WO2002017382A1 - Dispositif d'alignement - Google Patents
Dispositif d'alignement Download PDFInfo
- Publication number
- WO2002017382A1 WO2002017382A1 PCT/JP2001/007167 JP0107167W WO0217382A1 WO 2002017382 A1 WO2002017382 A1 WO 2002017382A1 JP 0107167 W JP0107167 W JP 0107167W WO 0217382 A1 WO0217382 A1 WO 0217382A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- positioning
- piezo
- movable
- alignment
- alignment device
- Prior art date
Links
- 230000008602 contraction Effects 0.000 claims description 25
- 239000004568 cement Substances 0.000 claims 1
- 230000002618 waking effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 48
- 230000033001 locomotion Effects 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 235000010675 chips/crisps Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
Definitions
- the present invention relates to an alignment apparatus capable of positioning a positioning object within a target accuracy range with high accuracy, and particularly to an apparatus suitable for use in an alignment in a mounting apparatus for wafers or an exposure apparatus.
- a mounting device that joins wafers an aligner that positions wafers for processing and mounting chips and other members on wafers, or performs predetermined exposure on wafers
- alignment devices used for positioning such positioning objects include, for example, stacking tapes that can be adjusted in the X and Y axis directions (horizontal direction) and zero direction (rotation direction).
- the conventional alignment device is configured by stacking the position adjustment tables in the X and Y axis directions and directions, so that when adjusting an axis other than the top axis, the alignment apparatus is stacked on the top. Axes need to be driven, and for positioning Drive and control efficiency is poor.
- the position adjustment tables in the X, Y-axis direction and ⁇ direction are stacked and configured, the thickness of the alignment device as a whole (up and down dimension) increases, and a device incorporating the alignment device, such as a mounting device or a mounting device, There is also a problem that an exposure apparatus is necessarily large in size.
- the distance from the guide to the uppermost positioning surface is increased, errors in the guide are amplified, and the positioning accuracy is adversely affected.
- the positioning in the 0 direction is performed by adjusting the position adjustment table around a predetermined center axis. Therefore, when the size of the object to be positioned, for example, the size of a wafer, becomes large, especially the alignment accuracy in the 0 direction is increased. There is a problem that it gets worse at the outer peripheral position in proportion to the radius of the wafer.
- an object of the present invention is not to construct a position adjustment table in each axial direction and rotation direction as in the conventional apparatus but to stack one movable table for holding the positioning object at least X , And the Y-axis direction and the 0-axis direction can be simultaneously adjusted within one plane, and the positioning object can be positioned at the target position at once with only one specific type of position adjustment means. It is an object of the present invention to provide an alignment device that can perform high-precision positioning up to the outer peripheral portion of the device and has a high efficiency of the positioning operation, and can configure the entire device as a compact.
- an alignment apparatus includes a movable table for holding an object to be positioned, a plurality of movable support means for supporting the movable table at a plurality of positions movably, and A recognition unit that reads a recognition mark attached to the object or the movable table; and a control unit that controls driving of the movable support unit based on information from the recognition unit.
- Telescopically operable first and second piezo elements extending substantially horizontally and crossing each other; and telescopically operable third piezo element extending substantially vertically.
- a pair of piezo drivers including a piezo element, and the two pairs of piezo drivers are provided with a pair of supporting blocks corresponding to the two piezo drivers. It is characterized by comprising a means capable of performing a walking operation on the movable table by alternately contacting and separating the pull with the pull.
- the support block in each piezo driving body in each movable support means, the support block is brought into contact with or separated from the movable table by the expansion and contraction operation of the third piezo element, and The support block is moved in the two-dimensional horizontal direction by the expansion and contraction operation of the second piezo element, and the third piezo element is swung accordingly.
- the third piezo element repeatedly contacts and separates from the movable table via the support block, and accordingly repeats the movement, and this operation is repeated for each piezo driver of the pair of piezo drivers.
