WO2002053474A1 - Corps amortisseur pour substrat en verre, et corps d'emballage utilisant le corps amortisseur - Google Patents

Corps amortisseur pour substrat en verre, et corps d'emballage utilisant le corps amortisseur Download PDF

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Publication number
WO2002053474A1
WO2002053474A1 PCT/JP2001/011472 JP0111472W WO02053474A1 WO 2002053474 A1 WO2002053474 A1 WO 2002053474A1 JP 0111472 W JP0111472 W JP 0111472W WO 02053474 A1 WO02053474 A1 WO 02053474A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
buffer
substrate
shape
corner
Prior art date
Application number
PCT/JP2001/011472
Other languages
English (en)
Japanese (ja)
Inventor
Yasushi Ueda
Itsuo Hamada
Original Assignee
Asahi Kasei Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Kabushiki Kaisha filed Critical Asahi Kasei Kabushiki Kaisha
Priority to KR1020037008648A priority Critical patent/KR100552879B1/ko
Priority to JP2002554602A priority patent/JP4091432B2/ja
Priority to DE10197125A priority patent/DE10197125B3/de
Publication of WO2002053474A1 publication Critical patent/WO2002053474A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/053—Corner, edge or end protectors
    • B65D81/054—Protectors contacting two generally perpendicular surfaces of the packaged article, e.g. edge protectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
    • B65D81/113—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D71/00—Bundles of articles held together by packaging elements for convenience of storage or transport, e.g. portable segregating carrier for plural receptacles such as beer cans or pop bottles; Bales of material
    • B65D71/02—Arrangements of flexible binders
    • B65D71/04—Arrangements of flexible binders with protecting or supporting elements arranged between binder and articles or materials, e.g. for preventing chafing of binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2581/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D2581/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D2581/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/051—Details of packaging elements for maintaining contents at spaced relation from package walls, or from other contents
    • B65D2581/052—Materials
    • B65D2581/055—Plastic in general, e.g. foamed plastic, molded plastic, extruded plastic

Definitions

  • the present invention relates to a transfer buffer for protecting a glass substrate having electronic components such as a semiconductor device formed on a glass substrate from damage due to vibrations during transportation, and the above glass substrate using the buffer.
  • the present invention relates to a package in which a plurality of sheets are packed at the same time.
  • the key point is a buffer made of a polyolefin bead foam having specific characteristics and having a substantially L-shaped cross section and a plurality of substrate insertion grooves provided inside along the L-shape.
  • a buffer made of a polyolefin bead foam having specific characteristics and having a substantially L-shaped cross section and a plurality of substrate insertion grooves provided inside along the L-shape.
  • the groove width of the substrate insertion groove is formed to be equal to or slightly smaller than the thickness of the glass substrate, and the elastic recovery property during compression, which is a characteristic of the polyolefin bead foam, is used.
  • the glass substrate is fixed using the height. Therefore, it is effective for dust generation resistance due to vibration friction with the glass substrate during transportation, but when packing the glass substrate, which is the original purpose, the frictional resistance with the glass substrate has an adverse effect.
  • the glass substrate which is extremely thin, about 0.4 to 1.0 mm, can easily break and bend easily. There is a problem that it takes a long time. This is the same when taking out the glass substrate.
  • automatic storage and unloading devices for glass substrates have been introduced in terms of labor saving, but some problems have been pointed out as problems are likely to occur due to the above problems, and they are not suitable for automation.
  • the problem of the present invention is that the groove of the glass substrate at the end of the L-shape of the buffer does not slip when packing the glass substrate, and the glass is not subjected to external force such as vibration or drop impact during transportation or handling. It is an object of the present invention to provide a buffer for a glass substrate that can safely protect the substrate, and is suitable for automating storage and removal of the glass substrate, and generates dust easily even when the glass substrate is rubbed. Another object of the present invention is to provide a buffer for a glass substrate which is excellent in durability and can be used a plurality of times, and provides a package which is packed using these buffers. ⁇ Disclosure of Invention>
  • the first buffer for a glass substrate of the present invention is a buffer for a glass substrate made of a polyolefin bead foam, has a substantially L-shaped cross section according to the shape of a corner of the glass substrate, and The inside surface is provided with a plurality of substrate insertion grooves for fixing the two sides forming the corners of the glass substrate, and the outside surface is provided with at least one fixing tool formed along the L-shape.
  • the groove has a groove, and the thickness of the buffer body with respect to the bottom of the fixture guide groove is gradually reduced from both ends of the L-shape to the corners.
  • the first buffer member for a glass substrate of the present invention preferably includes a chamfered bottom portion of the fixture guide groove at the corner.
  • the second buffer for a glass substrate of the present invention is a buffer for a glass substrate made of a polyolefin bead foam, having a substantially L-shaped cross section according to the shape of the corner of the glass substrate.
  • the inside surface is provided with a plurality of substrate insertion grooves for fixing the two ends forming the corners of the glass substrate, and the thickness of the buffer gradually decreases from both ends of the L-shape toward the corners. Is what it is.
  • the third buffer for a glass substrate of the present invention is a buffer for a glass substrate made of a polyolefin bead foam, and has a substantially L-shaped cross section according to the shape of the corner of the glass substrate, The inside surface is provided with a plurality of substrate insertion grooves for fixing two sides forming a corner of the glass substrate, and convex portions are formed at both outer ends of the L-shape. .
