WO2002059861A1 - Dispositif d'affichage - Google Patents
Dispositif d'affichage Download PDFInfo
- Publication number
- WO2002059861A1 WO2002059861A1 PCT/JP2002/000501 JP0200501W WO02059861A1 WO 2002059861 A1 WO2002059861 A1 WO 2002059861A1 JP 0200501 W JP0200501 W JP 0200501W WO 02059861 A1 WO02059861 A1 WO 02059861A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sealing member
- display device
- resin material
- resin
- light emitting
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims abstract description 144
- 229920005989 resin Polymers 0.000 claims abstract description 114
- 239000011347 resin Substances 0.000 claims abstract description 114
- 239000000463 material Substances 0.000 claims abstract description 96
- 238000003825 pressing Methods 0.000 claims abstract description 27
- 238000002156 mixing Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 71
- 239000011324 bead Substances 0.000 description 21
- 238000000151 deposition Methods 0.000 description 13
- 230000005525 hole transport Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 230000008021 deposition Effects 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000007772 electrode material Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- -1 3-methylphenylphenylamino Chemical group 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- UWRZIZXBOLBCON-VOTSOKGWSA-N (e)-2-phenylethenamine Chemical class N\C=C\C1=CC=CC=C1 UWRZIZXBOLBCON-VOTSOKGWSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 1
- MGADZUXDNSDTHW-UHFFFAOYSA-N 2H-pyran Chemical compound C1OC=CC=C1 MGADZUXDNSDTHW-UHFFFAOYSA-N 0.000 description 1
- OGGKVJMNFFSDEV-UHFFFAOYSA-N 3-methyl-n-[4-[4-(n-(3-methylphenyl)anilino)phenyl]phenyl]-n-phenylaniline Chemical group CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 OGGKVJMNFFSDEV-UHFFFAOYSA-N 0.000 description 1
- CFNMUZCFSDMZPQ-GHXNOFRVSA-N 7-[(z)-3-methyl-4-(4-methyl-5-oxo-2h-furan-2-yl)but-2-enoxy]chromen-2-one Chemical compound C=1C=C2C=CC(=O)OC2=CC=1OC/C=C(/C)CC1OC(=O)C(C)=C1 CFNMUZCFSDMZPQ-GHXNOFRVSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 241001061127 Thione Species 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- APLQAVQJYBLXDR-UHFFFAOYSA-N aluminum quinoline Chemical compound [Al+3].N1=CC=CC2=CC=CC=C12.N1=CC=CC2=CC=CC=C12.N1=CC=CC2=CC=CC=C12 APLQAVQJYBLXDR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical class C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- XPSQBNPZMNWIPV-UHFFFAOYSA-N ethenoxyperoxyethene Chemical compound C=COOOC=C XPSQBNPZMNWIPV-UHFFFAOYSA-N 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
- B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
Definitions
- FIG. 22 shows a light emitting element used in an organic electroluminescent device among the light emitting elements used in such a display device.
- An example of a configuration of an organic electroluminescence (electroluminescence) device is shown below.
- dark spots generally occur in a size that is invisible to the naked eye immediately after driving, and grow by continuous driving with this as a nucleus. It is also known that dark spots occur even in a storage state where no driving is performed, and grow over time.
- FIG. 1 is a diagram showing a configuration of a display device according to the embodiment.
- An organic EL element (hereinafter simply referred to as a light emitting element) 2 is, for example, a light-transmitting substrate when the display device is a “transmissive type” in which light is emitted from the element member L (base material 1) side.
- a light-transmitting lower electrode 3 formed by sputtering is provided on the material 1.
- the lower electrode 3 is used, for example, as an anode electrode.
- a hole transport layer 4, a light emitting layer 5, and an electron transport layer 6 are sequentially provided.
- An upper electrode 7 serving as a force source electrode is provided on the upper side, and the light emitting element 2 is configured by this.
- co-evaporation of trace molecules may be performed for the purpose of controlling the emission spectrum of the light-emitting layer 5.
- the organic thin film contains a trace amount of an organic substance such as a berylen derivative, a coumarin derivative, or a pyran dye, good.