- the two ⁇ 3 piezo elements are in a state of walking relative to the movable table, which appears as the walking operation.
- This walking operation is a relative operation with respect to the movable tape.
- the movable table is moved by driving a plurality of movable support means.
- the movable table can be simultaneously adjusted in at least the X and Y axis directions (horizontal direction) and the zero direction (rotation direction) within one plane, and moreover, the center of rotation of the movable table can be adjusted.
- the position is also able to arbitrarily control, in the stretch precisely to become c this positioning can be moved to the target position of the object to be positioned by the specific movable supporting lifting means using a piezoelectric driver, basic mechanical Since there is no need for a guide mechanism, there is no limit to positioning accuracy due to the mechanical guide mechanism.
- the movable table can be simultaneously driven in one plane in the X, Y, and 0 axis directions by driving the plurality of movable support means, the movable table can be moved from the drive surface of the plurality of movable support means onto the movable table or the movable table.
- the distance between the positioning object held above and the positioning target surface may be small, and when the distance from the driving surface to the positioning target surface is relatively large as in the conventional device, the positioning object caused by this distance
- the amplification of the control error of the driving surface on the surface does not occur. Therefore, high positioning accuracy is secured.
- the plurality of movable support means can perform the positioning efficiently and accurately at once without using a mechanical guide mechanism, so that an error due to the driving for positioning does not easily occur, and high-precision positioning is achieved. It becomes possible.
- the driving surface of the plurality of movable support means in the X, ⁇ , and 0 axis directions is substantially one plane. Therefore, the driving efficiency for positioning is high.
- the plurality of movable support means constitute a set of positioning means which is substantially arranged on one plane, the position adjustment table in each of the axial direction and the rotational direction is required as in the conventional apparatus. Compared to a stacked configuration, the size of the alignment device can be significantly reduced, especially in the vertical direction.
- the movement control of the movable table by the plurality of movable support means uses a piezo element that can control the amount of expansion and contraction with high accuracy. That is, since a piezo element with extremely high resolution is used (currently, The resolution of the piezo element itself is below the angstrom level, but the measurement and control system including the piezo element and various devices has a resolution of about 12 nm, and can be further decomposed to 5 nm or less by changing the control configuration. Performance can be enhanced), and extremely high-precision positioning becomes possible.
- the movable support means using the piezo element can be arranged at a position corresponding to the outer peripheral portion of the positioning target, so that the resolution in the 0 direction is maintained particularly high. it can.
- the alignment device since the alignment device according to the present invention basically has no sliding portion, the alignment device can be installed in a vacuum chamber or the like, which is difficult to install when having the conventional sliding portion.
- the alignment device can be configured to be thin in the vertical direction, so that the central portion has an opening structure, and the alignment recognition means (for example, Alignment camera) or a backup member in the event of a pressurizing operation.
- the alignment recognition means for example, Alignment camera
- a backup member in the event of a pressurizing operation.
- the alignment device includes a plurality of movable holding means for supporting a positioning target at a plurality of positions so as to be movable, and a recognition means for reading a recognition mark attached to the positioning target. And control means for controlling the driving of the positioning object based on information from the recognizing means.
- Each movable support means is provided with a support block provided so as to be able to come into contact with the positioning object and to be separated from the positioning object, and a telescopically operable second member connected to the support block and extending substantially horizontally and crossing each other.
- the second Pied Piezo driver having a pair of piezo elements and a third piezo element that can extend and contract substantially extending in the vertical direction, and the two pairs of piezo drivers correspond to them.
- the positioning object is roughly positioned by the walking operation, and the positioning object is precisely adjusted by the expansion and contraction operation of each piezo element in a state where the walking operation is stopped. Positioning can also be performed. Although the amount of expansion / contraction of each piezo element itself cannot be so large, it can be controlled with extremely high precision. From sub-micron level accuracy to nanometer level accuracy positioning is possible.