  • the second and third buffer members for a glass substrate of the present invention preferably include that the outer corners are chamfered.
  • the buffer for a glass substrate of the present invention has a cutout groove on the inner side in a direction perpendicular to the substrate insertion groove, the maximum thickness of the buffer is 10 to 60 mm, and two sides of an L-shape. Is 1.0 to 3.0 on the short side basis, the groove width of the substrate insertion groove is 1.0 to 4.0 times the thickness of the glass substrate, and the groove depth is 3 to 15 mm.
  • the pitch is 6 to; L0 Omm, the polyolefin bead foam has an average particle diameter of 1.5 to 5.0 mm, and a fusion rate of 70. /.
  • the preferred embodiment includes a compression elasticity index of 3.9 to 490 and a recovery rate of 60% or more.
  • the first package of the present invention comprises a plurality of glass substrates arranged in parallel at predetermined intervals to form a rectangular parallelepiped, and the corners of each substrate are respectively formed on the substrate of the first glass substrate buffer of the present invention.
  • the four sides of the rectangular parallelepiped which is inserted into the insertion groove and orthogonal to the substrate surface are fitted by the buffer, and a long fixing tool is wound along the fixing guide groove of the buffer. It is characterized by being concluded.
  • a plurality of glass substrates are arranged in parallel at a predetermined interval to form a rectangular parallelepiped, and the corners of each substrate are respectively formed in the second or third glass substrate of the present invention.
  • Four sides of the rectangular parallelepiped, which is inserted into the substrate insertion groove of the buffer and is orthogonal to the substrate surface, are fitted by the buffer, and a long fixing tool is formed outside the buffer along the L-shape. It is characterized by being wound and fastened.
  • FIG. 1 is a perspective view of one embodiment of the shock absorber of the present invention.
  • FIG. 2 is a perspective view of one embodiment of the package of the present invention.
  • 3 (a) to 3 (e) are schematic cross-sectional views of an embodiment of the buffer according to the present invention.
  • 4 (a) to 4 (c) are schematic cross-sectional views showing a configuration example of the substrate insertion groove of the buffer of the present invention.
  • 1 is a buffer
  • 2 is a groove for inserting a board
  • 3 is a guide groove for a fixture
  • 4 is a ridge
  • 21 is a glass substrate
  • 22 is a fixture
  • 31 is a wall surface of a buffer.
  • 32 is the bottom of the board insertion groove
  • 33 is the L-shaped end
  • 34, 34 ' is the L-shaped corner
  • 35 is the bottom of the fixture guide groove
  • 36 is the chamfer
  • 37 Is a notch groove
  • 38 is a convex portion
  • 39 is a concave portion.
  • the shock absorber of the present invention is characterized in that, in a shock absorber made of a polyolefin bead foam and having a substantially L-shaped cross section, the end of the L-shape is formed to be thicker than a corner. Accordingly, when the glass substrate is packed and the outside is fastened by the fixture, the fixture passes through the outside of the corner at the end of the L-shape, and the fastening force of the fixture is reduced to the corner. To protect the glass substrate by pressing the entire buffer evenly can do.
  • a specific configuration for making the thickness of the L-shaped end of the buffer body larger than the corners is as follows.
  • FIG. 1 is a perspective view of one embodiment of the shock absorber of the present invention having the above-mentioned configuration (1).
  • 1 is a buffer
  • 2 is a board insertion groove
  • 3 is a fixture guide groove
  • 4 is a ridge that separates adjacent board insertion grooves 2.
  • FIG. 2 is a perspective view of an embodiment of the package of the present invention in which a plurality of glass substrates are packed using four of the buffers.
  • 21 is a glass substrate
  • 22 is a fixture, and the same members as those in FIG.
  • the buffer 1 of the present invention protects the corners of the glass substrate 21 and fixes a plurality of the substrates integrally. However, two or more, preferably four, are packaged.
  • the buffer 1 of the present invention has a substantially L-shaped cross section according to the shape of the corner of the glass substrate.
  • a plurality of substrate insertion grooves 2 are provided along the groove and are separated from each other by the ridges 4.
  • the fixture guide groove 3 is formed along the L-shape.
  • the fixing tool guide groove 3 is for winding the fixing tool 22 along the guide groove 3 after packing the glass substrate 21.
  • the depth is changed so that the thickness of the buffer 1 at the bottom gradually decreases toward the corner.
  • FIG. 3 (a) schematically shows a cross section along the fixture guide groove 3 and the substrate insertion groove 2 of the buffer 1 in FIG. In FIG.
  • 3 1 Is the outer wall surface of the buffer 1, 32 is the bottom of the board insertion groove 2, 33 is the L-shaped end of the buffer 1, 34, 34 'is the L-shaped corner, and 35 is the fixture guide.
  • the bottom of the groove 3, 36 is a chamfered portion, 37 is a cutout groove, 38 is a convex portion, and 39 is a concave portion.
  • the thickness at the corner 34 or 34 ' means the thickness of the short side and the long side of the buffer at the inside corner of the L-shape.
  • the depth of the fixture guide groove is formed so as to be shallow at the end 33 of the L-shape and deep at the corner 34 ′ so that the guide for the fixture is formed.