- the laminating means 13 includes a substantially box-shaped support member 32 whose front and top surfaces are open, and is supported by the support member 32 and uses a suction force from a vacuum pump (not shown) to form a sealing member U.
- Holding means 33 capable of adsorbing and holding, and pressing force applying means 34 supported by the support 32 and capable of moving left and right while pressing the outer surface of the sealing member U, and the support 32
- a support moving means 36 for moving the support in the vertical and horizontal directions.
- FIGS. 3 and 7 to 16 a method of bonding the sealing member U to the element member L on which the light emitting element 2 is formed by using the bonding apparatus 10 according to the present embodiment is shown in FIGS. 3 and 7 to 16. This will be described with reference to FIG.
- the display area '1a side where the light emitting element 2 is formed is used as the bonding surface L1, and the element member L is placed on the mounting table with the bonding surface L1 facing up.
- 11 1 While installing in the right area on the top surface 1 1, the sealing member U is installed in the left area, and the claws 11 1 B are protruded and retracted to move the element member L and the sealing member U in the surface direction. Regulate.
- the application of the resin material M by the application means 12 is started. That is, by moving the syringe device 16 by the syringe moving means 17, the tip side of the nozzle 20 is moved to one end in the left-right direction of the bonding surface L 1.
- the discharge of the resin material M is started in the opposite direction, and a substantially linear bead B (see FIG. 4) extending in the same direction is reciprocated in the left-right direction of the syringe device 16 onto the bonding surface L1. Many are formed at predetermined intervals.
- the application amount of the resin material M, the length and the pitch of the bead B, and the like can be arbitrarily set, whereby the thickness of the resin layer after the element member L and the sealing member U are bonded to each other can be set. Can be arbitrarily controlled.
- the entire application means 12 moves to the depth side of the apparatus to create a space where the bonding means 13 can be positioned.
- the suction pad 46 rises with respect to the suction block 44 while sucking the sealing member U, and as a result, the suction pad
- the left end region of the sealing member U on the block 44 side is the base end side, and the sealing member U is held while bending the free end side of the suction pad 46 side upward.
- the support 32 is further lowered to bring the left end side region of the sealing member U into contact with the resin material M first.
- the suction pad 46 is slightly lowered with respect to the suction block 44, whereby the contact area between the sealing member U and the resin material M is on the right side.
- the resin material M slightly expands and the resin material M located below the pressure roller 55 is crushed.
- the resin material] VI is applied to a plurality of locations on the element member L so that the beads B are formed at predetermined intervals as shown in FIG.
- the beads B are provided in a dome shape such that they can be substantially point-contacted at the initial contact when the sealing member U first contacts the element member L, as shown in FIG. 17B. M and sealing member The contact area of U becomes small, and it becomes difficult to mix air between them.
- an air escape passage 28 is formed between the beads B, and the pressing force applying means 34 moves the sealing member U while pressing the sealing member U along the extending direction of the air escape passage 28.
- the manufacture of the display device S using the organic EL element as the light emitting element 2 has been exemplified.
- the present invention is not limited to this, and the present invention is not limited to this. It can also be applied.
- the bonding device 10 or the bonding device is used. It is also possible to use 100.
- each unit of the device in the present embodiment is not limited to the illustrated configuration example, and various changes can be made as long as substantially the same operation is achieved.
- the light emitting element 2 was formed in the display area 1a on the substrate 1 made of a glass plate.
- a sealing member U was bonded to an element member L having a light emitting element 2 formed on a substrate 1 by the above method in the same manner as in Example 1. Made in this way The resulting display device was a “top emission type” display device in which emitted light was extracted from the sealing member U side.
- the light emitting element 2 was formed in the display area 1a on the base material 1 made of a glass plate to obtain an element member L.
- ⁇ -NPD ⁇ -naphtyl pheni 1 diamine
- Fig. 21 a hole transport layer under vacuum by vacuum evaporation.
- A1q3 8-hydroxyquinor ine alminum
- Li was deposited to about 0.5 nm as the cathode electrode.
- A1Cu (Cu-1 weight percent) was deposited to a thickness of 200 nm as a force electrode sealing layer by vapor deposition (deposition rate: 0.3 nm Zsec.).