- the precise positioning of the positioning target be performed within one step of the walking operation, whereby high-precision fine adjustment using the expansion / contraction operation of the piezo element itself after the coarse adjustment is performed.
- the adjustment will be performed reliably.
- the swing position of the third piezo element due to the expansion and contraction operation of the first and second piezo elements is a center position within one step of the walking operation before the precise positioning of the positioning object. It is preferable that the fine adjustment can be performed in any direction using the expansion / contraction operation of the piezo element itself after the coarse adjustment.
- the piezo element has a feature that is easily affected by history, such that the next drive amount and trajectory are determined according to the previous drive stroke. Therefore, in order to eliminate the adverse effect on the positioning accuracy due to this feature, it is preferable to reset before the precise positioning so as not to affect the history of the previous operation. That is, it is preferable that before the precise positioning of the positioning object, the history of the expansion and contraction operation amounts of the respective piezo elements is reset.
- the expansion and contraction operation characteristics of each of the piezo elements are calibrated in advance. This ensures the accuracy of the control by the control means. Ki
- Ki The calibration timing may be set as appropriate, but if fluctuations in the expansion and contraction operation characteristics of the piezo element are expected, it is not necessary to perform it frequently, but it should be performed periodically. Preferably, in that case, it is preferable that the calibration value be updated to the latest one.
- Such an alignment device is particularly suitable for a device that requires high-precision positioning.
- it can be incorporated in a mounting device for bonding wafers, wafers and chips, or chips, and used for positioning of a workpiece in the mounting device.
- a wafer or the like can be used as an aligner for positioning chips and other members.
- the present invention can be used for positioning an object to be exposed in an exposure apparatus for performing a predetermined exposure on a wafer or the like.
- FIG. 1 is a schematic configuration diagram of a mounting device incorporating an alignment device according to an embodiment of the present invention.
- FIG. 2 is an enlarged perspective view of an alignment device in the device of FIG.
- FIG. 3 is an enlarged perspective view of a piezo drive unit in the apparatus of FIG.
- 4A to 4C are plan views showing operation examples of the apparatus of FIG.
- FIG. 5 is a flowchart showing a control example of the alignment device of FIG.
- FIG. 1 shows a mounting apparatus that incorporates an alignment apparatus according to an embodiment of the present invention and that joins wafers.
- the mounting apparatus 1 joins the wafer 1a and the wafer 2b as objects to be bonded.
- the alignment apparatus 3 according to the present invention is used for positioning the wafer 2a as a positioning object. It has been incorporated.
- the bonding between the wafer 2a and the wafer 2b is performed in the bonding chamber 4, but the chamber 4 may be installed as needed.
- a gate 5 that can be opened and closed is provided in the bonding champer 4, and in a state where the gate 5 is open, a wafer 6 as a workpiece is bonded by a robot 6 as a transfer means.
- One 2a and wafer 2b are introduced into the bonding chamber 4.
- the means for directly holding the upper wafer 1b in FIG. 1 at the joint between the objects to be bonded is constituted by the electrostatic chuck 7 in the present embodiment, and the electrostatic chuck 7 can be moved up and down. It is attached to the lower end of the head 8.
- a plurality of columns 9 that can be controlled to expand and contract are provided.
- the parallelism of the electrostatic chuck 7, and consequently, the parallelism of the upper wafer 1 b held by the upper electrostatic chuck 7 and the lower wafer 1 a of the lower electrostatic chuck 7 b can be adjusted.
- a piezo element can be used to control the amount of expansion and contraction of each support 9.
- a light guide 10 for guiding light emitted toward an infrared camera, which will be described later, is provided below the head 8.
- the light guide 10 irradiates light guided from a light source (not shown) through an optical fiber or the like vertically downward.
- the portion of the electrostatic check 7 through which the light from the light guide 10 is transmitted is made of a transparent body capable of transmitting light or has a hole for transmitting light.
