one side in the case is moved in a predetermined direction.
- a detection unit is provided at the lowest portion of the bottom surface of the case or at the vicinity thereof, and a warning unit outputs an alarm in response to the output of the brine detection sensor.
- a warning unit outputs an alarm in response to the output of the brine detection sensor.
- a plurality of radiating fins are provided on the side opposite to the integrated circuit element of the cold plate, so that heat generated by the integrated circuit element of the cold plate is cooled by brine.
- cooling can be performed by the radiation fins, so that rapid and accurate cooling of the integrated circuit element can be realized.
- a cooling plate blower is attached to the radiation fin, so that the radiation fin can be forcibly cooled by the cold plate blower. More rapid and accurate cooling of integrated circuit elements can be realized.
- the cold plate blower since the cold plate blower has a centrifugal blower type fan, the cold plate is forcibly cooled by a fan having a relatively small height. The size of the device can be reduced.
- the heat exchanger is composed of a plurality of plates having heat conductivity, and a pipe which penetrates these plates so that heat can be transferred and through which the brine flows.
- the outlet from the heat exchanger of the brine from this pipe to the cold plate is provided at a position higher than the cold plate, poor connection and cracks ⁇ occurred at the outlet from the heat exchanger.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CA002438496A CA2438496A1 (en) | 2001-03-02 | 2002-02-22 | Electronic device |
EP02703883A EP1372367A4 (en) | 2001-03-02 | 2002-02-22 | ELECTRONIC EQUIPMENT |
KR1020037011436A KR100909544B1 (ko) | 2001-03-02 | 2002-02-22 | 전자 장치 |
US10/651,606 US6967842B2 (en) | 2001-03-02 | 2003-08-29 | Electronic device |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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JP2001058832A JP2002261222A (ja) | 2001-03-02 | 2001-03-02 | 半導体素子の冷却装置 |
JP2001-58832 | 2001-03-02 | ||
JP2001059679 | 2001-03-05 | ||
JP2001060983A JP2002261480A (ja) | 2001-03-05 | 2001-03-05 | コンピューターの発熱部品の冷却器及び冷却方法 |
JP2001-60983 | 2001-03-05 | ||
JP2001-59679 | 2001-03-05 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/651,606 Continuation US6967842B2 (en) | 2001-03-02 | 2003-08-29 | Electronic device |
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WO2002074032A1 true WO2002074032A1 (en) | 2002-09-19 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2002/001597 WO2002074032A1 (en) | 2001-03-02 | 2002-02-22 | Electronic device |
Country Status (7)
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US (1) | US6967842B2 (ja) |
EP (1) | EP1372367A4 (ja) |
KR (1) | KR100909544B1 (ja) |
CN (1) | CN1290392C (ja) |
CA (1) | CA2438496A1 (ja) |
TW (1) | TW552685B (ja) |
WO (1) | WO2002074032A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104582422A (zh) * | 2013-10-28 | 2015-04-29 | 睿励科学仪器(上海)有限公司 | 一种水冷散热装置 |
CN108958402A (zh) * | 2018-06-29 | 2018-12-07 | 苏州朝霞生物科技有限公司 | 一种计算机散热型主机箱 |
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CN104582422A (zh) * | 2013-10-28 | 2015-04-29 | 睿励科学仪器(上海)有限公司 | 一种水冷散热装置 |
CN108958402A (zh) * | 2018-06-29 | 2018-12-07 | 苏州朝霞生物科技有限公司 | 一种计算机散热型主机箱 |
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TWI737410B (zh) | 2020-07-08 | 2021-08-21 | 緯創資通股份有限公司 | 電子裝置 |
CN114721485A (zh) * | 2022-04-29 | 2022-07-08 | 苏州浪潮智能科技有限公司 | 服务器导风罩及服务器 |
Also Published As
Publication number | Publication date |
---|---|
CN1494821A (zh) | 2004-05-05 |
EP1372367A1 (en) | 2003-12-17 |
CA2438496A1 (en) | 2002-09-19 |
KR20030085136A (ko) | 2003-11-03 |
US20040250992A1 (en) | 2004-12-16 |
CN1290392C (zh) | 2006-12-13 |
TW552685B (en) | 2003-09-11 |
EP1372367A4 (en) | 2008-09-03 |
US6967842B2 (en) | 2005-11-22 |
KR100909544B1 (ko) | 2009-07-27 |
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