- a light emitting element 2 was fabricated by vapor-depositing a 200 nm Au Ge electrode in order to complete the sealing.
- the maximum emission wavelength was 520 nm, and the coordinates on the CIE chromaticity coordinates were (0.32, 0.55). Good green emission was exhibited.
- the luminance at a current density of 400 mA / cm 2 was 260 000 cdZm 2 . It was clear that the shape of the light emitting scan Bae spectrum the emission from A 1 d 3.
- the light emitting element 2 was formed in the display area 1a on the substrate 1 made of a glass plate.
- the maximum emission wavelength was 520 nm, and the coordinates on the CIE chromaticity coordinates were (0.32, 0.55).
- the luminance at a current density of 400 O mA / cm 2 was 1,600 cd Zm 2 . It was clear from the shape of the light emitting spectrum that light was emitted from A 1 Q 3 .
- a sealing member U was bonded to an element member L having a light emitting element 2 formed on a substrate 1 by the above method in the same manner as in Example 1.
- the display device manufactured in this manner was a “top emission type” display device in which light was emitted from the sealing member U side.
- Example 2 When a drive test of the display device manufactured in this manner was performed under the same conditions as in Example 1 (initial luminance: 200 cd Zm 2 ), one hour after driving, the light emitting surface can be observed with the naked eye. There were no dark spots, and no dark spots were observed by observation through a 10-fold finder. It was also confirmed that no bubbles were mixed into the resin layer m.
- a resin material is applied to a plurality of locations so that an air escape passage is formed between an element member provided with a display area and a sealing member.
- a bonding force is applied along the air escape passage between the member and the sealing member, air is expelled from the air escape passage to the outside.
- the resin layer is formed so that the partially applied resin material continues.
- a display device in which no bubbles remain between the display region of the element member and the sealing member is obtained by forming the display device in which the element member and the sealing member are attached to each other in a state in which the sealing member is bonded. Can be.
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- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2003-7009704A KR20030076623A (ko) | 2001-01-24 | 2002-01-24 | 표시장치 |
EP02716357A EP1361556A4 (en) | 2001-01-24 | 2002-01-24 | DISPLAY DEVICE |
US10/466,901 US8797484B2 (en) | 2001-01-24 | 2002-01-24 | Display apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001015425A JP3903204B2 (ja) | 2001-01-24 | 2001-01-24 | 表示装置の製造方法 |
JP2001-015425 | 2001-01-24 |
Publications (1)
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WO2002059861A1 true WO2002059861A1 (fr) | 2002-08-01 |
Family
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PCT/JP2002/000501 WO2002059861A1 (fr) | 2001-01-24 | 2002-01-24 | Dispositif d'affichage |
Country Status (7)
Country | Link |
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US (1) | US8797484B2 (ja) |
EP (1) | EP1361556A4 (ja) |
JP (1) | JP3903204B2 (ja) |
KR (1) | KR20030076623A (ja) |
CN (1) | CN1578973A (ja) |
TW (1) | TWI308030B (ja) |
WO (1) | WO2002059861A1 (ja) |
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JP4240276B2 (ja) | 2002-07-05 | 2009-03-18 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP2004191608A (ja) * | 2002-12-11 | 2004-07-08 | Sony Corp | 表示装置およびその製造方法 |