- An elevating mechanism 11 is provided above the head 8, and a pressing means 13 having a heating cylinder 12 such as an air cylinder is provided above the elevating mechanism 11.
- the pressurized cylinder 12 is provided with a pressurized port 14 for controlling the pressurized force going downward, and a balance port 15 for controlling the applied pressure and generating an upward moving force. I have.
- the elevating mechanism 11 moves the upper wafer 1 b held by the head 8 and the electrostatic chuck 7 downward, and after moving and adjusting the parallelism, moves the upper wafer 1 a to the lower wafer 2 a. Temporary bonding can be performed by contacting one 2b.
- the pressurizing means 13 can apply a pressing force via the elevating mechanism 11 at the time of the temporary bonding, and after the temporary bonding, further lowers the upper wafer 2 b which has been further lowered to the lower wafer 2. It is designed so that it can be further pressed to a and then fully joined by pressing.
- an alignment device 3 for positioning the lower wafer 2a.
- the alignment device 3 includes a movable table 16 made of a transparent material for holding a wafer 2 a as an object to be positioned, and the movable tape 16. It has a plurality of movable support means 17 for supporting the table 16 at a plurality of positions movably (in this embodiment, at three points in the circumferential direction of the movable table 16).
- Each movable support means 17 is provided on a support base 18 extending in the vertical direction corresponding to each movable support means 17, and a movable table 16 is movable on each movable support means 17. Supported.
- an infrared camera as a recognition means is provided below, so that the movable table 16 is transparent so that light from the light guide 10 can reach the infrared camera. It is composed of a body (for example, a glass plate), but it is also possible to adopt a structure with a hole for transmission in the center or the like.
- Each of the support bases 18 may be formed of a base capable of adjusting the position (height adjustment) in the vertical direction (Z direction).
- the electrostatic chuck ⁇ ⁇ is provided only for the upper wafer 1 b, but in some cases, for the lower wafer 2 a, for example, an annular hole having a hole at the center is provided.
- An electrostatic chuck preferably made of a transparent material may be provided.
- an infrared camera 20 as recognition means is provided below the movable table 16 and outside the joining chamber 14.
- the infrared camera 20 uses the illumination light from the light guide 10 via the prism device 21 to recognize the alignment mark attached to the upper wafer 2 b or the electrostatic chuck 7. And the recognition mark on the lower wafer 1a or the movable tape 16 can be read.
- the positions of the infrared camera 20 and the prism device 21 can also be adjusted and controlled via the position adjusting means 22.
- the alignment device 3 is configured as shown in FIGS. 2 and 3. .
- three movable support means 17 are provided in three places in the circumferential direction of the disk-shaped movable tape 16, that is, three in total.
- Each movable support means 17 is provided with a piezo driver 23, 24 in a pair form.
- the piezo driving bodies 23 and 24 include support blocks 23 d and 24 d provided on the movable table 16 so as to be able to contact and separate from the movable table 16, and the support blocks 23 d and 24 d and extend substantially horizontally crossing each other (extending in the X and Y directions).
- the third piezo elements 23 c and 24 c are connected to 24 d and extend substantially in the vertical direction (extend in the Z direction).
- the support blocks 23d and 24d connected to them are As shown by an arrow in FIG. 3, the movable tape 16 can be arbitrarily moved in any plane direction, that is, in a substantially horizontal direction. Therefore, the support block 2
- Either 3 d or 24 d is in contact with the lower surface of the movable tape 16, and when the contacting support block is moved, the movable tape 16 is moved accordingly. Can be moved in the direction of movement of the tool.
- the third piezo element 23c or 24c is rotated with the movement of the support block, and supports the movable table 16 from below through the support block, and furthermore, through the support block. I do.
- the support blocks 23 d and 24 d are alternately brought into contact with the movable table 16 and separated from the movable table 16, the support blocks 23 d and 24 d are moved, and the third piezo elements 23 c and 2 are moved.