  • the thickness of the buffer at the bottom 35 of the groove gradually decreases from the L-shaped end 33 toward the corner 3 4 ′.
  • the chamfered portion 36 is preliminarily chamfered to prevent the fixing force of the fixing member from being concentrated on the corner portion 34 'of the bottom portion 35 of the fixing device guide groove. It is also preferable to form them. By forming the chamfered portion 36, there is no danger that the fixture will cut into the buffer and cause damage, the deformation distortion at the corner 34 'is reduced, and the end 33 of the buffer becomes difficult to open outward. .
  • the chamfered portion 36 may have a flat shape or a curved shape.
  • a cut is made in the buffer body in a direction perpendicular to the board insertion groove (a direction perpendicular to the paper surface), and at least one notch groove 37 is provided. It is preferable that the notch groove 37 absorbs the deformation stress that tends to open the end portion 33 to the outside at the time of fastening by the fixing tool and does not propagate the deformation stress to the end portion 33. It should be noted that the shape of the notch groove 37 may be a substantially U-shape in addition to the substantially V-shape shown in FIG. 3 (c).
  • a concave portion 39 from which the ridge 4 is partially removed is formed inside the corner portion 34 on the short side, which is caused by a vibration impact or a drop impact during transportation.
  • This is a configuration for preventing the loss of the corner of the glass substrate that is most easily damaged when the glass substrate is subjected to the heat.
  • the ridge 4 is removed until it reaches the bottom 32 of the substrate insertion groove. Just do it.
  • the L-shaped end 33 of the buffer is configured to be thicker than the corner 34, and an example of the above-described configuration (2) is shown in FIG. 3 (d), and an example of the configuration (3) is shown in FIG. (e).
  • the thickness of the buffer itself is formed so as to gradually decrease from the L-shaped end 33 toward the corner 34.
  • the width and the winding position of the fixture can be freely selected.
  • the thickness of the buffer is uniform, but a convex portion 38 is formed outside the L-shaped end 33, and as a result, the thickness of the buffer at the end 33 is square. It is thicker than part 34.
  • the protruding portion 38 may be formed integrally with the main body, but may be separately formed into a plate shape and subsequently attached to the main body by heat fusion or an adhesive, in which case the same as the main body is used. It may be a material or a different material.
  • the ratio of the two sides of the L-shape (the length of the portion in contact with the glass substrate) is preferably 1.0 or more, more preferably 3.0 or less, based on the short side. Within this range, the balance between the long side and the short side is good, and the fixing stability of the rectangular glass substrate is very good. Also, the probability of the glass substrate being radiused and damaged is lower. More preferably, it is less than 2.7.
  • the length of the short side is preferably 10% or more of the length of the short side of the glass substrate to be packed, and more preferably 45% or less. Furthermore, it is preferably at least 15%, and most preferably at most 40%. If the length of the short side of the buffer is within the above range, even if it receives a drop impact, etc., there is a risk of damaging the glass substrate because the buffer is arranged to sufficiently absorb the impact force. Can be avoided. In addition, since the stress (self-weight of the glass substrate) applied to the buffer can be reduced, dust generation due to contact friction due to vibration during transport can be suppressed, and cleanliness can be satisfied. As a specific external dimension, the short side is preferably 10 Omm or more, more preferably 50 Omm or less.
  • the long side is preferably 100 mm or more, more preferably 150 mm or less. Further, the length in the direction perpendicular to the short side and the long side depends on the number of glass substrates accommodated, but is preferably 15 Omm or more, more preferably 600 mm or less.
  • the maximum thickness of the buffer of the present invention is preferably 1 Omm or more, more preferably 60 mm or less, in view of the size, weight, number of packages, and compression index of the glass substrate. More preferably, it is 15 mm or more and / or 4 O mm or less.
  • the glass substrate before processing can be used as a transfer buffer that can stably fix all glass substrate products of various dimensions as well as the glass substrate before processing.
  • the glass substrate protection function that can sufficiently withstand the impact during transportation can be demonstrated.
  • the depth thereof is preferably 0.5 mm or more at the end 33, more preferably 5 mm or less, and furthermore, the corners 34, Is preferably 2 mm or more, more preferably 15 mm or less. If the depth of the fixture guide groove is formed so as to fall within this range, the fastening force will not only be displaced but also over the entire short side and long side of the shock absorber when the fixture is fastened and fixed by the fixture. As a result, the four corners of the glass substrate can be fixed stably, thereby fully satisfying the protection function of the glass substrate.
  • FIG. 3 (a) the depth thereof is preferably 0.5 mm or more at the end 33, more preferably 5 mm or less, and furthermore, the corners 34, Is preferably 2 mm or more, more preferably 15 mm or less.
  • the fixture guide groove is formed up to the end 33, but it may be formed near the end 33 so as to be flush with the outer wall 31 of the shock absorber.
  • the fixture guide groove is separated from the end 33 by at least 10 mm, more preferably 10 mm from the end 33, and more preferably gradually deeper toward the corner 3 4 ′. It is more preferable to form them so that Within this range, there is no displacement of the fixture during conveyance, and the same effect as when the guide groove is formed from the end 33 described above can be obtained.