TWI352553B (en) | 2002-12-26 | 2011-11-11 | Semiconductor Energy Lab | Light emitting device and a method for manufacturi |
JP4581342B2 (ja) * | 2003-06-13 | 2010-11-17 | 株式会社スリーボンド | 貼合装置 |
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JP2008226859A (ja) * | 2004-10-22 | 2008-09-25 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置の製造方法、及び有機エレクトロルミネッセンス装置 |
US20070000603A1 (en) * | 2005-07-01 | 2007-01-04 | Nordson Corporation | Method of forming at least one continuous line of viscous material between two components of an electronic assembly |
KR100793360B1 (ko) * | 2006-01-16 | 2008-01-11 | 삼성에스디아이 주식회사 | 레이저 조사 장치용 마스크 |
US7696683B2 (en) | 2006-01-19 | 2010-04-13 | Toppan Printing Co., Ltd. | Organic electroluminescent element and the manufacturing method |
KR100801623B1 (ko) | 2006-06-23 | 2008-02-11 | 삼성전자주식회사 | 표시장치의 제조방법과 이에 사용되는 표시장치의 제조장치및 이에 의하여 제조된 표시장치 |
JP5164422B2 (ja) | 2007-04-26 | 2013-03-21 | 本田技研工業株式会社 | 燃料電池用膜電極構造体及びセパレータの積層方法及びその積層装置 |
JP5469059B2 (ja) * | 2007-05-18 | 2014-04-09 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 弾性積層接着剤によって保護された有機電子デバイス |
JP5197089B2 (ja) * | 2008-03-27 | 2013-05-15 | 株式会社ジャパンディスプレイセントラル | 平面表示装置の製造方法及び製造装置 |
JP5195385B2 (ja) * | 2008-12-15 | 2013-05-08 | カシオ計算機株式会社 | 保護板一体型表示パネルの製造装置 |
JP2009187962A (ja) * | 2009-05-26 | 2009-08-20 | Seiko Epson Corp | 電気光学装置及び電子機器 |
US8246867B2 (en) | 2009-10-16 | 2012-08-21 | Corning Incorporated | Method for assembling an optoelectronic device |
SG179299A1 (en) * | 2010-09-13 | 2012-04-27 | Trimech Technology Pte Ltd | A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly |
JP5898698B2 (ja) * | 2011-12-12 | 2016-04-06 | 株式会社日立製作所 | 半導体光素子 |
TWI457070B (zh) * | 2011-12-23 | 2014-10-11 | Au Optronics Corp | 顯示裝置及其組裝方法 |
JP5857765B2 (ja) * | 2012-02-01 | 2016-02-10 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子 |
US20140071392A1 (en) * | 2012-09-07 | 2014-03-13 | Apple Inc. | Initial contact control for lamination |
WO2014077063A1 (ja) | 2012-11-16 | 2014-05-22 | コニカミノルタ株式会社 | 透光性電極、及び、電子デバイス |
CN103848575B (zh) * | 2012-12-07 | 2016-09-14 | 普罗科技有限公司 | 薄膜晶体管液晶显示面板制造方法 |
CN104626720B (zh) * | 2013-11-07 | 2017-02-15 | 宸鸿科技(厦门)有限公司 | 面板贴合结构以及贴合方法 |
CN103647007B (zh) * | 2013-12-30 | 2016-06-08 | 广州市鸿利光电股份有限公司 | 一种cob封装方法 |
US20150372251A1 (en) * | 2014-06-19 | 2015-12-24 | Toshishige Fujii | Electric element package |
CN104022234B (zh) * | 2014-06-24 | 2016-10-26 | 深圳市华星光电技术有限公司 | Oled封装设备及oled面板的封装方法 |
KR102190249B1 (ko) * | 2014-07-25 | 2020-12-14 | 삼성디스플레이 주식회사 | 라미네이션 장치 및 라미네이션 방법 |
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2001
- 2001-01-24 JP JP2001015425A patent/JP3903204B2/ja not_active Expired - Fee Related
-
2002
- 2002-01-24 TW TW091101138A patent/TWI308030B/zh not_active IP Right Cessation
- 2002-01-24 US US10/466,901 patent/US8797484B2/en active Active
- 2002-01-24 CN CNA028071603A patent/CN1578973A/zh active Pending
- 2002-01-24 KR KR10-2003-7009704A patent/KR20030076623A/ko active Search and Examination
- 2002-01-24 WO PCT/JP2002/000501 patent/WO2002059861A1/ja active Application Filing
- 2002-01-24 EP EP02716357A patent/EP1361556A4/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
EP1361556A4 (en) | 2009-08-05 |
TWI308030B (ja) | 2009-03-21 |
CN1578973A (zh) | 2005-02-09 |
KR20030076623A (ko) | 2003-09-26 |
JP3903204B2 (ja) | 2007-04-11 |
US8797484B2 (en) | 2014-08-05 |
JP2002216950A (ja) | 2002-08-02 |
US20040100601A1 (en) | 2004-05-27 |
EP1361556A1 (en) | 2003-11-12 |
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