- FIGS. 4A to 4C the movable table 16 can be arbitrarily moved in the X, Y, and 0 directions.
- FIG. 4A shows an operation example of each piezo element of each movable support means 17 when the movable table 16 is moved in the X direction.
- FIG. 4B shows an operation example in the Y direction, and FIG. Indicates an operation example in the 0 direction.
- the movable table 16 can be arbitrarily moved in the X, ⁇ , and ⁇ directions, and the wafer 1 a held on the movable table 16 can be moved in any of the X, Y, and It is positioned at. Moreover, at this time, the rotation center of the direction is also brought to an arbitrary position by controlling the operation of each piezo element. be able to.
- the alignment apparatus 3 it is possible to simultaneously adjust the position in at least the X, Y axis directions and the 0 direction, and to position the wafer 2a to the target position at a stretch.
- the control of such a series of operations is performed by at least position control information input from the infrared camera 20 and control means for controlling the drive direction and drive amount of each movable support means 17 based on the input information. For example, this is performed by control means using a microcomputer.
- the recognition means for reading the recognition mark is not limited to the infrared camera 20, and a normal visible light power lens or a recognition means using a laser can also be used.
- the driving of the movable support means 17 for the positioning is based on the expansion and contraction operation of each piezo element, and the amount of expansion and contraction operation of the piezo element can be controlled extremely minutely. Therefore, by preliminarily calibrating the expansion / contraction operation of each piezo element and positioning the wafer 12a based on the expansion / contraction operation of each piezo element, extremely high-precision positioning is performed. As a result, the lower wafer 2a and the upper wafer 2b are aligned with high accuracy, and the joining accuracy between the two is greatly improved.
- the positioning in the Z direction can be finely adjusted by using the expansion and contraction operation of the third piezo element 23c.24c itself.
- each position adjustment table for each axial direction is stacked as in the related art. Therefore, it is not necessary to configure the alignment device, and the alignment device 3 itself can be configured to be thin. As a result, this The size of the entire device incorporating the alignment device 3 can be reduced.
- positioning is performed simultaneously in each direction in the same plane, driving efficiency for positioning is high.
- each movable support means 17 is arranged on the periphery of the movable table 16, a relatively large movable table 16 and a wafer 12 a held on the movable table 16 are particularly effective. It is possible to respond without reducing the positioning accuracy in the direction.
- piezo elements generally have a feature that is easily affected by history, such that the next drive amount and trajectory are determined according to the previous drive stroke.
- the history of the previous operation is not affected.
- it is preferable to reset the walking operation so that the history of the previous operation is erased before the precise positioning within one step. That is, in addition to the third piezo elements 23c and 24c, the history of the expansion and contraction operation of the first and second piezo elements 23a, 24a, 23b and 2b It is preferable to reset before precise positioning.
- the above-described walking operation is basically performed in that state.
- the walking is stopped and the walking operation is stopped, it is possible to precisely and precisely position the wafer 1a by using the expansion and contraction operation of each piezo element itself. Since this precise positioning is performed while the walking operation is stopped, it is basically necessary to perform the positioning within a position adjustment range within one step of the walking operation.
- the foot of the walking operation that is, the first piezo element 23c, 24c It is preferable to reset the movement position by the expansion and contraction operation of the piezo elements 23a and 24a and the second piezo elements 23b and 24b to the center position within the range of one step of the walking operation. .
- the reset to the center position can be performed simultaneously with the above-described reset of the history.
- step S1 the walking operation for coarse positioning as described above is executed in step S1
- step S2 an error 5 from the target position measured by the recognition means is included in one step of the walking operation.
- step S2 the process returns to step S1 to continue the walking operation. If it is determined that one step has been taken, the position of the foot, that is, the position of the third piezo element 23c, 24c is reset to the center position within the range of one step of the walking operation.