  • the thickness of the corner portion 34 is thinner than the thickness of the end portion 33 by 1 mm or more, more preferably 10 mm. It is as follows. More preferably, 0.3 mm or more, most preferably 8 mm or less It is. Also in this case, the end 33 is formed to have a uniform thickness with the thickness of the end 33 up to a position of 1 Oram or more in the direction of the corner 34 from the end 33 and more preferably 10 Omm or less. The same effect as above can be obtained even if the thickness up to the portion 34 is gradually reduced.
  • the thickness of the corner portion 34 is thinner than the thickness of the end portion 33 by 1 mm or more, more preferably 1 Omm or less.
  • the means for reducing the thickness of the corner 34 can be achieved by forming a projection 38 near the end 33 as shown in FIG.
  • the width of the projection 38 in the direction along the L-shape is preferably 1 Omm or more, more preferably 10 Omm or less. More preferably, it is 20 mm or more, most preferably 8 Omm or less.
  • an arc-shaped or The length is preferably 3 mm or more, and more preferably 6 Omm or less.
  • the chamfer When the chamfer is within this range, when the glass substrate is packed and the outside is fastened by the fixture, the fastening force of the fixture is prevented from concentrating on the corners, so the entire buffer is even. To fix the corners of the glass substrate. Therefore, the function of fixing and protecting the glass substrate is further enhanced, and the phenomenon that the fixing tool is cut and bitten into the buffer even when the fixing tool is wound with a strong fastening force is eliminated, and the glass substrate is repeatedly reused many times over a long period of time. The durability can be greatly improved.
  • the groove depth is preferably 1/20 or more of the thickness of the buffer at the portion where the notch groove 37 is formed, and more preferably 1Z 2 The following is good.
  • the groove width is preferably 2 mm or more, more preferably 10 mm or less.
  • the side length is not particularly limited. Is preferably 1Z8 or more, more preferably 4/5 or less, more preferably 1 or more, more preferably 3 or less.
  • the glass substrate can be inserted without impairing the rigidity of the buffer. Since the admission qualities of the glass substrate are improved over the entire length of the groove, the protection function of the substrate is improved, and the effect of lowering the frictional dust generation of the buffer is derived.
  • the bottom of the concave portion 39 be set so as to reach the bottom portion 32 of the substrate insertion groove.
  • the bottom 32 of the board insertion groove should have a depth of at least 1 mm, most preferably at most 8 mm, most preferably at least 2 mm, most preferably at most 6 mm. It is good to form it. Within this range, even if the shock absorber is distorted and deformed due to a drop impact or the like, the probability of damage is extremely low because no external force is applied to the most fragile corner of the glass substrate. Further, since the structural strength of the cushioning member can be sufficiently maintained, the initial shape can be maintained even if the cushioning member is repeatedly used. Therefore, the function of fixing and protecting the glass substrate can be exhibited over a long period of time. '' "
  • the groove width of the substrate insertion groove formed in the buffer of the present invention is preferably 1.0 times or more and 4.0 times or less, more preferably 1.2 times or more and 3.5 times or more the thickness of the glass substrate to be packed. Double or less is better. Within this range, the insertion and removal of the glass substrate by a manual or automatic device can be performed quickly and efficiently, and the trouble of damage to the glass substrate during the insertion operation is drastically reduced. In addition, since the glass substrate is sufficiently fixed in the substrate insertion groove, the friction between the glass substrate and the buffer is suppressed even if it is subjected to vibration or shock during transportation, and the dust phenomenon is extremely low. Can be kept.
  • the depth of the substrate insertion groove is preferably 3 mm or more, more preferably 15 mm or less, in view of the size and weight of the glass substrate, the compression elasticity index of the buffer, the groove width of the substrate insertion groove, and the like. Is good. More preferably, it is at least 5 mm and most preferably at most 1 Omm. Within this range, the glass substrate can be securely fixed with the glass substrate inserted into the insertion groove even if it is subjected to a vibration impact during transportation or a drop impact due to handling. Damage accidents such as contact with the substrate can be prevented.
  • the portion where the glass substrate comes into contact with the substrate insertion groove is constantly rubbed with the buffer due to the vibration and impact during transportation, so that it is extremely possible that fine scratches are generated on the surface of the glass substrate.
  • the portion where the glass substrate comes into contact with the substrate insertion groove is constantly rubbed with the buffer due to the vibration and impact during transportation, so that it is extremely possible that fine scratches are generated on the surface of the glass substrate.
  • the pitch of the substrate insertion groove is determined by the type of glass substrate, etc. (eg, glass alone, force filter, liquid crystal module, liquid crystal, plasma display panel, etc.), its size, weight, compression elasticity index of the buffer, substrate insertion groove
  • the thickness is preferably 6 mm or more, and more preferably 100 mm or less.
  • the cross-sectional shape of the ridge separating the adjacent substrate insertion grooves is a flat top as shown in FIG. 4 (a).
  • a guide section is provided on the upper part of the ridge, as shown in a chevron (Fig. 4 (b)) or a trapezoid (Fig. 4 (c)).
  • the formed two-stage shape is preferable, and the trapezoid is more preferable.
  • the mold used for in-mold molding can be manufactured with high precision even for a buffer with a narrow storage groove pitch.
  • t1 is the maximum thickness of the buffer 1
  • t2 is the depth of the substrate insertion groove 2
  • t3 is the groove width
  • t4 is the groove pitch.
  • the buffer of the present invention comprises a polyolefin bead foam.
  • the foam is obtained by filling foamed polyolefin beads in a mold having a desired shape, heating and foaming with steam, cooling, and forming the foam into a desired shape.
  • a mold used for the molding a mold obtained by a solid-state method can be used. ⁇ Mold by metal method can be easily manufactured with high precision even for complicated shapes, and it is economical and mass-produced because the manufacturing cost is less than 10 times less than injection mold. It is suitable for
  • the polyolefin used for molding the polyolefin bead foam used in the present invention may be either a crosslinked type or a non-crosslinked type.
  • the resin material include low, medium, high density polyethylene, linear low density polyethylene, Linear ultra low density polyethylene, Random and block copolymers of propylene with polyethylene-based resins typified by polyethylene and ethylene-vinyl acetate copolymer, and copolymer components such as ethylene, butene 1-1, and 4-methylpentene 11
  • examples thereof include a polymerized polypropylene resin, a random copolymerized polypropylene resin obtained by using a meta-mouth catalyst, and a composition in which two or more of the above are blended.
  • random polyethylene resin the resin density 0. 9 2 7 g Z cm 3 or more, more preferably 0. 9 7 0 g / cm 3 or less of those or ethylene Ya butene one 1 and pro pyrene
  • a copolymerized polypropylene resin is a preferred example.
  • the buffer has properties such as moderate rigidity, flexibility, and recoverability, and has sufficient practical performance as a buffer for transporting a glass substrate, such as shape stability and drop.
  • the shock absorbing performance at the time, durability of repeated use and dust resistance are extremely improved.
  • the expansion ratio of the shock absorber can be relatively increased to obtain a specific compression elasticity index, which is excellent in terms of lightness and economy.
  • the random copolymer polypropylene resin of ethylene butene and propylene has higher elasticity than polyethylene resin, it is suitable for a buffer of a large-sized glass substrate. It is preferable because the initial state can be maintained even after repeated use and the durability is excellent.
  • the buffer made of the polyolefin bead foam of the present invention preferably has an average particle size of 1.5 mm or more, more preferably 5.0 mm or less, of the foamed particles constituting the buffer. It is more preferably at least 2.0 mm, most preferably at most 4.5 mm.
  • the average particle diameter is in this range, the surface area ratio per volume of the foamed particles is small, so that the rate at which the gas pressure (air) in the particles escapes and decreases during steam heating in the in-mold molding is extremely small. As a result, sufficient heat-expandable foaming properties are exhibited.
  • the average particle diameter of the foamed particles refers to three straight lines with a length of 100 mm on the surface of the in-mold molded product, which are marked with a ballpoint pen, and the number of foamed particles in contact with this straight line is measured. Then, the average particle diameter C [mm] is calculated from the following equation (A). The evaluation is the average value evaluated with three straight lines.
  • a second requirement of the buffer comprising the polyolefin bead foam of the present invention resides in the properties of the buffer. That is, the fusion rate is preferably 70% or more, the compression elasticity index is 3.9 or more (more preferably, 490 or less), and the recovery rate is preferably 60% or more.
  • the above fusion rate refers to the total length in the thickness direction of the fractured surface when a cut with a depth of about lmm is made in the thickness direction of the buffer body, and the cut is made with the cut outside.
  • the total number of foamed particles and the number of foamed particles that have been ruptured (material destruction) in the area over the length of 75 mm are measured, and the value obtained by dividing the number of broken particles by the total number of foamed particles is shown as a percentage. It is a numerical value.
  • the fusion rate is 70% or more, the inherent properties of the polyolefin bead foam inherently related to mechanical strength such as compression and tension are sufficiently exhibited.
  • the innumerable foamed particles constituting the buffer are fused and integrated firmly with each other, so they have excellent durability and recoverability.
  • the glass substrate is fixed and packaged using this buffer, Because it can withstand strong fastening force, it can fix and package the glass substrate at a high level, and the probability of damaging the glass substrate is further reduced.
  • there is no minute gap between the foamed particles on the surface of the buffer body and the water absorption is substantially zero even in the washing and washing performed repeatedly after each use, there is also an effect that the drying workability is excellent.
  • the compression elasticity index of the shock absorber when the compression elasticity index of the shock absorber is in the above range, the excellent shock-absorbing performance inherent in polyolefin can be efficiently exhibited to the maximum, and the appropriate rigidity and flexibility are well balanced.
  • the protection function is very high, especially if the glass substrate size exceeds 50 Omm X 60 Omm and the stability is fixed.
  • it since it has sufficient strength to withstand external forces during transport and handling, it is slightly deformed and has durability that can be used repeatedly over a long period of time.
  • the expansion ratio of the buffer can be relatively increased to obtain a specific compression elasticity index, which is excellent in terms of lightness and economy.
  • the polyolefin bead foam has excellent repetition durability, which is the largest characteristic, and is deformed even when used frequently. It can be kept small.
  • the compression elasticity index is a value obtained by dividing the compression elastic modulus (NZ cm 2 ) by the expansion ratio.
  • the above-mentioned compression modulus is a value obtained in accordance with JISK7220 for a sample in which the following expansion ratio is measured, and the compression speed is 1 OmmZ. If the sample thickness is less than 2 Omm, measure multiple samples so that the thickness is about 20 mm.