- Step S 3 each piezo element, in particular, the first piezo element 23 a, 24 a and the second piezo element 23 b, 24 b are precisely positioned by the telescopic operation, A high precision alignment is achieved (step S 4). Then, it is confirmed whether or not the error 5 from the target position measured by the recognition means is within the target high accuracy range (step S5). If not, the flow returns to step S3 to perform precise positioning. Repeat the operation. This control flow ends when the target precision range is entered. Such precise positioning enables high-precision alignment at the nanometer level, which was previously impossible.
- the mounting apparatus for one wafer has been described.
- the alignment apparatus according to the present invention can also be applied to a mounting apparatus for a wafer and a chip or a mounting apparatus for a chip.
- the present invention can also be applied to an exposure apparatus that exposes an object to be exposed, such as a wafer.
- the movable table is used.
- the object to be positioned can be directly supported by the movable support means.
- the movable table 16 may be omitted, and the positioning target may be directly supported by the plurality of movable support means 17.
- Other basic configurations may be the same as the above embodiment.
- Such an alignment device can be applied to any alignment device that is required to position a positioning object within a target accuracy range with high accuracy, and is particularly suitable for a mounting device and an exposure device.
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020037002649A KR100821797B1 (ko) | 2000-08-25 | 2001-08-21 | 얼라인먼트 장치 |
US10/362,461 US6825915B2 (en) | 2000-08-25 | 2001-08-21 | Alignment device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000255773A JP3938655B2 (ja) | 2000-08-25 | 2000-08-25 | アライメント装置 |
JP2000-255773 | 2000-08-25 |
Publications (1)
Publication Number | Publication Date |
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WO2002017382A1 true WO2002017382A1 (fr) | 2002-02-28 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2001/007167 WO2002017382A1 (fr) | 2000-08-25 | 2001-08-21 | Dispositif d'alignement |
Country Status (5)
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US (1) | US6825915B2 (ja) |
JP (1) | JP3938655B2 (ja) |
KR (1) | KR100821797B1 (ja) |
TW (1) | TW511219B (ja) |
WO (1) | WO2002017382A1 (ja) |
Families Citing this family (21)
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JP4408351B2 (ja) * | 2002-10-24 | 2010-02-03 | リンテック株式会社 | アライメント装置 |
JP2005051055A (ja) * | 2003-07-29 | 2005-02-24 | Tokyo Electron Ltd | 貼合せ方法および貼合せ装置 |
JP4563695B2 (ja) * | 2004-02-23 | 2010-10-13 | ボンドテック株式会社 | 加圧方法および接合装置 |
JP2005249531A (ja) * | 2004-03-03 | 2005-09-15 | Ueno Tekkusu Kk | アライメント装置 |
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2000
- 2000-08-25 JP JP2000255773A patent/JP3938655B2/ja not_active Expired - Fee Related
-
2001
- 2001-08-21 US US10/362,461 patent/US6825915B2/en not_active Expired - Fee Related
- 2001-08-21 KR KR1020037002649A patent/KR100821797B1/ko not_active IP Right Cessation
- 2001-08-21 WO PCT/JP2001/007167 patent/WO2002017382A1/ja active Application Filing
- 2001-08-24 TW TW090120835A patent/TW511219B/zh not_active IP Right Cessation
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JPH06291173A (ja) * | 1993-04-02 | 1994-10-18 | Olympus Optical Co Ltd | 微小ステージ送り装置 |
Also Published As
Publication number | Publication date |
---|---|
TW511219B (en) | 2002-11-21 |
KR20030031171A (ko) | 2003-04-18 |
US20030179353A1 (en) | 2003-09-25 |
KR100821797B1 (ko) | 2008-04-11 |
US6825915B2 (en) | 2004-11-30 |
JP3938655B2 (ja) | 2007-06-27 |
JP2002076098A (ja) | 2002-03-15 |
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