  • the foaming ratio is as follows: From the buffer, cut out a flat test piece with a width of 50 mm, a length of 50 mm and a thickness of 2 Omm, measure the weight (g) to 1 Omg, and then use a vernier caliper The length and thickness are measured, the volume (cm 3 ) is calculated, and the expansion ratio E [cm 3 / g] is calculated from the following equation (B).
  • the above-mentioned recovery rate refers to a compression test apparatus “Autograph AG-150” manufactured by Shimadzu Corporation, which is obtained by cutting a flat test piece having a width of 50 mm, a length of 50 mm, and a thickness of 20 mm from the buffer. After compressing to 50% of the thickness of the test piece at a compression speed of 1 OmrnZ using ⁇ 0 0D '', immediately remove it until the load becomes zero at the same speed, and remove the thickness at the moment when the load becomes zero.
  • the recovery rate R [%] is calculated from the following formula (C). If the thickness is less than 20 mm, measure multiple layers so that the thickness is about 20 mm.
  • a plurality of glass substrates are packed in a set of two or more of the above-described buffers of the present invention, and preferably in a set of four. That is, a plurality of glass substrates are arranged in parallel at a predetermined interval to form a rectangular parallelepiped, and the corners of each substrate are inserted into the substrate insertion groove of the buffer of the present invention, respectively, and are orthogonal to the substrate surface. The four sides of the rectangular parallelepiped are fitted by the buffer. afterwards, Wind and fasten a long fixture along the L-shape of the buffer. When the shock absorber has a fixture guide groove, the fixture is wound along the fixture guide groove.
  • a dummy glass substrate may be arranged as the outermost glass substrate.
  • Embodiments other than the glass substrate package using the buffer of the present invention will be described below.
  • a plurality of glass substrates are arranged in parallel at a predetermined interval to form a rectangular parallelepiped, and the corners of each substrate are inserted into the substrate insertion grooves of the buffer of the present invention, respectively.
  • the four sides of the rectangular parallelepiped perpendicular to the surface are fitted by the buffer.
  • the film When wrapping the package with the heat-shrinkable resin film as necessary, after storing the package in a bag-shaped or tubular-shaped film, preferably heat-sealing the end of the film.
  • the film may be sealed, and the film may be heat-shrinked to adhere to the package.
  • the above-described package is characterized in that a package in which a plurality of glass substrates are integrally packaged using the buffer of the present invention is shrink-wrapped using a heat-shrinkable resin film. Even with a glass substrate package, the packaging operation of the package is easy, and automatic packaging is possible. In the package after packaging, since the heat-shrinkable film has no looseness, the film does not come into contact with the outermost substrate of the package and the glass substrate is not contaminated.
  • the buffer can be used effectively and the efficiency is high. Furthermore, since the entire buffer is pressed from the outside by the shrinkage stress of the film, the buffer and the glass substrate are satisfactorily fixed together, so that the groove of the glass substrate is not dislodged or damaged. Rubbing between the glass substrate and the buffer due to vibrations at the time is drastically reduced, thereby preventing the glass substrate from being scratched or adhering dust and keeping the glass substrate clean.
  • Examples of the heat shrinkable resin film used for shrink packaging include a polyolefin resin film and a polychlorinated vinyl resin film. Due to its properties, a large amount of plasticizers and stabilizers are added to the resin in order to impart processability and flexibility during extrusion film formation. These additives exude to the surface of a film or the like over time after film formation, or cause a very small amount of volatilization even at room temperature, thereby deteriorating the cleanliness of a work place for packaging glass substrates. In addition, there is a risk of causing a fatal contamination problem such as indirect contact of the additive attached to the hand when handling the packaging of the glass substrate.
  • polystyrene-based resin film a single-layer or multi-layer product of a polypropylene-based resin or a polyethylene-based resin, or a crosslinked or non-crosslinked type is preferably used.
  • Such a polyolefin-based resin film preferably has a heat shrinkage at 120 ° C. of preferably at least 15% in at least one of the vertical and horizontal directions, more preferably 90% or less. Most preferably, it is 20% or more. More preferably, it is 15% or more and 90% or less in both the vertical and horizontal directions. If heat shrinkage is performed in this range, the package is tightly shrink-wrapped without loosening, and there is no possibility that the glass substrate comes into contact with the film to contaminate the glass substrate.
  • the heat shrinkage is a value measured at 120 ° C. by the method of ASTM D-2732.
  • the maximum heat shrinkage stress at 120 ° C. is preferably 0.15 NZmm 2 or more, more preferably 5 NZmm 2 or less, in at least one of the vertical and horizontal directions. Most preferably, it is not less than 0.2 N / mm 2 and not more than 4.5 N / mm 2 . More preferably, the vertical, in the lateral direction both 0. 1 5 NZmm 2 or more, 5 NZmra 2 below.
  • the package is tightly shrink-wrapped without loosening, and the film does not easily come into contact with the glass substrate even when the film is pressed at the time of handling. The cleanliness of the substrate is maintained.
  • the heat shrinkage stress is moderate, the film can be sealed and sealed without breaking at the corners during packaging. Intrusion of dust from the air can be blocked.
  • the maximum heat shrinkage stress is a value measured at 120 ° C. by ASTM D—2838.
  • the thickness of the polyolefin resin film is preferably 10 m or more, more preferably 200 m or less. It is even more preferably 20 or more, and most preferably 180 ⁇ or less. When the thickness is in this range, the film has an appropriate stiffness, so that the packaging workability of the package can be performed easily, efficiently, and efficiently. In addition to being able to perform heat sealing with high welding strength, it has breaking strength to withstand impact during transport and handling.
  • the fixing tool used in the present invention may be a long string-shaped or tape-shaped fixing tool.
  • a polypropylene tape is preferably used.
  • the buffer of the present invention is used in a set of four, the four may be completely the same or may have different configurations.
  • the buffer located below may be large and thick to withstand the weight of the glass substrate.
  • the buffer of the present invention may be used not only as a set of four but also as a stopper for preventing the absorber of the present invention from moving to the inner bottom of a plastic container or a plastic cardboard box having an open top.
  • the two are fixed in the opposite direction using a tool, etc., and the glass substrate is inserted and fixed from the upper opening.If necessary, cover the box with a box to prevent dust from entering from the upper opening. It can be used for storing glass substrates. In this case, by attaching the buffer or the plate-like plastic foam of the present invention to the glass lid, it can be used as a transport container.
  • Resin material Ethylene propylene random copolymer having an expansion ratio of 20 cm 3 / g Average particle diameter of expanded resin particles: 3.6 mm
  • Width 2.4 mm
  • Sectional shape of the ridge a trapezoid with a 6.5 mm wall perpendicular to the bottom of the board insertion groove and a top with a width of 8 mm and a height of 5.5 mm (Fig. 4 (c)) Shape
  • a total of two cushions with a width of 30 mm were provided at 1/4 the length (300 mm) of the buffer from both sides.
  • the depth of the groove is 1 mm at the end of the L-shape, an arc-shaped chamfer with a radius of 20 mm is formed at the corner, and the depth of the groove at the connection between the bottom of the groove and the chamfer is 4 mm. did.
  • the above-mentioned glass substrate was packaged as shown in FIG. 2 using four of the above-mentioned buffer bodies to obtain a package.
  • the test was performed.
  • Reference Example 1 the same test was performed using exactly the same buffer except that the fusion ratio was 65%.
  • Example 1 did not fall off the glass substrate at all after falling three times, and kept the glass substrate packaged state before the test, and showed no damage to the glass substrate. In addition, the adhesion of the buffer dust to the glass substrate surface can be visually observed. No dust of a size was observed at all.
  • Thickness 0.7 mm
  • Resin Material . Resin Density expansion ratio at 1 0 cm 3 / g is 0 9 3 0 g Z c ni 3 of crosslinked polyethylene
  • Length length perpendicular to short side and long side: 240mm
  • a total of two wires with a width of 25 mm were provided at 1/4 of the length of the buffer (240 mm) from both sides.
  • a groove is formed from the position of 5 Omm toward the corner from the end of the L-shape to the corner, an arc-shaped chamfer with a radius of 1 Omm is formed at the corner, and the bottom and the chamfer of the groove The depth of the groove at the connection part with was set to 3 mm.
  • the above-mentioned glass substrate was packaged as shown in FIG. 2 using four of the above-mentioned buffer bodies to obtain a package.
  • a vibration test was performed to evaluate the performance of fixing the buffer in the glass substrate package in this package.
  • the vibration test was performed by fixing the package on a vibration table of a vibration test apparatus and following the test method of JISZ0232. Further, as Comparative Example 1, the same test was performed using exactly the same buffer, except that the depth of the fixture guide groove was set to 1 mm at all portions. Test condition
  • Vibration waveform sine wave
  • the shock absorber of the present invention when the shock absorber of the present invention is fastened by the fastener, the fastening force of the fastener is prevented from concentrating on the corners, so that the glass substrate can be satisfactorily pressed against the glass substrate even at the end.
  • the groove of the substrate is not displaced, and a good protective effect is exhibited.
  • the shock absorber of the present invention has its dimensions adjusted, and by using a foam having a specific characteristic as a constituent material, the work of packing and removing the glass substrate becomes easy, which is also suitable for automation. Becomes In addition, excellent dust generation and durability, work in a clean room It can withstand repeated use many times. Therefore, in the package of the present invention in which a plurality of glass substrates are packed using the buffer of the present invention, the internal glass substrate is reliably protected against vibration impact and drop impact during transportation, and defective products are protected. The occurrence is greatly reduced.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Buffer Packaging (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

L'invention concerne un corps amortisseur pour substrat en verre, à section en forme de L. L'épaisseur en partie terminale de section est supérieure à l'épaisseur en coin de section. Les caractéristiques sont les suivantes: (1) l'épaisseur du corps amortisseur diminue progressivement depuis la partie terminale vers le coin de section, et la partie inférieure d'une rainure de guidage d'élément de serrage sert de référence, sachant que l'on établit cette rainure de manière à en augmenter progressivement la profondeur depuis la partie terminale vers le coin de section; (2) le dispositif amortisseur est établi de sorte que l'épaisseur du corps lui-même diminue progressivement depuis les deux parties terminales vers le coin de section, sans former la rainure susmentionnée; et (3) une partie saillante est établie aux deux parties terminales extérieures de la section du corps amortisseur, afin d'empêcher la force de l'élément de serrage de s'appliquer essentiellement sur le coin de ladite section lorsque le corps amortisseur est serré avec un élément de serrage.
PCT/JP2001/011472 2000-12-27 2001-12-26 Corps amortisseur pour substrat en verre, et corps d'emballage utilisant le corps amortisseur WO2002053474A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020037008648A KR100552879B1 (ko) 2000-12-27 2001-12-26 유리 기판용 완충 부재 및 상기 완충 부재를 이용한 포장부재
JP2002554602A JP4091432B2 (ja) 2000-12-27 2001-12-26 ガラス基板用緩衝体
DE10197125A DE10197125B3 (de) 2000-12-27 2001-12-26 Einbettungskörper für Glassubstrate sowie verpackter Gegenstand unter Verwendung desselben

Applications Claiming Priority (2)

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JP2000-396934 2000-12-27
JP2000396934 2000-12-27

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WO2002053474A1 true WO2002053474A1 (fr) 2002-07-11

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KR (1) KR100552879B1 (fr)
CN (1) CN1222449C (fr)
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WO2006038541A1 (fr) * 2004-10-05 2006-04-13 Toshiro Fujiwara Conteneur de transport de substrat, structure de paroi interne dudit conteneur, et organe inférieur de levage utilisé pour ledit conteneur
WO2006125107A2 (fr) * 2005-05-18 2006-11-23 Ppg Industries Ohio, Inc. Moyen de contention d'angle destine a fixer des articles dans un support de transport et/ou de stockage
JP2007022660A (ja) * 2006-10-27 2007-02-01 Nippon Electric Glass Co Ltd 梱包体および梱包材
JP2008213943A (ja) * 2008-05-26 2008-09-18 Renesas Technology Corp 半導体装置の搬送方法
JP2021187555A (ja) * 2020-06-03 2021-12-13 フェリックス ワルドナー ゲーエムべーハー 板状材料を固定するための装置

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CN100372744C (zh) * 2004-04-07 2008-03-05 友达光电股份有限公司 缓冲包装材
CN101020509B (zh) * 2007-03-19 2010-04-21 友达光电股份有限公司 承接基板的承接托盘及承接该托盘的包箱
EP2147869A1 (fr) * 2008-07-22 2010-01-27 Hornos Industriales Pujol S.A. élément de protection pour coins d' objets en verre
CN101811599A (zh) * 2010-04-01 2010-08-25 盐城市华鸥实业有限公司 玻璃制品的真空包装方法
KR101776962B1 (ko) * 2010-06-07 2017-09-08 세키스이가세이힝코교가부시키가이샤 판형상체의 반송용기
CA2814275A1 (fr) * 2013-04-26 2014-10-26 Conception Impack Dtci Inc. Supports reutilisables pour l'emballage d'articles plats et methode correspondante
CN103331285B (zh) * 2013-06-24 2016-02-17 句容骏成电子有限公司 一种插篮
CN103482255A (zh) * 2013-09-27 2014-01-01 昆山迈致治具科技有限公司 一种pcb板放置托盘
CN103662265A (zh) * 2014-01-04 2014-03-26 徐存然 一种栅格式环形托架
BE1022506B1 (fr) * 2014-11-05 2016-05-12 Splifar Sa Ensemble comprenant un climbia et au moins un élément de support.
CN110949832A (zh) * 2019-10-30 2020-04-03 沪东中华造船(集团)有限公司 一种轻围壁专用放置托架
KR102586759B1 (ko) * 2020-04-22 2023-10-11 수창티피에스 주식회사 접이식 플라스틱 포장재

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Cited By (8)

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Publication number Priority date Publication date Assignee Title
US7431547B2 (en) 2000-10-04 2008-10-07 Ppg Industries Ohio, Inc. Corner restraint for securing articles on a shipping and/or storage rack
WO2006038541A1 (fr) * 2004-10-05 2006-04-13 Toshiro Fujiwara Conteneur de transport de substrat, structure de paroi interne dudit conteneur, et organe inférieur de levage utilisé pour ledit conteneur
WO2006125107A2 (fr) * 2005-05-18 2006-11-23 Ppg Industries Ohio, Inc. Moyen de contention d'angle destine a fixer des articles dans un support de transport et/ou de stockage
WO2006125107A3 (fr) * 2005-05-18 2007-02-22 Ppg Ind Ohio Inc Moyen de contention d'angle destine a fixer des articles dans un support de transport et/ou de stockage
JP2007022660A (ja) * 2006-10-27 2007-02-01 Nippon Electric Glass Co Ltd 梱包体および梱包材
JP4569553B2 (ja) * 2006-10-27 2010-10-27 日本電気硝子株式会社 梱包体
JP2008213943A (ja) * 2008-05-26 2008-09-18 Renesas Technology Corp 半導体装置の搬送方法
JP2021187555A (ja) * 2020-06-03 2021-12-13 フェリックス ワルドナー ゲーエムべーハー 板状材料を固定するための装置

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KR100552879B1 (ko) 2006-02-20
JPWO2002053474A1 (ja) 2004-04-30
KR20030093192A (ko) 2003-12-06
CN1482985A (zh) 2004-03-17
CN1222449C (zh) 2005-10-12
DE10197125B3 (de) 2005-08-18

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